CN212164093U - Heat radiation shielding device - Google Patents
Heat radiation shielding device Download PDFInfo
- Publication number
- CN212164093U CN212164093U CN202020958483.7U CN202020958483U CN212164093U CN 212164093 U CN212164093 U CN 212164093U CN 202020958483 U CN202020958483 U CN 202020958483U CN 212164093 U CN212164093 U CN 212164093U
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- electromagnetic shielding
- shielding frame
- heat
- metal
- circuit board
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a heat dissipation shielding device, it is including: metal fin, electromagnetic shield frame, heat conduction pad. The top and the bottom of electromagnetic shielding frame link up, the metal fin cover completely in the top of electromagnetic shielding frame, a plurality of downwardly extending's connecting pin have on the bottom surface of the lateral part of electromagnetic shielding frame, the connecting pin is used for being fixed in outside circuit board, the bottom surface butt of the lateral part of electromagnetic shielding frame in outside circuit board. The heat conducting pad is located in the electromagnetic shielding frame, the upper surface of the heat conducting pad is used for being attached to the bottom surface of the metal radiating fin, and the lower surface of the heat conducting pad is used for being attached to a heating element on an external circuit board. Through the combination of the metal radiating fins and the electromagnetic shielding frame, the heat on the heating element can be guaranteed to be radiated out through the radiating fins, and meanwhile, the heating element is prevented from being subjected to electromagnetic interference of other components.
Description
Technical Field
The utility model relates to a heat dissipation shield assembly.
Background
With the development of economic society, more and more electronic products appear in our daily life, bring infinite convenience and fun to our life, but electromagnetic waves of various frequency bands and intensities also bring some negative effects to the electronic products and our life: electronic devices can affect each other and also affect our health. In order to avoid electromagnetic pollution, an electromagnetic shield is generally disposed on the circuit board to surround the component, circuit, assembly, cable or interference source of the whole system, and to prevent the interference electromagnetic field from spreading out. In addition, with the miniaturization and development of electronic components, the heat dissipation technology of electronic components is becoming a very critical technology in the development and development of electronic devices. At present, due to the fact that the space in the electromagnetic shielding cover is limited, electronic components in the electromagnetic shielding cover cannot be provided with cooling fins, and over-temperature faults are often caused due to too high heating power. The structure of installing the radiating fin outside the electromagnetic shielding cover is generally complex, and the installation is complex.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a heat dissipation shield assembly in order to overcome the defect that the device structure that electronic equipment heat dissipation and electromagnetic shield combined together is complicated among the prior art.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
a heat dissipation shielding device is characterized by comprising:
a metal heat sink;
the top and the bottom of the electromagnetic shielding frame are communicated, the metal radiating fin completely covers the top of the electromagnetic shielding frame, a plurality of connecting pins extending downwards are arranged on the bottom surface of the side part of the electromagnetic shielding frame, the connecting pins are used for being fixed on an external circuit board, and the bottom surface of the side part of the electromagnetic shielding frame abuts against the external circuit board;
the heat conducting pad is located in the electromagnetic shielding frame, the upper surface of the heat conducting pad is used for being attached to the bottom surface of the metal radiating fin, and the lower surface of the heat conducting pad is used for being attached to a heating element on an external circuit board.
Preferably, the four top corners of the top of the electromagnetic shielding frame are provided with connecting pieces, the connecting pieces are provided with connecting holes, the metal radiating piece is provided with a threaded hole, and the radiating and shielding device further comprises a screw, wherein the screw penetrates through the connecting holes to be connected with the threaded hole.
Preferably, the metal heat sink is an aluminum toothed heat sink.
Preferably, the metal heat sink is formed by extrusion.
Preferably, the heat conducting pad is made of a silica gel material.
On the basis of the common knowledge in the field, the above preferred conditions can be combined at will to obtain the preferred embodiments of the present invention.
The utility model discloses an actively advance the effect and lie in: through the combination of the metal radiating fins and the electromagnetic shielding frame, the heat on the heating element can be guaranteed to be radiated out through the radiating fins, and meanwhile, the heating element is prevented from being subjected to electromagnetic interference of other components.
Drawings
Fig. 1 is a schematic view of a connection structure of a heat dissipation shielding device used on a circuit board according to a preferred embodiment of the present invention.
Fig. 2 is a schematic diagram of an explosion structure of a heat dissipation shielding device used on a circuit board according to a preferred embodiment of the present invention.
Description of reference numerals:
Connecting sheet 210
Connecting pin 220
Screw 600
Detailed Description
The present invention will be more clearly and completely described below with reference to the accompanying drawings.
