TW200951688A - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- TW200951688A TW200951688A TW97121111A TW97121111A TW200951688A TW 200951688 A TW200951688 A TW 200951688A TW 97121111 A TW97121111 A TW 97121111A TW 97121111 A TW97121111 A TW 97121111A TW 200951688 A TW200951688 A TW 200951688A
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- heat dissipation
- dissipation device
- base
- embedded
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device includes a base and a first fin set standing on the base. The base includes a first plate, a second plate and a heat pipe group sandwiched between the first and second plates. The second plate defines an opening in centre thereof. The heat pipe group has a protrusion part in a top thereof which is embedded in the opening of the second plate and a recessing part in a bottom thereof in which the first plate is embedded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97121111A TWI413889B (en) | 2008-06-06 | 2008-06-06 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97121111A TWI413889B (en) | 2008-06-06 | 2008-06-06 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200951688A true TW200951688A (en) | 2009-12-16 |
TWI413889B TWI413889B (en) | 2013-11-01 |
Family
ID=44871805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97121111A TWI413889B (en) | 2008-06-06 | 2008-06-06 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI413889B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120247735A1 (en) * | 2010-02-26 | 2012-10-04 | Furukawa Electric Co., Ltd. | Heat sink |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
US7021368B2 (en) * | 2003-11-12 | 2006-04-04 | Cpumate Inc. | Heat dissipating device with uniform heat points |
US7493939B2 (en) * | 2005-11-13 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
-
2008
- 2008-06-06 TW TW97121111A patent/TWI413889B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120247735A1 (en) * | 2010-02-26 | 2012-10-04 | Furukawa Electric Co., Ltd. | Heat sink |
TWI458927B (en) * | 2010-02-26 | 2014-11-01 | Furukawa Electric Co Ltd | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TWI413889B (en) | 2013-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |