JP2004363521A - Heat radiation structure for semiconductor device - Google Patents

Heat radiation structure for semiconductor device Download PDF

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Publication number
JP2004363521A
JP2004363521A JP2003163431A JP2003163431A JP2004363521A JP 2004363521 A JP2004363521 A JP 2004363521A JP 2003163431 A JP2003163431 A JP 2003163431A JP 2003163431 A JP2003163431 A JP 2003163431A JP 2004363521 A JP2004363521 A JP 2004363521A
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semiconductor device
heat
cooler
heat dissipation
dissipation structure
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JP2003163431A
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JP4140452B2 (en
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Takahisa Hayakawa
崇央 早川
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Toyota Motor Corp
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Toyota Motor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the radiation performance from a heat radiation plate to a cooler with a simple structure. <P>SOLUTION: A case 20 has a plurality of projections 22-1 on an opposite face 20-1 to the mounting face 18-1 of a heat radiation plate 18. Each of the projections 22-1 is adjusted for its height so that, as its position of pressing the mounting face 18-1 of the heat radiation plate 18 is closer to a center of the entire heat sink plate 18, the projection 22-1 is higher. When the heat radiation plate 18 is fixed to the case 20, the mounting face 18-1 of the heat radiation plate 18 is pressed outside, thereby, the projection 22-1 deforms the entire heat radiation plate 18 convexly outside the case 20 in a state that the heat radiation plate 18 is fixed to the case 20. In this state, the semiconductor package 12 is fastened by a bolt in the entire peripheral part of a cooler 14 and the heat radiation plate 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体装置にて発生した熱が冷却器により吸収されることで半導体装置の放熱が行われる半導体装置の放熱構造に関する。
【０００２】
【従来の技術及び発明が解決しようとする課題】
従来の半導体装置の放熱構造の一例が特許文献１，２に開示されている。特許文献１においては、半導体チップを挟んで放熱板が両面に配設されてなる半導体モジュールが冷却器上に載置されている。そして、付勢保持部材が半導体モジュールの冷却器と反対側の放熱板を付勢することにより、半導体モジュールの冷却器側の放熱板を冷却器の表面に押しつけている。これによって、放熱板から冷却器への放熱性能の向上を図っている。
【０００３】
しかしながら、特許文献１においては、半導体モジュールを冷却器に押しつけるための付勢保持部材が半導体チップの実装側である冷却器と反対側に設けられている。したがって、半導体チップに接続する回路が複雑となり、構造が複雑になるという問題点がある。
【０００４】