Fig. 1 and 2 show a heat-dissipating shield apparatus, which includes: metal heat sink 100, electromagnetic shielding frame 200, and thermal pad 300. The top and the bottom of the electromagnetic shielding frame 200 are through, the metal heat sink 100 completely covers the top of the electromagnetic shielding frame 200, the bottom surface of the side of the electromagnetic shielding frame 200 is provided with a plurality of connecting pins 220 extending downward, the connecting pins 220 are used for being fixed on an external circuit board 400, and the bottom surface of the side of the electromagnetic shielding frame 200 abuts against the external circuit board 400. The thermal pad 300 is disposed in the electromagnetic shielding frame 200, an upper surface of the thermal pad 300 is used for being attached to a bottom surface of the metal heat sink 100, and a lower surface of the thermal pad 300 is used for being attached to the external heating element 500 on the circuit board 400.
When the heat dissipation shielding device is used, the metal heat sink 100 is covered on the electromagnetic shielding frame 200 and fixedly connected with the electromagnetic shielding frame 200, then the heat conducting pad 300 is attached to the heating element 500, the electromagnetic shielding frame 200 is covered on the heating element 500, and the connecting pins 220 are inserted into the mounting holes 410 on the external circuit board 400, so that the connecting pins 220 are fixed on the external circuit board 400. At this time, the upper surface of the thermal pad 300 can be pressed against the bottom surface of the metal heat sink 100, so that the heat generated by the heat generating element 500 can be dissipated through the metal heat sink 100. In this embodiment, after the connecting pins 220 are inserted into the mounting holes 410 of the circuit board 400, the connecting pins 220 are deformed by force to hook the circuit board 400. The metal heat sink 100 and the electromagnetic shielding frame 200 can block electromagnetic waves, so that the heat generating component 500 located in the electromagnetic shielding frame 200 is prevented from being subjected to electromagnetic interference, and simultaneously prevented from interfering with other electronic components.
In this embodiment, the top of the electromagnetic shielding frame 200 has four corner positions with connection plates 210, the connection plates 210 have connection holes 211, and the metal heat sink 100 has screw holes (not shown). The heat radiation shield apparatus further includes a screw 600, and the screw 600 is coupled to the screw hole through the coupling hole 211. In other embodiments, the electromagnetic shielding frame 200 and the metal heat sink 100 may be fixed together by rivet connection, glue bonding, or the like.
Further, the metal heat sink 100 is an aluminum toothed heat sink. The metal aluminum has strong heat conductivity, and aluminum tooth-shaped radiating fins are common in the market and have low price. The metal heat sink 100 is easily processed by extrusion molding.
In this embodiment, the thermal pad 300 is made of a silicon material. The heat conducting pad 300 made of the silica gel material has good heat conducting capacity and high-level pressure resistance, and the material itself has certain flexibility, so that the heat conducting pad can be well attached to the metal radiating fin 100 and the heating element 500, and therefore good heat conducting and radiating purposes are achieved.
Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (5)
1. A heat dissipation shielding device, comprising:
a metal heat sink;
the top and the bottom of the electromagnetic shielding frame are communicated, the metal radiating fin completely covers the top of the electromagnetic shielding frame, a plurality of connecting pins extending downwards are arranged on the bottom surface of the side part of the electromagnetic shielding frame, the connecting pins are used for being fixed on an external circuit board, and the bottom surface of the side part of the electromagnetic shielding frame abuts against the external circuit board;
the heat conducting pad is located in the electromagnetic shielding frame, the upper surface of the heat conducting pad is used for being attached to the bottom surface of the metal radiating fin, and the lower surface of the heat conducting pad is used for being attached to a heating element on an external circuit board.
2. The heat dissipation shielding device of claim 1, wherein the top of the electromagnetic shielding frame has connection tabs at four corners, the connection tabs have connection holes, the metal heat sink has screw holes, and the heat dissipation shielding device further comprises screws passing through the connection holes and connected to the screw holes.
3. The heat dissipating shield of claim 1 wherein the metal fins are aluminum castellated fins.
4. The heat dissipating shield of claim 3, wherein the metal heat sink is formed by extrusion.
5. The heat dissipating shield assembly of claim 1, wherein the thermal pad is a silicone material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020958483.7U CN212164093U (en) | 2020-05-27 | 2020-05-27 | Heat radiation shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020958483.7U CN212164093U (en) | 2020-05-27 | 2020-05-27 | Heat radiation shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212164093U true CN212164093U (en) | 2020-12-15 |
Family
ID=73702547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020958483.7U Active CN212164093U (en) | 2020-05-27 | 2020-05-27 | Heat radiation shielding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212164093U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888237A (en) * | 2021-01-21 | 2021-06-01 | 重庆蓝岸通讯技术有限公司 | Multipurpose radiating, shielding and anti-static structure for electronic product device |
-
2020
- 2020-05-27 CN CN202020958483.7U patent/CN212164093U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888237A (en) * | 2021-01-21 | 2021-06-01 | 重庆蓝岸通讯技术有限公司 | Multipurpose radiating, shielding and anti-static structure for electronic product device |
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