JPH0543482Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling structure for an integrated circuit, and particularly to a cooling structure for an integrated circuit that can cool an integrated circuit regardless of the mounting height or inclination of the integrated circuit.

[Prior Art] Conventionally, as shown in FIG. 3, this type of integrated circuit cooling structure includes a cooling pipe installed on each heat release surface 3 of a plurality of integrated circuit cases 2 mounted on a printed wiring board 1. 5 was directly soldered to 7 and cooled.

[Problems to be solved by the invention] In the conventional integrated circuit cooling structure described above, the cooling pipe 5 is directly attached to the integrated circuit case 2, which is the heat-generating surface, by soldering 7. Although it can be expected to have excellent effects, it has the following drawbacks.

Depending on how the multiple integrated circuit cases 2 are mounted on the printed wiring board 1, it is very difficult to mount them all at the same height, and it is difficult to fit them into the highly rigid cooling pipe 5. As a result, force is applied to the cooling pipe 5 and the integrated circuit case 2, resulting in bending damage and the like.

Furthermore, when maintaining or replacing the integrated circuit case 2 attached to the printed wiring board 1, it is necessary to apply heat to melt the solder 7, resulting in the disadvantage that a great deal of labor is required.

[Means for Solving the Problems] The present invention has been made to solve the above-mentioned conventional problems, and as a means for solving the problems, an integrated circuit case having an integrated circuit chip inside,
a cooling pipe having a refrigerant passage therein; and a spring-shaped, highly thermally conductive heat conductive plate having a holding part for inserting and holding the cooling pipe and having one or both sides thereof in contact with the heat dissipation surface of the integrated circuit case. The present invention provides a cooling structure for an integrated circuit, comprising the integrated circuit and a printed wiring board on which a heat conductive plate is mounted and fixed.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a cross-sectional view showing an integrated circuit cooling structure according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an integrated circuit cooling structure according to another embodiment.

The integrated circuit cooling structure shown in FIG. 1 includes a cooling pipe 5 having a refrigerant passage therein, and a heat conduction plate 4 having a holding portion 4a for holding the cooling pipe 5.

The heat conduction plate 4 is made of a material with excellent heat conduction, and has a shape in which a holding part 4a having a substantially U-shaped cross section is located in the center, and pressing parts 4b that are open horizontally on both sides of the upper end of the holding part 4a. 4b is located in the shape of a spring. The heat conduction plate 4 includes an integrated circuit case 2, which has a cooling pipe 5 fitted into a holding part 4a and is mounted on a printed wiring board 1 with pressing parts 4b, 4b on both sides.
2 is pressed onto the printed wiring board 1 with screws or the like. Pressing parts 4b, 4b on both sides
is in sufficient contact with the heat dissipation surface 3 of the integrated circuit case 2.

Next, the operation of this embodiment will be explained.

The heat released from the heat release surface 3 of the integrated circuit case 2 is transmitted to the pressing parts 4b, 4b of the heat conduction plate 4,
It reaches the holding part 4a. The heat reaching the holding part 4a is transmitted to the refrigerant in the cooling pipe 5 held by the holding part 4a, and is cooled by this refrigerant.

Therefore, the cooling structure of this embodiment cools the two integrated circuit cases 2 through one heat conduction plate 4, and is therefore suitable for cases where the heat generated by the integrated circuits is relatively small. Furthermore, since the heat conductive plate 4 has a spring shape, it easily follows the height and inclination of the integrated circuit case 2, and the integrated circuit case 2 can be removed by lightly lifting the pressing part 4b in the direction of arrow A. This can be easily done by

In the integrated circuit cooling structure according to the other embodiment shown in FIG.
This cooling structure differs from the cooling structure shown in FIG. 1 in that it has a pressing portion 14b located horizontally on one side of the upper end of the cooling structure.

Therefore, the cooling structure of this embodiment cools one integrated circuit case 2 through one heat conduction plate 14, and is therefore suitable for cases where the heat generated by the integrated circuit is relatively large.

The other configurations, functions, and effects are the same as the integrated circuit cooling structure according to the embodiment shown in FIG.

[Effects of the invention] As explained above, the present invention has a cooling pipe having a refrigerant passage therein, a holding part for inserting and holding the cooling pipe, and one or both sides of which are connected to the heat release surface of the integrated circuit case. The integrated circuit cooling structure includes a spring-shaped heat conductive plate with good thermal conductivity and a printed wiring board that mounts and fixes the integrated circuit and the heat conductive plate, so it can easily absorb the unevenness of the integrated circuit and improve the integration. This has the effect of making it possible to easily replace the circuit, and also has the effect of providing a relatively inexpensive cooling structure for integrated circuits.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an integrated circuit cooling structure according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an integrated circuit cooling structure according to another embodiment. Further, FIG. 3 is a sectional view showing a conventional cooling structure for an integrated circuit. 1...Printed wiring board, 2...Integrated circuit case, 3...Heat release surface, 4, 14...Heat conduction plate, 4
a, 14a... Holding part, 4b, 14b... Pressing part, 5... Cooling pipe, 7... Solder.

Claims (1)

[Scope of utility model registration request] An integrated circuit case having an integrated circuit chip inside, a cooling pipe having a refrigerant passage inside, and a holding part for inserting and holding the cooling pipe, one or both sides of which are in contact with the heat emitting surface of the integrated circuit case. A spring-shaped heat conductive plate with good thermal conductivity,
A cooling structure for an integrated circuit, comprising the integrated circuit and a printed wiring board on which a heat conductive plate is mounted and fixed.