JP4741947B2 - Electronic component assembly - Google Patents

Electronic component assembly Download PDF

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JP4741947B2
JP4741947B2 JP2005377215A JP2005377215A JP4741947B2 JP 4741947 B2 JP4741947 B2 JP 4741947B2 JP 2005377215 A JP2005377215 A JP 2005377215A JP 2005377215 A JP2005377215 A JP 2005377215A JP 4741947 B2 JP4741947 B2 JP 4741947B2
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heat
conductive sheet
heat conductive
electronic component
sheet
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JP2007180281A (en
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学 小野
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Description

本発明は、例えばＩＣチップ等から発生する熱を放熱するための熱伝導シートの技術に関する。   The present invention relates to a technique of a heat conductive sheet for radiating heat generated from, for example, an IC chip.

近年、ノートブックタイプのコンピュータやデジタルカメラ等の多くの電子機器には、発熱するチップ状の電子部品が搭載されており、その電子部品の放熱を行うため熱伝導シートが用いられている（例えば特許文献１参照）。   In recent years, many electronic devices such as notebook computers and digital cameras have mounted chip-like electronic components that generate heat, and a heat conductive sheet is used to radiate the electronic components (for example, Patent Document 1).

従来、この種の熱伝導シートにおいては、電子部品に貼付する際に、電子部品との間に空気溜り（混入）が生じやすいという問題がある。この空気溜りは、断熱機能となり目的とする熱伝導機能を阻害する原因となる。   Conventionally, in this type of heat conductive sheet, there is a problem that air retention (mixing) is likely to occur between the electronic component and the electronic component. This air pool becomes a heat insulating function and becomes a cause of hindering a target heat conduction function.

このような空気溜りを生じさせることなく熱伝導シートを被着体に貼付するためには貼付の際に被着体と熱伝導シートを密着させることが必要であるが、貼付の際に被着体と熱伝導シート間の密着性を確保することは、特殊な冶具の使用や作業者の熟練等を必要とするので容易ではない。
特開２００４−３３１８３５号公報 In order to apply the heat conductive sheet to the adherend without causing such air pockets, it is necessary to adhere the adherend and the heat conductive sheet at the time of application. Ensuring the adhesion between the body and the heat conductive sheet is not easy because it requires the use of special jigs and the skill of the operator.
JP 2004-331835 A

本発明は、このような従来の技術の課題を解決するためになされたもので、ＩＣチップ等の被着体に対する密着性を向上させて貼付時の空気の混入を確実に防止しうる熱伝導シートを有する電子部品組立体を提供することを目的とする。 The present invention has been made in order to solve the above-described problems of the prior art, and improves the adhesion to an adherend such as an IC chip, thereby preventing air contamination during application. An object of the present invention is to provide an electronic component assembly having a sheet.

上記目的を達成するためになされた請求項１記載の発明は、基板上に実装された所定の電子部品と所定の放熱部材との間に熱伝導シートが配置されている電子部品組立体であって、前記放熱部材に、前記熱伝導シートを位置決め支持する位置決め支持部と所定の固定具を係止する係止部を設けるとともに、前記基板に、前記固定具を係止する係止部を設け、前記熱伝導シートを前記放熱部材の位置決め支持部によって支持した状態で、前記放熱部材の係止部と前記基板の係止部とに前記固定具を係合して当該放熱部材と当該基板を位置決め固定することにより、当該熱伝導シートを当該放熱部材と当該電子部品に密着させるように構成され、前記放熱部材の位置決め支持部が、当該放熱部材の前記電子部品と対向する部分に設けた凹部又は枠部であり、前記熱伝導シートは、その中央部分の厚さが周縁部分の厚さより厚く、かつ、全体形状が凸レンズ形状となるようにシート本体部上に凸状密着部が設けられるとともに、当該シート本体部に対する前記凸状密着部の厚さの比が０．０５〜０．２である電子部品組立体である。 In order to achieve the above object, an invention according to claim 1 is an electronic component assembly in which a heat conductive sheet is disposed between a predetermined electronic component mounted on a substrate and a predetermined heat radiating member. The heat dissipating member is provided with a positioning support portion for positioning and supporting the heat conductive sheet and a locking portion for locking the predetermined fixing tool, and a locking portion for locking the fixing tool is provided on the substrate. In a state where the heat conductive sheet is supported by the positioning support portion of the heat radiating member, the fixing member is engaged with the engaging portion of the heat radiating member and the engaging portion of the substrate, and the heat radiating member and the substrate are By positioning and fixing, the heat conductive sheet is configured to be in close contact with the heat radiating member and the electronic component, and the positioning support portion of the heat radiating member is provided in a portion facing the electronic component of the heat radiating member. Or frame The heat conductive sheet is provided with a convex contact portion on the sheet main body so that the thickness of the central portion is larger than the thickness of the peripheral portion, and the overall shape is a convex lens shape, and the sheet In the electronic component assembly, the thickness ratio of the convex contact portion to the main body portion is 0.05 to 0.2 .

本発明にあっては、熱伝導シートの中央部分の厚さが周縁部分の厚さより厚くなるようにシート本体部上に凸状密着部が設けられていることから、被着体に接触させて加圧した場合にシートの中央部分が確実に被着体に密着するようになり、その結果、作業者の熟練度及び作業環境を問わず、熱伝導シートの貼付の際に空気の混入を防止して放熱機能の維持を図ることができる。 In the present invention, since the convex contact portion is provided on the sheet main body so that the thickness of the central portion of the heat conductive sheet is thicker than the thickness of the peripheral portion, it is brought into contact with the adherend. When pressed, the center part of the sheet comes into close contact with the adherend, and as a result, air can be prevented from adhering to the heat conductive sheet regardless of the skill level and working environment of the worker. Thus, the heat dissipation function can be maintained.

本発明においては、当該シートの全体形状が凸レンズ形状となるように構成されていることから、より確実に熱伝導シートを被着体に密着させることができ、しかも容易に製造することができる。 In the present invention, it is possible overall shape of the sheet since it is configured to be a convex lens shape, it is possible to more reliably in close contact with the heat conductive sheet to an adherend, yet easily manufactured.

本発明においては、シート本体部の両面側の部分に凸状密着部が設けられていることから、熱伝導シートの両面側においてより確実に被着体に密着させることができるので、放熱機能の維持をより確実にすることができる。 In the present invention, since the convex contact portions are provided on both sides of the sheet main body, it is possible to more reliably adhere to the adherend on both sides of the heat conductive sheet. Maintenance can be made more reliable.

本発明においては、シート本体部の厚さに対する凸状密着部の厚さの比が、０．０５〜０．２となるように構成されていることから、熱伝導シートの貼付の際に空気の混入を最小限にすることが可能になる。 In the present invention, the ratio of the thickness of the convex contact portion to the thickness of the sheet body portion, the air from it is configured such that 0.05 to 0.2, upon application of the heat conduction sheet It becomes possible to minimize contamination.

一方、本発明の電子部品組立体においては、基板上に実装された所定の電子部品と所定の放熱部材との間に上述した熱伝導シートが配置されていることから、電子部品から発生する熱を放熱部材に確実に伝えることができるので、放熱機能の高い電子機器を製造することができる。 On the other hand, in the electronic component assembly of the present invention, generated from the thermal conductive sheet is arranged as described above between the predetermined electronic component and a predetermined heat radiation member which is mounted on a substrate, the electronic component heat Can be reliably transmitted to the heat radiating member, so that an electronic device having a high heat radiating function can be manufactured.

この場合、熱伝導シートの凸状密着部が電子部品側に配置されていれば、凸状密着部がシート本体部の一方の面に形成されている熱伝導シートを用いる場合に電子部品にシートを密着させて確実に放熱機能を発揮させることができる。   In this case, if the convex contact portion of the heat conductive sheet is arranged on the electronic component side, the sheet is attached to the electronic component when using the heat conductive sheet in which the convex contact portion is formed on one surface of the sheet main body portion. Can be brought into close contact with each other to reliably exhibit a heat radiation function.

また、本発明においては、熱伝導シートを位置決め支持する位置決め支持部と所定の固定具を係止する係止部を放熱部材に設けるとともに、この固定具を係止する係止部を基板に設け、熱伝導シートを放熱部材の位置決め支持部によって支持した状態で放熱部材の係止部と基板の係止部とに固定具を係合して放熱部材と基板を位置決め固定することにより熱伝導シートを放熱部材と電子部品に密着させるように構成すれば、作業者の熟練度及び作業環境を問わず、熱伝導シートの凸状密着部を常に放熱部材又は電子部品の最適位置に位置決めして密着させることができ、これにより貼付の際に空気の混入を確実に防止して放熱機能の維持を図ることができる。 In the present invention, it is provided on the heat radiating member an engagement portion for engaging the positioning support part and a predetermined fixture for positioning and supporting the heat conducting sheet is provided with a locking portion for locking the fastener to the substrate In a state where the heat conductive sheet is supported by the positioning support portion of the heat radiating member, the heat conductive sheet is positioned and fixed by engaging the fixing member with the locking portion of the heat radiating member and the locking portion of the substrate. If the heat sink is configured to be in close contact with the heat dissipating member and the electronic component, the convex contact portion of the heat conductive sheet is always positioned at the optimum position of the heat dissipating member or electronic component regardless of the skill level of the worker and the work environment. Thus, it is possible to reliably prevent air from being mixed during sticking and maintain the heat radiation function.

本発明によれば、作業者の熟練度及び作業環境を問わず、熱伝導シートの貼付の際に確実に被着体に密着させることができるので、空気の混入を防止して放熱機能の維持を図ることができる。   According to the present invention, regardless of the skill level of the worker and the work environment, the heat conductive sheet can be reliably adhered to the adherend, so that the mixing of air is prevented and the heat radiation function is maintained. Can be achieved.

以下、本発明の好ましい実施の形態を図面を参照して詳細に説明する。
図１（ａ）は、本発明に用いる熱伝導シートの外観構成を示す斜視図、図１（ｂ）は、同熱伝導シートの外観構成を示す側面説明図、図１（ｃ）は、同熱伝導シートの寸法関係を示す側面説明図である。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
1 (a) is a perspective view showing an external configuration of the heat conduction sheet Ru used in the present invention, FIG. 1 (b), side view of outline configuration of the thermally conductive sheet, FIG. 1 (c), It is side surface explanatory drawing which shows the dimensional relationship of the heat conductive sheet.

図１（ａ）〜（ｃ）に示すように、本実施の形態の熱伝導シート１は、所定の熱伝導材料からなり、例えば四角形状のシート本体部２の一方の面に凸状密着部３が設けられている。
これにより、熱伝導シート１は、当該シートの中央部分の厚さが周縁部分の厚さより厚く、全体形状として湾曲面を有する凸レンズ形状となるように構成されている。 As shown in FIGS. 1A to 1C, the heat conductive sheet 1 of the present embodiment is made of a predetermined heat conductive material, and has, for example, a convex contact portion on one surface of a rectangular sheet main body portion 2. 3 is provided.
Thereby, the heat conductive sheet 1 is configured such that the central portion of the sheet is thicker than the peripheral portion and has a convex lens shape having a curved surface as a whole.

本発明の場合、シートの材料である熱伝導材料は、従来公知の材料を使用することができる。このような材料としては、例えば、酸化アルミニウム及びシリコーン樹脂を含有するものがあげられる。   In the case of the present invention, a conventionally known material can be used as the heat conductive material that is a material of the sheet. Examples of such a material include those containing aluminum oxide and silicone resin.

また、本発明の場合、凸状密着部３の厚さ（高さ）は特に限定されることはないが、被着体に対する密着性を向上させる観点からは、シート本体部２の厚さＴに対し、凸状密着部３の厚さｔが０．０５Ｔ〜０．２Ｔとなるように構成することが好ましい。   In the present invention, the thickness (height) of the convex contact portion 3 is not particularly limited, but from the viewpoint of improving the adhesion to the adherend, the thickness T of the sheet main body portion 2 is used. On the other hand, it is preferable that the thickness t of the convex contact portion 3 is 0.05T to 0.2T.

より具体的には、シート本体部２の厚さＴが０．２〜５．０ｍｍで、したがって、凸状密着部３の厚さｔが０．０１〜１．０ｍｍの熱伝導シートに好適に適用することができる。
なお、本発明は、一般的な熱伝導シートと同様、３０ｍｍ×３０ｍｍ以下の大きさを有する熱伝導シートに好適に適用することができるものである。 More specifically, the thickness T of the sheet main body 2 is 0.2 to 5.0 mm, and therefore, suitable for a heat conductive sheet having a thickness t of the convex contact portion 3 of 0.01 to 1.0 mm. Can be applied.
In addition, this invention can be applied suitably to the heat conductive sheet which has a magnitude | size of 30 mm x 30 mm or less similarly to a general heat conductive sheet.

図２は、本発明の他の実施の形態における熱伝導シートの外観構成を示す側面図である。
図２に示すように、本実施の形態の熱伝導シート１Ａは、上記実施の形態と同様の熱伝導材料からなるもので、例えば四角形状のシート本体部２の両方の面に凸状密着部３（３ａ、３ｂ）が設けられている。
そして、本実施の形態においても、当該シートの中央部分の厚さが周縁部分の厚さより厚く、全体形状として凸レンズ形状となるように構成されている。 Figure 2 is a side view showing an external configuration of the thermally conductive sheet according to another embodiment of the present invention.
As shown in FIG. 2, the heat conductive sheet 1 </ b> A of the present embodiment is made of the same heat conductive material as that of the above-described embodiment. For example, convex contact portions are formed on both surfaces of the rectangular sheet main body 2. 3 (3a, 3b) is provided.
And also in this Embodiment, the thickness of the center part of the said sheet | seat is thicker than the thickness of a peripheral part, and it is comprised so that it may become a convex lens shape as a whole shape.

本発明の場合、各凸状密着部３ａ、３ｂの厚さ（高さ）は特に限定されることはないが、被着体に対する密着性を向上させる観点からは、上記実施の形態と同様、シート本体部２の厚さＴに対し、各凸状密着部３ａ、３ｂの厚さｔが０．０５Ｔ〜０．２Ｔとなるように構成することが好ましい。   In the case of the present invention, the thickness (height) of each convex contact portion 3a, 3b is not particularly limited, but from the viewpoint of improving the adhesion to the adherend, as in the above embodiment. It is preferable that the thickness t of each of the convex contact portions 3a and 3b is 0.05T to 0.2T with respect to the thickness T of the sheet main body portion 2.

図３（ａ）〜（ｃ）は、本発明に用いる熱伝導シートを製造する方法の一例を示す工程図で、シート本体部２の一方の面に凸状密着部３を有する熱伝導シート１を製造するものである（図１（ａ）〜（ｃ）参照）。 3A to 3C are process diagrams showing an example of a method for producing a heat conductive sheet used in the present invention. The heat conductive sheet 1 having the convex contact portion 3 on one surface of the sheet main body portion 2 is shown. Is manufactured (see FIGS. 1A to 1C).

図３（ａ）に示すように、本例においては、まず、形成しようとする凸状密着部３の形状に対応する凹部６を有する金型５を用意する。この場合、金型５には、所定の間隔をおいて複数の凹部６を形成しておく。   As shown in FIG. 3A, in this example, first, a mold 5 having a concave portion 6 corresponding to the shape of the convex close contact portion 3 to be formed is prepared. In this case, a plurality of recesses 6 are formed in the mold 5 at a predetermined interval.

そして、図３（ｂ）（ｃ）に示すように、金型５の凹部６上に熱伝導材料７を配置し、さらにその上に剥離シート（図示せず）を積層させ、熱圧着ヘッド２０を用い所定の温度及び圧力で熱伝導材料を加熱加圧する。
その後、成形された熱伝導材料７を複数個に切断することにより、図１（ａ）〜（ｃ）に示す熱伝導シート１を得る。 Then, as shown in FIGS. 3B and 3C, a heat conductive material 7 is disposed on the concave portion 6 of the mold 5, and a release sheet (not shown) is further laminated thereon, and a thermocompression bonding head 20 is formed. Is used to heat and press the heat conductive material at a predetermined temperature and pressure.
Then, the heat conductive sheet 1 shown to Fig.1 (a)-(c) is obtained by cut | disconnecting the shape | molded heat conductive material 7 into plurality.

図４は、本発明に用いる熱伝導シートを製造する方法の他の例の要部を示す工程図で、シート本体部２の両方の面に凸状密着部３ａ、３ｂを有する熱伝導シート１Ａを製造するものである（図２参照）。 FIG. 4 is a process diagram showing the main part of another example of the method for producing a heat conductive sheet used in the present invention , and a heat conductive sheet 1A having convex contact portions 3a and 3b on both surfaces of the sheet main body 2. (See FIG. 2).

図４に示すように、本例においては、凸状密着部３ａ、３ｂの形状に対応する凹部６ａ、６ｂを有する一対の金型５ａ、５ｂの凹部６ａ、６ｂ同士を向かい合わせ、金型５ａ、５ｂ間に配置した熱伝導材料７を対向する側から所定の温度及び圧力で加熱加圧するようにする。
その後、成形された熱伝導材料７を複数個に切断することにより、図２に示す熱伝導シート１Ａを得る。 As shown in FIG. 4, in this example, the concave portions 6a and 6b of the pair of molds 5a and 5b having the concave portions 6a and 6b corresponding to the shapes of the convex close contact portions 3a and 3b face each other. The heat conducting material 7 disposed between 5b is heated and pressurized at a predetermined temperature and pressure from the opposite side.
Then, the heat conductive sheet 1A shown in FIG. 2 is obtained by cutting the formed heat conductive material 7 into a plurality of pieces.

図５（ａ）（ｂ）及び図６（ａ）（ｂ）は、本発明に用いる熱伝導シートの使用状態の例を示す説明図である。
図５（ａ）（ｂ）に示すように、本実施の形態の電子部品組立体３０においては、例えば上述した熱伝導シート１が、基板８上に表面実装されたＩＣチップ（ＣＰＵ等）９と放熱部材１０との間に配置される。 5 (a), 5 (b) and 6 (a), 6 (b) are explanatory diagrams showing examples of usage states of the heat conductive sheet used in the present invention.
As shown in FIGS. 5A and 5B, in the electronic component assembly 30 of the present embodiment, for example, the above-described heat conductive sheet 1 is an IC chip (CPU or the like) 9 having a surface mounted on a substrate 8. And the heat dissipating member 10.

ここで、放熱部材１０は、熱伝導率の大きい金属からなるもので、その熱伝導シート１と対向する部分には、熱伝導シート１の位置決め支持を行うための位置決め凹部（位置決め支持部）１０ａが設けられている。   Here, the heat radiating member 10 is made of a metal having a high thermal conductivity, and a positioning recess (positioning support portion) 10a for positioning and supporting the heat conductive sheet 1 is provided in a portion facing the heat conductive sheet 1. Is provided.

この位置決め凹部１０ａは、熱伝導シート１とほぼ同一の大きさに形成され、熱伝導シート１を密着した状態で収容支持するようになっている。
また、放熱部材１０の例えばフィン１００側の部位には、所定の固定具１１を係止するための係止溝１０ｂが設けられている。
一方、基板８上のＩＣチップ９の近傍の位置には、固定具１１を係止するための係止部８ａが設けられている。 The positioning recess 10a is formed to have substantially the same size as that of the heat conductive sheet 1, and accommodates and supports the heat conductive sheet 1 in a close contact state.
Further, a locking groove 10b for locking a predetermined fixing tool 11 is provided in a part of the heat dissipation member 10 on the fin 100 side, for example.
On the other hand, a locking portion 8 a for locking the fixture 11 is provided at a position in the vicinity of the IC chip 9 on the substrate 8.

本例の電子部品組立体３０を組み立てる場合には、熱伝導シート１を放熱部材１０の位置決め凹部１０ａ内に収容して固定具１１を放熱部材１０の係止溝１０ｂと基板８上の係止部８ａに係合し、ＩＣチップ９と放熱部材１０とを押圧状態で位置決め固定することにより、熱伝導シート１を位置決めしてＩＣチップ９と放熱部材１０に密着させるようにする。   When assembling the electronic component assembly 30 of this example, the heat conductive sheet 1 is accommodated in the positioning recess 10 a of the heat radiating member 10, and the fixture 11 is locked on the locking groove 10 b of the heat radiating member 10 and the substrate 8. The IC chip 9 and the heat dissipating member 10 are positioned and fixed in a pressed state by engaging with the portion 8a, thereby positioning the heat conductive sheet 1 and bringing it into close contact with the IC chip 9 and the heat dissipating member 10.

なお、凸状密着部３がシート本体部２の一方の面に設けられている熱伝導シート１を用いる場合には、より確実な放熱を確保する観点から、例えば図５（ａ）に示すように、凸状密着部３をＩＣチップ９側に配置してその表面に密着させることが好ましい。   In addition, when using the heat conductive sheet 1 in which the convex contact | adherence part 3 is provided in one surface of the sheet | seat main-body part 2, as shown to Fig.5 (a) from a viewpoint of ensuring more reliable heat dissipation, for example. Further, it is preferable that the convex contact portion 3 is disposed on the IC chip 9 side and is in close contact with the surface thereof.

一方、図６（ａ）（ｂ）に示すように、本実施の形態の電子部品組立体３１においては、放熱部材１０の熱伝導シート１と対向する部分に、熱伝導シート１の位置決め支持を行うための位置決め枠部（位置決め支持部）１０ｃが設けられている。   On the other hand, as shown in FIGS. 6A and 6B, in the electronic component assembly 31 of the present embodiment, the positioning support of the heat conductive sheet 1 is provided on the portion of the heat radiating member 10 facing the heat conductive sheet 1. A positioning frame portion (positioning support portion) 10c is provided for this purpose.

この位置決め枠部１０ｃは、熱伝導シート１より若干大きい大きさに形成され、その内側の部分において熱伝導シート１を放熱部材１０に対して密着した状態で収容支持するようになっている。   The positioning frame portion 10 c is formed to be slightly larger than the heat conductive sheet 1, and accommodates and supports the heat conductive sheet 1 in an intimate contact with the heat radiating member 10 at an inner portion thereof.

本例の電子部品組立体３１を組み立てる場合には、上記電子部品組立体３０の場合と同様に、熱伝導シート１を放熱部材１０の位置決め枠部１０ｃ内に収容して固定具１１を放熱部材１０の係止溝１０ｂと基板８上の係止部８ａに係合し、ＩＣチップ９と放熱部材１０とを押圧状態で位置決め固定することにより、熱伝導シート１を位置決めしてＩＣチップ９と放熱部材１０に密着させるようにする。   When assembling the electronic component assembly 31 of this example, as in the case of the electronic component assembly 30, the heat conductive sheet 1 is accommodated in the positioning frame portion 10 c of the heat radiating member 10, and the fixture 11 is placed in the heat radiating member. 10 is engaged with the engagement groove 10b and the engagement portion 8a on the substrate 8, and the IC chip 9 and the heat dissipating member 10 are positioned and fixed in a pressed state, thereby positioning the heat conductive sheet 1 and the IC chip 9. The heat radiating member 10 is closely attached.

図７は、本発明に用いる熱伝導シートの使用状態の他の例を示す説明図である。
図７に示すように、本例の電子部品組立体４０においては、基板８上に実装されたＩＣチップ（パワートランジスタ等）１２に放熱板１３が取り付けられ、この放熱板１３と放熱部材１４との間に熱伝導シート１が配置される。 FIG. 7 is an explanatory view showing another example of the usage state of the heat conductive sheet used in the present invention.
As shown in FIG. 7, in the electronic component assembly 40 of this example, a heat radiating plate 13 is attached to an IC chip (power transistor or the like) 12 mounted on the substrate 8, and the heat radiating plate 13, the heat radiating member 14, The heat conductive sheet 1 is disposed between the two.

そして、本例においても、固定具１５によって放熱部材１４を放熱板１３に押圧することにより、熱伝導シート１を位置決めして放熱板１３と放熱部材１４に密着させるようにする。   And also in this example, by pressing the heat radiating member 14 against the heat radiating plate 13 with the fixture 15, the heat conductive sheet 1 is positioned and brought into close contact with the heat radiating plate 13 and the heat radiating member 14.

なお、図５（ａ）に示す場合と同様、凸状密着部３がシート本体部２の一方の面に設けられている熱伝導シート１を用いる場合には、より確実な放熱を確保する観点から、凸状密着部３を放熱板１３側に配置してその表面に密着させることが好ましい。   As in the case shown in FIG. 5A, when the heat conductive sheet 1 provided on the one surface of the sheet main body 2 is used as the convex contact portion 3, the viewpoint of ensuring more reliable heat dissipation. Therefore, it is preferable that the convex contact portion 3 is disposed on the heat radiating plate 13 side and is in close contact with the surface thereof.

以上述べたように上記実施の形態によれば、シートの中央部分の厚さが周縁部分の厚さより厚くなるようにシート本体部２上に凸状密着部３が設けられていることから、被着体に接触させて加圧した場合にシートの中央部分が確実に被着体に密着するようになり、その結果、作業者の熟練度及び作業環境を問わず、熱伝導シート１の貼付の際に空気の混入を防止して放熱機能の維持を図ることができる。   As described above, according to the above-described embodiment, the convex contact portion 3 is provided on the sheet main body 2 so that the thickness of the central portion of the sheet is thicker than the thickness of the peripheral portion. When the contacted body is pressed and pressed, the center portion of the sheet comes into close contact with the adherend. As a result, regardless of the skill level and working environment of the worker, In this case, it is possible to prevent air from being mixed and maintain the heat radiation function.

特に、本実施の形態においては、当該シートの全体形状が凸レンズ形状となるように構成したことから、確実に熱伝導シート１を被着体に密着させることができ、しかも容易に製造することができる。   In particular, in the present embodiment, since the entire shape of the sheet is a convex lens shape, the heat conductive sheet 1 can be reliably adhered to the adherend and can be easily manufactured. it can.

また、シート本体部２の両面側の部分に凸状密着部３ａ、３ｂが設けられている熱伝導シート１Ａによれば、熱伝導シート１Ａの両面側においてより確実に被着体に密着させることができるので、放熱機能の維持をより確実にすることができる。   Moreover, according to the heat conductive sheet 1A in which the convex contact portions 3a and 3b are provided on the both surface side portions of the sheet main body portion 2, the both sides of the heat conductive sheet 1A can be more securely adhered to the adherend. Therefore, the heat dissipation function can be more reliably maintained.

一方、上述した電子部品組立体３０、３１、４０によれば、ＩＣチップ９、１２から発生する熱を放熱部材１０、１４に確実に伝えることができるので、放熱機能の高い電子機器を製造することができる。   On the other hand, according to the electronic component assemblies 30, 31, and 40 described above, heat generated from the IC chips 9 and 12 can be reliably transmitted to the heat radiating members 10 and 14, and thus an electronic device having a high heat dissipation function is manufactured. be able to.

特に、上述した電子部品組立体３０、３１においては、熱伝導シート１を放熱部材１０の位置決め凹部１０ａ又は位置決め枠部１０ｃによって支持した状態で放熱部材１０の係止部１０ｂと基板８の係止部８ａとに固定具１１を係合して放熱部材１０と基板８を位置決め固定することにより熱伝導シート１を放熱部材１０とＩＣチップ９に密着させるように構成されていることから、作業者の熟練度及び作業環境を問わず、熱伝導シート１の凸状密着部３を常に放熱部材１０又はＩＣチップ９の最適位置に位置決めして密着させることができ、これにより貼付の際に空気の混入を確実に防止して放熱機能の維持を図ることができる。
なお、本発明は上述の実施の形態に限られることなく、種々の変更を行うことができる。 In particular, in the electronic component assemblies 30 and 31 described above, the locking portion 10b of the heat dissipation member 10 and the substrate 8 are locked while the heat conductive sheet 1 is supported by the positioning recess 10a or the positioning frame portion 10c of the heat dissipation member 10. Since the fixing member 11 is engaged with the portion 8a and the heat radiating member 10 and the substrate 8 are positioned and fixed, the heat conductive sheet 1 is configured to be in close contact with the heat radiating member 10 and the IC chip 9. Regardless of the skill level and working environment, the convex contact portion 3 of the heat conductive sheet 1 can always be positioned and brought into close contact with the optimum position of the heat radiating member 10 or the IC chip 9. Mixing can be reliably prevented and the heat radiation function can be maintained.
The present invention is not limited to the above-described embodiment, and various changes can be made.

例えば、上記実施の形態では、シートの全体形状が凸レンズ形状となるように凸状密着部を形成したが、本発明はこれに限られず、例えば錐体形状又は錐台形状の凸状密着部を設けることもできる。   For example, in the above embodiment, the convex contact portion is formed so that the overall shape of the sheet is a convex lens shape, but the present invention is not limited to this, and for example, a convex contact portion having a cone shape or a frustum shape is provided. It can also be provided.

また、シート本体部の形状も四角形状には限られず、放熱対象である電子部品の形状に対応させて種々の形状とすることができる。
さらに、シート本体部の両面側の部分に凸状密着部が設けられている熱伝導シートにおいては、各凸状密着部の形状や高さを異ならせることも可能である。 Further, the shape of the sheet main body is not limited to a quadrangular shape, and various shapes can be used in accordance with the shape of the electronic component to be radiated.
Furthermore, in the heat conductive sheet in which the convex contact portions are provided on the both surfaces of the sheet main body, the shape and height of each convex contact portion can be made different.

