TWI413889B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a base and a first fin set standing on the base. The base includes a first plate, a second plate and a heat pipe group sandwiched between the first and second plates. The second plate defines an opening in centre thereof. The heat pipe group has a protrusion part in a top thereof which is embedded in the opening of the second plate and a recessing part in a bottom thereof in which the first plate is embedded.

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for cooling electronic components.

As the electronics industry continues to evolve, the operating speed and overall performance of electronic components (especially central processing units) continues to increase. However, its heat generation also increases. On the other hand, the volume is getting smaller and smaller, and the heat is more concentrated. This makes the heat sink of metal solid heat transfer in the industry unable to meet the heat dissipation requirements of high-end electronic components.

A heat sink and a base thereof are generally included, and include a base that is in contact with a heat source, a plurality of equally spaced fins disposed on the base, and a plurality of heat pipes sandwiched between the base and the heat sink fins. . The middle portion of the upper surface of the pedestal and the plurality of heat dissipating fins are disposed in parallel with the pedestal joint, and the corresponding slats are combined to form a through hole, and the heat pipe is inserted into the through hole. Since the heat transfer speed of the heat pipe is fast, the heat of the heat source can be quickly diffused to the susceptor, thereby promoting the heat dissipation efficiency. However, in the manufacturing process of the heat dissipating device, a cavity corresponding to the heat pipe is respectively formed on the base and the heat dissipating fin, which wastes raw materials and increases processing cost.

In view of this, it is necessary to provide a heat sink that is simple to process and cost-effective.

A heat dissipating device includes a base and a first heat sink group attached to a top surface of the base, the base comprising a first substrate, a second substrate and being sandwiched between the first and second substrates In the heat pipe group, the second substrate is provided with a central hole, and the top surface of the heat pipe group has an embedded portion embedded in the central hole, and the bottom surface of the heat pipe group is recessed with a receiving portion for receiving the first substrate.

The heat pipe group of the heat dissipating device is sandwiched between the first substrate and the second substrate, and the thick base is replaced by two relatively thin metal plates, and the groove for accommodating the heat pipe is not needed on the base and the heat sink. Therefore, the processing cost and time are reduced, and raw materials are saved.

10, 40‧‧‧ Pedestal

14, 44‧‧‧ second substrate

142‧‧‧Flange

16, 46‧‧‧Heat management group

162, 462‧‧ ‧ heat absorption department

1624‧‧‧ 容部

20‧‧‧First heat sink set

220‧‧‧Folding

30‧‧‧Second heat sink

12, 42‧‧‧ first substrate

140, 440‧‧‧ center hole

144‧‧‧ mounting holes

160‧‧‧heat pipe

1622, 4622‧‧‧ embedded section

164‧‧‧ Department of heat dissipation

22‧‧‧First heat sink

24‧‧ ‧ gap

32‧‧‧second heat sink

1 is an exploded view of a heat sink device in accordance with a preferred embodiment of the present invention.

2 is an inverted combination view of the heat sink of FIG. 1.

Figure 3 is an exploded view of the heat sink of Figure 1.

4 is a view of the base of the heat sink of FIG. 1.

Figure 5 is an exploded view of a heat sink in accordance with another preferred embodiment of the present invention.

Figure 6 is a view of the base of the heat sink of Figure 5.

1 to 3 illustrate a heat dissipating device for dissipating a heat generating electronic component mounted on a circuit board such as a central processing unit in a preferred embodiment of the present invention. The heat generating device comprises a base 10, a first heat sink group 20 attached to the top surface of the base 10, and a second heat sink group 30 thermally connected to the bottom surface of the base 10.

The susceptor 10 is composed of a first substrate 12, a second substrate 14, and a heat pipe group 16 sandwiched between the first substrate 12 and the second substrate 14. The first substrate 12 is a rectangular metal thin plate body made of a metal material having good thermal conductivity such as aluminum or copper. The bottom surface of the first substrate 12 is attached to the top surface of the heat-generating electronic component to absorb heat.

The second substrate 14 is made of a metal material having good thermal conductivity such as aluminum or copper, and is substantially a rectangular plate body having a size much larger than that of the first substrate 12. A central portion of the second substrate 14 corresponding to the first substrate 12 defines a central opening 140 that is rectangular in shape and slightly larger in size than the first substrate 12 . A flange 142 extends vertically downward from the periphery of the second substrate 14 to protect the heat pipe group 16 disposed under the second substrate 14. The second substrate 14 is provided with a plurality of spaced apart mounting holes 144 near the flange 142 for receiving a fixing member (not shown) for mounting the heat sink to the heat-generating electronic components of the circuit board.

The heat pipe group 16 is formed by a plurality of curved flat heat pipes 160, which are formed at a position corresponding to the central holes 140 of the first substrate 12 and the second substrate 14 and are formed by a heat absorbing portion 162 which is closely arranged in the middle of all the heat pipes 160. A plurality of heat dissipating portions 164 are formed by side end portions of the portion of the heat pipe 160 and extending from the center of the second substrate 14 toward both sides and corners of the second substrate 14. The heat-receiving portion 16 has a top surface facing upwardly with an embedded portion 1622 (shown in FIG. 1 ). The embedded portion 1622 has a rectangular shape and is embedded in the central hole 140 of the second substrate 14 and is embedded therein. The top surface of the 1622 is flush with the top surface of the second substrate 14 (as shown in FIG. 4) for the first heat sink group 20 to be attached thereto. The bottom surface of the heat absorbing portion 162 is formed with a receiving portion 1624 which is recessed in a rectangular region. The receiving portion 1624 is sized to receive the first substrate 12, and the bottom surface of the first substrate 12 is slightly protruded from the heat pipe. The bottom surface of the group 16 is in contact with the heat generating electronic components.

The first heat sink group 20 is composed of a plurality of first heat sinks 22 vertically arranged on the second substrate 14. The first fins 22 are equally spaced apart from each other and are parallel to the opposite long sides of the second substrate 14 , and the bottom portion of the second heat sink 22 extends perpendicularly to the flange 220 attached to the surface of the second substrate 14 . The first heat sink group 20 defines a gap 24 corresponding to the mounting hole 144 of the second substrate 14 to facilitate the piercing of the fixing member.

The second heat sink group 30 is formed by stacking a plurality of second heat sinks 32 spaced apart from each other. The second heat sink group 30 is attached to the bottom surface of the heat pipe group 16 and can be shaped according to the bottom of the base 10 according to the specific use. The size and shape of the free space are adjusted to maximize the overall heat dissipation area of the heat sink. In this embodiment, the second heat sink group 30 is attached to the near end of the bottom surface of the second base 14 and has a substantially T shape.

As shown in FIG. 5 and FIG. 6, a heat dissipating device in another preferred embodiment of the present invention, compared with the previous embodiment, the heat pipe group 46 formed by a plurality of heat pipes and the heat pipe group of the previous embodiment. 16 is different, and the central hole 440 formed on the second substrate 44 of the susceptor 40 is different from the central hole 140 of the second substrate 14 of the previous embodiment, and the central hole 440 is corresponding to the embedded portion 4622 of the heat pipe group 46, The embedding portion 4622 is accommodated. The shape of the first substrate 42 of the susceptor 40 can be appropriately adjusted according to the specific shape of the heat absorbing portion 462 of the heat pipe group 46.

When the heat dissipating device is in use, the heat generated by the heat generating electronic component is directly absorbed by the first substrate 12 of the susceptor 10 and directly transmitted to the first heat sink group 20 through the heat pipe group 16 or transmitted to the second substrate 14 to be evenly distributed to the first The two heat sink groups 20, 30 are removed to be distributed to the surrounding environment.

The heat pipe group 16 can be sandwiched between the first substrate 12 and the second substrate 14 by soldering or the like, and the thick base is replaced by two relatively thin metal plates, without the base 10 and the first heat sink group. The recess of the heat pipe group 16 is provided on the 20, so that the processing cost and time are reduced, and the raw materials are saved. In addition, the heat pipe group 16 is formed with a convex portion corresponding to the top surface of the heat absorbing portion 162 of the heat source, and is embedded in the embedded portion 1622 of the center hole 140 of the second substrate 14 and the first heat sink group 20, and the bottom surface is recessed to receive the first substrate 12. The accommodating portion 1624 is such that the distance between the first and second substrates 12 and 14 is closer, that is, the thickness of the susceptor 10 is smaller, and the thickness of the heat absorbing portion 162 of the heat pipe group 16 is not reduced to affect the heat pipe group 16 . Strength and performance, as well as the structure of the base 10 is more compact. Since the heat absorbing portion 162 is the place where the temperature of the heat pipe group 16 is the highest, the direct contact with the first heat sink group 20 is also advantageous for ensuring timely heat dissipation.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ Pedestal

14‧‧‧second substrate

16‧‧‧Heat management group

1622‧‧‧ embedded department

164‧‧‧ Department of heat dissipation

22‧‧‧First heat sink

24‧‧ ‧ gap

32‧‧‧second heat sink

12‧‧‧First substrate

140‧‧‧ center hole

162‧‧‧heat absorption department

1624‧‧‧ 容部

20‧‧‧First heat sink set

220‧‧‧Folding

30‧‧‧Second heat sink

Claims (10)

A heat dissipating device includes a base and a first heat sink group attached to a top surface of the base, the base comprising a first substrate, a second substrate and a heat pipe group, wherein the heat pipe group is modified by The plurality of curved flat heat pipes are closely arranged side by side, and are completely sandwiched between the first substrate and the second substrate. The second substrate is provided with a central hole, and the top surface of the heat pipe group is protruded and embedded in the center hole. The bottom of the heat pipe group is recessed with a receiving portion for receiving the first substrate. The heat dissipating device according to claim 1, wherein the top surface of the embedding portion is flush with the top surface of the second substrate. The heat dissipating device of claim 1 or 2, wherein the embedding portion is directly above the receiving portion. The heat dissipating device of claim 3, wherein the heat pipe group comprises a heat absorbing portion which is formed by arranging the middle portions of all the heat pipes, and is formed by side by side of a part of the heat pipe and is connected to the two ends of the pedestal by the heat absorbing portion and A plurality of heat radiating portions extending on both sides. The heat dissipating device of claim 4, wherein the embedding portion is located at the top of the heat absorbing portion, and the accommodating portion is located at the bottom of the heat absorbing portion. The heat dissipating device of claim 3, wherein the central hole is located in a middle portion of the second substrate and has a rectangular shape corresponding to the embedded portion, and the second base periphery extends downwardly to a flange surrounding the heat pipe group. The heat dissipating device of claim 1, wherein the first substrate is embedded in the accommodating portion and the bottom surface thereof slightly protrudes from the bottom surface of the heat pipe group. The heat dissipating device of claim 1, wherein the first fin group is in contact with the top surface of the embedding portion corresponding to the embedding portion. The heat dissipation device of claim 1, wherein the first heat sink group comprises a plurality of first heat sinks spaced apart from each other, and a bottom end of each of the first heat sinks is vertically extended and attached to the second substrate. The fold on the top of the embedding section. The heat dissipating device of claim 9, further comprising a second heat sink group attached to the bottom surface of the heat pipe group and located around the first substrate.