JP2009059760A - Heat dissipation structure of electronic circuit board - Google Patents

Heat dissipation structure of electronic circuit board Download PDF

Info

Publication number
JP2009059760A
JP2009059760A JP2007223742A JP2007223742A JP2009059760A JP 2009059760 A JP2009059760 A JP 2009059760A JP 2007223742 A JP2007223742 A JP 2007223742A JP 2007223742 A JP2007223742 A JP 2007223742A JP 2009059760 A JP2009059760 A JP 2009059760A
Authority
JP
Japan
Prior art keywords
circuit board
heat
generating component
head
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2007223742A
Other languages
Japanese (ja)
Inventor
Fujio Nomura
富二夫 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2007223742A priority Critical patent/JP2009059760A/en
Publication of JP2009059760A publication Critical patent/JP2009059760A/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic circuit board capable of eliminating the necessity of large-scale configuration by improving the heat dissipation performance of a semiconductor element for a signal base board having good heat transfer and excellent heat dissipation performance of the semiconductor element. <P>SOLUTION: The heat dissipation structure 11 of an electronic circuit board is provided with: a circuit board 12 mounted with a heat generating component 16a; base boards 13 provided with a predetermined space in almost parallel to the circuit board 12 on the side of the circuit board 12 where a head 16a1 of the heat generating component 16a is positioned; a heat path 18a provided adjacently to the head 16a1 of the heat generating component 16a in the space; an adhesive layer 17a for adhering and bonding the heat path 18a to the head 16a1 of the heat generating component 16a; and a solder layer 19a for heat-conductively coupling the heat path 18a to the base board 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電子回路基板に実装されるＩＣやＬＳＩ等の電子部品からの発熱を外部に放熱するための放熱構造体にかかるもので、特に密閉型の電子回路基板において好適する電子回路基板の放熱構造体に関する。   The present invention relates to a heat dissipation structure for dissipating heat generated from electronic components such as ICs and LSIs mounted on an electronic circuit board to the outside, and is particularly suitable for a sealed electronic circuit board. The present invention relates to a heat dissipation structure.

一般に、この種の電子回路基板の放熱構造体は、電子回路基板に実装されるＩＣやＬＳＩ等の電子部品からの発熱を外部へ放熱するために、電子回路基板の外部への開放型の場合には、熱伝導性のよいメタルベース基板を設けて発熱を逃がしたり、また、密閉型の場合には、メタルベース基板を設けることなく強制空冷により発熱を外部へ逃がす構成にしている。   Generally, this type of electronic circuit board heat dissipation structure is an open circuit type outside the electronic circuit board in order to dissipate heat generated from electronic components such as ICs and LSIs mounted on the electronic circuit board to the outside. In this case, a metal base substrate with good thermal conductivity is provided to release heat, and in the case of a sealed type, heat generation is released to the outside by forced air cooling without providing a metal base substrate.

従来のこの種の電子回路基板の放熱構造体として、例えば密閉型のものとして熱伝導性のよいメタルベース基板を採用したものがある。（特許文献１参照）。   As a conventional heat dissipation structure for this type of electronic circuit board, for example, there is a closed type that employs a metal base substrate having good thermal conductivity. (See Patent Document 1).

図２は、従来の電子回路基板の放熱構造体（特許文献１）の概要を示す要部断面図である。   FIG. 2 is a cross-sectional view of an essential part showing an outline of a conventional heat dissipation structure for an electronic circuit board (Patent Document 1).

電子回路基板の放熱構造体１は、相対向して設けられた２枚のメタルベース基板２と、これらのメタルベース基板２の相対向する側に設けられた配線パターン層３と、この各々の配線パターン層３上に任意に点在して設けられる複数の半導体素子群４と、特定の半導体素子４ａに対して熱伝導的に接するように、２枚のメタルベース基板２のそれぞれに相対向して内側に突出させて設けたメタル隆起部２ａを備えている。   An electronic circuit board heat dissipation structure 1 includes two metal base substrates 2 provided opposite to each other, a wiring pattern layer 3 provided on the opposite sides of these metal base substrates 2, Opposite to each of the two metal base substrates 2 so as to be in thermal conductive contact with a specific semiconductor element 4a and a plurality of semiconductor element groups 4 that are arbitrarily scattered on the wiring pattern layer 3 And a metal raised portion 2a provided to protrude inward.

