JP2000323875A - Equipment and method for cooling electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiciently radiate the heat from an electronic component by providing a holder for a radiator at a specified position with respect to the electronic component and fixing the radiator and a printed board through a cushion material disposed between the holder and the printed board. SOLUTION: A radiator 6 is held by means of an installation board 4 at a specified position with respect to an IC package mounted with an integrated circuit element 2. A fixing hole 4-2 is formed in each end part of the installation board 4 for holding the radiator 6 and the IC package 1 and through holes 9 are formed in the printed board 3 to fix the installation board 4 on the printed board 3. Then, the fixing holes 4-2 of the installation board 4 and the through holes 9 of the printed board 3 are fixed with fixing components such as screws 8 through cushion materials 5. Due to this structure, the cushion materials 5 disposed between the installation board 4 and the printed board 3 are elastically deformed to keep the contact pressure among the radiator 6, a radiation sheet 7, and the IC package 1 properly. As a result, good thermal conductivity can be achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device and a cooling method for electronic components, and more particularly, to a device and a method for mounting a radiator (heat sink) for cooling heat generated by electronic components.

[0002]

2. Description of the Related Art Generally, electronic components tend to generate more heat due to higher integration and higher processing speed. A radiator (heat sink) is attached to such an electronic component in order to radiate generated heat and radiate heat. An increase in the amount of heat generated from the electronic component causes reliability and malfunction of the electronic component. Therefore, stable operation of the electronic component is guaranteed by lowering the heat generation temperature of the electronic component. Among recent electronic components, BGA (Ball Grid Array),
2. Description of the Related Art High integration of a semiconductor element mounted on a package such as a PGA (pin grid array) and a technology for increasing a processing speed have been advanced, and the amount of generated heat has been increased. In order to fix the radiator, it was fixed to various packages with an adhesive or the like. However, if it became clear that the heat radiation capability was insufficient, it was difficult to remove the radiator to replace it with a radiator with high radiation efficiency. Therefore,
There is a need for a cooling method that allows easy attachment and detachment of a radiator and that has a heat radiation effect equivalent to that when the radiator is fixed with an adhesive.

FIG. 4 shows a configuration diagram of a cooling device with a fixing bracket as a first conventional example. A fixing bracket 12 for fixing to the printed circuit board 3 is attached to the radiator 6 of the cooling device with the fixing bracket of FIG. The fixing bracket 12 attached to the radiator 6 has a flat plate shape, and has an end formed in a hook shape. A through hole 9 having a predetermined hole diameter is formed around the IC package 1 (PGA and BGA package) mounted on the printed circuit board. It is inserted and fixed in the through hole 9. In addition, there is a fixture (not shown) in which the hook portion is screwed. In such a screwing method, the printed circuit board is directly screwed and fixed. Therefore, in the first conventional example, the radiator 6 can be attached / detached by inserting / removing the hook portion 12-1 of the fixing bracket 9 or removing the screw. However, in the first conventional example, since the fixing method of the fixing fitting 9 is insertion fixing by a hook shape or direct screw fixing to the printed circuit board 3, the radiator 6 and the IC package 1 are not fixed. However, there is a problem that the pressure of the contact portion does not always become an appropriate contact pressure, and the contact pressure varies.

Next, a method of mounting a radiator in a cooling device of a second conventional example will be described with reference to FIG. In a second conventional example, an IC package 1 (such as a PGA package) is
It is configured to be attached to a C socket. In the second conventional example, the I
The method of attaching the radiator to the C package 1 is as follows. A radiator mounting bracket 11 is formed by processing a linear object processed from a wire, a plate-shaped object processed from a plate, or an object having a shape sharing a wire and a plate.
(In the figure, a wire-shaped object). Generally, these mounting brackets 11 are of a clip type utilizing the elasticity of a wire or a plate, and all of them are generated by elastic deformation of the mounting bracket 11 using the metal fixing portion 12 of the fixed IC socket 11. The IC package 1 and the radiator 6 are fixed by the applied pressure. Thereby, the radiator 6 and the IC package 1 are brought into close contact with each other by the mounting bracket 11, and the heat generated from the semiconductor element mounted on the IC package 1 is conducted to the radiator to radiate heat. But,
The method of mounting the radiator according to the second conventional example described above can be applied only to the IC package 1 mounted on the IC socket 10 and is applicable to electronic components directly soldered to a printed circuit board. The radiator 6 cannot be mounted.

[Problems to be solved by the invention]

In a conventional cooling device for electronic parts, in order to satisfy the reliability of the electronic parts that generate heat, a radiator is brought into contact with the electronic parts to lower the heat generation temperature by a heat radiation effect. When fixing the radiator, it is difficult to replace the radiator for changing the heat radiation effect. When attaching a radiator to an electronic component, it is difficult to fix the radiator to the electronic component with an appropriate pressure. In the case of fixing by using the elastic force of the metal fittings or the like, the holding power between the radiator and the electronic component is not stable and the reliability is insufficient. There were the above problems. In order to solve the above problem, as described above, in the cooling device with the fixing fitting of the first conventional example, the fixing fitting 1 for attaching the radiator 6 to the electronic component.
2 holds and closely contacts the heat radiator 6 and the IC package 1. The fixture 12 includes a hook portion 12-1 having a hook-shaped end portion of the fixture, and the hook portion 12-1 is inserted and fixed in a hole serving as the through hole 9 provided in the printed circuit board 3. Therefore, the hook can be removed,
The radiator can be attached and detached and changed. However, the radiator 6
It is difficult to keep the fixed load of the IC package 1 and the fixed load depending on the hooking condition or the shape of the radiator 6, so that the heat radiation efficiency (reduction of thermal resistance) which is the original purpose of the radiator cannot be stabilized. . Further, since it is difficult to make the fixed load on the IC package 1 constant, it is difficult to efficiently obtain the heat radiation effect. Further, when the fixing bracket 12 is screwed, an excessive load is applied to the radiator 6 and the pressing of the IC package 1, which may cause physical damage.

In the second conventional example, the IC socket 1
The radiator 6 can be fixed only to the IC package 1 mounted on the IC package 0, and various radiators 6 can be easily replaced by changing the mounting bracket 11. However, since the radiator 6 cannot be fixed to a BGA package or the like that is soldered to a printed circuit board, if a radiator is to be attached, it must be processed into a form that can be mounted on the IC socket 10.

The present invention has been made in view of the above-mentioned problems in the prior art, and can be applied to the above-described electronic component cooling device. An object of the present invention is to efficiently radiate heat generated from an electronic component, and to improve heat radiation efficiency (reduce thermal resistance) while applying an appropriate fixed load to a radiator and a PGA package or a BGA package. An object of the present invention is to provide a cooling device for an electronic component that can be designed and can be attached and detached with a radiator.

[Means for Solving the Problems]

[0008] The first invention of the present application for solving the above-mentioned problems is as follows.
A cooling device for cooling an electronic component mounted on a printed circuit board by a radiator, comprising: a holding unit that holds the radiator at a predetermined position with respect to the electronic component; and a cushioning material between the holding unit and the holding unit. A cooling device for an electronic component, comprising: fixing means for fixing the radiator and the printed board.

According to the electronic component cooling device of the first invention of the present application having the above-described configuration, since the fixing bracket for holding the radiator is securely fixed by the detachable fixing component such as a screw, the radiator can be secured safely. Can be attached to In addition, since the mounting plate is fixed via the cushioning material, the radiator and the IC can be always fixed at an appropriate pressure, so that the reliability of the IC due to the heat radiation effect can be improved.

The cooling device for an electronic component according to the second invention of the present application is the cooling device for an electronic component according to the first invention of the present application, wherein the holding means sandwiches and holds the radiator by a mounting plate. The fixing means is characterized in that the mounting plate and the printed circuit board are fixed via a cushioning material.

According to the electronic component cooling device of the second invention of the present application having the above-mentioned configuration, since the mounting plate holds the radiator while sandwiching it by the holding means, heat from the radiator is radiated to the mounting plate. Can be. In addition, by the fixing means, the mounting plate and the printed board are fixed with the cushioning material interposed therebetween, so that the heat conducted from the mounting plate can be conducted to the printed board via the cushioning material, and the heat radiation effect is improved. It can function as an enhancing component.

Further, a cooling device for an electronic component according to the third invention of the present application is a cooling device for an electronic component according to the first invention of the present application or the second invention of the present application, wherein the mounting plate has high thermal conductivity. It is made of a material, a material having good conductivity and an elastic material. The cooling device for an electronic component according to the fourth invention of the present application is the cooling device for an electronic component according to the first invention of the present application or the second invention of the present application. It is made of a material having good properties and a material having elasticity.

According to the electronic component cooling device of the third and fourth aspects of the present invention, the mounting plate and the cushioning material are made of a material having high heat conductivity, a material having good conductivity, and elasticity. Due to the material, the heat radiation effect can be enhanced. Further, in the case of a conductive material, a design that can expect an electrical effect can be constructed, and a shielding effect of blocking noise from an IC to which a radiator is attached or external noise can be expected. .

The cooling device for an electronic component according to the fifth invention of the present application is the electronic component according to the first invention of the present application, the second invention of the present application, the third invention of the present application, or the fifth invention of the present application. Wherein the electronic component, the mounting plate, the radiator, and the cushioning material are in conduction with the pattern provided on the printed circuit board.

According to the cooling device for an electronic component of the fifth aspect of the present invention having the above-described configuration, heat from the electronic component as a heating element is converted into air from a radiator or a mounting plate as a refrigerant. Since heat can be conducted to the pattern portion of the printed circuit board, the heat dissipation efficiency can be further improved.

According to a sixth aspect of the present invention, there is provided a method for cooling an electronic component, wherein the radiator is held by a mounting plate, and the radiator is brought into close contact with an electronic component mounted on a printed circuit board. It is characterized in that it is fixed to the substrate via a buffer material.

According to the electronic component cooling method of the sixth invention of the present application having the above structure, after the radiator is held by the mounting plate, the mounting plate and the printed circuit board can be detached with a screw or the like via the cushioning material. The radiator can be detached by being fixed by the appropriate fixing parts, and the radiator can be easily replaced. Further, since the cushioning material is interposed between the printed board and the fixing plate, the radiator and the IC package can be fixed with an appropriate contact pressure, so that no excessive pressure is applied to the IC package. Safe fixing can be achieved and the heat radiation effect can be improved.

A method for cooling an electronic component according to a seventh aspect of the present invention is the method for cooling an electronic component according to the sixth aspect of the present invention, wherein the mounting plate and the cushioning material are made of a material having high conductivity. It is characterized by being made of a material having elasticity.

According to the electronic component cooling method of the seventh aspect of the present invention having the above structure, the mounting plate and the cushioning material are made of a material having high conductivity and a material having elasticity. Using the elasticity, the radiator can be held while being sandwiched. Also, when the radiator is fixed to the printed circuit board due to the elasticity of the cushioning material,
The radiator and the IC package can be fixed with an appropriate contact pressure. Further, generated heat can be conducted to the printed circuit board side, and an effect of releasing heat to the printed circuit board as a refrigerant other than air can be expected.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. However, the following embodiments are merely examples showing a cooling device for electronic components of the present invention. (First Embodiment) FIG. 1 is a perspective view showing a cooling device for an electronic component according to a first embodiment of the present invention. FIG.
1 is a cross-sectional view illustrating a cooling device for an electronic component according to a first embodiment of the present invention.

As shown in FIG. 1, a cooling device for electronic parts according to a first embodiment of the present invention
Is held at a predetermined position with respect to the IC package 1 on which the integrated circuit element 2 is mounted. Further, a fixing hole 4-2 is provided at an end of the mounting plate 4 for holding the radiator 6 and the IC package 1. A through hole 9 for fixing the mounting plate 4 is provided on the printed board. Fixing hole 9 of mounting plate 4
The through hole 9 provided in the printed circuit board 3 is fixed by a fixing component such as a screw 8 via the cushioning material 5. The heat dissipation sheet 7 or silicon grease having a high heat conductivity is interposed on the joint surface between the radiator 6 and the IC package 1 to minimize the heat conduction loss. The radiator 6
Is molded using a metal (eg, aluminum) having high heat conductivity as a material, and is provided with a columnar heat radiating portion. Further, the mounting plate 4 has a gate shape, and the inner surface of the ceiling portion is in contact with the upper surface of the radiator 6, and the radiator 6 is moved downward.
That is, the surface is pressed in the direction of the printed circuit board. On the other hand, two side portions following both ends of the ceiling are each bent at an angle of less than 90 ° inward with respect to the ceiling. The inner surfaces of the two side surfaces are in contact with the two side surfaces of the radiator 6 facing each other, and sandwich and hold the radiator 6. In addition, the end portions of the two side portions are each bent outward, and form a surface parallel to the surface of the ceiling portion. A fixing hole 4-2 is formed in the center of the bent parallel surface as a through hole into which a fixing component such as a screw can be inserted. Next, a method of cooling an electronic component will be described with reference to FIGS. The radiator 6 is sandwiched and held by the U-shaped portion 4-1 of the mounting plate 4, and the cushioning material 5 is provided in the fixing holes 4-2 of the mounting plate 4 and the through holes 9 provided in the printed circuit board 3. And screwed with a screw 8. Junction heat generated from the integrated circuit 2 is transmitted to the radiator 6 via the radiating sheet 7,
The temperature of the integrated circuit 2 can be reduced by radiating heat to the surrounding air. When the radiator 6 is fixed to the IC package 4, the cushioning material 5 provided between the mounting plate 4 and the printed board 3 is elastically deformed, so that the radiator (heat sink) is formed.
6. The contact pressure between the heat radiation sheet 7 and the IC package 1 can be properly maintained.

(Second Embodiment) Next, an electronic component cooling device according to a second embodiment of the present invention will be described. FIG.
FIG. 4 is a diagram illustrating an example of a cooling device for an electronic component according to a second embodiment of the present invention. The second embodiment of the present invention is almost the same as the configuration of the first embodiment, and only the differences will be described. The difference between Embodiment 2 of the present invention and Embodiment 1 is that FIG.
A mounting plate 40 is used in which the mounting plate 4 is fixed at four points from the two-point fixing shape of the mounting plate 4. The mounting plate 40 is formed such that the two mounting plates 4 (FIG. 1) intersect each other, and the upper flat surface is formed in a cross shape. This is the surface pressed toward the substrate. On the other hand, the four side surfaces following both ends of the ceiling are each bent at an angle of less than 90 ° inward with respect to the ceiling. The insides of the four side surfaces are in contact with the four side surfaces of the radiator facing each other, and sandwich and hold the radiator 6 from four directions. Also, 4
The ends of the two side parts are each bent outwardly, forming a plane parallel to the plane of the ceiling. A fixing hole 4-2 is formed in the center of the bent parallel surface as a through hole into which a fixing component such as a screw can be inserted. That is, the mounting plate 40 of the second embodiment can hold the radiator 6 from all sides, improves the holding force, further increases the contact area between the mounting plate 40 and the radiator 6, and 3 and an increase in the contact area with the mounting plate 40 can be achieved. Further, since the number of screwed portions is four, the pressure applied to the cushioning material 5 can be further dispersed, and the radiator 6 and the IC package 1 can be held at an appropriate contact pressure. 6 can improve the reliability.

[0023]

As described in detail above, according to the electronic component cooling device of the present invention, the radiator is mounted on the IC by the mounting plate.
The package can be easily fixed by screwing, and can be easily attached and detached when the radiator is replaced. In addition, when the mounting plate is fixed to the printed circuit board, the cushioning material is deformed, so that the mounting plate does not press the radiator against the IC package with excessive force, so that the IC package is damaged. can avoid. Further, an appropriate contact pressure can be obtained between each of the IC package, the heat radiating sheet, and the heat radiator by the effect of the buffer material, so that good heat conduction can be obtained. Also, since the mounting plate securely holds the radiator, the radiator can be safely held even when the printed circuit board is mounted in the vertical direction. Furthermore, since the radiator, the mounting plate, and the cushioning material are in contact with each other, all the components are made to have conductivity, and the mounting holes on the printed circuit board side are connected to the pattern on the printed circuit board. And heat conduction to the pattern can be performed, and the generated heat can be conducted to the ground pattern and radiated. In addition, since all parts are conductive, the pattern on the printed circuit board is a GND pattern, so that the electrical level becomes the ground level, the radiator and the mounting plate can have a shielding effect, and the It is possible to reduce noise (EMI) or noise from the surroundings (EMI).

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a cooling device for an electronic component according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the electronic component cooling device according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating an example of an electronic component cooling device according to a second embodiment of the present invention.

FIG. 4 is a configuration diagram of a cooling device with a fixing bracket according to a first conventional example.

FIG. 5 is a configuration diagram of a cooling device when a second conventional PGA package is attached to an IC socket.

[Explanation of symbols]

 1 -------------------- IC package 2 ---------------------- Semiconductor integrated circuit 3 ----- Printed circuit board 4 --------------------- -Mounting plate 4-1-------------------------------------Buffer material 6- −−−−−−−− Heat radiator (heat sink) 7 −−−−−−−−−− Heat radiation sheet 8 −−−−−−−−−−−− Screw 9 −−−−−−−−−−−− Hole 40---------Mounting plate (4-way type)

Claims (7)

[Claims] 1. A cooling device for cooling an electronic component mounted on a printed circuit board by a radiator, comprising: a holding unit that holds the radiator at a predetermined position with respect to the electronic component; A cooling device for an electronic component, comprising: fixing means for fixing the radiator and the printed board via a buffer material. 2. The apparatus according to claim 1, wherein said holding means sandwiches and holds the radiator by a mounting plate, and wherein the fixing means fixes the mounting plate and the printed board via a cushioning material. A cooling device for an electronic component according to the above. 3. The electronic component cooling device according to claim 1, wherein the mounting plate is made of a material having high heat conductivity, a material having good conductivity, and a material having elasticity. 4. The cooling device for an electronic component according to claim 1, wherein the cushioning member is made of a material having high heat conductivity, a material having good conductivity, and a material having elasticity. 5. The electronic component, the mounting plate, the radiator, and the cushioning material are in conduction with the pattern provided on the printed circuit board. The cooling device for an electronic component according to claim 4. 6. The radiator is held by a mounting bracket, the radiator is brought into close contact with an electronic component mounted on a printed board, and the mounting bracket and the printed board are fixed via a cushioning material. Electronic component cooling method. 7. The method for cooling an electronic component according to claim 6, wherein the mounting plate and the cushioning material are made of a material having high conductivity and elasticity.