TWI322257B - - Google Patents

Description

1322257 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method for forming a heat sink and a positioning structure thereof, and more particularly to a positioning that can stabilize two or more heat sink fin groups. A molding method mounted on a heat pipe and a positioning structure thereof. Technology], generally used to wear the heat exchange, the heat dissipation fins of the Korean fins are forced into the wall to be embedded in a plurality of scattered fins, and the heat-dissipating fins are arranged when the heat pipes are cooled or finned. A short or short line of media, such as the front of a heat sink fin [previously according to the Korean film fluid, the source is carried out and a plurality of rings of the heat conductive sheet, so that only the heat of the heat has been worn so that every collision or even between Only improve the auxiliary heat-dissipating heat-conducting capillary group to make the heat-dissipating group want to string. After the hot-finned hot fins are not in the gap between the loose fins, loose contact or wire is often generated, such as tin. The film set, the heat-conducting woven or the Han-Korean set is formed by forming the heat fins, and the heat-dissipating fins are tight enough to dissipate the heat, and the hail is made in the heat-dissipating heat-dissipating tube. The fluid can be quickly formed in the perforated wall of the heat conduction hole, and the heat pipe is formed by the fins, and the fins are formed in the image, and the entire heat pipe is joined, the rate can be accelerated, and the capillary group and the dispersion are provided. When the fins are cooled and dissipated on the heat pipe of the heat-dissipating woven or working group, the outer edge of the fin is first punched out to form a ring wall, and then the wall is pressed against the heat pipe to complete the piercing. The assembly or transport surface that is stretched upwards causes the heat sink fins to dissipate efficiently due to the collision. And the heat sink fins, but this is bound to be set between the heat sink fins. Going up to the stack, and restoring the force, the process is deformed, and the heat pipe is therefore added

I m Page 5 丄 JZZZ:)/

Road forming step. , % The industry; problems arising from the above-mentioned practices of the car' The inventor of the case was engaged in the experience of * 5 and actively studied and reformed in the spirit of excellence. The invention of the invention discloses a method for forming a heat sink and a positioning structure thereof. [Invention] The present invention is directed to a second embodiment of the present invention, which provides a positioning structure of a heat sink, M m U a heat dissipating fin group is formed above the group, and a perforation is formed at a position corresponding to the heat conducting tube, and the perforation is formed with a taper portion connected to the perforated hole edge thereof, and : the pressing portion extending from the small diameter of the tapered portion is such that when the heat dissipation is applied to the heat conducting member, the pressing portion of the front heat radiating fin is embedded in the back, '... Between the tapered portion and the surface of the heat pipe. Wherein, when the heat pipe is worn with a plurality of heat dissipation fin groups, a positioning piece is installed between the adjacent two heat dissipation fin groups, and the positioning piece is provided with a through hole for the heat pipe series, and at the most The upper heat dissipating fin group is provided with a resisting plate, the thickness of the resisting fin is larger than the thickness of the heat dissipating fin, and the resisting plate is also provided with a through hole for the heat conductor. In this way, the positioning piece and the abutting plate are used as the positioning and abutting functions, so that each of the heat dissipating fins can be put together with each other, and the heat dissipating fin group is prevented from being loosened during assembly and transportation, and the heat conducting tube is Form the contact of the face to improve heat dissipation efficiency. Another object of the present invention is to provide a method of forming a heat sink, the steps of which include:

Page 6 1322257 V. Invention Description (3) First, the first heat sink fin group that has been stamped and stacked is put on the heat pipe; secondly, the positioning piece is attached to the uppermost heat sink fin. a force that is pressed downward so that the pressing portion of the front heat sink fin is embedded between the tapered portion of the rear heat sink fin and the surface of the heat pipe to reduce the distance between the heat sink fins; The second heat-dissipating fin group that has been stamped and stacked is also put on the heat-conducting tube; 嗣, and then a resisting plate is put on the heat-dissipating fin sheet group located at the uppermost layer of the heat-conducting tube; The board is positioned to abut against the second heat sink fin set, and the complex array of heat sink fin sets are positioned against the heat pipe. The detailed description and technical content of the present invention are set forth below with reference to the accompanying drawings. The invention is a "forming method of the heat sink and its positioning structure", and the molding steps are as follows: a) First, the first heat sink fin group which has been stamped and stacked is put on the heat pipe; b) secondly, The positioning piece is sleeved on the heat pipe and attached to the uppermost heat radiating fin, and applies a downward pressing force, so that the pressing portion of the front heat radiating fin is embedded in the tapered portion of the rear heat radiating fin and the heat conduction. Between tube surfaces

Page 7 1322257

II. Inventive Note (4), to narrow the distance between the heat sinks, C) Furthermore, the second heat sink fins that have been stamped and stacked are also put on the heat pipe; d) 嗣, then Inserting a resisting plate over the heat dissipating fin set of the uppermost layer of the heat pipe; e) finally, positioning a resisting plate against the second heat radiating fin set to position each of the heat radiating fin sets Resist on the heat pipe. In order to make those skilled in the art more aware of the features of the present invention, an embodiment will be described with reference to the drawings; as shown in the first figure, the heat pipe 2 is placed in the thickness. 0. The thin heat sink fin 1 of 2 mm or less is required to provide heat dissipation for the cooling end of the heat pipe 2, and the bonding density between the heat pipe 2 and the heat radiating fins 1 is increased to reduce the generation of voids, wherein the heat pipe 2 The system can be a water-cooled tube or a heat pipe type, and the embodiment is a heat pipe. In the first embodiment of the present invention, the heat-conducting tube 2 is sleeved with two sets of heat-dissipating fin sets 10, 10', and each of the heat-dissipating fin sets 10, 10' is composed of a plurality of heat-dissipating fins 1. 1' is formed by stamping and stacking, and perforations 11, 11' are provided at positions corresponding to the heat-conducting tubes 2 on each of the heat-dissipating fins 1, and the heat-dissipating fins 1, > At the same time, at the same time, the ring wall of the outlet diameter is gradually drawn on the perforation 11, 1 Γ, and the ring wall 1 2, 1 2 ' is connected to the perforation edge of the perforation 11, 1 When the tapered portion 1 2 1 , 1 2 1 ' (as shown in the third figure) and the pressing portions extending from the small portion of the tapered portion 12 1 , 1 2 1 ' are stacked, The latter 1 2 2, 1 2 2 ', when the heat sink fins 1, the fins, the fins 1, the perforations of the crucibles 11, the straps are placed on the front fins

III

Page 8 1322257 '. V. Invention Description (5) i, 1, the pressing portion 1 2 2, 1 2 2 'up; and the heat pipe 2 is then erected on a heat conducting plate 3 to form a heat sink 100. In the present invention, when the heat transfer tube 2 is covered with a plurality of heat dissipation fin sets "1 〇, 10, the positioning piece is installed between the adjacent two heat dissipation fin sets 10, 10' 5 'the positioning piece 5 is provided with a through hole 51 for the heat pipe 2 to be arranged in series, and the uppermost heat dissipation fin group 1 〇' is mounted with a resisting plate 4, the thickness of the abutting plate 4 is greater than The thickness of the heat-dissipating Korean sheets 1, 1' is set to the abutting plate 4, and there is a through hole 41 through which the heat transfer tubes 2 are arranged. Referring to the first and second figures, when the first heat-dissipating fin set 1 that has been stamped and stacked is to be put on the heat-conducting tube 2, first, the first heat-dissipating group 10 of the above-mentioned stacking is completed. In a tight fit manner, the heat transfer tube 2 is inserted into the through hole 11 of each of the heat dissipation fins 1 by a large diameter of the ring wall 12, and the spacing between the heat dissipation fins 1 is slightly elongated during the process of laying. At this time, the perforation 11 of the heat-dissipating fin 1 and the heat transfer tube 2 are in a point or line contact type (as shown in /3).

In the present invention, before the heat-conducting tube 2 and the heat-dissipating fins 1 are worn, a heat-conducting medium (not shown) may be coated on the outer surface of the heat-conducting tube 2, and the heat-transfer medium is a Nanyi, a fine molecular structure. 'such as Shixia oil, mineral oil or Polyethylene Glycol (PEG), etc. and has a lubricating effect, so that the heat transfer tube 2 and each of the heat dissipation fins 1 can be easily worn, and because of the heat conduction The medium is also a high-density fine molecular structure, and can completely fill the gap between the heat-conducting tube 2 and the pressing portion 122 of each of the heat-dissipating fins 1 to increase the contact effect. Please refer to the fourth figure, and secondly, attach the positioning piece 5 to the first piece.

1322257 .* .; V. Description of the invention (6) On the heat-dissipating fin 1 of the uppermost layer of the hot fin group 10, and applying a downward pressing force to make the pressing portion of the front heat-dissipating fin J! 22 is embedded between the tapered portion 1 2 1 of the rear heat dissipation fin-1 and the surface of the heat transfer tube 2 (as shown in the eighth figure), and the distance between the heat dissipation fins 1 is reduced, thereby enabling each The ring wall 12 between the fins 1 is sequentially embedded and pressed against the heat pipe 2, and is in surface contact with the heat pipe-2 to improve the contact tightness. Referring to FIG. 5, when the positioning piece 5 is positioned against the first heat-dissipating film group 10, the second heat-dissipating fin set 1' is put on the heat-transfer tube 2 to complete the above-mentioned stacking. The second heat-dissipating fin group 1〇' is tightly matched with the square 'j, so that the heat-conducting tube 2 is penetrated by the ring wall 丨2, and the caliber of the heat-dissipating tube 2 is penetrated into the heat-dissipating fins, and the holes 1' During the process, the spacing between the fins 会' will be slightly elongated. Referring to the sixth and seventh figures, the squeezing plate 4 is then placed over the guide==2, so that the abutting plate 4 is positioned against the second heat-dissipating fin set. The second heat sink fin group is preceded by a heat sink fin 1 and the pressing portion is inserted into the tapered portion 12 of the rear heat sink fin, and the surface distance of the heat pipe 2 is: (as shown in the eighth figure) And narrowing between the heat-dissipating clocks 1 ' between each of the heat-dissipating fins, the ring wall 12 between the two, sequentially embedded and forced to face, and the surface contact with the heat pipe 2 to improve contact tightly In the present invention, the abutting plate 4 and its positioning piece 5 may be firstly disposed in the heat conducting pipe 21 to apply an adhesive in the through hole 41 to increase the abutting plate 4 and the barium 5 and the heat pipe. 2 holding power. . Referring to the ninth figure, the cross section of the second embodiment of the present invention is schematically illustrated.

Page 10 1322257 V. Description of the Invention (7) In the figure, the abutting plate 4 can be mounted on the first heat dissipating plate 4, and the abutting plate 4 can also be mounted on the first heat dissipating plate. Below the fin group 1 ,, the two heat sink fin groups 10, 10 are placed on the heat transfer tube 2 by the upper and lower sides. Referring to the tenth figure, in the third embodiment of the present invention, the section of the heat transfer tube 2 is stacked with three sets of heat-dissipating groups, 10, and 10, first, first The abutting plate 4 is sleeved on the guiding tube, and then the first heat dissipating fin group 10 is first put on the ^2 officially in a tight fit manner, and secondly, the first piece 5 is attached to the first heat dissipation The Korean film group 1〇”, on, and the force of the downward pressure against the ink, so that the ring wall 12 between the heat dissipation fins 1 of the first heat dissipation Korean film group is sequentially embedded and forced to be small in heat conduction. The distance between each of the heat dissipating fins 1 . @ ^ 嗣 The second fin group 10 is placed over the heat pipe 2 so that the hot fins: 10' are positioned to be positioned above the first fin group 10 , the second month, the second two positioning piece 5, attached to the second heat dissipation film group 10, on, and; "the force of the downward pressure" makes the second heat dissipation ... 10, each of the two pieces of 1 The ring wall 12' is embedded in the same order and is tightly pressed between the '·, 曰 heat sink fins. ...the upper and the smaller, then the third heat sink Korean group 10, also wears the third heat sink fin group 1 〇,, 彳抿 彳抿 + force m V , , s 2, upper, last, and then another:: stop: 4 4 2 1 °, the stop plate 4 抵 position in the second cooling fin group 1 〇, ^ into ^ heat sink fin group 10, 10, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ', with thermal conductivity

Page 11 1322257 < r

The contact between the tubes 2 is more closely related. According to the invention, the heat pipe 2 is not limited to the heat pipe 2 of different shapes, for example, a U-shaped pipe, or a ^-shaped ellipse tube, and the heat-dissipating film 2 is slightly 2 And the penetration of the plate 4?丨41 will have a perforation 11 on σ ^ 1, Α ^ ηη ^ 'hole 41 is also king-elliptical. Or as shown in the eleventh figure, slightly. - t is a three-dimensional external view of the fifth embodiment, wherein the guide Ξ二二二方方官 (or referred to as a temperature equalization plate), relatively, heat dissipation rectangle. The through hole 41 in the abutting plate 4 is also known from the above description, so that a plurality of loose fin sets 10, 10'" 〇' can be pressed during the pressing of the heat pipe 2, The positioning resisting function of the plate 4 and its positioning piece 5 prevents the heat dissipating fin set 10, 10', and 10 from being loosened during assembly and transportation, thereby reducing the defective rate of the finished product. At the same time, the amount of pressure applied by the abutting plate 4 and its positioning piece 5 can force the heat dissipating fins 1, 1 ' ' i ', the wall i 2 , 1 2 , i 2 , and the heat conduction. The contact between the tubes 2 is more encrypted, and the heat transfer effect is naturally greatly improved to help the cooling end of the heat pipe 2 to quickly dissipate heat. In summary, the "forming method of the heat sink and its positioning structure" of the present invention can achieve the above-mentioned effects by the structure disclosed above. Moreover, the invention has not been disclosed in the publication before the application of the invention, and has already met the novelty, progress and other requirements of the invention patent. The drawings and descriptions of the present invention are merely illustrative of the embodiments of the present invention, and are not intended to limit the embodiments of the present invention;

Page 12 1322257 V. INSTRUCTIONS (9) In addition to the features of the present invention, other equivalent variations or modifications are to be included in the scope of the patent application below. <1 is· Page 13 1322257 Brief description of the drawings [Simplified description of the drawings] The first figure is a perspective view of the heat sink of the present invention. The first heat-dissipating fin group is sleeved in the cross section of the heat-conducting tube. The second figure is the fourth figure, the fourth figure, the fifth figure, the sixth figure, the seventh figure, the eighth figure, and the ninth figure. The second drawing is a view of the present invention. This is a view of the invention. This is a picture of the invention. The sixth embodiment of the present invention is a partially enlarged schematic view of the present invention. The positioning piece is sleeved on the outer surface of the first heat dissipation fin group, and the second heat dissipation fin group is sleeved on the outer side of the heat conduction tube, and the stereoscopic appearance of the abutting plate on the heat pipe is placed on the heat pipe. The upper section of the map. Part of the enlarged schematic. A cross-sectional view of a heat sink of the second embodiment. A cross-sectional view of a heat sink of a third embodiment. A perspective view of a heat sink of the fourth embodiment. Figure 12 is a perspective view of a heat sink of a fifth embodiment of the present invention. The tenth figure is the eleventh figure of the present invention. The main components of the present invention are described as follows: Heat sink 1 0 0 Heat sink fins 1, Γ, Γ Heat pipe 2, 2', 2' ' Tapered portion 1 2 1 , 1 2 1 ' Heat-conducting plate 3 Heat-dissipating fin set 1 0, 1 0 ', 1 0 Piercing 11, 11 ' Ring wall 1 2, 1 2 ', 1 2 ' ' Tightening part 1 2 2, 1 2 2 ' Abutting plate 4

Page 14 1322257 Schematic description of the through hole 41, 51 positioning piece 5, 5 ’

Claims (1)

1322257 2 * VI. Patent Application No. 1 Place the positioning piece on the heat pipe and attach it to the uppermost layer and apply a downward pressing force to reduce the heat dissipation fins. 2. The second heat sink fin that has been stamped and stacked. The film set also wears a method for forming a heat sink, the steps of which include: a) first, the first heat sink fin group that has been stamped and stacked is put on the heat pipe; b) the second heat sink fin, the stop plate The sleeve is placed between the sheets located at the uppermost layer of the heat pipe, c) the sleeve is placed on the heat pipe; d) 嗣, then the hot fin group is placed; e) Finally, abutting plate is positioned Stopped above the second heat sink fin set, and each of the heat sink fin sets is positioned against the heat pipe. 2. The method of forming a heat sink according to claim 1, wherein each of the heat dissipating fins punches a perforation, and simultaneously pulls a ring wall having a tapered outlet diameter on the perforation, the ring wall having a tapered portion connected to the edge of the perforated hole, and a pressing portion extending from a small portion of the tapered portion. When the heat dissipating fins are stacked and stacked, the perforation of the rear fin is sleeved On the tight part of the front fin. 3. The method for forming a heat sink according to claim 2, wherein the positioning piece applies a downward pressing force to embed the pressing portion of the front heat sink fin in the rear heat sink fin The tapered portion is located between the heat transfer tube surface and reduces the distance between the heat dissipation fins. 4. The method of forming a heat sink according to claim 1, wherein the heat pipe and the heat sink fins are disposed before the heat pipe Page 16 1322257 f .* VI. Scope of Application The coating is coated with a layer of heat-conducting medium with lubrication. 5. The method for forming a heat sink according to claim 1, wherein the positioning piece and the abutting plate are coated on the heat pipe, and the adhesive is first applied in the hole to increase the resistance. The holding force between the plate and the heat pipe. 6. A positioning structure of a heat sink, wherein the heat sink is composed of a plurality of heat radiating fin groups and at least one heat conducting tube, wherein the heat radiating fin group is formed by stacking and stacking a plurality of heat radiating fins, corresponding to each heat radiating fin a hole is formed at a position of the heat pipe; the heat pipe is mounted with abutting plate at at least one outer side surface of the heat dissipation fin group, the thickness of the abutting plate is greater than the thickness of the heat dissipation fin, and is resisted The plate is provided with a through hole for the heat pipe to be arranged in series; and the heat pipe is provided with a positioning piece between the adjacent two heat dissipation fin sets, and the positioning piece is also provided with a through hole for the heat pipe to be arranged in series. 7. The positioning structure of the heat sink according to claim 6, wherein the perforation periphery of the heat dissipation fin extends outward to form a ring wall having a tapered shape connected to the perforation hole edge and having a reduced diameter a portion and a pressing portion extending from the smaller portion of the tapered portion. 8. The positioning structure of the heat sink according to claim 6, wherein the heat conducting tube and the perforations of the heat dissipating fins are filled with a heat conducting medium having a lubricating effect. 9. The positioning structure of the heat sink according to claim 6, wherein an adhesive is interposed between the heat conducting tube and the through hole of the abutting plate. 1 0. The positioning knot of the heat sink as described in claim 6 of the patent application scope Page 17 1322257 I t VI. Patent application scope, in which the resisting plate is installed at the outer side of the uppermost heat sink fin set. 1. The positioning structure of the heat sink of claim 6, wherein the outer surface of the uppermost heat sink fin set and the lowermost heat sink fin set are further provided with abutting plates. 1 . The positioning structure of the heat sink according to claim 6 , wherein the heat pipe is a U-shaped round tube, an elliptical tube or a rectangular tube. 1 . The positioning structure of the heat sink according to claim 6 , wherein the heat pipe is any one of a water cooling pipe or a heat pipe. Page 18