KR20100052069A - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
KR20100052069A
KR20100052069A KR1020080110936A KR20080110936A KR20100052069A KR 20100052069 A KR20100052069 A KR 20100052069A KR 1020080110936 A KR1020080110936 A KR 1020080110936A KR 20080110936 A KR20080110936 A KR 20080110936A KR 20100052069 A KR20100052069 A KR 20100052069A
Authority
KR
South Korea
Prior art keywords
heat sink
heat
circuit board
power device
heat transfer
Prior art date
Application number
KR1020080110936A
Other languages
Korean (ko)
Other versions
KR101281043B1 (en
Inventor
고수현
Original Assignee
주식회사 만도
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 만도 filed Critical 주식회사 만도
Priority to KR1020080110936A priority Critical patent/KR101281043B1/en
Publication of KR20100052069A publication Critical patent/KR20100052069A/en
Application granted granted Critical
Publication of KR101281043B1 publication Critical patent/KR101281043B1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)

Abstract

PURPOSE: A heat sink is provided to enhance the heat radiating effect by forming a heat transfer part contacting with a power device through a circuit board. CONSTITUTION: A heat sink(10) is installed at one side of a circuit board(20). The heat sink comprises a heat transfer part(11), and a plurality of supporting parts(13). The heat transfer part passes through the circuit board, and contacts with a power device through a soldering process. The power device is installed at the other side of the circuit board. The heat transfer part is projected from the central part of the heat sink. The supporting parts are attached to the other side of the circuit board through the soldering process, and improve the contact strength of the heat sink. The supporting parts are formed at the 4 corners of the heat sink.

Description

Heat Sink {HEAT SINK}

The present invention relates to a heat sink, and more particularly to a heat sink for heat dissipation of a power device installed on a circuit board.

In general, the heat sink is a member that is used to heat the heat generated from various electronic components with heat exchange with the air, attached to a circuit board.

As shown in FIG. 1, the heat sink 1 is installed on the opposite side of the circuit board 2 on which one surface of the power element 3 is installed, so as to dissipate heat generated from the power element 3. The circuit board 2 includes a plurality of heat transfer members 2a formed of a material having high thermal conductivity such as metal so that heat generated from the power device 3 can be easily transferred to the heat sink 1 to dissipate heat. It is installed so as to pass through. Therefore, heat generated in the power device 3 is transmitted to the heat sink 1 through the circuit board 2 through the heat transfer member 2a, thereby dissipating heat in the heat sink 1.

At this time, the power device 3 is fixed to the circuit board 2 through the soldering operation, the heat sink 1 is fixed to the circuit board 2 through the heat-sensitive adhesive, so that one surface and the wave of the circuit board 2 A solder layer 4 is formed between the war elements 3, and an adhesive layer 5 is formed between the heat sink 1 and the opposite side of the circuit board 2.

However, such a conventional heat sink is complicated to manufacture because a heat transfer member must be installed on a circuit board, and even though a heat transfer adhesive is used, the heat transfer rate of the heat transfer adhesive is lower than that of metals, so that the heat of the power device is smoothly transferred to the heat sink. Therefore, there is a problem in that the heat radiation effect of the power device by the heat sink is low.

The present invention is to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a heat sink that can be made simple and more efficient heat dissipation of the power device.

The present invention for achieving the above object relates to a heat sink which is provided on the opposite side of the circuit board is provided with a power device on one surface,

The heat sink is provided with a heat transfer part penetrating the circuit board and contacting the power device through soldering, and a plurality of supporting parts attached to the opposite side of the circuit board through soldering to improve the contact force of the heat sink. do.

The heat transfer part protrudes from a central portion of the heat sink, and the support part protrudes from a corner of the heat sink.

A first solder layer is formed between the heat transfer part and the power device, and a second solder layer is formed between the supporting part and the circuit board.

The circuit board is provided with a through hole through which the heat transfer part is installed.

As described above, the heat sink according to the present invention has a heat transfer portion that protrudes through the circuit board and contacts the power element, so that the heat of the power element is directly transmitted to the heat sink through the heat transfer portion, thereby simplifying the manufacture of the heat sink. The heat of the power device has an effect that can be more effectively transferred to the heat sink to dissipate heat.

In addition, the heat sink according to the present invention is provided with a plurality of supporting parts attached to the opposite side of the circuit board by the soldering operation, even if the first solder layer between the heat transfer unit and the power element is melted by the heat transferred to the heat transfer unit. It is also possible to maintain contact force.

Hereinafter, one preferred embodiment of the present invention will be described in detail with reference to the drawings.