また、特許文献２においては、半導体チップが筐体内に収納された半導体パッケージの製造の際に、放熱板の熱膨張係数が筐体の熱膨張係数より小さくなるようにそれぞれの材質を決定し、高温環境下で筐体と放熱板との接合を行った後、常温まで冷却している。冷却の際に、熱膨張係数の違いによる収縮量の差により、放熱板が筐体外側に凸の反った状態となる。そして、筐体外側に凸に反った状態の放熱板を冷却器に固定することにより、放熱板から冷却器への放熱性能の向上を図っている。
【０００５】
しかしながら、特許文献２においては、半導体パッケージの製造の際に、放熱板を筐体外側に凸に反らせる工程を必要とするため、生産性が低下してしまうという問題点がある。さらに、製造ばらつきによる放熱板の反り量のばらつきにより、放熱板から冷却器への放熱性能にばらつきが発生してしまうという問題点もある。
【０００６】
本発明は、簡単な構成で放熱板から冷却器への放熱性能を向上させることができる半導体装置の放熱構造を提供することを目的とする。なお、その他にも特許文献３〜６に示す半導体装置の放熱構造が開示されている。
【０００７】
【特許文献１】
特開２００２−８３９１５号公報
【特許文献２】
特開平１１−１７７００２号公報
【特許文献３】
特開平１０−１８９８４２号公報
【特許文献４】
特開２００３−２３１３０号公報
【特許文献５】
特開２００２−３１６５９７号公報
【特許文献６】
特開平４−２８４６９５号公報
【０００８】
【課題を解決するための手段】
このような目的を達成するために、第１の本発明に係る半導体装置の放熱構造は、半導体装置と、該半導体装置が実装面に実装された放熱板と、該半導体装置が収納されるとともに該放熱板が固定された筐体と、を含む半導体パッケージが冷却器に固定されている半導体装置の放熱構造であって、前記筐体は、前記半導体パッケージの前記冷却器への固定前の状態において、前記放熱板を該冷却器側に凸に変形させるように、該放熱板の実装面を押圧する当接部を該実装面との対向面に有し、該当接部によって前記冷却器側に凸に変形された放熱板が該冷却器に押圧されるように、前記半導体パッケージが該冷却器に固定されていることを特徴とする。
【０００９】
第２の本発明に係る半導体装置の放熱構造は、第１の本発明に記載の放熱構造であって、前記当接部は、前記筐体における前記放熱板の実装面との対向面に形成された複数の突起部によって構成され、前記放熱板の実装面を押圧する位置が該放熱板の中心に近い突起部ほど、その高さが高いことを特徴とする。
【００１０】
第３の本発明に係る半導体装置の放熱構造は、第１または第２の本発明に記載の放熱構造であって、前記放熱板は複数に分割して設けられ、前記当接部は、隣り合う放熱板の実装面を共通して押圧する位置決め部を含むことを特徴とする。
【００１１】
第４の本発明に係る半導体装置の放熱構造は、第１〜３の本発明のいずれか１に記載の放熱構造であって、前記当接部は、前記筐体における該当接部以外の部分とともに樹脂で一体成型されていることを特徴とする。
【００１２】
第５の本発明に係る半導体装置の放熱構造は、第１〜４の本発明のいずれか１に記載の放熱構造であって、前記半導体パッケージと前記冷却器とが、該放熱板の周辺部にてボルトにより締結されていることを特徴とする。
【００１３】
第６の本発明に係る半導体装置の放熱構造は、第１〜５の本発明のいずれか１に記載の放熱構造であって、前記筐体と前記放熱板とが接着剤により接着されていることを特徴とする。
【００１４】
第７の本発明に係る半導体装置の放熱構造は、第１〜６の本発明のいずれか１に記載の放熱構造であって、該放熱構造は、車両に搭載されていることを特徴とする。
【００１５】
【発明の実施の形態】
以下、本発明の実施の形態（以下実施形態という）を、図面に従って説明する。
【００１６】
図１〜５は、本発明の実施形態に係る半導体装置の放熱構造の構成の概略を示す図である。図１は半導体パッケージ及び冷却器の斜視図を示し、図２は半導体パッケージの分解斜視図を示す。そして、図３は冷却器への固定前における半導体パッケージの図１におけるＡ−Ａ断面図を示し、図４は冷却器への固定前における半導体パッケージの図１におけるＢ−Ｂ断面図を示す。さらに、図５は半導体パッケージが冷却器へ固定されるときの図１におけるＡ−Ａ断面図に相当する断面図を示す。本実施形態の放熱構造においては、半導体装置１０を含む半導体パッケージ１２が冷却器１４に固定されており、半導体装置１０にて発生した熱が冷却器１４により吸収されることで半導体装置１０の放熱が行われる。そして、半導体パッケージ１２は、絶縁基板１６、放熱板１８及び筐体２０をさらに含んでいる。なお、本実施形態の放熱構造の適用例としては、ハイブリッド車両や電気自動車に搭載されている例が挙げられる。
【００１７】
半導体装置１０には、半導体素子（図示せず）が形成されている。半導体装置１０は、はんだ付けされることにより、絶縁基板１６上に実装されている。絶縁基板１６は、はんだ付けされることにより、放熱板１８の実装面１８−１に実装されている。このようにして、半導体装置１０が絶縁基板１６を介して放熱板１８の実装面１８−１に実装されており、半導体装置１０と放熱板１８との間の絶縁が絶縁基板１６により行われている。なお、本実施形態では、放熱板１８は複数に分割して設けられている。
【００１８】
筐体２０には、放熱板１８の実装面１８−１に実装された半導体装置１０を収納するための開口部が設けられている。そして、放熱板１８の実装面１８−１と筐体２０における実装面１８−１との対向面２０−１とが接着剤により接着されることにより、半導体装置１０が筐体２０に収納されるとともに放熱板１８が筐体２０に固定される。ただし、放熱板１８と筐体２０とを固定する手段としては、接着剤以外の手段を用いることもできる。なお、図１〜５では図示は省略しているが、半導体装置１０はワイヤボンディングにより筐体２０内の回路または配線と接続される。また、筐体２０の材質としては、例えば樹脂が用いられる。
【００１９】
以上の構成の半導体パッケージ１２は、放熱板１８が冷却器１４の上面である固定面１４−１へ押圧されるように、冷却器１４の固定面１４−１にグリス層を介して固定されている。ここで、図１，２に示すように、冷却器１４の固定面１４−１の周辺部にはねじ穴１４−２が設けられており、放熱板１８全体及び筐体２０の周辺部にはボルトを通すための貫通穴１８−２，２０−２がそれぞれ設けられている。そして、半導体パッケージ１２と冷却器１４とが、放熱板１８全体の周辺部にてボルト（図示せず）により締結されている。ただし、半導体パッケージ１２と冷却器１４とを固定する手段としては、ボルト締結以外の手段を用いることもできる。なお、冷却器１４の固定面１４−１の形状は、略平面形状となっている。
【００２０】
本実施形態においては、図３，４に示すように、筐体２０は、放熱板１８の実装面１８−１との対向面２０−１に、複数の突起部２２−１，２２−２を有している。突起部２２−１，２２−２は、放熱板１８を筐体２０に固定する際に、放熱板１８の実装面１８−１を筐体２０外側へ押圧することにより、放熱板１８を筐体２０外側へ変形させる。そして、突起部２２−１，２２−２の各々は、放熱板１８の実装面１８−１を押圧する位置が放熱板１８全体の中心に近いものほど高くなるように、その高さが予め調整されている。これによって、放熱板１８が筐体２０に固定された状態で、放熱板１８全体を筐体２０外側へ凸に変形させることができる。なお、突起部２２−１，２２−２と、筐体２０のそれ以外の部分とを樹脂で一体成型することにより、突起部２２−１，２２−２の成型が容易となる。
【００２１】
そして、本実施形態においては、図５に示すように、放熱板１８全体が筐体２０外側へ凸に変形されている状態、すなわち放熱板１８全体が冷却器１４の固定面１４−１側に凸に変形されている状態で、半導体パッケージ１２が冷却器１４と放熱板１８全体の周辺部にてボルトにより締結される。
【００２２】
また、図４に示すように、突起部２２−２の各々については、放熱板１８の実装面１８−１を押圧している面の形状が略平面形状であり、隣り合う放熱板１８の実装面１８−１を共通して押圧している。これによって、放熱板１８を筐体２０に固定する際に、突起部２２−２によって隣り合う放熱板１８の位置決めを行うことで、隣り合う放熱板１８間に段差が発生するのを抑止している。
【００２３】
以上説明したように、本実施形態によれば、半導体パッケージ１２の冷却器１４への固定前の状態において、放熱板１８全体を冷却器１４側に凸に変形させるように、放熱板１８の実装面１８−１を押圧する突起部２２−１，２２−２が放熱板１８の実装面１８−１との対向面２０−１に複数形成されている。そして、この突起部２２−１，２２−２により冷却器１４側に凸に変形されている状態の放熱板１８が冷却器１４の固定面１４−１に押圧されるように、半導体パッケージ１２が冷却器１４に固定されている。これによって、放熱板１８全体の中央部を冷却器１４の固定面１４−１へ確実に押圧させることができるので、十分な面圧の確保が難しい放熱板１８全体の中央部に関して、簡単な構成で面圧を十分に得ることができる。したがって、簡単な構成で放熱板１８から冷却器１４への放熱性能を向上させることができる。
【００２４】
そして、突起部２２−１，２２−２の各々の高さを調整するだけで、筐体２０に固定された後の放熱板１８全体の面形状の調整を行うことができるので、最適な放熱性能を得るための突起部２２−１，２２−２の設計も容易となる。さらに、製造ばらつきに起因する放熱性能のばらつきも小さくすることができる。また、突起部２２−１，２２−２と、筐体２０のそれ以外の部分とを樹脂で一体成型することにより、突起部２２−１，２２−２を容易に成型することができる。
【００２５】
さらに、本実施形態によれば、放熱板１８全体の周辺部にてボルト締結することにより、半導体パッケージ１２を冷却器１４へ固定している。これによって、放熱板１８全体の中央部に関しては、突起部２２−１，２２−２により放熱板１８全体が冷却器１４側に凸に変形されていることで十分な面圧を得ることができるとともに、放熱板１８全体の周辺部に関しては、ボルト締結により十分な面圧を得ることができる。したがって、放熱板１８全体に関して、十分な面圧を得ることができるとともに、面圧分布をより均一に近づけることができるので、放熱板１８から冷却器１４への放熱性能をさらに向上させることができる。
【００２６】
また、本実施形態によれば、隣り合う放熱板１８の実装面１８−１を共通して押圧する突起部２２−２が放熱板１８の実装面１８−１との対向面２０−１に形成されている。これによって、放熱板１８が分割して設けられている場合に、突起部２２−２によって隣り合う放熱板１８の位置決めを行うことができるので、隣り合う放熱板１８間に段差が発生するのを抑止することができる。したがって、放熱板１８から冷却器１４への放熱性能をさらに向上させることができる。
【００２７】
以上、本発明の実施の形態について説明したが、本発明はこうした実施の形態に何等限定されるものではなく、本発明の技術思想を逸脱しない範囲内において、種々なる形態で実施し得ることは勿論である。
【００２８】
【発明の効果】
以上説明したように、本発明によれば、筐体は、半導体パッケージの冷却器への固定前の状態において、放熱板を冷却器側に凸に変形させるように、放熱板の実装面を押圧する当接部を実装面との対向面に有し、当接部によって冷却器側に凸に変形された放熱板が冷却器に押圧されるように、半導体パッケージが冷却器に固定されていることにより、簡単な構成で放熱板から冷却器への放熱性能を向上させることができる。
【図面の簡単な説明】
【図１】本発明の実施形態に係る半導体装置の放熱構造の概略を示す斜視図である。
【図２】本発明の実施形態に係る半導体装置の放熱構造の概略を示す分解斜視図である。
【図３】本発明の実施形態に係る半導体装置の放熱構造の概略を示す断面図である。
【図４】本発明の実施形態に係る半導体装置の放熱構造の概略を示す断面図である。
【図５】本発明の実施形態に係る半導体装置の放熱構造の概略を示す断面図である。
【符号の説明】
１０ 半導体装置、１２ 半導体パッケージ、１４ 冷却器、１６ 絶縁基板、１８ 放熱板、２０ 筐体、２２−１，２２−２ 突起部。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat dissipation structure of a semiconductor device in which heat generated in the semiconductor device is absorbed by a cooler to radiate heat of the semiconductor device.
[0002]
Problems to be solved by the prior art and the invention
Patent Documents 1 and 2 disclose examples of conventional heat dissipation structures of semiconductor devices. In Patent Literature 1, a semiconductor module having heat sinks disposed on both sides of a semiconductor chip is mounted on a cooler. Then, the urging holding member urges the heat sink on the side opposite to the cooler of the semiconductor module, thereby pressing the heat sink on the cooler side of the semiconductor module against the surface of the cooler. Thereby, the heat radiation performance from the heat radiating plate to the cooler is improved.
[0003]
However, in Patent Document 1, an urging holding member for pressing the semiconductor module against the cooler is provided on the side opposite to the cooler on which the semiconductor chip is mounted. Therefore, there is a problem that a circuit connected to the semiconductor chip becomes complicated and a structure becomes complicated.
[0004]
Further, in Patent Document 2, at the time of manufacturing a semiconductor package in which a semiconductor chip is housed in a housing, each material is determined such that the thermal expansion coefficient of the heat sink is smaller than the thermal expansion coefficient of the housing, After joining the housing and the heat sink in a high temperature environment, it is cooled to room temperature. At the time of cooling, due to the difference in the amount of shrinkage due to the difference in the coefficient of thermal expansion, the heat radiating plate is in a state of being convexly warped to the outside of the housing. Then, by fixing the radiator plate which is warped convexly to the outside of the housing to the cooler, the heat radiation performance from the radiator plate to the cooler is improved.
[0005]
However, in Japanese Patent Application Laid-Open No. H11-163, there is a problem in that, when a semiconductor package is manufactured, a step of warping a heat radiating plate to the outside of the housing is required, thereby lowering productivity. Further, there is a problem that a variation in the amount of warpage of the heat sink due to manufacturing variations causes a variation in the heat radiation performance from the heat sink to the cooler.
[0006]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat dissipation structure of a semiconductor device that can improve heat dissipation performance from a heat sink to a cooler with a simple configuration. In addition, the heat dissipation structures of the semiconductor devices disclosed in Patent Documents 3 to 6 are disclosed.
[0007]
[Patent Document 1]
JP 2002-83915 A [Patent Document 2]
JP-A-11-177002 [Patent Document 3]
JP-A-10-189842 [Patent Document 4]
JP 2003-23130 A [Patent Document 5]
JP 2002-316597 A [Patent Document 6]
JP-A-4-284695
[Means for Solving the Problems]
In order to achieve such an object, a heat dissipation structure of a semiconductor device according to a first aspect of the present invention includes a semiconductor device, a heat dissipation plate on which the semiconductor device is mounted on a mounting surface, and a housing for accommodating the semiconductor device. A housing to which the heat sink is fixed, wherein the semiconductor package includes a semiconductor package fixed to a cooler, wherein the housing is in a state before the semiconductor package is fixed to the cooler. In the above, the heat radiating plate has a contact portion for pressing the mounting surface of the heat radiating plate on a surface facing the mounting surface so as to deform the heat radiating plate to be convex toward the cooler side, and the contact portion corresponds to the cooler side. The semiconductor package is fixed to the cooler such that the heat sink deformed to be convex is pressed by the cooler.
[0009]
A heat dissipation structure for a semiconductor device according to a second aspect of the present invention is the heat dissipation structure according to the first aspect of the invention, wherein the contact portion is formed on a surface of the housing facing a mounting surface of the heat dissipation plate. A plurality of projections, and the height of the projection closer to the center of the radiator plate at a position where the mounting surface of the radiator plate is pressed is higher.
[0010]
The heat dissipation structure of a semiconductor device according to a third aspect of the present invention is the heat dissipation structure according to the first or second aspect of the invention, wherein the heat dissipation plate is provided in a plurality of parts, and the contact portion is adjacent to the heat dissipation plate. It is characterized by including a positioning portion that presses the mounting surfaces of the matching heat sinks in common.
[0011]
A heat dissipation structure for a semiconductor device according to a fourth aspect of the present invention is the heat dissipation structure according to any one of the first to third aspects of the invention, wherein the contact portion is a portion other than the contact portion in the housing. It is characterized by being integrally molded with resin.
[0012]
The heat dissipation structure of a semiconductor device according to a fifth aspect of the present invention is the heat dissipation structure according to any one of the first to fourth aspects of the present invention, wherein the semiconductor package and the cooler are arranged in a peripheral portion of the heat sink. It is characterized by being fastened by bolts.
[0013]
A heat dissipation structure of a semiconductor device according to a sixth aspect of the present invention is the heat dissipation structure according to any one of the first to fifth aspects of the invention, wherein the housing and the heat dissipation plate are bonded with an adhesive. It is characterized by the following.
[0014]
A heat dissipation structure for a semiconductor device according to a seventh aspect of the present invention is the heat dissipation structure according to any one of the first to sixth aspects of the invention, wherein the heat dissipation structure is mounted on a vehicle. .
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention (hereinafter, referred to as embodiments) will be described with reference to the drawings.
[0016]
1 to 5 are diagrams schematically illustrating the configuration of a heat dissipation structure of a semiconductor device according to an embodiment of the present invention. FIG. 1 is a perspective view of a semiconductor package and a cooler, and FIG. 2 is an exploded perspective view of the semiconductor package. 3 is a sectional view of the semiconductor package taken along line AA in FIG. 1 before being fixed to the cooler, and FIG. 4 is a sectional view taken along line BB of FIG. 1 of the semiconductor package before being fixed to the cooler. Further, FIG. 5 shows a cross-sectional view corresponding to the AA cross-sectional view in FIG. 1 when the semiconductor package is fixed to the cooler. In the heat dissipation structure of the present embodiment, the semiconductor package 12 including the semiconductor device 10 is fixed to the cooler 14, and the heat generated in the semiconductor device 10 is absorbed by the cooler 14 so that the heat dissipation of the semiconductor device 10 Is performed. The semiconductor package 12 further includes an insulating substrate 16, a heat sink 18, and a housing 20. In addition, as an application example of the heat dissipation structure of the present embodiment, there is an example in which the heat dissipation structure is mounted on a hybrid vehicle or an electric vehicle.
[0017]
A semiconductor element (not shown) is formed in the semiconductor device 10. The semiconductor device 10 is mounted on the insulating substrate 16 by soldering. The insulating substrate 16 is mounted on the mounting surface 18-1 of the heat sink 18 by soldering. Thus, the semiconductor device 10 is mounted on the mounting surface 18-1 of the heat sink 18 via the insulating substrate 16, and the insulation between the semiconductor device 10 and the heat sink 18 is performed by the insulating substrate 16. I have. In the present embodiment, the heat radiating plate 18 is provided by being divided into a plurality.
[0018]
The housing 20 is provided with an opening for housing the semiconductor device 10 mounted on the mounting surface 18-1 of the heat sink 18. Then, the semiconductor device 10 is housed in the housing 20 by bonding the mounting surface 18-1 of the heat sink 18 and the surface 20-1 of the housing 20 facing the mounting surface 18-1 with an adhesive. At the same time, the heat sink 18 is fixed to the housing 20. However, as means for fixing the heat radiating plate 18 and the housing 20, means other than the adhesive can be used. Although not shown in FIGS. 1 to 5, the semiconductor device 10 is connected to a circuit or a wiring in the housing 20 by wire bonding. As a material of the housing 20, for example, a resin is used.
[0019]
The semiconductor package 12 having the above configuration is fixed to the fixing surface 14-1 of the cooler 14 via a grease layer so that the heat sink 18 is pressed against the fixing surface 14-1 which is the upper surface of the cooler 14. I have. Here, as shown in FIGS. 1 and 2, screw holes 14-2 are provided in the periphery of the fixing surface 14-1 of the cooler 14, and the entire heat sink 18 and the periphery of the housing 20 are provided in the periphery. Through holes 18-2 and 20-2 for passing bolts are provided, respectively. The semiconductor package 12 and the cooler 14 are fastened by bolts (not shown) around the entire heat sink 18. However, as means for fixing the semiconductor package 12 and the cooler 14, means other than bolting may be used. In addition, the shape of the fixing surface 14-1 of the cooler 14 is substantially planar.
[0020]
In this embodiment, as shown in FIGS. 3 and 4, the housing 20 includes a plurality of projections 22-1 and 22-2 on a surface 20-1 facing the mounting surface 18-1 of the heat sink 18. Have. The protrusions 22-1 and 22-2 press the mounting surface 18-1 of the heat radiating plate 18 to the outside of the housing 20 when the heat radiating plate 18 is fixed to the housing 20, thereby causing the heat radiating plate 18 to move to the housing 20. Deform 20 outward. The height of each of the protrusions 22-1 and 22-2 is adjusted in advance so that the position where the mounting surface 18-1 of the heat radiating plate 18 is pressed is closer to the center of the entire heat radiating plate 18. Have been. Thus, the entire heat radiating plate 18 can be deformed to protrude outward from the housing 20 in a state where the heat radiating plate 18 is fixed to the housing 20. The protrusions 22-1 and 22-2 and the other parts of the housing 20 are integrally molded with resin, so that the protrusions 22-1 and 22-2 can be easily molded.
[0021]
In the present embodiment, as shown in FIG. 5, a state in which the entire radiator plate 18 is deformed so as to protrude outward from the housing 20, that is, the entire radiator plate 18 faces the fixing surface 14-1 of the cooler 14. In a state where the semiconductor package 12 is deformed to be convex, the semiconductor package 12 is fastened to the cooler 14 and the heat radiation plate 18 by bolts around the entire periphery.
[0022]
Further, as shown in FIG. 4, for each of the protrusions 22-2, the shape of the surface pressing the mounting surface 18-1 of the heat radiating plate 18 is substantially planar, and the mounting of the adjacent heat radiating plate 18 is performed. The surface 18-1 is pressed in common. Thus, when the heat radiating plate 18 is fixed to the housing 20, the adjacent heat radiating plates 18 are positioned by the projections 22-2, thereby suppressing the occurrence of a step between the adjacent heat radiating plates 18. I have.
