M362598 • 五、新型說明： 【新型所屬之技術領域】 本新型涉及一種散熱裝置，特別係指一 • 電子元件之散熱裝置。 【先前技術】 ^ 隨著電子產業不斷發展，電子元件（特別係中 央處理器）運行速度和整體性能在不斷提升。然而， • $之發熱量亦隨之增加’另-方面體積越來越小，’ 發熱亦就更加集中，使得業界單純使用金屬 熱之散熱裝置無法滿足高端電子元件之散熱需求。寻 現在常見之一種散熱裝置及其基座，包括一與 熱源接觸之基座、設於基座上之複數等間距排狀 ^熱鰭片及於基座與散熱鰭片之間夾設之數個熱 管。該基座上表面中部區域和上述複數散熱 ^ 與基座結合處平行設有數個相對之容槽，而且該對 • 應，容槽共同組合形成一通孔，該通孔中插設上述 熱g由於熱官之傳熱速度較快，將熱源之熱量能 夠很快之擴散縣座上，進而促進散熱效率提高。 . 由於此類基板需要開槽容置熱管，所以-般只能採 - 用密度較小而容易加工之厚實鋁板來製成，然而， 此類鋁板一般厚度較大且由於鋁質自身導熱性能一 般，而使如此厚實之鋁板難於及時將熱量均勻分佈 到散熱鰭片上。 【新型内容】 M362598 及基Γ型旨在提供-種導熱性能良好之散熱裝置 ——種散熱裝置’包括一基座和位於基座之上之 二散熱片組，該基座包括—導熱板、固定於導熱板 ，面之-支撐架、貼在導熱板底面且其—端部夹置 ::熱板與支撐架之間之複數熱管和一吸熱板，該 ^擇架對應熱管處開設—空缺部，該吸熱板容置在 二缺部内且與熱管接觸。 一種散熱裝置之基座，該基座包括一導埶板、 ，定於導熱板底面之-支撐架、貼在導熱板底面且 ，、一端部夾置在導熱板與支料之間之複數熱管和 一吸熱板’該i撐架對應熱管處開設一空缺部，該 吸熱板容置在空缺部内且與熱管接觸。 上述散熱裝置之基座通過支撐架將導熱性能良 好但不易與加J1之銅制導熱板及吸熱板與熱管連接 起來，從而既能保證基座之導熱性能，亦使該基座 便於製造以及組裝。 【實施方式】 @ 1至® 3示出本新型_個較佳實施例中之散 熱裝置’該散熱裝置用於散發中央處理器等發熱電 子元件（圖未示）產生之熱量’該散熱裝置包括一 基座10和貼在基板10頂面上之一散熱片組2〇。 上述基座10包括與散熱片組2〇底部接觸之一 導熱板12、固定在導熱板12底部之—支撐架14、 M362598 夾置在導熱板12與支撐架14之間之複數熱管16和 嵌置在支撐架14内並同時與熱管16及發熱電子元 件接觸之一吸熱板18。 上述導熱板12為一薄銅板，其相對兩側向上彎 折形成定位凸緣122，所述定位凸緣122分別抵靠散 熱片組20之兩側，以限定散熱片組20之位置來防 止散熱片組20產生移位而脫落。該導熱板12在靠 近其兩側定位凸緣122處分別開設有二相對應之穿 孔120,以與固定件100配合而將散熱裝置固定在發 熱電子元件上。 上述支撐架14由密度小且加工容易之鋁材料一 體成型，該支撐架14包括一矩形支撐板140,該支 撐板140之尺寸小於導熱板12之尺寸，支撐板140 中部開設一矩形空缺部142，以收容吸熱板18。該 支撐板140在位於空缺部142之前後兩侧處開設有 並排在一起之複數凹槽144。所述凹槽144用於容置 熱管18並與支撐板140之前後兩侧邊垂直，且凹槽 144 一端與空缺部142連通。該支撐板140在其底面 各個角落處垂直向下延伸形成有固定筒146,支撐板 140在其面對應各個固定筒146處向上凸起形成定位 環148,每一定位環148與對應之固定筒146内形成 有上下貫通之一安裝孔1460，每一固定件100穿置 在安裝孔1460内。該支撐板140之頂面貼在導熱板 12底面上，並可通過焊接、粘貼或鎖螺釘等方式固 M362598 定在一起。該支撐板140上之四定位環146正好分 別穿置在導熱板12之四穿孔120内，且所述定位環 146之頂面與導熱板12之頂面齊平。該支撐板140 中間對應空缺部142部分之厚度達於靠近兩側部分 之厚度，如此可以節省基座10之材料並基座10更 小巧輕便。 上述熱管16均為扁平型，具有平坦之頂面和底 面，所述熱管16靠近其中一端之第一部分相互緊挨 著並排在一起並且夾置在支撐架14之支撐板140與 導熱板12之間，所述熱管16靠近另一端之第二部 分與第一部分呈一定角度彎折，且熱管16之第二部 分從支撐板140 —侧穿出並相互遠離呈放射狀延 伸。所述熱管16之第一部分容置在支撐板140之凹 槽144内並跨過支撐板140之空缺部142,且所有熱 管16第一部分之底面並排在一起，在對應缺口部142 形成一平坦之接觸面。所述熱管16之頂面均與導熱 板12底面接觸，而熱管16之底面則僅有其第一部 分位於支撐板140空缺部142前後兩側並容置於支 撐板140凹槽144内之部分與支撐板140接觸。 上述吸熱板18大小正好容置在支撐架14之空 缺部142内，吸熱板18之底面齊平或者凸出於支撐 架14支撐板140之底面，且吸熱板18之底面與發 熱電子元件接觸，吸熱板18之頂面與對應空缺部142 内之熱管16之接觸面接觸，並可通過焊接或粘貼等 M362598 方式將吸熱板18緊貼在熱管16之接觸面上。該吸 熱板18由導熱性能優越之金屬銅製成，以將快速吸 收發熱電子元件之熱量，並通過熱管16將熱量傳遞 到導熱板12上，最後由導熱板12將熱量分佈到散 熱片組20上而散發出去。 上述散熱片組20包括排列在導熱板12上之複 數散熱片22,所述散熱片22相互間隔，並垂直於導 熱板12，平行於導熱板12之一對侧邊。散熱片22 之底部邊緣垂直彎折出折邊22〇,所有折邊22〇並在 一起形成一平板面，該散熱片組20通過該平板面貼 固在導熱板12頂面上。該散熱片組20對應導熱板 12穿孔120處開設有缺口 24 ,以便固定件1〇〇穿入 支稽架14之安裝孔1460内。 上述基座10由支撐架14將銅質材料製成之導 熱板12及吸熱板18與熱管16結合組成，其中發熱 電子元件產生之熱量可以通過銅制之導熱板12、吸 熱板18及熱管16來傳遞，因此保證基座ι〇具有高 效熱傳導之性質。此外，通過便於加工之鋁制支撐 ，Η將簡單銅板結構之導熱板U及吸熱板切與熱 官16結合起來，從而基座1〇具有加工簡單、組裝 便捷之優勢。 ^ 綜上所述，本發明確已符合發明專利之要件， 遂依法提出專利申請。惟，以上所述者僅為本發明 之較佳實施方式，自不能以此限制本案之中請專利 M362598 枕圍。舉凡熟悉本案技藝之人士援依本發明之精神M362598 • V. New description: [New technical field] The present invention relates to a heat dissipating device, in particular to a heat dissipating device for electronic components. [Prior Art] ^ With the continuous development of the electronics industry, the operating speed and overall performance of electronic components (especially the central processor) are constantly improving. However, the heat generated by $ also increases. 