The heat sink 10 according to the embodiment of the present invention is installed on the opposite side of the circuit board 20 in which the power device 30 is installed on one surface as shown in FIGS. 2 and 3. It is used to dissipate the generated heat, and is made in a thin plate shape as shown. The thin plate-shaped heat sink 10 may be formed through press working.

The heat sink 10 protrudes from the heat sink 10 at the center of one surface of the heat sink 10 so that heat dissipation of the power device 30 can be more effectively performed in the heat sink 10. Is formed. The heat transfer part 11 penetrates the circuit board 20 and comes into contact with the power device 30 to receive heat directly from the power device 30. For this purpose, the heat transfer part 11 is provided in the circuit board 20. The through hole 25 is provided to be installed through. In addition, the heat transfer part 11 of the heat sink 10 is in direct contact with the power device 30 through a soldering operation. As a result, a first solder layer (between the heat transfer part 11 and the power device 30) is formed. 40) is provided.

That is, in the embodiment of the present invention, since the heat sink 10 receives heat directly from the power device 30 through the heat transfer unit 11, the heat of the power device 30 is more effectively applied to the heat sink 10. The heat dissipation of the power device 30 through the heat sink 10 can be achieved more effectively.

On the other hand, the heat sink 10 according to the embodiment of the present invention is provided with a plurality of support portions 13 protruding from the four corner portions of the heat sink 10. The plurality of supports 13 may be formed during press working of the heat sink 10 like the heat transfer part 11. In addition, the plurality of support parts 13 are attached to the opposite side of the circuit board 20 by soldering, and thus, a plurality of support parts 13 are formed between the support part 13 of the heat sink 10 and the opposite side of the circuit board 20. The two solder layer 50 is provided.

That is, in the exemplary embodiment of the present invention, as the heat transfer part 11 of the heat sink 10 receives heat directly from the power element 30, the first solder layer 40 melts, so that the contact force of the heat sink 10 is increased. The second solder layer 50 may be disposed between the upper surface of the support part 13 protruding from the four corners of the heat sink 10 and the opposite side of the circuit board 20. Heat transmitted to 11 may not affect the second solder layer 50 to maintain the contact force of the heat sink 10.

1 is a cross-sectional view showing a conventional heat sink attachment structure.

2 is a cross-sectional view showing a heat sink attachment structure according to the present invention.

3 is a perspective view illustrating a heat sink according to the present invention.

Explanation of symbols on the main parts of the drawings

10: heat sink 11: heat transfer unit

13 support 20: circuit board

25: through hole 30: power element

40: first solder layer 50: second solder layer

Claims (4)

In the heat sink is provided on the opposite side of the circuit board on which one side the power element is installed, The heat sink is provided with a heat transfer part that penetrates the circuit board and contacts the power device through soldering, and a plurality of support parts are attached to the opposite side of the circuit board through soldering to improve a contact force of the heat sink. Heat sink, characterized in that. The method of claim 1, The heat transfer portion protrudes from the center of the heat sink, And the support portion protrudes from the corners of the heat sink. The method of claim 2, A first solder layer is formed between the heat transfer part and the power device. And a second solder layer formed between the support portion and the circuit board. The method of claim 1, The circuit board has a heat sink, characterized in that the through-hole provided through the heat transfer unit is provided.
KR1020080110936A 2008-11-10 2008-11-10 Heat sink KR101281043B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080110936A KR101281043B1 (en) 2008-11-10 2008-11-10 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080110936A KR101281043B1 (en) 2008-11-10 2008-11-10 Heat sink

Publications (2)

Publication Number Publication Date
KR20100052069A true KR20100052069A (en) 2010-05-19
KR101281043B1 KR101281043B1 (en) 2013-07-09

Family

ID=42277506

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080110936A KR101281043B1 (en) 2008-11-10 2008-11-10 Heat sink

Country Status (1)

Country Link
KR (1) KR101281043B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160118781A (en) * 2015-04-03 2016-10-12 엘지이노텍 주식회사 Embedded printed circuit board
KR102339303B1 (en) * 2021-05-03 2021-12-14 김성기 Ice box with refrigeration function

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
JPH1163862A (en) * 1997-08-22 1999-03-05 Furukawa Electric Co Ltd:The Plate type heat pipe and cooling structure using it
JP3851875B2 (en) 2003-01-27 2006-11-29 株式会社東芝 Cooling device and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160118781A (en) * 2015-04-03 2016-10-12 엘지이노텍 주식회사 Embedded printed circuit board
KR102339303B1 (en) * 2021-05-03 2021-12-14 김성기 Ice box with refrigeration function

Also Published As

Publication number Publication date
KR101281043B1 (en) 2013-07-09

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