[0023]
As described above, according to the present embodiment, before the semiconductor package 12 is fixed to the cooler 14, the mounting of the heat radiator 18 is performed so that the entire heat radiator 18 is deformed to be convex toward the cooler 14. A plurality of protrusions 22-1 and 22-2 for pressing the surface 18-1 are formed on the surface 20-1 of the heat sink 18 facing the mounting surface 18-1. Then, the semiconductor package 12 is pressed so that the heat radiating plate 18, which is deformed to be convex toward the cooler 14 by the protrusions 22-1 and 22-2, is pressed against the fixing surface 14-1 of the cooler 14. It is fixed to the cooler 14. As a result, the central portion of the entire heat radiating plate 18 can be reliably pressed against the fixing surface 14-1 of the cooler 14, so that it is difficult to secure a sufficient surface pressure. Thus, a sufficient surface pressure can be obtained. Therefore, the heat radiation performance from the heat radiating plate 18 to the cooler 14 can be improved with a simple configuration.
[0024]
Then, only by adjusting the height of each of the projections 22-1 and 22-2, the surface shape of the entire heat radiating plate 18 after being fixed to the housing 20 can be adjusted, so that optimal heat radiation is achieved. The design of the projections 22-1 and 22-2 for obtaining performance is also facilitated. Further, variation in heat radiation performance due to manufacturing variation can be reduced. In addition, by integrally molding the protrusions 22-1 and 22-2 and other portions of the housing 20 with resin, the protrusions 22-1 and 22-2 can be easily molded.
[0025]
Furthermore, according to the present embodiment, the semiconductor package 12 is fixed to the cooler 14 by bolting around the entire heat sink 18. As a result, a sufficient surface pressure can be obtained in the central portion of the entire radiator plate 18 because the entire radiator plate 18 is deformed to be convex toward the cooler 14 by the projections 22-1 and 22-2. At the same time, a sufficient surface pressure can be obtained for the peripheral portion of the entire heat sink 18 by bolting. Therefore, a sufficient surface pressure can be obtained for the entire heat radiating plate 18 and the surface pressure distribution can be made more uniform, so that the heat radiation performance from the heat radiating plate 18 to the cooler 14 can be further improved. .
[0026]
In addition, according to the present embodiment, the projection 22-2 that presses the mounting surface 18-1 of the adjacent heat sink 18 in common is formed on the surface 20-1 facing the mounting surface 18-1 of the heat sink 18. Have been. Accordingly, when the heat radiating plates 18 are provided separately, the adjacent heat radiating plates 18 can be positioned by the projections 22-2, so that a step is generated between the adjacent heat radiating plates 18. Can be deterred. Therefore, the heat radiation performance from the heat radiating plate 18 to the cooler 14 can be further improved.
[0027]
As described above, the embodiments of the present invention have been described, but the present invention is not limited to these embodiments at all, and can be implemented in various forms without departing from the technical idea of the present invention. Of course.
[0028]
【The invention's effect】
As described above, according to the present invention, the housing presses the mounting surface of the radiator plate so as to deform the radiator plate to the side of the cooler before the semiconductor package is fixed to the cooler. The semiconductor package is fixed to the cooler such that the heat dissipating plate deformed to the cooler side by the contact portion is pressed by the cooler. Thereby, the heat radiation performance from the heat radiating plate to the cooler can be improved with a simple configuration.
[Brief description of the drawings]
FIG. 1 is a perspective view schematically showing a heat dissipation structure of a semiconductor device according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view schematically showing a heat dissipation structure of the semiconductor device according to the embodiment of the present invention.
FIG. 3 is a cross-sectional view schematically showing a heat dissipation structure of the semiconductor device according to the embodiment of the present invention.
FIG. 4 is a cross-sectional view schematically showing a heat dissipation structure of the semiconductor device according to the embodiment of the present invention.
FIG. 5 is a cross-sectional view schematically showing a heat dissipation structure of the semiconductor device according to the embodiment of the present invention.
