200815726 九、發明說明： 【發明所屬之技術領域】 本發明係與一種散熱裝置有關，更詳而言之，特別是 指一種石墨散熱裝置上電鍍金屬層之散熱裝置。 【先前技術】 目如’ p通者各種電子產品的而性能化與小型化，以組 裝在其内之半導體零件也不斷邁向大容量化與集約化，因 此’在電子產品内部的發熱量也隨之大幅地增加，像電腦 等的電子產品中，大多係將來自半導體零件的熱能，大多 使用石墨片來散熱，因其熱傳導率為銅或鋁等金屬片之2〜3 倍’而且其重量輕盈，成本低，因此可作為電路基板間或 者是電漿電視顯示面板之散熱裝置等，然而，使用石墨作 為政熱裝置卻存在一個問題，也就是碳具有層次的構造， 雖然各層的平面方向分子係透過共有結合而緊密地結合在 一起’但是，與面方面呈垂直相交的方向（厚度方向），則 口為刀子間的結合較弱，因此容易產生層間剝離的問題， 且無法得到充分的散熱效果。 •,請參閱公告號1265612「散熱片及熱沈」發明專利案， ’、特徵為在石墨片的正面與背面分別疊設由金屬線所構成 的網狀體，並且使該石墨片與該網狀體一體化而形成，其 可解決石墨片層間剝離問題，使其厚度方向具有較佳之熱 傳導性，而可將電子產品所產生之熱有效地排放出去。… 【發明内容】 惟，習知之散熱裝置利用網狀體與該石墨片一體化， =於纏繞金屬線之製程加工上較複雜，造成成本上之提 π;且金屬線之網狀體易脫離石墨片，造成空隙而影響導 200815726 熱效果，其結構強度低，另外，習知之散熱裝置若 :組合之結構，需以石墨片預先成型，而無法以焊 : α另外，與熱官結合時’亦無法產生相對的固定， 故習知之散熱裝置於使甩上仍有多處不便。 本發明係提供一種散熱裝置，係包含有一石 二^一預定厚度及形狀’並於其表面上電鍍結Si 墨气作供之散熱裝置，其藉由該金屬層加強該石 、月立心衣置之強度，有效防止具有層次構造之石墨散熱 =層間_的問題’而有優異的熱傳導性，而可將^ 可與熱2效率地排放出去，另外，金屬層亦 化者 、進行一焊接，增加其加工之便利及結構之變 【實施方式】 々埶ίί，請參閱第一至二圖所示’係分別為本發明一種 雪二ΐ 口 =較佳實施例之立體圖犮剖視圖，係可供裝置於 厗：，該散熱裝置係包含有一石墨散熱裝置10、一 金屬層20及—熱管座30所構成；其中： )該，墨散熱裝置1〇，係由石墨製成數具有預定厚度及 形狀之政熱片11 ’該石墨散熱裝置10之散熱片11四周表 面上係電鍛έ Jr人士 u 、八：、、、"a有該金屬層20，、而該金屬層20係選自由鎳 或銅至屬t群製成，係藉由該金屬層加強該石墨散熱裝 200815726 置10之強度，其中，訪楚私勒μ η 有數結合孔⑴。兩端上分別貫設排列 該熱s座3G，主要包含有__底座31， 縱 向等距排列有數開σ朝上之U形狀之熱管32， 含縱 係由、銅㈣製成，而使該等散熱片u之結合孔m、易於禪 接为別固疋於該等熱管32之開口兩端上。 〇月茶閱弟二至四圖所示，係分別為本創作另-實施例 之立體®及剖視w ’其主要結構與功能係 施例同’不同之處在於，該石墨散熱裝置!。主要包二： 基板12，該基板12上等距縱向排列有數鯖片13，該金屬 =10係湘錢方式結合於該基板12及該等鰭片13四周 表面t且相鄰之鰭片I3間具有間隔u。 塊狀結構 絲再將本創作之特徵及其可達成之預期功效陳述士 圖：：：f五圖所示’係為本創作又-實施例之剖視 :在二：、、、°構與功能係與本創作較佳實施例同，不同之 Γ5上等’距縱熱裝置10主要包含有一基板15,該基板 方式結八二1列/數凸肋16，該金屬層20係利用電鍍 周;::5"石、墨散熱裝置10之基板15及該等凸肋16四 二心士德且相鄰凸肋16間亦結合有該金屬層20，而形成 下·· 於焊 200815726 散熱裝置產生層間剝離的間題，而可將電子產品所產生之 熱量有效率地排放出去。 f、本發明之金屬層電鍍於石墨散熱裝置裝置，使兮 散熱裝置可以進行烊接固定 罝便該 用综^述’本發明在同類產品中實有其極佳之進步實 於，遍查_外關於此類結構之 中 >新型專利要件，爰依法提出中請。只已具備 惟’以上所述者，僅係本發明之—較 已，故舉凡應用本發 /仏了仃只鉍例而 結構變化，理庫包人:母及申請專利範圍所為之等效 里應包含在本發明之專利範圍内。 200815726 .【圖式簡單說明】 第一圖係為本發明較佳實_之立體外觀H 弟二圖係為本發明較佳實施例之剖視圖圖 f三亂係為本發明另1佳實施狀立體外 ，四圖係為本發明另—較佳實施例之剖視圖 第五圖係為本發明又—較佳實施例之剖視圖 主要元件符號說明】 觀圖 〔本發明〕 10 石墨散熱裝置 11 散熱片 111 結合孔 12 基板 13 鰭片 14 間隔 15 基板 16 凸肋 20 金屬層 30 熱管座 31 底座 32 熱管BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for electroplating a metal layer on a graphite heat dissipating device. [Prior Art] As for the performance and miniaturization of various electronic products, the semiconductor components assembled therein are also moving toward large-capacity and intensification, so the heat generation inside the electronic products is also With the increase of the number of electronic products such as computers, most of the heat from semiconductor components is mostly cooled by graphite sheets, because the thermal conductivity is 2 to 3 times that of metal sheets such as copper or aluminum. Lightweight and low cost, it can be used as a heat sink between circuit boards or plasma TV display panels. However, there is a problem in using graphite as a thermal device, that is, carbon has a hierarchical structure, although the plane direction molecules of each layer They are tightly bonded together by mutual bonding. However, in the direction perpendicular to the surface (thickness direction), the joint between the knives is weak, so that the problem of interlayer peeling is likely to occur, and sufficient heat dissipation cannot be obtained. effect. • Please refer to the invention patent of Bulletin No. 1265612 “Heat sink and heat sink”, 'characterized to stack a mesh body composed of metal wires on the front and back sides of the graphite sheet, and make the graphite sheet and the net The shape is integrated, which can solve the problem of peeling between the layers of the graphite sheet, so that the thickness direction thereof has better thermal conductivity, and the heat generated by the electronic product can be efficiently discharged. [Invention] The conventional heat dissipating device utilizes the mesh body and the graphite sheet to be integrated, and the processing of the wound metal wire is complicated, resulting in a cost increase of π; and the mesh of the metal wire is easily separated. The graphite sheet causes voids to affect the thermal effect of the guide 200815726, and its structural strength is low. In addition, the conventional heat dissipating device: if the combined structure needs to be pre-formed with graphite sheets, it cannot be welded: α additionally, when combined with the hot official' There is also no relative fixation, so the conventional heat sink has many inconveniences on the raft. The