JP2011258869A - Heat radiating plate unit and electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique that effectively conducts heat radiation of a plurality of heating components with a simple constitution.SOLUTION: A first IC51 and a second IC52 are provided as multiple heating electronic components in an electronic circuit device 1. The first IC51 and the second IC52 are installed with a composite heat radiating plate 10 in common which is fixed with screws 91, 92 to a substrate 80. In this case, the heating value of the first IC51 is higher than that of the second IC52. The composite heat radiating plate 10 includes a first heat radiating plate 20 and a second heat radiating plate 30 which are integrated through a thermal separation member 40.

Description

  The present invention relates to a heat radiating plate unit and an electronic circuit device, for example, a heat radiating plate unit having a function of radiating heat from a plurality of heat generating components, and an electronic circuit device having such a heat radiating plate unit and a plurality of heat generating components.

  Various electronic components such as an IC are mounted on the electronic circuit device. Among such electronic components, there are components that generate a large amount of heat and require a heat sink or the like to be attached. And when there is much calorific value, the technique which employ | adopted the heat sink which provided many fins in order to expand a thermal radiation area is known. In addition, there is a technique (see Patent Document 1) that efficiently radiates heat by bending a plurality of heat radiating plates to increase a heat radiating area.

  Here, FIGS. 8A and 8B show an example of an electronic circuit device in which a heat sink is attached to a plurality of electronic components. FIG. 8A is a side view, and FIG. 8B is a plan view. A first IC 151 and a second IC 152 are attached to the substrate 180, and the heat sinks 111 and 112 are fixed with screws 191, respectively. Thus, it is common that a heat sink is attached to each heat generating component (electronic component). And according to the emitted-heat amount, the thickness and the thermal radiation area of the heat sinks 111 and 112 are changed suitably.

Utility model registration No. 3153291

  By the way, as shown in FIG. 8, when there are parts with different calorific values, a heat radiating plate is attached to each part to separate the heat so as not to be affected by mutual heat. However, there are problems such as making extra holes in the board and chassis when mounting, and extra screws being required, and a technique to solve them has been demanded.

  In view of the above problems, an object of the present invention is to provide a technique for effectively radiating heat from a plurality of heat generating components with a simple configuration.

The apparatus according to the present invention relates to a heat sink unit. The heat radiating plate unit includes a first heat radiating plate that radiates heat generated in the first component arranged on the substrate, and a second heat radiating that radiates heat generated in the second component arranged on the substrate. A plate, and a heat separating means sandwiched between the first heat radiating plate and the second heat radiating plate, and configured integrally while thermally separating the first heat radiating plate and the second heat radiating plate, The first heat radiating plate covers a part of the second heat radiating plate.
The second heat radiating plate may include a fixing hole for fixing the second heat radiating plate to the substrate in a portion not covered with the first heat radiating plate.
The heat separating means may be made of an elastic material and extendable in a direction in which a height shift between the first component and the second component can be adjusted.
The heat separating means may be made of an elastic material and extendable in a direction in which the shift of the fixed position can be adjusted.
Another apparatus according to the present invention includes the above-described heat radiating plate unit, and the first component and the second component to which the heat radiating plate unit is attached in common.

  According to the present invention, there is provided a technique for effectively radiating heat from a plurality of heat generating components with a simple configuration.

It is the figure which showed typically the electronic circuit apparatus based on embodiment of this invention. It is a figure which shows the shape of the 1st heat sink based on embodiment of this invention. It is a figure which shows the shape of the 2nd heat sink based on embodiment of this invention. It is a figure which shows the shape of the heat separation member based on embodiment of this invention. It is a figure explaining the effect of the composite heat sink based on embodiment of this invention. It is the figure which showed typically the electronic circuit apparatus based on the modification of this invention. It is the figure which showed typically the electronic circuit apparatus based on the modification of this invention. It is the figure which showed the electronic circuit device based on a prior art typically.

  Next, modes for carrying out the present invention (hereinafter, simply referred to as “embodiments”) will be specifically described with reference to the drawings. FIG. 1 is a diagram schematically showing an electronic circuit device 1 according to the present embodiment, in which FIG. 1 (a) is a front view and FIG. 1 (b) is a plan view.

  As illustrated, the electronic circuit device 1 includes a first IC 51 and a second IC 52 as a plurality of electronic components that generate heat. The first IC 51 and the second IC 52 are mounted with the composite heat sink 10 as a heat sink unit in common, and are fixed to the substrate 80 with screws 91 and 92. Here, it is assumed that the heat generation amount of the first IC 51 is larger than the heat generation amount of the second IC 52.

  The composite heat radiating plate 10 includes a first heat radiating plate 20 and a second heat radiating plate 30, which are integrated via a heat separating member 40. Specifically, the first heat radiating plate 20 is made of a metal having good heat transfer characteristics (for example, made of aluminum), and functions as a heat radiating means of the first IC 51 that generates a relatively large amount of heat. On the other hand, the second heat radiating plate 30 is similarly made of a metal having good heat transfer characteristics, and functions as a heat radiating means of the second IC 52 that generates a relatively small amount of heat.