[Explanation of symbols]
Reference Signs List 10 semiconductor device, 12 semiconductor package, 14 cooler, 16 insulating substrate, 18 heat sink, 20 housing, 22-1, 22-2 projection.

Claims (7)

半導体装置と、該半導体装置が実装面に実装された放熱板と、該半導体装置が収納されるとともに該放熱板が固定された筐体と、を含む半導体パッケージが冷却器に固定されている半導体装置の放熱構造であって、
前記筐体は、前記半導体パッケージの前記冷却器への固定前の状態において、前記放熱板を該冷却器側に凸に変形させるように、該放熱板の実装面を押圧する当接部を該実装面との対向面に有し、
該当接部によって前記冷却器側に凸に変形された放熱板が該冷却器に押圧されるように、前記半導体パッケージが該冷却器に固定されていることを特徴とする半導体装置の放熱構造。A semiconductor in which a semiconductor package including a semiconductor device, a heat sink on which the semiconductor device is mounted on a mounting surface, and a housing in which the semiconductor device is housed and the heat sink is fixed is fixed to a cooler. The heat dissipation structure of the device,
The housing includes a contact portion that presses a mounting surface of the heat radiating plate so that the heat radiating plate is deformed to be convex toward the cooler in a state before the semiconductor package is fixed to the cooler. On the surface facing the mounting surface,
The heat dissipation structure for a semiconductor device, wherein the semiconductor package is fixed to the cooler such that the heat dissipation plate deformed convexly toward the cooler by the contact portion is pressed against the cooler. 請求項１に記載の半導体装置の放熱構造であって、
前記当接部は、前記筐体における前記放熱板の実装面との対向面に形成された複数の突起部によって構成され、
前記放熱板の実装面を押圧する位置が該放熱板の中心に近い突起部ほど、その高さが高いことを特徴とする半導体装置の放熱構造。The heat dissipation structure of the semiconductor device according to claim 1, wherein:
The contact portion is configured by a plurality of protrusions formed on a surface of the housing facing the mounting surface of the heat sink,
A heat dissipating structure for a semiconductor device, wherein the height of a projecting portion closer to the center of the heat dissipating plate at which the mounting surface of the heat dissipating plate is pressed is higher. 請求項１または２に記載の半導体装置の放熱構造であって、
前記放熱板は複数に分割して設けられ、
前記当接部は、隣り合う放熱板の実装面を共通して押圧する位置決め部を含むことを特徴とする半導体装置の放熱構造。A heat dissipation structure for a semiconductor device according to claim 1, wherein:
The radiator plate is provided divided into a plurality,
The heat dissipating structure of a semiconductor device according to claim 1, wherein the contact portion includes a positioning portion for pressing the mounting surfaces of the adjacent heat dissipating plates in common. 請求項１〜３のいずれか１に記載の半導体装置の放熱構造であって、
前記当接部は、前記筐体における該当接部以外の部分とともに樹脂で一体成型されていることを特徴とする半導体装置の放熱構造。A heat dissipation structure for a semiconductor device according to claim 1, wherein:
The heat dissipation structure of a semiconductor device, wherein the contact portion is integrally molded with a portion of the housing other than the contact portion with a resin. 請求項１〜４のいずれか１に記載の半導体装置の放熱構造であって、
前記半導体パッケージと前記冷却器とが、該放熱板の周辺部にてボルトにより締結されていることを特徴とする半導体装置の放熱構造。A heat dissipation structure for a semiconductor device according to claim 1, wherein:
The heat dissipation structure of a semiconductor device, wherein the semiconductor package and the cooler are fastened by bolts at a peripheral portion of the heat sink. 請求項１〜５のいずれか１に記載の半導体装置の放熱構造であって、
前記筐体と前記放熱板とが接着剤により接着されていることを特徴とする半導体装置の放熱構造。It is a heat dissipation structure of the semiconductor device according to any one of claims 1 to 5,
A heat dissipation structure for a semiconductor device, wherein the housing and the heat dissipation plate are adhered by an adhesive. 請求項１〜６のいずれか１に記載の半導体装置の放熱構造であって、
該放熱構造は、車両に搭載されていることを特徴とする半導体装置の放熱構造。A heat dissipation structure for a semiconductor device according to claim 1, wherein:
The heat radiating structure is mounted on a vehicle.
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