TW200951688A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200951688A
TW200951688A TW97121111A TW97121111A TW200951688A TW 200951688 A TW200951688 A TW 200951688A TW 97121111 A TW97121111 A TW 97121111A TW 97121111 A TW97121111 A TW 97121111A TW 200951688 A TW200951688 A TW 200951688A
Authority
TW
Taiwan
Prior art keywords
plate
heat dissipation
dissipation device
base
embedded
Prior art date
Application number
TW97121111A
Other languages
Chinese (zh)
Other versions
TWI413889B (en
Inventor
Hai-Gang Xiong
Zhi-Yong Zhou
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW97121111A priority Critical patent/TWI413889B/en
Publication of TW200951688A publication Critical patent/TW200951688A/en
Application granted granted Critical
Publication of TWI413889B publication Critical patent/TWI413889B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device includes a base and a first fin set standing on the base. The base includes a first plate, a second plate and a heat pipe group sandwiched between the first and second plates. The second plate defines an opening in centre thereof. The heat pipe group has a protrusion part in a top thereof which is embedded in the opening of the second plate and a recessing part in a bottom thereof in which the first plate is embedded.
TW97121111A 2008-06-06 2008-06-06 Heat dissipation device TWI413889B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97121111A TWI413889B (en) 2008-06-06 2008-06-06 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97121111A TWI413889B (en) 2008-06-06 2008-06-06 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200951688A true TW200951688A (en) 2009-12-16
TWI413889B TWI413889B (en) 2013-11-01

Family

ID=44871805

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97121111A TWI413889B (en) 2008-06-06 2008-06-06 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI413889B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120247735A1 (en) * 2010-02-26 2012-10-04 Furukawa Electric Co., Ltd. Heat sink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6840311B2 (en) * 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US7021368B2 (en) * 2003-11-12 2006-04-04 Cpumate Inc. Heat dissipating device with uniform heat points
US7493939B2 (en) * 2005-11-13 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120247735A1 (en) * 2010-02-26 2012-10-04 Furukawa Electric Co., Ltd. Heat sink
TWI458927B (en) * 2010-02-26 2014-11-01 Furukawa Electric Co Ltd Heat sink

Also Published As

Publication number Publication date
TWI413889B (en) 2013-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees