KR100687582B1 - Method for manufacturing heat sink plate - Google Patents

Abstract

A method for manufacturing a heat sink plate is provided to reduce manufacturing time and cost for the heat sink plate by forming a contacting unit, a mounting protrusion, and a supporting protrusion after plastic-working of a heat sink groove. A method for manufacturing a heat sink plate includes the steps of: forming a heat sink groove by plastic-working of an original plate for manufacturing the heat sink plate through a mold for forming the heat sink groove; cutting the plate along a cutting surface for uniforming the lower surface of the plate; and forming more than one protrusion on the lower surface of the plate, which is cut, by using a mold(700) for forming the protrusion.

Description

Heat sink manufacturing method {Method for Manufacturing Heat Sink Plate}

1 is a perspective view showing a typical heat sink and a circuit board,

2 is a perspective view showing a bottom surface of a general heat sink;

3 is a cross-sectional view showing a combined state of a general heat sink and a circuit board,

Figure 4 is a perspective view showing a conventional heat sink manufacturing process,

5a and 5b is a perspective view schematically showing a heat sink manufacturing process of the present invention,

6 is a first side view illustrating a process of forming a heat dissipation groove during a heat sink manufacturing process of the present invention;

7 is a second side view illustrating a process of forming a protrusion in a heat sink manufacturing process of the present invention.

<Description of Symbols for Main Parts of Drawings>

100: heat sink 110: heat dissipation groove

120: circuit board 122: heating element

150: cover 155: fastener

200: support protrusion 202: mounting protrusion

204: contact portion 500: cutting surface

600: mold 602: die

604: home 704: home

The present invention relates to a heat sink manufacturing method. More specifically, in the method of forming the heat radiation groove of the heat sink, it is related with the manufacturing method of the heat sink which forms a heat radiation groove easily through plastic working, without cutting and forming a heat radiation groove.

CPU, graphic chip, memory chip, hard disk, and power supply components installed inside various IT products generate a large amount of heat during operation. When the heat accumulates and the temperature exceeds 80 ~ 100 ℃, the product It may be damaged or stop working.

Recently, as integration of semiconductor chips improves, the width of internal lines becomes narrower, and heat generation increases, while demand for light and light reduction of products is increasing. Therefore, a cooling device having excellent cooling performance and a small volume are essential.

In general, technologies related to cooling devices for electronic circuits include a heat sink type, a thermoelectric element type, a cooling water circulation type, and a heat pipe type.

1 is a perspective view illustrating a general heat sink and a circuit board.

The circuit board 120 is equipped with a heat generating element 122 for generating heat. In addition, a cover 150 is attached to the circuit board 120. The cover 150 protects the heating element 122 and the chip, etc., installed on the circuit board 120 from the external environment.

Meanwhile, as shown in FIG. 1, one side of the cover 150 is open and a fastening hole 155 is formed.

In addition, a heat sink 100 is attached to the upper surface of the heating element 122 through the opening of the cover 150 to transfer heat generated inside the heating element 122 to the air. A plurality of heat dissipation grooves 110 are formed on the top surface of the heat sink 100 to increase heat dissipation efficiency, and the heat sink 100 is in contact with the top surface of the heat generating element 122 to receive heat, and transfers the received heat into the air. Will diverge.

2 is a perspective view illustrating a bottom surface of a general heat sink.

As illustrated, the bottom surface of the heat sink 100 has a contact portion 204 in contact with the heating element 122, a mounting protrusion 202 inserted into the fastening hole 155 of the cover 150 shown in FIG. 1, and FIG. 1. A support protrusion 200 protruding to protect the heating element 122 of the illustrated circuit board 120 is formed.

The contact portion 204 is formed to protrude in order to improve contact efficiency with the heat generating element 122, and may be formed by cutting and attaching a heat conductive tape to an appropriate size to protect the heat generating element 122 due to an impact.

3 is a cross-sectional view illustrating a combined state of a general heat sink and a circuit board.

As shown in the drawing, the heat sink 100 is installed on the circuit board 120 having the heating element 122 through the opening of the cover 150.

In detail, the mounting protrusion 202 protruding to the bottom surface of the heat sink 100 is seated in the fastening hole 155 formed in the cover 150. In addition, the support protrusion 200 is formed to have a minute gap with the circuit board 120 to prevent the heat sink 100 from impacting the heat generating element 122 when an external shock is applied to the heat sink 100 or the cover 150. do.

The mounting protrusion 202 protruding to the bottom surface of the heat sink 100 is seated in the fastening hole 155 so that the contact portion 204 of the heat sink 100 corresponds to the heating element 122.

The support protrusion 200 maintains a constant gap between the heat sink 100 and the circuit board 120, and air moves through the gap, thereby increasing the cooling efficiency of the heat sink 100.

Figure 4 is a perspective view showing a conventional heat sink manufacturing process.

4 illustrates the external shape of the heat sink during the manufacturing process of the heat sink. In order to protrude the support protrusion 200, the mounting protrusion 202, the contact portion 204, and the like, the one surface is plasticized.

The manufacturing procedure is explained in detail. First, in order to form the support protrusion 200, the mounting protrusion 202, and the contact portion 204, a plate, which is a raw material of the heat sink 100, is subjected to plastic working. Since a mold having a protruding portion is used, a processing groove is formed on the upper surface of the plate. The support protrusion 200, the mounting protrusion 202, and the contact portion 204 protrude from the opposite side of the processing groove, that is, the bottom surface.

Flat for plastic processing, but with the mounting protrusion 202 and the support protrusion 200 and the grooves formed with the corresponding grooves and the upper surface of the plate placed on the die, the mounting protrusion 202, the contact portion 204 and the support shown in FIG. A mold having a structure protruding to form the protrusion 200 is used.

The processing sequence is to place the plate member that becomes the disc of the heat sink 100 on the die, and then apply force to the mold to deform the surface of the die, and then the mold plastically deforms the disc so that the mounting protrusion 202 and the support protrusion 200 are formed on the bottom of the disc. ), And to cut the plate into a rectangular shape by using a press, and when the processing is finished, it will have a shape as shown in Figure 4a. The contact portion 204 may be formed as the mounting protrusion 202 and the support protrusion 200 may be formed, and the contact portion 204 may be formed using a separate thermal conductive tape.

The next step is to perform a cutting process to form the heat dissipation groove 110 on the upper surface of the heat sink 100 as shown in Figure 4b. Cutting operations use machining methods such as milling. In this conventional method, since the heat dissipation grooves 110 must be cut in order to form a plurality of heat dissipation grooves 110, there is a problem in that the production time and cost of the heat dissipation plate 100 increase due to a lot of time and effort.

In addition, since the cutting process must be performed to form a plurality of heat dissipation grooves 110 in the heat dissipation plate 100, the disc material of the heat dissipation plate 100 should be thick. Since the raw material is thick, the cost of the material is increased and plastic processing must be performed to form the mounting protrusion 202 and the supporting protrusion 200 on the thick disc, thereby providing a cause of an increase in processing cost and energy required for processing. do.

In order to solve the above problems, the present invention provides a method of manufacturing a heat sink in the method of forming a heat radiation groove of the heat sink, the heat radiation groove is easily formed through plastic working without performing a cutting process to form a heat radiation groove. It is for that purpose.

In order to achieve the above object, the present invention has a plurality of heat dissipation grooves formed on one side thereof, and protruding portions are formed on the other side thereof, and one of the protrusions is in contact with a heating element to receive heat generated from the heating element. In the heat sink manufacturing method, the method of manufacturing a heat sink comprises: forming the heat dissipation groove by plastic working the original plate for heat sink production using a mold for forming a heat dissipation groove; Cutting along a plate cut surface to equalize the surface of the bottom of the plate; And forming one or more protrusions on the bottom surface of the cut plate by using a mold for forming protrusions.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

5A and 5B are perspective views schematically showing a heat sink manufacturing process of the present invention.

In summary, after the plastic working process is performed to form a plurality of heat dissipation grooves 110 on the upper surfaces of the plurality of heat sinks 100 as shown in FIG. 5A, the cutting process is performed along the cutting surface 500 on the bottom surface of the heat sink 100. After the plastic mold is processed again using a mold to form protrusions such as the support protrusion 200 and the mounting protrusion 202 on the bottom surface of the heat sink 100 as shown in FIG. 5B.

The contact portion 204 may be formed to protrude together with the support protrusion 200 and the mounting protrusion 202, or may be formed by attaching a separate thermal conductive tape.

When the plastic working is used, the heat dissipation groove 110 may be easily formed in one step. In addition, since the dimensional accuracy of the plastic working surface is good, there is also an advantage that almost no finishing process is required.

6 is a first side view illustrating a process of forming a heat dissipation groove during a heat sink manufacturing process of the present invention.

6A illustrates the die 602, the heat sink 100, and the heat dissipation groove forming die 600.

In the plastic working for forming the heat dissipation groove 110 according to the present invention, the heat dissipation groove having the unevenness of the heat dissipation groove 110 shape so as to form the heat dissipation groove 110 on the die 602 and the upper surface of the plate placed on the die 602. Forming die 600 is required.

One side of the heat dissipation groove forming mold 600 has a structure for forming a heat dissipation groove. In addition, in the heat sink 100, a portion in contact with the heating element 122 should increase the thickness of the heat sink 100 in order to facilitate the conduction of heat and increase the amount of heat transferred, and thus, the heat dissipation groove forming mold 600. In the structure of), the center part has an approximately wide groove part.

As shown in FIG. 6 (b), when the plate, which is a raw material of the heat sink 100, is brought into close contact with the upper surface of the die 602, the die 600 for lowering the heat dissipation grooves is lowered, and the plate is external to the heat dissipation groove forming die 600. A plurality of heat dissipation grooves 110 are formed on the upper surface of the plate while plastically deforming along the shape.

Then, the cutting process is performed along the cutting surface 500 of the plate shown in FIG. 6C to adjust the thickness of the plate and to facilitate contact with the heating element. By such a cutting process, the surface of the bottom face of a plate is processed uniformly.

Cutting is performed by cutting and removing portions below the cutting surface 500 using a grinder or broach.

After the cutting process, an intermediate plate having a shape as shown in FIG. 6 (d) is formed.

7 is a second side view illustrating a process of forming a protrusion in a heat sink manufacturing process of the present invention.

As shown, Fig. 7A shows the die 702, the intermediate plate, and the mold 700 for forming the protrusions.

One side of the protrusion forming mold 700 is formed with a protrusion for forming the support protrusion 200 on the intermediate plate and a protrusion for forming the mounting protrusion 202 on the intermediate plate, and additionally a contact portion ( Protrusions for forming 204 may each be formed. When the contact portion 204 is formed of a thermally conductive tape, the protrusion of the mold 700 for forming the contact portion 204 is not necessary.

As shown in FIG. 7B, the die 702 having the groove 704 corresponding to the support protrusion 200 and the mounting protrusion 202 is formed, and the plurality of heat dissipation grooves 110 are already formed on the upper surface of the die 702. When the protrusion forming die 700 is moved downward after the formed intermediate plate is in close contact, the intermediate plate is plastically deformed along the outer surface of the protrusion forming die. Accordingly, the mounting protrusion 202 and the supporting protrusion 200 are formed on the bottom of the plate by the groove 704 and the protrusion forming die 700 as shown in (c), thereby completing the heat sink 100 according to the present invention. . As described above, the contact portion 204 may be further formed using a thermal conductive tape or the like.

The shape of the heat sink 100 passed through the manufacturing method is as shown in FIG. As shown in the drawing, the heat dissipation plate 100 has a thin plate shape as a whole, and a plurality of heat dissipation grooves 110 are formed on the upper surface thereof to improve heat dissipation efficiency. In addition, a support protrusion 200, a mounting protrusion 202, and a contact portion 204 illustrated in FIG. 2 are formed on the bottom surface of the heat sink 100.

During the manufacturing process of the heat sink 100, the cutting process is to smooth the surface as in the case described above in Figure 6, if the non-uniformity of the material surface is within the tolerance range may not be performed.

Conventionally, since a plurality of cuttings are formed because the heat dissipation groove 110 is formed through cutting, in the embodiment of the present invention, the heat dissipation groove 110 is formed through plastic working, and only a part of the heat sink 100 is formed if necessary. Because cutting is performed, less cutting material is discarded.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

As described above, according to the present invention, the heat dissipation grooves of the heat dissipation plate may be formed by plasticizing the heat dissipation grooves of the heat dissipation plate, and then forming a plurality of heat dissipation grooves by cutting the heat dissipation grooves. In addition to reducing time and manufacturing cost, there is an effect that plastic processing for forming protrusions is facilitated by reducing the thickness of the original plate of the heat sink by performing plastic working and bottom cutting to form a heat dissipation groove.

Claims (5)

A plurality of heat dissipation grooves are formed on one side, and protrusions are formed to protrude on the other side, and one of the protrusions is in contact with a heating element to receive and release heat generated by the heating element. Forming a heat dissipation groove by firing the original plate for heat dissipation plate using a heat dissipation groove forming mold; Cutting along a plate cut surface to equalize the surface of the bottom of the plate; And Forming at least one protrusion on the bottom surface of the cut plate by using a protrusion forming mold; Heat sink manufacturing method comprising a. The method of claim 1, At least one of the protrusions is a mounting protrusion inserted into a fastening hole formed in a circuit board around a heating element. The method of claim 1, At least one of the protrusions is a heat sink manufacturing method characterized in that the support projection. The method of claim 1, At least one of the protrusions is a heat sink manufacturing method characterized in that the contact portion in contact with the heating element. The method of claim 1, A heat conductive tape is attached to one side of the heat sink to contact with one side of the heat generating member heat sink.

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