JP3158655B2 - Radiator for electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transistor or an IC inside an outer casing of an electronic apparatus which is most suitable for application to, for example, a color viewfinder of a video camera for a studio.
The present invention relates to a heat radiating device of an electronic device for radiating heat generated by a heat- generating component into the atmosphere using an outer casing .

[0002]

Heretofore, as a heat radiator of the heat generating components of the transistor or IC, etc. in the electronic device, but there is mounted a heat sink inside the outer casing, on the heat sink to get significantly costly, inside the outer casing Temperature is remarkable
In order to increase the height, a huge heat sink must be used, and there has been a problem that the electronic device becomes large.

In addition, a heat-generating component is directly attached to an outer casing,
There is a device that dissipates heat of the heat-generating component to the outer casing. However, there is a problem that the detachability of the outer casing is difficult, and the maintainability is very poor.

Further, there is a type in which a heat-generating component is pressed against the inner surface of the outer casing by a spring which presses the entire printed circuit board. However, a structure in which a heavy printed circuit board is entirely supported by the spring is very weak against shock and vibration. There was a problem to say.

[0005]

The problem to be solved by the present invention is disclosed in Japanese Unexamined Patent Publication No. Sho 60-1.
No. 8942, a plurality of heat-generating components mounted side by side on a printed circuit board are formed into a metal through a plurality of heat-transfer rubbers having a large heat-transfer rubber formed by a mold in accordance with these shapes. Some of them are pressure-bonded to a heat radiator. However, heat transfer rubber formed by a metal mold according to the shape of the heat-generating component is extremely expensive. When a tall component such as a capacitor is mounted on the same printed circuit board, and the distance between the printed circuit board and the metal radiator must be large, the thermal conductivity is about 1/100 of that of metal. Therefore, there is a problem that the thickness of the heat transfer rubber must be increased and the heat transfer loss becomes very large.

Further, as disclosed in Japanese Patent Application Laid-Open No. 53-106579, a spring-shaped radiating fin attached to each heat-generating component is press-bonded to an outer casing. The structure for mounting the radiating fins is extremely costly, and the spring-shaped radiating fins have a problem that the contact area with the outer casing is very small and the heat radiation effect is low.

Further, as shown in Japanese Patent Application Laid-Open No. 60-1850, a heat transfer spring composed of a plate spring having heat conductivity is screwed to a chassis, and the heat transfer spring is mounted on a printed circuit board by heat. Although there is a component crimped on the component, the contact area of the heat transfer spring with the chassis is very small, and the heat radiation effect is low. It is possible to screw the heat transfer spring to the chassis to which the printed circuit board is attached. Misalignment and deformation of the heat transfer spring with respect to
It is difficult to attach and detach the outer casing in a direction substantially parallel to the printed circuit board, and the attaching and detaching directions of the outer casing are restricted. Further, there is a problem that the degree of freedom in designing the outer casing is small, for example, it becomes difficult to design the outer casing into a three-dimensional curved shape.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a large degree of freedom in designing the outer casing, has good detachability of the outer casing, and furthermore, transfers the heat of the heat-generating components to the outer casing. It is an object of the present invention to provide a heat radiating device for an electronic device that can efficiently and directly conduct electricity.

[0009]

According to the present invention, there is provided a heat radiating device for an electronic device, which comprises a plurality of heat generating components arranged side by side on a printed circuit board, the heat radiating device being mounted on an outer casing having a heat radiating property. Directly conducts the heat and uses the outer casing to
In a heat radiating device of an electronic device for dissipating heat, a heat transfer spring composed of a plate spring having heat conductivity in which a plurality of crimp pieces that can move independently of each other are integrally formed on one base plate is provided. The base plate is thermally coupled to the plurality of heat generating components, and the plurality of crimp pieces of the heat transfer spring are crimped independently of each other so as to follow the inner surface of the outer casing. At this time, it is preferable that a heat transfer table having heat transfer properties is pressed on the plurality of heat-generating components and mounted on the printed circuit board, and the base plate of the heat transfer spring is pressed and mounted on the heat transfer table. In addition, elastic heat transfer rubber having elasticity and heat transfer property is attached to the inner surface of the outer casing in close contact.
Attaching the plurality of crimped pieces of the heat transfer spring to the elastic heat transfer rubber, pressing and attaching the base plate of the heat transfer spring to the heat transfer table using a holding plate, It is preferable to mount the heat transfer springs on a table in a plurality of rows.

[0010]

The heat dissipating device for an electronic device according to the present invention having the above-described structure has a plurality of crimping pieces which are independently movable on a single base plate and is integrally formed with a heat conductive leaf spring. Using a heat spring, the base plate of the heat transfer spring is thermally coupled to a plurality of heat-generating components mounted side by side on a printed circuit board, and a plurality of crimped pieces of the heat transfer spring are mounted inside the outer casing .
In <br/> of was crimped independently of each other so as to modeled after the plane, the outer casing is being formed into a three-dimensional curved surface shape, that
The distance between the inner surface of the outer casing and one base plate of the heat transfer spring is uneven
Even if they are the same, the heat transfer spring
All the crimping pieces are securely crimped independently
On the inner surface of the three-dimensional curved outer casing.
Make sure that the heat transfer spring contacts with a sufficiently large contact area.
Can be. Then, the plurality of crimping pieces at the outer casing desorption 3
It is possible to flex smoothly independently of each other with respect to the outer casing having a three- dimensional curved surface . At this time, if a heat transfer table having heat transfer properties is crimped on a plurality of heat generating components and mounted on a printed circuit board, and a base plate of a heat transfer spring is crimped and mounted on the heat transfer table, the same applies. Even when tall parts such as capacitors are mounted on the printed circuit board, even when the distance between the printed circuit board and the outer case must be large,
By changing the dimensions of the heat transfer table, the same heat transfer spring can be used as it is. Also, a plurality of crimping pieces of a heat transfer spring are crimped to an elastic heat transfer rubber having an elasticity and a heat transfer property, which is attached to the inner surface of the outer casing in a close contact state, or a plurality of heat transfer springs are mounted on a heat transfer table. If the heat transfer spring is attached to the row, the contact area between the heat transfer spring and the outer casing can be further increased. In addition, if the base plate of the heat transfer spring is press-fitted onto the heat transfer table using the holding plate, good contact between the heat transfer spring and the heat transfer table can be obtained.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a heat radiating device for electronic equipment to which the present invention is applied will be described below with reference to the drawings.

First, in this embodiment, as shown in FIGS. 7 and 8, the present invention is applied to a viewfinder 2 of a video camera 1 for a studio. An outer casing 4 serving as a cover is detachably attached to the main body 3 by a plurality of screws 5 in the directions of arrows a and b. As shown in FIGS. 5 and 6, the outer casing 4 is formed of a metal part having high heat dissipation and heat conductivity such as aluminum die-casting. The outer casing 4 is formed in a three-dimensional curved shape for reasons of miniaturization and design, and is formed in a box shape in order to improve maintainability.
No electronic components are attached to the inner surface of the outer casing 4.

Next, a heat radiating device for a transistor will be described with reference to FIGS.

First, a printed circuit board 7 is horizontally screwed on a chassis 6 in the main body 3 by a plurality of brackets 8 and a plurality of set screws 9. The printed board 7 is a double-sided board having wiring patterns formed on both upper and lower surfaces.

A plurality of (for example, nine) transistors 10, which are heat-generating components, are soldered by these leads 10a and mounted on the printed circuit board 7 in a row. Components that are taller than the transistor 10 such as the capacitor 11 are also mounted on the printed board 7, and the distance H between the printed board 7 and the top plate 4 a of the outer casing 4 is increased.

In view of this, a plurality of transistors 10 are horizontally laid down on a belt-like reinforcing heat transfer plate 13 which is a good heat conductive sheet made of aluminum or the like placed horizontally on the printed circuit board 7 and placed thereon. A heat transfer table 14 pressed with a good heat conductive sheet metal is pressed onto the plurality of transistors 10 and screwed onto the printed circuit board 7.

At this time, the heat transfer table 14 is pressed to have a substantially U-shaped cross section, and the lower piece 14a is placed on the plurality of transistors 10 by an insulating and heat-conductive material such as silicon rubber. The printed circuit board 7 is placed horizontally via the thermal rubber 15 and is co-tightened with the reinforcing heat transfer plate 13 by a plurality of setscrews 16 inserted from below into the printed circuit board 7 and the reinforcing heat transfer plate 13. A plurality of transistors 10 are screwed between the lower piece 14 a and the reinforcing heat transfer plate 13 via an insulating heat transfer cover 15 in a sandwich manner.

At this time, both ends of the reinforcing heat transfer plate 13 are pressed on a thick ground pattern 7a of the printed circuit board 7, and the ground pattern 7a is connected to the chassis 6 via a plurality of set screws 9 and brackets 8. Connected to a certain ground. Therefore, the reinforcing heat transfer plate 13 also serves as a reinforcing plate for the printed circuit board 7 and a heat radiating member for grounding the plurality of transistors 10.