'The other side is getting smaller and smaller,' and the heat is more concentrated. This makes it impossible for the industry to use the heat sink of metal heat to meet the heat dissipation requirements of high-end electronic components. A common type of heat sink and its base are provided, including a base that is in contact with a heat source, a plurality of equally spaced rows of heat fins disposed on the base, and a number between the base and the heat sink fins. a heat pipe. a plurality of opposite pockets are disposed in parallel with the central portion of the upper surface of the base and the plurality of heat sinks and the joint of the base, and the pair of slots are combined to form a through hole, wherein the heat is inserted in the through hole The heat transfer speed of the hot official is faster, and the heat of the heat source can be quickly diffused into the county seat, thereby promoting the heat dissipation efficiency. Since such a substrate needs to be grooved to accommodate the heat pipe, it can only be produced by using a thick aluminum plate which is small in density and easy to process. However, such an aluminum plate generally has a large thickness and is generally characterized by its own thermal conductivity. Therefore, it is difficult for such a thick aluminum plate to evenly distribute heat to the fins in time. [New content] The M362598 and the base type are designed to provide a heat-dissipating device with good thermal conductivity. The heat sink device includes a base and two heat sink groups on the base. The base includes a heat conducting plate. Fixed to the heat conducting plate, the surface-supporting frame, attached to the bottom surface of the heat conducting plate and sandwiched at the end: a plurality of heat pipes and a heat absorbing plate between the hot plate and the support frame, the selected frame corresponding to the heat pipe opening - vacancy The heat absorbing plate is housed in the two missing portions and is in contact with the heat pipe. A base of a heat dissipating device, the base comprises a guiding plate, a support frame fixed on the bottom surface of the heat conducting plate, a heat pipe attached to the bottom surface of the heat conducting plate, and a plurality of heat pipes sandwiched between the heat conducting plate and the supporting material at one end And a heat absorbing plate, the i-supporting frame defines a vacant portion corresponding to the heat pipe, and the heat absorbing plate is received in the vacant portion and is in contact with the heat pipe. The pedestal of the heat dissipating device has good thermal conductivity through the support frame, but is not easy to be connected with the copper heat conducting plate and the heat absorbing plate and the heat pipe added with J1, thereby ensuring the thermal conductivity of the pedestal and making the susceptor easy to manufacture and assemble. . [Embodiment] @1 to ® 3 show a heat dissipating device in the preferred embodiment of the present invention. The heat dissipating device is for dissipating heat generated by a heat generating electronic component (not shown) such as a central processing unit. A susceptor 10 and a heat sink unit 2 贴 attached to the top surface of the substrate 10. The pedestal 10 includes a heat conducting plate 12 in contact with the bottom of the heat sink group 2, a heat pipe 16 fixed to the bottom of the heat conducting plate 12, and a plurality of heat pipes 16 and embedded between the heat conducting plate 12 and the support frame 14. A heat absorbing plate 18 is placed in the support frame 14 and simultaneously in contact with the heat pipe 16 and the heat-generating electronic components. The heat conducting plate 12 is a thin copper plate, and the opposite sides thereof are bent upward to form a positioning flange 122. The positioning flanges 122 respectively abut against the two sides of the heat sink group 20 to define the position of the heat sink group 20 to prevent heat dissipation. The sheet set 20 is displaced and falls off. The heat conducting plate 12 is respectively provided with two corresponding through holes 120 at the positioning flanges 122 on the two sides thereof to cooperate with the fixing member 100 to fix the heat dissipating device on the heat generating electronic component. The support frame 14 is integrally formed of an aluminum material having a small density and easy processing. The support frame 14 includes a rectangular support plate 140. The size of the support plate 140 is smaller than the size of the heat conductive plate 12, and a rectangular cutout portion 142 is defined in the middle of the support plate 140. To accommodate the heat absorbing plate 18. The support plate 140 is provided with a plurality of grooves 144 which are arranged side by side at the rear sides of the vacant portion 142. The groove 144 is for accommodating the heat pipe 18 and perpendicular to the front and rear sides of the support plate 140, and one end of the groove 144 is in communication with the vacant portion 142. The support plate 140 extends vertically downward at each corner of the bottom surface thereof to form a fixing cylinder 146. The support plate 140 is upwardly protruded at a surface corresponding to each of the fixing cylinders 146 to form a positioning ring 148, and each positioning ring 148 and the corresponding fixing cylinder One of the mounting holes 1460 is formed in the 146, and each of the fixing members 100 is disposed in the mounting hole 1460. The top surface of the support plate 140 is attached to the bottom surface of the heat conducting plate 12, and can be fixed by welding, pasting or locking screws. The four positioning rings 146 on the support plate 140 are disposed in the four through holes 120 of the heat conducting plate 12, and the top surface of the positioning ring 146 is flush with the top surface of the heat conducting plate 12. The thickness of the portion corresponding to the vacant portion 142 in the middle of the support plate 140 is close to the thickness of the two side portions, so that the material of the susceptor 10 can be saved and the pedestal 10 can be made smaller and lighter. The heat pipes 16 are all of a flat type having a flat top surface and a bottom surface, and the first portions of the heat pipes 16 adjacent to one end thereof are next to each other and are arranged together and sandwiched between the support plate 140 of the support frame 14 and the heat conducting plate 12 The second portion of the heat pipe 16 near the other end is bent at an angle to the first portion, and the second portion of the heat pipe 16 extends from the side of the support plate 140 and extends radially away from each other. The first portion of the heat pipe 16 is received in the recess 144 of the support plate 140 and spans the vacant portion 142 of the support plate 140, and the bottom surfaces of the first portions of all the heat pipes 16 are juxtaposed together to form a flat surface at the corresponding notch portion 142. Contact surfaces. The top surface of the heat pipe 16 is