この構成により、特定の半導体素子４ａからの発熱がメタル隆起部２ａを介してメタルベース基板２全体から外部へ放熱するようになっている。また、他の半導体素子群４からの発熱に対しても間接的に放熱させる構成になっている。   With this configuration, heat generated from the specific semiconductor element 4a is radiated from the entire metal base substrate 2 to the outside via the metal raised portion 2a. In addition, heat is indirectly radiated from heat generated from other semiconductor element groups 4.

従って、半導体素子群４からの発熱のみならず、特に半導体素子４ａからの発熱を放熱するので、半導体素子４ａの故障の原因や誤作動を起こすというようなことがないようになっている。
特開平４−２２５５８９号公報 Therefore, not only the heat generation from the semiconductor element group 4 but also the heat generation from the semiconductor element 4a is dissipated in particular, so that there is no cause of failure or malfunction of the semiconductor element 4a.
JP-A-4-225589

従来の電子回路基板の放熱構造体１によれば、配線パターン層３や半導体素子群４がメタルベース基板２の片面に設けられ、このメタルベース基板２を２枚１組として構成されたものであって、特に、半導体素子群４が向かい合うように設置された構成であるので、半導体素子群４からの発熱が集中して十分な放熱作用が得られなかった。   According to the heat dissipation structure 1 of the conventional electronic circuit board, the wiring pattern layer 3 and the semiconductor element group 4 are provided on one side of the metal base board 2, and the metal base board 2 is configured as a set of two sheets. In particular, since the semiconductor element group 4 is disposed so as to face each other, the heat generated from the semiconductor element group 4 is concentrated, and a sufficient heat radiation function cannot be obtained.

また、特定した半導体素子４ａからの発熱に対しては放熱を良好にすることができるが、他の半導体素子群４にあっては、十分な放熱が期待できず、それがため、メタルベース基板２は、必要以上に大きなものを設けねばならず構成が大掛かりになる上、コスト高となっていた。   In addition, although heat dissipation can be improved with respect to the heat generated from the specified semiconductor element 4a, in the other semiconductor element group 4, sufficient heat dissipation cannot be expected. 2 has to be provided with a larger size than necessary, and the construction becomes large and the cost is high.

本発明は、上記の事情に鑑みてなされたもので、半導体素子群全体の放熱性に優れた１つのメタルベース基板に相当する熱伝導性の良好なベース基板を用いることにより、個々の半導体素子の放熱性を良好にすると共に、大掛かりな構成にする必要のない電子回路基板の放熱構造体を提供することを目的とする。   The present invention has been made in view of the above circumstances, and by using a base substrate with good thermal conductivity corresponding to one metal base substrate having excellent heat dissipation of the entire semiconductor element group, individual semiconductor elements are provided. An object of the present invention is to provide a heat dissipation structure for an electronic circuit board that does not require a large-scale configuration.

上記目的を達成するために、本発明によれば、発熱部品を実装した回路基板と、前記回路基板の発熱部品の頭部が位置する側に、前記回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、前記間隔内において、前記発熱部品の頭部に隣接して設けられるヒートパスと、当該ヒートパスと発熱部品の頭部とを接着接合する接着剤層と、前記ヒートパスと前記ベース基板とを熱伝導的に結合する半田層とを具備したことを特徴とする電子回路基板の放熱構造体を提供する。   In order to achieve the above object, according to the present invention, a predetermined interval is provided substantially parallel to the circuit board on the side of the circuit board on which the heat generating component is mounted and the head of the heat generating component on the circuit board. A base substrate provided within the space, a heat path provided adjacent to the head of the heat generating component, an adhesive layer for adhesively bonding the heat path and the head of the heat generating component, and the heat path and the base. Provided is a heat dissipation structure for an electronic circuit board, comprising a solder layer that thermally conductively couples the board.

上記目的を達成するために、本発明によれば、発熱部品を実装した回路基板と、前記回路基板の発熱部品の頭部が位置する側に、回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、前記間隔内において、前記発熱部品の頭部と前記ベース基板とを接着接合する接着剤層とを具備したことを特徴とする電子回路基板の放熱構造体を提供する。   In order to achieve the above object, according to the present invention, a circuit board on which a heat generating component is mounted and a side of the circuit board on which the head of the heat generating component is located are spaced substantially parallel to the circuit board. Provided is a heat dissipation structure for an electronic circuit board, comprising: a base substrate provided; and an adhesive layer that adhesively bonds the head of the heat generating component and the base substrate within the interval.

上記目的を達成するために、本発明によれば、発熱部品を実装した回路基板と、前記回路基板の発熱部品の頭部が位置する反対側に、回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、前記間隔内において、前記発熱部品の頭部が位置する反対側の前記頭部の対向位置に設けられるヒートパスと、前記ヒートパスと前記回路基板とを接着接合する接着剤層と、前記ヒートパスと前記ベース基板とを結合する半田層とを具備したことを特徴とする電子回路基板の放熱構造体を提供する。   In order to achieve the above object, according to the present invention, a predetermined interval is provided substantially in parallel with the circuit board on the opposite side of the circuit board on which the heat generating component is mounted and the head of the heat generating component on the circuit board. A base substrate provided in a space, a heat path provided at an opposite position of the head on the opposite side of the space where the head of the heat generating component is located, and an adhesive layer for adhesively bonding the heat path and the circuit board. And a heat dissipation structure for an electronic circuit board, comprising: a solder layer that couples the heat path and the base substrate.

上記目的を達成するために、本発明によれば、発熱部品を実装した回路基板と、前記回路基板の発熱部品の頭部が位置する側に、回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、前記間隔内において、前記発熱部品の頭部に隣接して設けられるヒートパスと、当該ヒートパスと前記ベース基板とを結合する半田層と、前記間隔内において、他の発熱部品の頭部と前記ベース基板とを接合接着させる接着剤層とを具備したことを特徴とする電子回路基板の放熱構造体を提供する。   In order to achieve the above object, according to the present invention, a circuit board on which a heat generating component is mounted and a side of the circuit board on which the head of the heat generating component is located are spaced substantially parallel to the circuit board. A base substrate provided, a heat path provided adjacent to the head of the heat generating component within the interval, a solder layer that couples the heat path and the base substrate, and other heat generating components within the interval. Provided is a heat dissipation structure for an electronic circuit board comprising an adhesive layer for bonding the head and the base substrate together.

上記目的を達成するために、本発明によれば、発熱部品を実装した回路基板と、前記回路基板とほぼ平行に所定の間隔をおいて設けたベース基板と、前記回路基板の下側に設けた発熱部品の頭部および前記回路基板の上側に設けた発熱部品の頭部と対向する前記回路基板の下側において、前記発熱部品の頭部および前記回路基板の下側にそれぞれ熱伝導的に設けられるヒートパスと、これらのヒートパスと前記ベース基板とを結合する半田層とを具備したことを特徴とする電子回路基板の放熱構造体を提供する。   In order to achieve the above object, according to the present invention, a circuit board on which a heat generating component is mounted, a base board provided substantially parallel to the circuit board at a predetermined interval, and a lower side of the circuit board are provided. The heat generating component head and the heat generating component provided on the upper side of the circuit board are opposed to the heat generating component on the lower side of the circuit board. Provided is a heat dissipation structure for an electronic circuit board, comprising: a heat path to be provided; and a solder layer that couples the heat path and the base substrate.

本発明によれば、特に密閉型の電子回路基板において、半導体素子の放熱性に優れた１つの熱伝導性の良好なベース基板を用いると共に、このベース基板に対して半導体素子の放熱性を良好にして、大掛かりな構成にする必要のない電子回路基板の放熱構造体を提供することができる。   According to the present invention, in particular, in a sealed electronic circuit board, a single heat-conductive base substrate having excellent heat dissipation of the semiconductor element is used, and the heat dissipation of the semiconductor element is excellent with respect to the base substrate. Thus, it is possible to provide a heat dissipation structure for an electronic circuit board that does not require a large-scale configuration.

本発明に係る電子回路基板の放熱構造体の実施形態について、添付図面を参照して説明する。   An embodiment of a heat dissipation structure for an electronic circuit board according to the present invention will be described with reference to the accompanying drawings.

図１は本発明の電子回路基板の放熱構造体の概要を示す断面図である。電子回路基板の放熱構造体１１は、電子部品や回路部品を装着した回路基板１２と、この回路基板１２を支持固定する一方、電子部品や回路部品からの発熱を外部へ放熱するベース基板１３と、回路基板１２とベース基板１３とを所定の間隔が保持されるように、回路基板１２とベース基板１３との間において、ほぼ平行な所定の間隔ｌが得られるように設けられるスペーサ１４と、回路基板１２とベース基板１３とをスペーサ１４に固定するボルト・ナット１５とを備えている。   FIG. 1 is a sectional view showing an outline of a heat dissipation structure for an electronic circuit board according to the present invention. An electronic circuit board heat dissipation structure 11 includes a circuit board 12 on which electronic parts and circuit parts are mounted, and a base board 13 that supports and fixes the circuit board 12 and radiates heat generated from the electronic parts and circuit parts to the outside. A spacer 14 provided so as to obtain a substantially parallel predetermined interval l between the circuit board 12 and the base substrate 13 so that the predetermined interval is maintained between the circuit board 12 and the base substrate 13; Bolts and nuts 15 for fixing the circuit board 12 and the base board 13 to the spacer 14 are provided.

回路基板１２は、回路基板本体１２ａの下面ａ側に、発熱部品である半導体素子１６ａおよび１６ｂが、またその上面ｂ側には半導体素子１６ｃがそれぞれ設けられて構成される。   The circuit board 12 is configured by providing semiconductor elements 16a and 16b, which are heat-generating components, on the lower surface a side of the circuit board body 12a, and a semiconductor element 16c on the upper surface b side.

回路基板本体１２ａは、例えばその上面ｂ側に、図示しない複数の半導体およびその他の電子素子間を接続する導電パターン１２ａ１を備えている。   The circuit board body 12a includes, for example, a conductive pattern 12a1 that connects a plurality of semiconductors and other electronic elements (not shown) on the upper surface b side.

半導体素子１６ａは、その頭部１６ａ１が回路基板１２とベース基板１３との間隔ｌの中間部に位置する程度に下向きに設けられる。この頭部１６ａ１の頂部平坦面が、例えばシリコンの主成分が０．８Ｗ／（ｍ・Ｋ）以上の熱伝導率の高いゲル状の樹脂からなる接着剤層１７ａを介して、熱伝導部材である例えば黄銅製のヒートパス１８ａが設けられる。更に、例えば錫・銀・銅の成分からなる半田層１９ａを介してベース基板１３側へ一体的に固定される。   The semiconductor element 16a is provided downward so that the head portion 16a1 is positioned at an intermediate portion of the interval l between the circuit board 12 and the base substrate 13. The top flat surface of the head 16a1 is a heat conductive member via an adhesive layer 17a made of a gel-like resin having a high thermal conductivity of, for example, a silicon main component of 0.8 W / (m · K) or more. For example, a heat path 18a made of brass is provided. Furthermore, it is integrally fixed to the base substrate 13 side via a solder layer 19a made of, for example, a tin, silver, or copper component.

半導体素子１６ｂは、その頭部１６ｂ１が、回路基板１２とベース基板１３との間隔ｌに丁度収まる程度の大きさのもので、頭部１６ｂ１の頂部平坦面が直接接着剤層１７ａと同様の接着剤層１７ｂを介して一体的に固定される。   The semiconductor element 16b has such a size that the head portion 16b1 is just fit in the interval l between the circuit board 12 and the base substrate 13, and the top flat surface of the head portion 16b1 is directly bonded to the adhesive layer 17a. It is integrally fixed via the agent layer 17b.

半導体素子１６ｃは、頭部１６ｃ１が回路基板本体１２ａの上面ｂに上向きに位置するように回路基板本体１２ａに設けられる。頭部１６ｃ１と対向する回路基板本体１２ａの下面ａ側には、回路基板１２とベース基板１３との間隔ｌよりやや高さの低い熱伝導部材である例えば黄銅製のヒートパス１８ｂが接着剤層１７ａと同様の樹脂性の接着剤層１７ｃを介して一体的に接着される。更に、このヒートパス１８ｂは、半田層１９ａと同様の材質の半田層１９ｂを介してベース基板１３側へ一体的に固定される。   The semiconductor element 16c is provided on the circuit board body 12a so that the head portion 16c1 is positioned upward on the upper surface b of the circuit board body 12a. On the lower surface a side of the circuit board main body 12a facing the head portion 16c1, a heat path 18b made of, for example, brass, which is a heat conductive member having a height slightly lower than the distance l between the circuit board 12 and the base substrate 13, is an adhesive layer 17a. Are integrally bonded through the same resinous adhesive layer 17c. Further, the heat path 18b is integrally fixed to the base substrate 13 via a solder layer 19b made of the same material as the solder layer 19a.

ベース基板１３は、回路基板１２側からの発熱を熱伝導により受け、ヒートシンク２０側に放熱するようになっているもので、熱伝導性良好なベース基板本体１３ａと、接着剤層１３ｂを介して接着接合される支持体１３ｃとから構成される。   The base board 13 receives heat generated from the circuit board 12 side by heat conduction and dissipates heat to the heat sink 20 side. The base board body 13a having good heat conductivity and the adhesive layer 13b are used. It is comprised from the support body 13c adhere | attached and joined.

ベース基板本体１３ａは、例えばガラスクロス入りエポキシ樹脂と銅箔で構成されたものである。支持体１３ｂは、アルミニウムなどの熱伝導性の良好な金属が用いられる。接着剤層１３ｃは、これらのベース基板本体１３ａおよび支持体１３ｂを接着接合してベース基板１３が構成される。   The base substrate body 13a is made of, for example, an epoxy resin containing glass cloth and copper foil. The support 13b is made of a metal having good thermal conductivity such as aluminum. The adhesive layer 13c is formed by bonding the base substrate body 13a and the support 13b to form the base substrate 13.

なお、スペーサ１４は、回路基板１２とベース基板１３との間隔を保持させるために設けたものであるが、回路基板１２に設けられる各半導体素子１６ａ〜１６ｃの頭部１６ａ１〜１６ｃ１の大きさに応じて十分収まる寸法となるように適当長のものを選定して使用すればよい。   The spacer 14 is provided to maintain the distance between the circuit board 12 and the base substrate 13, but is the size of the heads 16 a 1 to 16 c 1 of the semiconductor elements 16 a to 16 c provided on the circuit board 12. Accordingly, an appropriate length may be selected and used so that the dimensions can be sufficiently accommodated.

従って、回路基板１２の回路基板本体１２ａに設けられる各半導体素子１６ａ〜１６ｃからの発熱は、接着剤層１７ａ〜１７ｃ、ヒートパス１８ａ，１８ｂおよび半田層１９ａ，１９ｂを介してそれぞれベース基板１３側を介してヒートシンク２０側に放熱するようにしたから、
特に密閉型の電子回路基板において、半導体素子の放熱性に優れた１つの熱伝導性の良好なベース基板を用いる一方、このベース基板に対して半導体素子の放熱性を良好にしたから、大掛かりな構成にする必要のない電子回路基板の放熱構造体を提供することができる。 Therefore, the heat generated from each of the semiconductor elements 16a to 16c provided on the circuit board main body 12a of the circuit board 12 passes through the adhesive layers 17a to 17c, the heat paths 18a and 18b, and the solder layers 19a and 19b, respectively. Since heat is radiated to the heat sink 20 side,
In particular, in a sealed electronic circuit board, a single heat conductive base substrate having excellent heat dissipation of a semiconductor element is used, while the heat dissipation of the semiconductor element is improved with respect to this base substrate. It is possible to provide a heat dissipation structure for an electronic circuit board that does not need to be configured.

また、放熱構造体１１によれば、半導体素子群全体の放熱性に優れ、発熱部品の異常温度上昇に起因してこの発熱部品が故障して機能不良になったり、損傷したりすることがない。   Moreover, according to the heat dissipation structure 11, the heat dissipation of the entire semiconductor element group is excellent, and the heat generating component does not fail due to an abnormal temperature rise of the heat generating component, resulting in malfunction or damage. .

更に、放熱構造体１１に用いた半田層１９ａ，１９ｂは、リフローによる半田付けを可能にすることができるのでローコスト化を図ることができる。また、リフロー化によりヒートパス１８ａやベース基板１３の基礎となる排熱用金属の使用を極少化することができ、コストダウンや資源の有効活用ができる。   Furthermore, since the solder layers 19a and 19b used in the heat dissipation structure 11 can be soldered by reflow, the cost can be reduced. In addition, the reflow process can minimize the use of the heat exhaust metal that is the basis of the heat path 18a and the base substrate 13, thereby reducing costs and effectively utilizing resources.

上述した本発明の電子回路基板の放熱構造体１１によれば、回路基板１２は、回路基板本体１２ａの下面ａおよび上面ｂのそれぞれに設けた半導体素子１６ａ〜１６ｃを例示したが、半導体素子１６ａ〜１６ｃは、回路基板本体１２ａの下面ａおよび上面ｂの両方または何れか一方であってもよい。   According to the electronic circuit board heat dissipation structure 11 of the present invention described above, the circuit board 12 is exemplified by the semiconductor elements 16a to 16c provided on the lower surface a and the upper surface b of the circuit board body 12a. -16c may be both or any one of the lower surface a and the upper surface b of the circuit board main body 12a.

また、半導体素子１６ａ，１６ｂの頭部１６ａ１，１６ｂ１は、その頂面が平坦なものを用いたが、凸凹状のものであっても差し支えない。その場合には、接着剤層やヒートパス部材も同様に凸凹状のものにすれば平坦な場合と同様に熱伝達機能を得ることができる。   The heads 16a1 and 16b1 of the semiconductor elements 16a and 16b have flat top surfaces, but may be uneven. In that case, if the adhesive layer and the heat path member are similarly uneven, a heat transfer function can be obtained as in the case of flatness.

また、電子回路基板の放熱構造体１１のベース基板１３は、熱伝導性良好なベース基板本体１３ａと、接着剤層１３ｃを介して接着接合される支持体１３ｂとから構成されたものを用いたが、ベース基板本体１３ａ自体に支持体１３ｂを兼用させたベース基板であってもよい。   In addition, the base substrate 13 of the heat dissipation structure 11 of the electronic circuit board used was composed of a base substrate body 13a with good thermal conductivity and a support 13b bonded and bonded via an adhesive layer 13c. However, a base substrate in which the base substrate body 13a itself is also used as the support 13b may be used.

本発明の電子回路基板の放熱構造体の概要を示す断面図。Sectional drawing which shows the outline | summary of the thermal radiation structure of the electronic circuit board of this invention. 従来の電子回路基板の放熱構造体を示す断面図。Sectional drawing which shows the heat dissipation structure of the conventional electronic circuit board.

符号の説明Explanation of symbols

１１ 放熱構造体
１２ 回路基板
１２ａ 回路基板本体
１２ａ１ 導電パターン
１３ ベース基板
１３ａ ベース基板本体
１３ｂ 支持体
１３ｃ 接着剤層
１４ スペーサ
１５ ボルト・ナット
１６ａ〜１６ｃ 半導体素子（発熱部品）
１６ａ１〜１６ｃ１ 頭部
１７ａ〜１７ｃ 接着剤層
１８ａ，１８ｂ ヒートパス
１９ａ，１９ｂ 半田層
２０ ヒートシンク
ａ 下面
ｂ 上面 DESCRIPTION OF SYMBOLS 11 Heat dissipation structure 12 Circuit board 12a Circuit board main body 12a1 Conductive pattern 13 Base board 13a Base board main body 13b Support body 13c Adhesive layer 14 Spacer 15 Bolt / nut 16a-16c Semiconductor element (heat-generating component)
16a1 to 16c1 Heads 17a to 17c Adhesive layers 18a and 18b Heat paths 19a and 19b Solder layer 20 Heat sink a Lower surface b Upper surface

Claims (5)

発熱部品を実装した回路基板と、
前記回路基板の発熱部品の頭部が位置する側に、前記回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、
前記間隔内において、前記発熱部品の頭部に隣接して設けられるヒートパスと、
当該ヒートパスと発熱部品の頭部とを接着接合する接着剤層と、
前記ヒートパスと前記ベース基板とを熱伝導的に結合する半田層とを具備したことを特徴とする電子回路基板の放熱構造体。 A circuit board on which a heat generating component is mounted;
A base substrate provided on the side where the head of the heat generating component of the circuit board is located at a predetermined interval substantially parallel to the circuit board;
Within the interval, a heat path provided adjacent to the head of the heat generating component,
An adhesive layer for adhesively bonding the heat path and the head of the heat generating component;
A heat dissipation structure for an electronic circuit board, comprising: a solder layer that thermally conductively couples the heat path and the base substrate. 発熱部品を実装した回路基板と、
前記回路基板の発熱部品の頭部が位置する側に、回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、
前記間隔内において、前記発熱部品の頭部と前記ベース基板とを接着接合する接着剤層とを具備したことを特徴とする電子回路基板の放熱構造体。 A circuit board on which a heat generating component is mounted;
A base substrate provided on the side of the circuit board on which the head of the heat generating component is located and provided substantially in parallel with the circuit board at a predetermined interval;
An electronic circuit board heat dissipation structure comprising an adhesive layer for bonding the head of the heat generating component and the base substrate within the interval. 発熱部品を実装した回路基板と、
前記回路基板の発熱部品の頭部が位置する反対側に、回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、
前記間隔内において、前記発熱部品の頭部が位置する反対側の前記頭部の対向位置に設けられるヒートパスと、
前記ヒートパスと前記回路基板とを接着接合する接着剤層と、
前記ヒートパスと前記ベース基板とを結合する半田層とを具備したことを特徴とする電子回路基板の放熱構造体。 A circuit board mounted with a heat generating component;
A base substrate provided on the opposite side of the circuit board where the head of the heat-generating component is located and provided substantially in parallel with the circuit board at a predetermined interval;
Within the interval, a heat path provided at an opposite position of the head on the opposite side where the head of the heat generating component is located,
An adhesive layer for adhesively bonding the heat path and the circuit board;
A heat dissipation structure for an electronic circuit board, comprising a solder layer for joining the heat path and the base board. 発熱部品を実装した回路基板と、
前記回路基板の発熱部品の頭部が位置する側に、回路基板とほぼ平行に所定の間隔をおいて設けられるベース基板と、
前記間隔内において、前記発熱部品の頭部に隣接して設けられるヒートパスと、
当該ヒートパスと前記ベース基板とを結合する半田層と、
前記間隔内において、他の発熱部品の頭部と前記ベース基板とを接合接着させる接着剤層とを具備したことを特徴とする電子回路基板の放熱構造体。 A circuit board on which a heat generating component is mounted;
A base substrate provided on the side of the circuit board on which the head of the heat generating component is located and provided substantially in parallel with the circuit board at a predetermined interval;
Within the interval, a heat path provided adjacent to the head of the heat generating component,
A solder layer for bonding the heat path and the base substrate;
An electronic circuit board heat dissipation structure comprising: an adhesive layer for bonding and bonding a head of another heat generating component and the base substrate within the interval. 発熱部品を実装した回路基板と、
前記回路基板とほぼ平行に所定の間隔をおいて設けたベース基板と、
前記回路基板の下側に設けた発熱部品の頭部および前記回路基板の上側に設けた発熱部品の頭部と対向する前記回路基板の下側において、前記発熱部品の頭部および前記回路基板の下側にそれぞれ熱伝導的に設けられるヒートパスと、
これらのヒートパスと前記ベース基板とを結合する半田層とを具備したことを特徴とする電子回路基板の放熱構造体。 A circuit board on which a heat generating component is mounted;
A base substrate provided at a predetermined interval substantially parallel to the circuit board;
On the lower side of the circuit board facing the head of the heat generating component provided on the lower side of the circuit board and the head of the heat generating component provided on the upper side of the circuit board, the head of the heat generating component and the circuit board A heat path provided on each of the lower sides in a thermally conductive manner;
A heat dissipating structure for an electronic circuit board, comprising: a heat layer for joining the heat path and the base board.
JP2007223742A 2007-08-30 2007-08-30 Heat dissipation structure of electronic circuit board Abandoned JP2009059760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007223742A JP2009059760A (en) 2007-08-30 2007-08-30 Heat dissipation structure of electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007223742A JP2009059760A (en) 2007-08-30 2007-08-30 Heat dissipation structure of electronic circuit board

Publications (1)

Publication Number Publication Date
JP2009059760A true JP2009059760A (en) 2009-03-19

Family

ID=40555272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007223742A Abandoned JP2009059760A (en) 2007-08-30 2007-08-30 Heat dissipation structure of electronic circuit board

Country Status (1)

Country Link
JP (1) JP2009059760A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014013849A (en) * 2012-07-05 2014-01-23 Fujikura Ltd Heat dissipation structure for electronic apparatus
EP2779231A2 (en) * 2013-03-14 2014-09-17 General Electric Company Power overlay structure and method of making same
EP2779230A2 (en) * 2013-03-14 2014-09-17 General Electric Company Power overlay structure and method of making same
DE102012202576B4 (en) * 2011-02-24 2017-02-16 Denso Corporation ELECTRONIC CONTROL UNIT
US9826623B2 (en) 2013-05-22 2017-11-21 Kaneka Corporation Heat dissipating structure

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489451A (en) * 1987-07-01 1989-04-03 Digital Equipment Corp Package for semiconductor chip
JPH06196598A (en) * 1992-12-25 1994-07-15 Oki Electric Ind Co Ltd Mounting structure for semiconductor chip
JPH098185A (en) * 1995-06-23 1997-01-10 Hitachi Ltd Package with electronic-component cooling structure and its manufacture
JPH09213847A (en) * 1996-02-01 1997-08-15 Hitachi Ltd Semiconductor integrated circuit device, manufacture thereof, and electronic device equipped therewith
JPH1065385A (en) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp Substrate case structure
JPH10229288A (en) * 1997-02-13 1998-08-25 Sansha Electric Mfg Co Ltd Power semiconductor device
JP2001237353A (en) * 2000-02-21 2001-08-31 Fujitsu Denso Ltd Heat radiating structure of electronic part and method of manufacturing electronic part
JP2003051573A (en) * 2001-05-31 2003-02-21 Matsushita Electric Ind Co Ltd Power module and its manufacturing method
JP2003289191A (en) * 2002-03-28 2003-10-10 Denso Corp Electronic control device
JP2004006791A (en) * 2002-04-12 2004-01-08 Denso Corp Electronic controller and its production method
JP2005012127A (en) * 2003-06-20 2005-01-13 Denso Corp Electronic control apparatus
JP2005109005A (en) * 2003-09-29 2005-04-21 Murata Mfg Co Ltd Heat dissipation structure of module

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489451A (en) * 1987-07-01 1989-04-03 Digital Equipment Corp Package for semiconductor chip
JPH06196598A (en) * 1992-12-25 1994-07-15 Oki Electric Ind Co Ltd Mounting structure for semiconductor chip
JPH098185A (en) * 1995-06-23 1997-01-10 Hitachi Ltd Package with electronic-component cooling structure and its manufacture
JPH09213847A (en) * 1996-02-01 1997-08-15 Hitachi Ltd Semiconductor integrated circuit device, manufacture thereof, and electronic device equipped therewith
JPH1065385A (en) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp Substrate case structure
JPH10229288A (en) * 1997-02-13 1998-08-25 Sansha Electric Mfg Co Ltd Power semiconductor device
JP2001237353A (en) * 2000-02-21 2001-08-31 Fujitsu Denso Ltd Heat radiating structure of electronic part and method of manufacturing electronic part
JP2003051573A (en) * 2001-05-31 2003-02-21 Matsushita Electric Ind Co Ltd Power module and its manufacturing method
JP2003289191A (en) * 2002-03-28 2003-10-10 Denso Corp Electronic control device
JP2004006791A (en) * 2002-04-12 2004-01-08 Denso Corp Electronic controller and its production method
JP2005012127A (en) * 2003-06-20 2005-01-13 Denso Corp Electronic control apparatus
JP2005109005A (en) * 2003-09-29 2005-04-21 Murata Mfg Co Ltd Heat dissipation structure of module

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012202576B4 (en) * 2011-02-24 2017-02-16 Denso Corporation ELECTRONIC CONTROL UNIT
JP2014013849A (en) * 2012-07-05 2014-01-23 Fujikura Ltd Heat dissipation structure for electronic apparatus
EP2779231A2 (en) * 2013-03-14 2014-09-17 General Electric Company Power overlay structure and method of making same
EP2779230A2 (en) * 2013-03-14 2014-09-17 General Electric Company Power overlay structure and method of making same
CN104051377A (en) * 2013-03-14 2014-09-17 通用电气公司 Power Overlay Structure And Method Of Making Same
JP2014179612A (en) * 2013-03-14 2014-09-25 General Electric Co <Ge> Power overlay structure and method for manufacturing the same
EP2779231A3 (en) * 2013-03-14 2015-04-29 General Electric Company Power overlay structure and method of making same
EP2779230A3 (en) * 2013-03-14 2015-04-29 General Electric Company Power overlay structure and method of making same
US9704788B2 (en) 2013-03-14 2017-07-11 General Electric Company Power overlay structure and method of making same
US10186477B2 (en) 2013-03-14 2019-01-22 General Electric Company Power overlay structure and method of making same
US10269688B2 (en) 2013-03-14 2019-04-23 General Electric Company Power overlay structure and method of making same
US9826623B2 (en) 2013-05-22 2017-11-21 Kaneka Corporation Heat dissipating structure

Similar Documents

Publication Publication Date Title
JP2010182831A (en) Semiconductor device
JPH09283697A (en) Stack module
JP2009117612A (en) Circuit module and method of manufacturing the same
JP2017123379A (en) Semiconductor device
US20130206367A1 (en) Heat dissipating module
WO2018168591A1 (en) Module
JP2009043851A (en) Semiconductor package
JP2007305761A (en) Semiconductor device
JP2009059760A (en) Heat dissipation structure of electronic circuit board
JP2009218299A (en) Liquid cooling module
JPH0247895A (en) Heat dissipation plate
JP4726729B2 (en) Heat dissipation structure for electronic devices
TWI645588B (en) Thermal and thermal structure of semiconductor
JP4438526B2 (en) Power component cooling system
TWI522032B (en) Heat dissipating module
US20120002371A1 (en) Electronic device with heat dissipation apparatus
JP2012169330A (en) Electronic device
JP2004079949A (en) Heat sink of heat generating semiconductor device in memory module
JP3975203B2 (en) Capacitor board with radiator
JP6686467B2 (en) Electronic component heat dissipation structure
JP2006140390A (en) Power semiconductor equipment
JP2011258869A (en) Heat radiating plate unit and electronic circuit device
JP5935330B2 (en) Semiconductor device, manufacturing method thereof, and electronic device
KR101281043B1 (en) Heat sink
JP2001068887A (en) Cooling structure of printed-circiut board

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091127

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100426

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110201

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20110318