The upper piece 14b of the heat transfer table 14 is inclined at a predetermined angle with respect to the lower piece 14a so as to be substantially parallel to the top plate 4a of the outer casing 4 formed in a three-dimensional curved shape. .

On the upper piece 14b of the heat transfer table 14, a heat transfer spring 17 pressed with a good heat transfer leaf spring such as beryllium copper is attached in parallel . The heat transfer spring 17 is formed by integrally forming a plurality of (for example, ten) crimping pieces 17b and stopper pieces 17c along both sides of a single band- like horizontal base plate 17a. Adjacent portions of the stopper 17b and the stopper piece 17c are separated from each other by a plurality of slits 17e. The crimping piece 17b and the stopper piece 17c are folded back from the opposite side above the base plate 17a, and the tip of each crimping piece 17b formed in a substantially mountain shape is engaged with the lower part of the tip of each stopper piece 17c. Has been stopped. Therefore, the plurality of pressure-bonding pieces 17b correspond to one base plate 17a.
In this way, they can be elastically displaced vertically within a certain range independently of each other.

[0021] Then, in parallel form via a heat transfer rubber 18 (or thermal grease) having a heat transfer property such as silicon rubber on the upper piece onto 14b of the base plate 17a of the heat transfer spring 17 is inclined in Dennetsudai 14 And a strip-shaped holding plate 20 made of a good heat-conductive sheet metal such as aluminum, which is placed in parallel on the base plate 17a and screwed on the upper piece 14b by a pair of setscrews 19. It is crimped and attached in a sandwich shape on 14b.

An elastic heat transfer rubber 21 having an appropriate thickness having elasticity and heat conductivity, such as silicon rubber, is formed on the inner surface of the top plate 4a of the outer casing 4 formed of a three-dimensional curved surface. have been adhered to the adhesion state by thermally conductive adhesive, such as glue, the elastic heat transfer rubber 21 of the outer casing 4 the top plate 4a
Is formed in a three-dimensional curved surface shape following the inner surface of the. Follow
Of the heat transfer spring 17 mounted on the heat transfer table 14
It is formed in a three-dimensional curved shape with one base plate 17a.
Between the inner surface 4a of the outer casing 4 and the inner surface of the elastic heat transfer rubber 21.
Despite uneven spacing in the vertical direction, heat transfer
All the plurality of crimping pieces 17b of the spring 17 are independent
The inner surface of the elastic heat transfer rubber 21 having the three-dimensional curved surface
Can be securely pressed from below.

According to the transistor heat radiator configured as described above, the heat generated from the plurality of transistors 10 is transmitted to the heat transfer table 14 via the insulating heat transfer cover 15. Since the lower piece 14b of the heat base 14 is elastically pressed to the plurality of transistors 10 via the insulating heat transfer cover 15, good contact between the plurality of transistors 10 and the insulating heat transfer cover 15 is obtained. The heat is efficiently transmitted to the heat transfer table 14.

The heat transmitted to the heat transfer table 14 is transferred to the heat transfer spring 17 via a heat transfer rubber 18 (or heat radiation grease).
Conveyed to. Also at this time, the base plate 1 of the heat transfer spring 17
7a is elastically pressed to the upper piece 14b of the heat transfer table 14 via the heat transfer rubber 18 (or heat radiation grease) by the holding plate 20, so that the base plate 17a and the upper piece 14b of the heat transfer table 14 With good contact, heat is efficiently transmitted to the heat transfer spring 17. Further, at this time, the holding plate 20 is
This prevents accidents such as short-circuiting on the printed circuit board 7 from accidentally dropping from the heat transfer table 14 onto the heat transfer spring 17.

Then, the plurality of crimping pieces 1 of the heat transfer spring 17
7b independently of one another so as to follow the inner surface of the three-dimensional curved shape of the outer casing 4 of the top of the three-dimensional curved surface shape that is adhered to the adhering state by thermally conductive adhesive plate 4a <br/> elastic heat transfer rubber 21 And the inner surface 4a of the top plate 4a formed into a three-dimensional curved surface and one base plate of the heat transfer table 14
The distance between the vertical direction 14b and the vertical direction 14b is not uniform.
In spite of the above, all of the plurality of crimping pieces 17b are elastically heat-transferred.
Independently can be reliably crimped so as to modeled after well in a three-dimensional curved surface of the inner surface of the rubber 21, reliably against the heat transfer spring 17 with a large contact area sufficiently in the outer casing 4 <br / > Can be touched.

