TW200716939A - A method to form a heat sink and its positioning structure - Google Patents

A method to form a heat sink and its positioning structure

Info

Publication number
TW200716939A
TW200716939A TW094137280A TW94137280A TW200716939A TW 200716939 A TW200716939 A TW 200716939A TW 094137280 A TW094137280 A TW 094137280A TW 94137280 A TW94137280 A TW 94137280A TW 200716939 A TW200716939 A TW 200716939A
Authority
TW
Taiwan
Prior art keywords
heat
fins
dissipation
heat dissipation
assembly
Prior art date
Application number
TW094137280A
Other languages
Chinese (zh)
Other versions
TWI322257B (en
Inventor
guo-xing Chen
xuan-zhi Lin
Original Assignee
Hoff Thermal Industry
guo-xing Chen
xuan-zhi Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoff Thermal Industry, guo-xing Chen, xuan-zhi Lin filed Critical Hoff Thermal Industry
Priority to TW094137280A priority Critical patent/TW200716939A/en
Publication of TW200716939A publication Critical patent/TW200716939A/en
Application granted granted Critical
Publication of TWI322257B publication Critical patent/TWI322257B/zh

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Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This invention regards a method to form a heat sink and its positioning structure. It consists of at least one heat pipe and multiple heat dissipation fins. The stamped heat dissipation fins are stacked to form the first heat-dissipation-fin set and positioned by inserting heat pipes through holes on stacked fins. Positioning plates are then pressed on top of assembly to reduce spacings between fins and hold assembly in position. The second heat-dissipation-fin set is then stacking on top of the positioning plates and held in position by a stopping plate. This invention helps to prevent heat dissipation fins from distortion when under assembly and conveying processes. It would help also the efficiency on heat dissipation by assuring surface contact between fins and heat pipes.
TW094137280A 2005-10-25 2005-10-25 A method to form a heat sink and its positioning structure TW200716939A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094137280A TW200716939A (en) 2005-10-25 2005-10-25 A method to form a heat sink and its positioning structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094137280A TW200716939A (en) 2005-10-25 2005-10-25 A method to form a heat sink and its positioning structure

Publications (2)

Publication Number Publication Date
TW200716939A true TW200716939A (en) 2007-05-01
TWI322257B TWI322257B (en) 2010-03-21

Family

ID=45073924

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137280A TW200716939A (en) 2005-10-25 2005-10-25 A method to form a heat sink and its positioning structure

Country Status (1)

Country Link
TW (1) TW200716939A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407897B (en) * 2009-07-29 2013-09-01 Golden Sun News Tech Co Ltd Method of thermo conductor having coplanar evaporator sections

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407897B (en) * 2009-07-29 2013-09-01 Golden Sun News Tech Co Ltd Method of thermo conductor having coplanar evaporator sections

Also Published As

Publication number Publication date
TWI322257B (en) 2010-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees