CN207398124U - A kind of radiator structure of semiconductor components and devices - Google Patents
A kind of radiator structure of semiconductor components and devices Download PDFInfo
- Publication number
- CN207398124U CN207398124U CN201721300345.4U CN201721300345U CN207398124U CN 207398124 U CN207398124 U CN 207398124U CN 201721300345 U CN201721300345 U CN 201721300345U CN 207398124 U CN207398124 U CN 207398124U
- Authority
- CN
- China
- Prior art keywords
- heat
- semiconductor components
- devices
- radiation rack
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of radiator structures of semiconductor components and devices, including radiating shell and semiconductor components and devices, radiating shell is internally provided with radiating gasket, the upper end of radiating gasket is equipped with heat radiation rack, the upper end of heat radiation rack is equipped with heat-conducting pad, the both sides of heat radiation rack are equipped with fixed link, and heat radiation rack is connected with heat dissipating housing by fixed link, the lower end of fixed link is equipped with compression spring, it can be good at reducing the pressure that radiating shell generates semiconductor components and devices, so as to expand the contact surface of radiating gasket and semiconductor components and devices.Heat emission hole is equipped with around heat dissipating housing, the heat that semiconductor components and devices generates is transferred to by heat-conducting silicone grease in heat radiation rack, then heat dissipating housing is distributed heat to by heat-conducting pad and discharged, effectively reduced the operating temperature of semiconductor components and devices, improve working performance.
Description
Technical field
The utility model is related to semiconductor heat-dissipating technical fields, are specially a kind of radiator structure of semiconductor components and devices.
Background technology
In electronic circuit, with the continuous improvement of integrated level and the progressively diminution of volume so that occupy larger space originally
Electronic equipment be gradually reduced, but the caloric value of its internal unit volume constantly increases, and especially semiconductor components and devices is in work
There are problems that caloric value is excessive during making causes temperature overheating so that the working condition and system of semiconductor components and devices are stablized
Property is greatly affected.
Utility model content
The purpose of this utility model is to provide a kind of radiator structure of semiconductor components and devices, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the utility model provides following technical solution：A kind of radiator structure of semiconductor components and devices,
Including radiating shell and semiconductor components and devices, the semiconductor components and devices is connected with circuit board by welding column, the radiating shell
Be internally provided with radiating gasket, the upper end of the radiating gasket is equipped with heat radiation rack, and the heat radiation rack is internally provided with main heat-dissipating pipe
With scattered heat pipe, the upper end of the heat radiation rack is equipped with heat-conducting pad, and the both sides of the heat radiation rack are equipped with fixed link, and heat radiation rack
It is connected with heat dissipating housing by fixed link, the lower end of the fixed link is equipped with compression spring, and the bottom of the heat dissipating housing, which is equipped with, to be fixed
Link block, the block that is fixedly connected are equipped with fixing nut, heat emission hole are equipped with around the heat dissipating housing.
Preferably, on circuit boards, and semiconductor components and devices and circuit board are mutual for the semiconductor components and devices uniform welding
Vertically.
Preferably, the outer surface of the radiating gasket is equipped with heat-conducting silicone grease.
Preferably, the surface of the main heat-dissipating pipe and scattered heat pipe is equipped with copper alloy layer.
Preferably, the inside of the heat dissipating housing is equipped with noise reducing plate.
Preferably, the compression spring is correspondingly provided with fixing groove on circuit boards with the lower end for being fixedly connected with block.
Compared with prior art, the beneficial effects of the utility model are：1. the radiator structure of the semiconductor components and devices solves
In small volume space environment, when circuit works, semiconductor components and devices temperature overheating problem.Pass through radiating gasket and semiconductor element
Device comes into full contact with, and the heat that semiconductor components and devices generates is transferred to by heat-conducting silicone grease in heat radiation rack, then passes through heat conduction
Gasket distributes heat to heat dissipating housing, finally discharges heat by heat emission hole, so as to effectively reduce semiconductor element device
The operating temperature of part improves performance.
2. the both sides of radiating gasket are equipped with fixed link, fixed link lower end is equipped with compression spring, in practical work process, energy
Enough effectively reducing radiating shell gives semiconductor components and devices increased pressure, reduces friction, expands radiating gasket and semiconductor element
The contact surface of device.