At this time, the elastic heat transfer rubber 21 has an appropriate thickness and an appropriate elasticity.
In order to fit each shape well, a plurality of crimping pieces 1
It is possible to obtain a remarkably good contact state between 7b and the top plate 4a.
And the contact area can be further increased, and the heat transfer efficiency of conducting the heat of the heat transfer spring 17 to the outer casing 4 can be improved.
It can be further improved .

Therefore, according to this transistor radiator, the heat generated by the plurality of transistors 10 inside the electronic device is configured to have the maximum area in the electronic device.
That the outer casing 4 efficiently and directly conducting, transistor 10 is generated by using the outer casing 4 of the largest area to the radiator heat
Can be efficiently radiated into the atmosphere .

Since the reinforcing heat transfer plate 13 is pressed on the thick ground pattern 7a of the printed circuit board 7, a part of the heat generated by the plurality of transistors 10 is transferred to the reinforcing heat transfer plate 13 and the ground pattern 7a. The heat can also be dissipated to the ground which is the chassis 6 via the plurality of setscrews 9 and the brackets 8.

On the other hand, according to this transistor radiator, no electronic parts are attached to the inner surface of the outer casing 4 and a plurality of crimping pieces 17b of the heat transfer spring 17 are provided.
Since it can bend independently and smoothly according to the top plate 4a formed in a three-dimensional curved surface shape, the printed circuit board 7 shown in FIG. 1 of the outer casing 4 with respect to the main body 3 shown in FIGS. The attachment / detachment operation in the directions of the substantially parallel arrows a and b can be performed safely and easily, and the maintainability is very excellent.

The degree of freedom in designing the outer casing 4 can be greatly increased, for example, by forming the outer casing 4 into a three-dimensional curved surface shape.

Then, even if the outer casing 4 is removed, the heat transfer spring 17 is fixed on the heat transfer table 14 and the printed circuit board 7
No problem such as a short circuit occurs.

Also, the printed board 7 and the top plate 4a of the outer casing 4
By simply changing the height and the like of the heat transfer table 14 according to the interval H between the heat transfer spring 17 and the heat transfer spring 17, the heat transfer spring 17 can be used as it is.

As shown in FIG. 6, the width of the upper piece 14b of the heat transfer table 14 is increased, and the heat transfer springs 17 are mounted on the upper piece 14b in two or more rows. Top plate 4a
It is easy to increase the contact area of the heat transfer table 14 with the heat transfer table 14 and further increase the heat conduction efficiency.

The heat transfer table 14 can be easily formed of a sheet metal such as aluminum, and is inexpensive because it is not necessary to use an expensive extruded product such as a heat sink.

Since the printed circuit board 7 is fixed on the chassis 6 and only the crimping piece 17b of the heat transfer spring 17 is movable up and down, it is very resistant to shock and vibration.

According to the temperature measurement data of the transistor radiator, the outer case 4 was removed and the printed circuit board 7 was removed.
The temperature rise of the transistor 10 when the transistor 10, the heat transfer table 14, the heat transfer spring 17, and the like are exposed to the outside air is lower than the transistor 1 with the outer casing 4 attached.
Data indicating that the temperature rise value of 0 is lower is obtained, demonstrating the high heat dissipation effect of this heat dissipation device.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made based on the technical concept of the present invention. Further, the heat radiating device of the electronic device of the present invention is not limited to the transistor heat radiating device shown in the above embodiment, but can be applied to a heat radiating device of an IC or other various heat generating components. Ma
In the above embodiment, the plurality of crimping pieces 1 of the heat transfer spring 17 are used.
Elastic heat transfer 7b adhered to the inner surface of the top plate 14a of the outer casing 4.
The elastic heat transfer rubber 21 was pressed against the rubber 21.
Without using, a plurality of crimping pieces 17b are attached to the top plate 14a of the outer casing 4.
Needless to say, it may be directly press-bonded.

[0038]

The heat radiating device for an electronic device according to the present invention having the above-described structure has the following effects.

According to a first aspect of the present invention, there is provided a heat radiating device for an electronic device according to the present invention having the above-described structure, and has a heat transfer property in which a plurality of crimping pieces that can move independently of each other are integrally formed on one base plate. Using a heat transfer spring composed of a leaf spring, the base plate of the heat transfer spring is thermally coupled to a plurality of heat-generating components mounted side by side on a printed circuit board, and a plurality of crimping pieces of the heat transfer spring are attached to an outer casing. The outer casing is formed in a three-dimensional curved surface shape so as to be pressed independently of each other so as to follow the inner face of the outer casing, and the inner face of the outer casing and one base of the heat transfer spring
Even if the distance from the plate is not uniform,
All the crimping pieces of the heat transfer spring are independent on the inner surface of the
Can be pressed securely, and its three-dimensional curved surface
Heat transfer spring on the inner surface of the outer case with sufficient contact area.
You can actually make contact. Therefore, the heat of the heat-generating components is efficiently and directly conducted to the outer casing, and the plurality of heat-generating portions inside the outer casing are formed.
The heat generated by the product should be
To efficiently radiate heat into the atmosphere .

According to the first aspect, the plurality of crimping pieces can be smoothly bent independently of each other with respect to the three-dimensionally curved outer casing when the outer casing is attached or detached. It can be performed and is excellent in maintainability.

According to the first aspect, the degree of freedom in designing the outer case is high, for example, by forming the outer case into a three-dimensional curved surface shape.

According to the first aspect of the present invention, the base plate of the heat transfer spring is fixed to the chassis via the printed board, and only the crimped piece of the heat transfer spring can be moved with respect to the outer casing. This
From the, very strong against shock and vibration.

According to a second aspect of the present invention, a heat transfer table having heat conductivity is pressed on a plurality of heat-generating components and mounted on a printed circuit board, and a base plate of a heat transfer spring is pressed and mounted on the heat transfer table. Therefore, even when tall parts such as capacitors are mounted on the same printed circuit board, even when the distance between the printed circuit board and the outer case must be large,
By changing the dimensions of the heat transfer table, the same heat transfer spring can be used as it is, so that the heat transfer loss does not increase at all.

Claims 3 and 5 are in close contact with the inner surface of the outer casing.
If a plurality of crimping pieces of the heat transfer spring are crimped to the elastic heat transfer rubber having elasticity and heat transfer attached to the heat transfer spring, or the heat transfer springs are mounted on the heat transfer table in a plurality of rows, A very good contact with the housing can be obtained.
In addition, the contact area can be further increased, and the heat conduction efficiency can be further improved.

[0045] Claim 4, be attached and pressed on the thermal conductive base using a plate pressing the base plate of the heat transfer spring, since the good contact with the heat transfer spring and the heat transfer base is obtained, the thermal conductivity Efficiency can be further improved.

[Brief description of the drawings]

FIG. 1 is a side view of a main part of a transistor heat dissipation device according to an embodiment of the present invention, taken along line AA of FIG. 2;

FIG. 2 is a cross-sectional side view taken along line BB of FIG.

FIG. 3 is a plan view as viewed in the direction of arrows CC in FIG. 1;

FIG. 4 is a perspective view of a heat transfer spring and a heat transfer table.

FIG. 5 is a perspective view of the outer casing.

FIG. 6 is a transparent perspective view of an outer casing showing a modification of the heat transfer spring and the heat transfer table.

FIG. 7 is a side view of the studio video camera.

FIG. 8 is a rear view of the studio video camera.

[Explanation of symbols]

 Reference Signs List 4 outer casing 6 chassis 7 printed circuit board 10 transistor (heat generating component) 13 reinforcing heat transfer plate 14 heat transfer table 15 insulating heat transfer rubber 17 heat transfer spring 17a base plate of heat transfer spring 17b crimping piece of heat transfer spring 20 press plate 21 Elastic heat transfer rubber

Claims (5)

(57) [Claims] The heat of a plurality of heat-generating components mounted side by side on a printed circuit board is directly conducted to a heat-radiating outer casing ,
A heat dissipating device for an electronic device that dissipates the heat to the atmosphere using an outer casing, comprising a heat-conductive leaf spring in which a plurality of crimping pieces that can move independently of each other are integrally formed on one base plate. A heat transfer spring is provided, a base plate of the heat transfer spring is thermally coupled to the plurality of heat generating components, and a plurality of crimp pieces of the heat transfer spring are connected to the outer casing .
A heat radiating device for an electronic device, wherein the heat radiating device is pressed independently of each other so as to follow the inner surface . 2. A heat transfer base having heat conductivity is pressed on said plurality of heat-generating components and mounted on said printed circuit board, and a base plate of said heat transfer spring is mounted on said heat transfer base by pressing. The heat radiating device for an electronic device according to claim 1, wherein: 3. An elastic heat transfer rubber having elasticity and heat conductivity is attached to an inner surface of the outer casing in a tightly contacted state, and a plurality of crimping pieces of the heat transfer spring are crimped to the elastic heat transfer rubber. The heat radiating device for an electronic device according to claim 1 or 2, wherein 4. The heat radiating device for an electronic device according to claim 2, wherein a base plate of said heat transfer spring is mounted on said heat transfer table by pressing using a holding plate. 5. The heat radiating device according to claim 2, wherein said heat transfer springs are mounted in a plurality of rows on said heat transfer table.