KR101281043B1 - Heat sink - Google Patents

Abstract

In the heat sink according to the present invention, a heat transfer part that penetrates the substrate and contacts the power element is formed by soldering, and heat generated from the power element is directly transferred to the heat sink through the heat transfer part to radiate heat, thereby more effectively dissipating the power element. The second solder layer between the support and the circuit board does not melt even if the first solder layer between the heat transfer unit and the power device is melted by heat transferred directly through the heat transfer unit due to a plurality of support parts protruding from the circuit board. The contact force of the heat sink can be maintained.

Description

Heat Sink {HEAT SINK}

The present invention relates to a heat sink, and more particularly to a heat sink for heat dissipation of a power device installed on a circuit board.

In general, the heat sink is a member that is used to heat the heat generated from various electronic components with heat exchange with the air, attached to a circuit board.

As shown in FIG. 1, the heat sink 1 is installed on the opposite side of the circuit board 2 on which one surface of the power element 3 is installed, so as to dissipate heat generated from the power element 3. The circuit board 2 includes a plurality of heat transfer members 2a formed of a material having high thermal conductivity such as metal so that heat generated from the power device 3 can be easily transferred to the heat sink 1 to dissipate heat. It is installed so as to pass through. Therefore, heat generated in the power device 3 is transmitted to the heat sink 1 through the circuit board 2 through the heat transfer member 2a, thereby dissipating heat in the heat sink 1.

At this time, the power device 3 is fixed to the circuit board 2 through the soldering operation, the heat sink 1 is fixed to the circuit board 2 through the heat-sensitive adhesive, so that one surface and the wave of the circuit board 2 A solder layer 4 is formed between the war elements 3, and an adhesive layer 5 is formed between the heat sink 1 and the opposite side of the circuit board 2.

However, such a conventional heat sink is complicated to manufacture since a heat transfer member must be installed on a circuit board, and even though a heat transfer adhesive is used, the heat transfer rate of the heat transfer adhesive is lower than that of metals, so that the heat of the power device is smoothly transferred to the heat sink. Therefore, there is a problem in that the heat radiation effect of the power device by the heat sink is low.

The present invention is to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a heat sink that can be made simple and more efficient heat dissipation of the power device.

The present invention for achieving the above object relates to a heat sink which is provided on the opposite side of the circuit board is provided with a power device on one surface,

The heat sink is provided with a heat transfer part penetrating the circuit board and contacting the power device through soldering, and a plurality of supporting parts attached to the opposite side of the circuit board through soldering to improve the contact force of the heat sink. do.

The heat transfer part protrudes from a central portion of the heat sink, and the support part protrudes from a corner of the heat sink.

A first solder layer is formed between the heat transfer part and the power device, and a second solder layer is formed between the supporting part and the circuit board.

The circuit board is provided with a through hole through which the heat transfer part is installed.

As described above, the heat sink according to the present invention has a heat transfer portion that protrudes through the circuit board and contacts the power element, so that the heat of the power element is directly transmitted to the heat sink through the heat transfer portion, thereby simplifying the manufacture of the heat sink. The heat of the power device has an effect that can be more effectively transferred to the heat sink to dissipate heat.

In addition, the heat sink according to the present invention is provided with a plurality of supporting parts attached to the opposite side of the circuit board by the soldering operation, even if the first solder layer between the heat transfer unit and the power element is melted by the heat transferred to the heat transfer unit. It is also possible to maintain contact force.

Hereinafter, one preferred embodiment of the present invention will be described in detail with reference to the drawings.

The heat sink 10 according to the embodiment of the present invention is installed on the opposite side of the circuit board 20 in which the power device 30 is installed on one surface as shown in FIGS. 2 and 3. It is used to dissipate the generated heat, and is made in a thin plate shape as shown. The thin plate-shaped heat sink 10 may be formed through press working.

In the heat sink 10, the heat transfer part 11 protrudes from the center of one surface of the heat sink 10 so that heat dissipation of the power device 30 can be more effectively performed, and the heat sink 1 is press-processed. Is formed. The heat transfer part 11 penetrates the circuit board 20 and comes into contact with the power device 30 to receive heat directly from the power device 30. For this purpose, the heat transfer part 11 is provided in the circuit board 20. The through hole 25 is provided to be installed through. In addition, the heat transfer part 11 of the heat sink 10 is in direct contact with the power device 30 through a soldering operation. As a result, a first solder layer (between the heat transfer part 11 and the power device 30) may be used. 40) is provided.

That is, in the embodiment of the present invention, since the heat sink 10 receives heat directly from the power device 30 through the heat transfer unit 11, the heat of the power device 30 is more effectively applied to the heat sink 10. The heat dissipation of the power device 30 through the heat sink 10 can be achieved more effectively.

On the other hand, the heat sink 10 according to the embodiment of the present invention is provided with a plurality of support portions 13 protruding from the four corner portions of the heat sink 10. The plurality of supports 13 may be formed during press working of the heat sink 10 like the heat transfer part 11. In addition, the plurality of support parts 13 are attached to the opposite side of the circuit board 20 by soldering, and thus, a plurality of support parts 13 are formed between the support part 13 of the heat sink 10 and the opposite side of the circuit board 20. The two solder layer 50 is provided.

That is, in the exemplary embodiment of the present invention, as the heat transfer part 11 of the heat sink 10 receives heat directly from the power element 30, the first solder layer 40 melts, so that the contact force of the heat sink 10 is increased. The second solder layer 50 may be disposed between the upper surface of the support part 13 protruding from the four corners of the heat sink 10 and the opposite side of the circuit board 20. Heat transmitted to 11 may not affect the second solder layer 50 to maintain the contact force of the heat sink 10.

1 is a cross-sectional view showing a conventional heat sink attachment structure.

2 is a cross-sectional view showing a heat sink attachment structure according to the present invention.

3 is a perspective view illustrating a heat sink according to the present invention.

Explanation of symbols on the main parts of the drawings

10: heat sink 11: heat transfer unit

13 support 20: circuit board

25: through hole 30: power element

40: first solder layer 50: second solder layer

Claims (4)

In the heat sink is provided on the opposite side of the circuit board on which one side the power element is installed, The heat sink directly receives heat generated from the power device and heat transfers through the circuit board to contact the power device through soldering to increase heat dissipation effect, and heat transfer by heat generated from the power device. In order to maintain contact between the heat transfer unit and the power element even if the contact force between the unit and the power element is reduced, a plurality of supports are attached to the opposite side of the circuit board through soldering to improve the contact force of the heat sink. Heat sink. The method of claim 1, The heat transfer portion protrudes from the center of the heat sink, And the support portion protrudes from the corners of the heat sink. The method of claim 2, A first solder layer is formed between the heat transfer part and the power device. And a second solder layer formed between the support portion and the circuit board. The method of claim 1, The circuit board has a heat sink, characterized in that the through-hole provided through the heat transfer unit is provided.

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