Description of the drawings
Fig. 1 is the utility model structure principal sketches；
Fig. 2 is the utility model heat radiation rack part-structure principal sketches；
Fig. 3 is the utility model heat dissipating housing part-structure principal sketches；
In figure：1 radiating shell, 2 welding columns, 3 semiconductor components and devices, 4 circuit boards, 5 heat dissipating housings, 6 fixed links, 7 heat conductive pads
Piece, 8 heat radiation racks, 9 radiating gaskets, 10 compression springs, 11 main heat-dissipating pipes, 12 scattered heat pipes, 13 be fixedly connected block, 14 heat emission holes,
15 fixing nuts.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of radiator structure of semiconductor components and devices, bag
Include radiating shell 1 and semiconductor components and devices 3, semiconductor components and devices 3 is connected with circuit board 4 by welding column 2, radiating shell 1 it is interior
Portion is equipped with radiating gasket 9, and the upper end of radiating gasket 9 is equipped with heat radiation rack 8, and heat radiation rack 8 is internally provided with main heat-dissipating pipe 11 and disperses
Heat pipe 12, the upper end of heat radiation rack 8 are equipped with heat-conducting pad 7, and the both sides of heat radiation rack 8 are equipped with fixed link 6, and heat radiation rack 8 and heat dissipation
Cover 5 is connected by fixed link 6, and the lower end of fixed link 6 is equipped with compression spring 10, and the bottom of heat dissipating housing 5, which is equipped with, is fixedly connected with block 13,
It is fixedly connected with block 13 and is equipped with fixing nut 15, heat emission hole 14 is equipped with around heat dissipating housing 5.
Specifically, 3 uniform welding of semiconductor components and devices is on the circuit board 4, and semiconductor components and devices 3 and circuit board 4
It is mutually perpendicular to.
Specifically, the outer surface of the radiating gasket 9 is equipped with heat-conducting silicone grease.
Specifically, the surface of the main heat-dissipating pipe 11 and scattered heat pipe 12 is equipped with copper alloy layer.
Specifically, the inside of the heat dissipating housing 5 is equipped with noise reducing plate.
Specifically, the compression spring 10 is correspondingly provided with fixing groove on the circuit board 4 with the lower end for being fixedly connected with block 13, make
Compression spring 10 is more firmly mounted with block 13 is fixedly connected with.
Operation principle：It when radiating shell 1 works, is come into full contact with by radiating gasket 9 and semiconductor components and devices 3 so that half
The heat that conductor component 3 generates is transferred to by heat-conducting silicone grease in heat radiation rack 8, is then distributed heat by heat-conducting pad 7
To heat dissipating housing 5 and pass through heat emission hole 14 and discharge so as to fulfill heat dissipation effect.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that in the case where not departing from the principle of the utility model and spirit can these embodiments be carried out with a variety of variations, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of radiator structure of semiconductor components and devices, including radiating shell（1）And semiconductor components and devices（3）, it is characterised in that：
The semiconductor components and devices（3）With circuit board（4）Pass through welding column（2）Connection, the radiating shell（1）Be internally provided with cooling pad
Piece（9）, the radiating gasket（9）Upper end be equipped with heat radiation rack（8）, the heat radiation rack（8）Be internally provided with main heat-dissipating pipe（11）
With scattered heat pipe（12）, the heat radiation rack（8）Upper end be equipped with heat-conducting pad（7）, the heat radiation rack（8）Both sides be equipped with fix
Bar（6）, and heat radiation rack（8）With heat dissipating housing（5）Pass through fixed link（6）Connection, the fixed link（6）Lower end be equipped with compression bullet
Spring（10）, the heat dissipating housing（5）Bottom be equipped be fixedly connected with block（13）, it is described to be fixedly connected with block（13）It is equipped with fixing nut
（15）, the heat dissipating housing（5）Around be equipped with heat emission hole（14）.
2. a kind of radiator structure of semiconductor components and devices according to claim 1, it is characterised in that：The semiconductor element device
Part（3）Uniform welding is in circuit board（4）On, and semiconductor components and devices（3）With circuit board（4）It is mutually perpendicular to.
3. a kind of radiator structure of semiconductor components and devices according to claim 1, it is characterised in that：The radiating gasket
（9）Outer surface be equipped with heat-conducting silicone grease.
4. a kind of radiator structure of semiconductor components and devices according to claim 1, it is characterised in that：The main heat-dissipating pipe
（11）With scattered heat pipe（12）Surface be equipped with copper alloy layer.
5. a kind of radiator structure of semiconductor components and devices according to claim 1, it is characterised in that：The heat dissipating housing（5）
Inside be equipped with noise reducing plate.
6. a kind of radiator structure of semiconductor components and devices according to claim 1, it is characterised in that：The compression spring
（10）Be fixedly connected with block（13）Lower end in circuit board（4）On be correspondingly provided with fixing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721300345.4U CN207398124U (en) | 2017-10-10 | 2017-10-10 | A kind of radiator structure of semiconductor components and devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721300345.4U CN207398124U (en) | 2017-10-10 | 2017-10-10 | A kind of radiator structure of semiconductor components and devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398124U true CN207398124U (en) | 2018-05-22 |
Family
ID=62331233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721300345.4U Expired - Fee Related CN207398124U (en) | 2017-10-10 | 2017-10-10 | A kind of radiator structure of semiconductor components and devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207398124U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020037467A1 (en) * | 2018-08-20 | 2020-02-27 | 海能达通信股份有限公司 | Heat dissipation assembly and electronic device |
-
2017
- 2017-10-10 CN CN201721300345.4U patent/CN207398124U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020037467A1 (en) * | 2018-08-20 | 2020-02-27 | 海能达通信股份有限公司 | Heat dissipation assembly and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20181010 |