JPH0677364A - Radiation fin - Google Patents

Abstract

PURPOSE:To prevent the strain of a contact surface due to the thermal deformation while facilitating a manufacturing process concerning a radiation fin for performing a heat dissipation and cooling through mounting a heating component such as semiconductor device. CONSTITUTION:By respectively inserting a plurality of radiation members 1 having abutment plates 11 and radiation protrusions 12 into openings 21 of a push plate 2 and pushingly mounting the abutment plates 11 on a heating component, shapes of the radiation members 1 and the push plate 2 are simplified and the process is facilitated and thus an adhesive is eliminated and the strain due to heat is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiating fin which is attached to a heat generating component such as a semiconductor element to radiate heat to the outside air.

Radiating fins are designed to enhance heat radiation efficiency.
Although it is necessary to increase the surface area, it has a complicated shape with a large number of fins protruding, and when mounting it, a smooth contact is made so that it is attached closely to the surface of the heat generating component to reduce heat transfer resistance. It is necessary to form a surface, and its manufacturing process is troublesome. Under such circumstances, there is a demand for a radiation fin that is easy to manufacture and has good radiation efficiency.

[0003]

2. Description of the Related Art A conventional radiation fin 10 is shown in FIG.
As shown in (b), the base portion 110 is attached to the package surface 31 of the heat-generating component 3 such as a semiconductor element by adhering it with an adhesive layer 40. The protrusions 120 are provided so as to radiate heat by applying these heat radiating protrusions 120 to the cooling air blown by a cooling fan (not shown). The heat dissipation protrusion 120 is shown in FIG.
There is a plate-like protrusion as shown in FIG. 4 and a rod-like protrusion as shown in FIG. 4B, and is integrally formed with the base 110 by cutting or the like.

[0004]

However, in the conventional radiating fin 10, since a large number of radiating projections 120 are integrally formed on the base 110, the shape thereof is complicated and difficult to process, and the bonding surface of the base 110 is difficult. Also in the heating component 3
There is a problem that high flatness is required in order to improve the adhesion with the and the processing cost becomes high.

Further, the radiation fin 10 has an adhesive layer 40 having high thermal conductivity on the surface 31 of the package of the heat-generating component 3.
However, the package 31, the adhesive layer 40, and the heat dissipation fin 10 are deformed differently due to the different materials, and the distortion causes the distortion, which is the semiconductor element which is the heat generating component 3. However, there is a problem in that the heat transfer resistance is increased due to the damage to the base material and the decrease in the adhesiveness due to the adhesive layer 40, resulting in a decrease in heat dissipation efficiency.

Therefore, an object of the present invention is to provide a radiation fin which is easy to process and can be manufactured at low cost, can be attached without using an adhesive, and has high radiation efficiency.

[0007]

DISCLOSURE OF THE INVENTION The above-mentioned object is to dissipate a heat-dissipating member 1 in which a heat-dissipating protrusion 12 is provided at the center of a flat plate-shaped contact plate portion 11.
And a pressing plate 2 having an opening 21 through which the heat radiating projection 12 is inserted, the contact plate portion 11 is brought into contact with the surface of the heat generating component 3, and the heat radiating projection is provided from the opening 21 of the pressing plate 2. This is achieved by a radiating fin, characterized in that the contact plate portion 11 is attached by pressing the contact plate portion 11 with the pressing plate 2 while projecting the protrusion 12.

[0008]

That is, in the present invention, the fin portion having a complicated shape by integrally forming a large number of heat radiation protrusions by the heat radiation member 1 having the contact plate portion 11 and the heat radiation protrusions 12 in the related art. Is a substantially rod-shaped simple shape, and the pressing plate 2 is also a simple shape that only forms the opening 21. Therefore, manufacturing is facilitated and mass production is possible, and it is different only by changing the size of the pressing plate 2. It is possible to easily deal with a large size of heat radiation fin.

Further, since the heat radiating member 1 is attached by being pressed against the surface of the heat generating component 3 by the pressing plate 2, it is not necessary to interpose an adhesive agent layer, and even if deformation occurs due to heat generation,
Since the contact surface between the contact plate portion 11 and the heat-generating component 3 shifts while maintaining the contact state, distortion due to deformation is absorbed, so that the adhesiveness is not impaired and the heat dissipation efficiency is not reduced.

[0010]

Embodiments of the present invention will be described in detail below with reference to FIGS. 1 is an exploded perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view showing a heat radiating member 1, and FIG. 3 is a sectional view showing a state of attachment to a heat generating component 3.

As shown in FIG. 1, the radiating fins are a pressing plate for fixing a large number of radiating members 1, 1, ... And an abutting plate portion 11 formed at the root of these radiating members 1 by pressing them from the upper surface. 2 and. Heat dissipation member 1 and pressing plate 2
Each is formed by processing a material such as metal having high thermal conductivity.

As shown in FIG. 2, the heat dissipating member 1 has a disc-shaped abutting plate portion 11 at its root portion, and a rod-shaped heat dissipating protrusion 12 is vertically formed at the center thereof to be integrally formed. ing. The contact surface 13 of the bottom surface of the contact plate portion 11 is formed to be smooth to enhance the adhesiveness with the heat-generating component 3, and the heat from the heat-generating component 3 is radiated from the heat dissipation protrusion 12 to the outside air. To do.

As shown in FIG. 1, the pressing plate 2 is formed in the flat plate portion 22 at appropriate intervals by forming openings 21, 21 ... Through which the heat radiating protrusions 11 of the heat radiating member 1 are inserted. Then, the peripheral edge portion 23 of the pressing plate 2 is hung downward, as shown in FIG.
As shown in, a fixed edge 23 for receiving the fixing screw 4 is formed. The opening 21 is formed to have a diameter that is substantially the same as or slightly larger than the diameter of the heat radiating projection 12 so that the heat radiating projection 12 can be inserted therethrough, and is formed to be smaller than the diameter of the abutting plate portion 11, and the peripheral portion of the opening 21 The flat plate portion 22 of the contact plate portion 1
Hold down 1.

To attach the heat radiating members 1, 1, ... To the heat generating component 3 by the pressing plate 2, as shown in FIG. 3, the heat radiating protrusions 1 of the heat radiating member 1 from the rear surface of the pressing plate 2 to the opening 21.
2 is put on the upper surface of the heat-generating component 3 in a previously inserted state, and the peripheral fixed edge 23 is fastened and fixed to the substrate 32 by the fixing screw 4. A small gap is formed between the fixed edge 23 and the substrate 32, and the flat plate portion 22 of the pressing plate 2 is fixed to the surface 31 of the heat-generating component 3 in a pressing manner by tightening the fixing screw. Like

The heat generating component 3 is generally a semiconductor element as shown in FIG. 3, the surface 31 of which is packaged with ceramics or the like, and the lead frame 33 is projected downward and inserted into the substrate 32. In FIG. 3, the fixing screw 4 is screwed into the fixed edge 23 of the pressing plate 2 from the back surface of the substrate 32 through the insertion hole 34, but in this case, the heat radiating fin is on the lower side and the heat generating component 3 is on the upper side. The heat radiating components 1, 1, ... And the pressing plate 2 can be easily handled in the temporarily assembled state by assembling them in the inverted state.

[0016]

As described above, in the heat dissipating fin of the present invention, by forming a large number of heat dissipating protrusions on each heat dissipating member, it is not necessary to integrally process a complicated shape, and the manufacturing process is easy. In addition, the processing cost can be reduced, and by changing the number of heat radiating members and the size of the pressing plate according to the heat generating components, multiple types of heat radiating fins can be formed with a common heat radiating member. You can

Further, when mounting to the heat-generating component, since it is mounted in a pressure-bonded state by the pressing plate, it is not necessary to interpose an adhesive, and it is possible to reduce the occurrence of strain between members due to thermal deformation, and to prevent damage to the heat-generating component. It is possible to prevent the heat radiation efficiency from decreasing.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a heat dissipation member.

FIG. 3 is a cross-sectional view showing a mounted state.

FIG. 4 is a perspective view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat dissipation member 11 Contact plate part 12 Heat dissipation protrusion 2 Pressing plate 21 Opening 3 Heating component

Claims (1)

[Claims] 1. A heat radiating protrusion is provided at the center of a flat plate-shaped contact plate portion (11).
A heat radiating member (1) projecting from (12), and a pressing plate (2) having an opening (21) for inserting the heat radiating projection (12),
The contact plate portion (11) is brought into contact with the surface of the heat-generating component (3) so that the heat dissipation protrusion (12) is projected from the opening (21) of the pressing plate (2), and the contact plate portion (11). ) Is attached by pressing the pressing plate (2).