present invention provides a heat dissipating device comprising a stone having a predetermined thickness and shape and electroplating a Si ink on the surface thereof for heat dissipation, wherein the stone layer and the moon core are reinforced by the metal layer The strength is set to effectively prevent the graphite heat dissipation of the layered structure = the problem of interlayer _ and has excellent thermal conductivity, and can be efficiently discharged with heat 2, and the metal layer is also subjected to a welding. Increasing the convenience of its processing and the change of structure [Embodiment] 々埶ίί, please refer to the first to second drawings, respectively, which is a perspective view of a snow rim of the present invention = a preferred embodiment, which is available The device comprises: a graphite heat sink 10, a metal layer 20 and a heat pipe holder 30; wherein: the ink heat sink 1 is made of graphite and has a predetermined thickness and shape. The hot film 11' is electrically wounded on the surface of the fins 11 of the graphite heat sink 10. Jr persons u, eight:, ,, "a have the metal layer 20, and the metal layer 20 is selected from nickel Or copper to t group The strength of the graphite heat dissipating device is enhanced by the metal layer, wherein the access hole has a number of bonding holes (1). The heat s seat 3G is arranged on both ends, and mainly includes a __base 31, and longitudinally equidistantly arranged a plurality of U-shaped heat pipes 32 with σ upwards, the vertical system is made of copper (four), and the The bonding holes m of the heat sink u are easy to be spliced to be fixed on both ends of the openings of the heat pipes 32. The two-dimensional diagrams of the two-dimensional diagrams and the cross-sections of the two-dimensional drawings and the functional system of the other embodiments are the same as the graphite heat sinks! Main package 2: a substrate 12 having a plurality of cymbals 13 arranged in an equidistant manner on the substrate 12, the metal=10-series mode is coupled to the substrate 12 and the peripheral surface t of the fins 13 and adjacent to the fins I3 Has a spacing u. The block structure wire will reproduce the characteristics of this creation and its expected effect. The diagram of the :::f five diagrams is the creation of the creation and the cross-section of the embodiment: in the second:,,, and The function is the same as the preferred embodiment of the present invention. The difference between the upper and lower longitudinal heat devices 10 mainly includes a substrate 15 which is formed by a combination of eight or two columns/number of ribs 16 and the metal layer 20 is formed by electroplating. ;::5"The substrate 15 of the stone and ink heat dissipating device 10 and the ribs 16 and the two ribs and the adjacent ribs 16 are also combined with the metal layer 20 to form the lower heat sink of the 200815726 The problem of interlayer peeling is generated, and the heat generated by the electronic product can be efficiently discharged. f. The metal layer of the invention is electroplated on the graphite heat dissipating device, so that the crucible heat dissipating device can be spliced and fixed, and the utility model has the excellent progress in the similar products. In addition to the new type of patents in this type of structure, it is requested in accordance with the law. Only those who have already mentioned the above are only the ones of the present invention, so the structure changes are applied to the application of the present invention, and the structure of the library is the equivalent of the parent and the patent application. It should be included in the scope of the patent of the present invention. 200815726. The following is a simplified view of the preferred embodiment of the present invention. The second embodiment of the present invention is a cross-sectional view of a preferred embodiment of the present invention. 4 is a cross-sectional view of a preferred embodiment of the present invention. The fifth embodiment of the present invention is a cross-sectional view of a preferred embodiment of the present invention. The main components are illustrated. [The present invention] 10 graphite heat sink 11 heat sink 111 Bonding hole 12 substrate 13 fin 14 spacing 15 substrate 16 rib 20 metal layer 30 heat pipe seat 31 base 32 heat pipe