（ａ）：本発明に用いる熱伝導シートの外観構成を示す斜視図（ｂ）：同熱伝導シートの外観構成を示す側面説明図（ｃ）：同熱伝導シートの寸法関係を示す側面説明図(A): a perspective view showing an external configuration of the heat conduction sheet Ru used in the present invention (b): side view of outline configuration of the thermally conductive sheet (c): side explanatory showing the dimensional relationship of the thermally conductive sheet Figure 本発明の他の実施の形態における熱伝導シートの外観構成を示す側面図The side view which shows the external appearance structure of the heat conductive sheet in other embodiment of this invention. （ａ）〜（ｃ）：本発明に用いる熱伝導シートを製造する方法の一例を示す工程図(A)-(c): Process drawing which shows an example of the method of manufacturing the heat conductive sheet used for this invention 本発明に用いる熱伝導シートを製造する方法の他の例の要部を示す工程図Process drawing which shows the principal part of the other example of the method of manufacturing the heat conductive sheet used for this invention （ａ）（ｂ）：本発明に用いる熱伝導シートの使用状態の例を示す説明図(A) (b): Explanatory drawing which shows the example of the use condition of the heat conductive sheet used for this invention （ａ）（ｂ）：本発明に用いる熱伝導シートの使用状態の例を示す説明図(A) (b): Explanatory drawing which shows the example of the use condition of the heat conductive sheet used for this invention 本発明に用いる熱伝導シートの使用状態の他の例を示す説明図Explanatory drawing which shows the other example of the use condition of the heat conductive sheet used for this invention

１、１Ａ…熱伝導シート ２…シート本体部 ３、３ａ、３ｂ…凸状密着部 ３０、４０…電子部品組立体
DESCRIPTION OF SYMBOLS 1, 1A ... Thermal conductive sheet 2 ... Sheet | seat main-body part 3, 3a, 3b ... Convex contact part 30, 40 ... Electronic component assembly

Claims (1)

基板上に実装された所定の電子部品と所定の放熱部材との間に熱伝導シートが配置されている電子部品組立体であって、An electronic component assembly in which a heat conductive sheet is disposed between a predetermined electronic component mounted on a substrate and a predetermined heat dissipation member,
前記放熱部材に、前記熱伝導シートを位置決め支持する位置決め支持部と所定の固定具を係止する係止部を設けるとともに、前記基板に、前記固定具を係止する係止部を設け、前記熱伝導シートを前記放熱部材の位置決め支持部によって支持した状態で、前記放熱部材の係止部と前記基板の係止部とに前記固定具を係合して当該放熱部材と当該基板を位置決め固定することにより、当該熱伝導シートを当該放熱部材と当該電子部品に密着させるように構成され、The heat dissipating member is provided with a positioning support portion for positioning and supporting the heat conductive sheet and a locking portion for locking the predetermined fixing tool, and the board is provided with a locking portion for locking the fixing tool, With the heat conduction sheet supported by the positioning support portion of the heat radiating member, the fixing member is engaged with the locking portion of the heat radiating member and the locking portion of the substrate to position and fix the heat radiating member and the substrate. By doing so, the heat conductive sheet is configured to adhere to the heat dissipation member and the electronic component,
前記放熱部材の位置決め支持部が、当該放熱部材の前記電子部品と対向する部分に設けた凹部又は枠部であり、The positioning support portion of the heat radiating member is a recess or a frame portion provided in a portion facing the electronic component of the heat radiating member,
前記熱伝導シートは、その中央部分の厚さが周縁部分の厚さより厚く、かつ、全体形状が凸レンズ形状となるようにシート本体部上に凸状密着部が設けられるとともに、当該シート本体部に対する前記凸状密着部の厚さの比が０．０５〜０．２である電子部品組立体。The heat conductive sheet is provided with a convex contact portion on the sheet main body so that the thickness of the central portion is greater than the thickness of the peripheral portion and the overall shape is a convex lens shape, and An electronic component assembly in which the thickness ratio of the convex contact portion is 0.05 to 0.2.
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