  2 is a view showing the first heat radiating plate 20, FIG. 2 (a) is a front view, FIG. 2 (b) is a plan view, and FIG. 2 (c) is a right side view. . As shown in FIG. 2B, the first heat radiating plate 20 has a rectangular shape in plan view. A screw hole 93 is formed in the vicinity of the upper and lower left ends so as to penetrate vertically.

  Furthermore, a space for arranging the second heat radiating plate 30 and the heat separating member 40 is formed on the bottom surface 22 so that a part thereof is removed. Specifically, a rectangular parallelepiped space (arrangement space 29) having a total thickness of the thickness of the second heat radiation plate 30 and the thickness of the heat separation member 40 is removed. On the other hand, although the upper surface 21 is formed flush, a shape such as a fin for expanding the heat radiation area may be formed.

  3 is a view showing the second heat radiating plate 30, FIG. 3 (a) is a front view, FIG. 3 (b) is a plan view, and FIG. 3 (c) is a right side view. . The 2nd heat sink 30 is flat form. A screw hole 94 is formed in the vicinity of the upper and lower right ends so as to penetrate vertically. As shown in FIG. 1 and FIG. 3B, the left side portion (about 3/4 of the entire surface) of the upper surface 31 becomes a joint surface 31a covered with the first heat radiating plate 20 (joint surface 23). On the other hand, the remaining part on the right side is an exposed surface 31b whose upper part is exposed. A second IC 52 is attached to the bottom surface 32.

  FIG. 4 is a view showing the heat separating member 40. The heat separation member 40 is made of, for example, silicon resin. Silicone resin has a certain heat insulating property and elasticity. The dimensions of the outer shape of the heat separating member 40 are such that they can be placed in the placement space 29 formed on the bottom surface 22 of the first heat radiating plate 20. Further, a space (arrangement space 49) for arranging the second heat radiating plate 30 is also formed on the bottom surface 42 of the heat separating member 40. Here, the width of the arrangement space 49 shown in FIG. 4A and FIG. 4B, that is, the width of the bonding surface 43 coincides with the width of the bonding surface 31 a of the second heat radiation plate 30.

  And when manufacturing the composite heat sink 10, for example, first, the heat separation member 40 is attached to the arrangement space 29 of the first heat sink 20. That is, the bonding upper surface 41 of the heat separating member 40 is attached to the bonding surface 23 of the first heat radiating plate 20. At this time, the joining side surface 24 that is the step portion of the first heat radiating plate 20 is joined to the joining side surface 45 (for example, the left side surface in FIG. 4A) of the heat separating member 40.

  Subsequently, the second heat radiating plate 30 is attached to the arrangement space 49 of the heat separating member 40. That is, the upper surface 31 of the second heat radiating plate 30 is attached to the bonding lower surface 43 of the heat separating member 40. At this time, the inner wall surface 44 of the heat separating member 40 is bonded to the bonding side surface 34 of the second heat radiating plate 30. As a result, the composite heat radiating plate 10 integrally formed with the first heat radiating plate 20 and the second heat radiating plate 30 interposed by the heat separating member 40 is formed. The first heat radiating plate 20 is fixed to the substrate 80 by screws 91 in the screw holes 93 of the first heat radiating plate 20. Similarly, the second heat radiating plate 30 is fixed to the substrate 80 by screws 92 in the screw holes 94 of the second heat radiating plate 30. At this time, the first heat sink 20 is disposed on the first IC 51, and the second heat sink 30 is disposed on the second IC 52. The first heat radiating plate 20, the second heat radiating plate 30, and the heat separating member 40 can be joined by pressure bonding or an adhesive.

  At this time, as shown in FIG. 1, a part on the right side (exposed surface 31 b) of the upper surface 31 of the second heat radiating plate 30 is exposed upward. And it is screw-fixed with the screw hole 94 formed in the part of the exposed surface 31b. On the other hand, the 1st heat sink 20 has spread so that the joint surface 31a of the upper surface 31 of the 2nd heat sink 30 may be covered. That is, the heat dissipation area of the first IC 51 that generates a large amount of heat is expanded. On the other hand, the heat radiating surface of the second IC 52 is covered with the first heat radiating plate 20 (the heat separating member 40), and the heat radiating performance is lower than when the entire surface is exposed. However, since the second IC 52 has a smaller amount of heat generation than the first IC 51, desired heat dissipation characteristics can be ensured, and the exposure amount is set according to the required heat dissipation characteristics. Further, since the first heat radiating plate 20 and the second heat radiating plate 30 are thermally separated by the heat separating member 40, the heat of the first heat radiating plate 20 is larger than that of the second heat radiating plate 30. It is not transmitted to. In general, the thermal limits of the first IC 51 and the second IC 52 are often similar values. In such a case, when the amount of heat generated by the first IC 51 actually increases, a certain amount of heat is safely released from the first heat radiating plate 20 to the second heat radiating plate 30 via the heat separating member 40. As a result, the overall heat dissipation efficiency can be improved.

  FIG. 5 is a diagram for explaining the effect of this embodiment. As shown in FIG. 5A, since the heat separating member 40 has elasticity, the position error D1 of the screw holes 93 and 94 of the first heat radiating plate 20 and the second heat radiating plate 30, and the substrate 80 Even if the screw hole position error D2 is relatively large, the distance between the first heat radiating plate 20 and the second heat radiating plate 30 of the heat separating member 40 is deformed by a predetermined amount d1, so that these errors are absorbed. Is done. Accordingly, an allowable amount of error is increased, and a defective product generation rate at the time of manufacturing can be reduced. In addition, the degree of freedom in design is improved.

  Furthermore, as shown in FIG. 5B, even when the heights of the first IC 51 and the second IC 52 are different, the heat separating member 40 is deformed by a predetermined amount d2, and the difference in height is reduced. Can be absorbed.

  In addition, since the heat separating member 40 can absorb the vibration of the member, the occurrence of failure is suppressed and the degree of design freedom is improved as described above.

  The present invention has been described based on the embodiments. This embodiment is an exemplification, and it will be understood by those skilled in the art that various modifications can be made to combinations of these components, and such modifications are also within the scope of the present invention.

  FIG. 6 shows an electronic circuit device 1A according to a modification. Here, two screw holes 93A for fixing the first heat radiating plate 20A are arranged so as to face each other with the first IC 51 interposed therebetween. Similarly, two screw holes 94A for fixing the second heat radiation plate 30A are arranged so as to face each other with the second IC 52 interposed therebetween. Further, in the first heat radiating plate 20A and the heat separating member 40, a portion covering the second heat radiating plate 30 is deformed into a shape such that the screw hole 94A can be exposed. Thus, the fixing balance between the first and second ICs 51 and 52 and the composite heat sink 10 is improved by setting the screw fixing positions to be opposed to each other with the first and second ICs 51 and 52 interposed therebetween. This makes it easy to maintain good adhesion.

  FIG. 7 shows an electronic circuit device 1B according to another modification. Here, the two screw holes 93B for fixing the first heat radiation plate 20B are arranged so as to face each other with the first IC 51 interposed therebetween. Further, two screw holes 94A for fixing the second heat radiating plate 30B are arranged so as to face each other with the second IC 52 interposed therebetween. However, unlike the modification of FIG. 6, the shape of the first heat sink 20 </ b> B is the same as that of the first heat sink 20 of FIG. 1. And the screw hole 94C of the same diameter is formed in the upper part of the screw hole 94B of the 2nd heat sink 30B in the 1st heat sink 20B. Further, screw holes 94D are also formed in the heat separating member 40 at positions corresponding to the screw holes 94B and 94C. That is, the first heat radiating plate 20 and the second heat radiating plate 30 are fixed at the overlapping portion. Even in this configuration, it is easy to make the fixing balance between the first and second ICs 51 and 52 and the composite heat radiating plate 10 good, and good adhesion can be maintained.

DESCRIPTION OF SYMBOLS 1 Electronic circuit apparatus 10 Composite heat sink 20 1st heat sink 21 Upper surface 22 Bottom 23 Bonding surface 24 Bonding side 30 Second heat sink 31 Upper surface 31a Bonding surface 31b Exposed surface 32 Bottom surface 34 Bonding side 40 Heat separation member 44 Inner wall surface 45 Bonding side surface 51 First IC
52 Second IC
80 Substrate 91, 92 Screw 93, 94 Screw hole

Claims (5)

A first heat radiating plate for radiating heat generated in the first component disposed on the substrate;
A second heat radiating plate for radiating heat generated in the second component disposed on the substrate;
A heat separating means sandwiched between the first heat radiating plate and the second heat radiating plate and configured integrally while thermally separating the first heat radiating plate and the second heat radiating plate;
The first heat radiating plate covers a part of the second heat radiating plate. A heat radiating plate unit.   The heat radiating plate unit according to claim 1, wherein the second heat radiating plate includes a fixing hole for fixing the second heat radiating plate to the substrate in a portion not covered with the first heat radiating plate. .   The heat separation means is an elastic material, and is formed so as to be able to expand and contract in a direction in which a deviation in height between the first part and the second part can be adjusted. 2. A heat sink unit according to 2.   The heat-radiating plate unit according to any one of claims 1 to 3, wherein the heat separating means is made of an elastic material and can be expanded and contracted in a direction in which a shift of a fixed position can be adjusted.   An electronic circuit device comprising: the heat sink unit according to any one of claims 1 to 4, and the first component and the second component to which the heat sink unit is mounted in common. .

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