in contact with the bottom surface of the heat conducting plate 12, and only the first portion of the heat pipe 16 is located at the front and rear sides of the vacant portion 142 of the supporting plate 140 and is received in the groove 144 of the supporting plate 140. The support plate 140 is in contact. The heat absorbing plate 18 is sized to be received in the vacant portion 142 of the support frame 14. The bottom surface of the heat absorbing plate 18 is flush or protrudes from the bottom surface of the support frame 14 of the support frame 14, and the bottom surface of the heat absorbing plate 18 is in contact with the heat generating electronic component. The top surface of the heat absorbing plate 18 is in contact with the contact surface of the heat pipe 16 in the corresponding vacant portion 142, and the heat absorbing plate 18 can be closely attached to the contact surface of the heat pipe 16 by means of welding or pasting M362598. The heat absorbing plate 18 is made of metallic copper with excellent thermal conductivity to quickly absorb heat of the heat-generating electronic component, and transfer heat to the heat conducting plate 12 through the heat pipe 16, and finally distribute heat to the heat sink group 20 by the heat conducting plate 12. And exudes. The heat sink group 20 includes a plurality of fins 22 arranged on the heat conducting plate 12, the fins 22 being spaced apart from each other and perpendicular to the heat conducting plate 12, parallel to one of the side edges of the heat conducting plate 12. The bottom edge of the heat sink 22 is bent perpendicularly to the flange 22, and all the flanges 22 are formed together to form a flat surface. The heat sink group 20 is attached to the top surface of the heat conducting plate 12 through the flat surface. The heat sink group 20 is provided with a notch 24 corresponding to the through hole 120 of the heat conducting plate 12, so that the fixing member 1 is inserted into the mounting hole 1460 of the branch frame 14. The susceptor 10 is composed of a heat conducting plate 12 made of a copper material and a heat absorbing plate 18 combined with a heat pipe 16 by a support frame 14. The heat generated by the heat generating electronic components can pass through the heat conducting plate 12, the heat absorbing plate 18 and the heat pipe 16 made of copper. To pass, thus ensuring that the pedestal 〇 has the property of efficient heat conduction. In addition, through the easy-to-process aluminum support, the heat-conducting plate U and the heat-absorbing plate of the simple copper plate structure are combined with the heat-receiving plate 16, so that the base 1 has the advantages of simple processing and convenient assembly. ^ In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the case of the patent M362598 pillow. Anyone who is familiar with the skills of this case will be assisted by the spirit of the invention.
所作之等效修飾或變化’皆應涵蓋於以下申請專利 範圍内。 J 【圖式簡單說明】 圖1係本新型一個較佳實施例中散熱裴置之組 ......、今、且〜刀肝圃 。Equivalent modifications or variations made by </ RTI> should be covered by the following patents. J [Simple Description of the Drawings] Fig. 1 is a group of heat dissipating devices in a preferred embodiment of the present invention.
圖3係圖1中散熱裝置之倒置組合圖。 分組^係圖3中散熱裝置之導熱板分解出來之部3 is an inverted combination view of the heat sink of FIG. 1. The group ^ is the part of the heat-dissipating plate of the heat-dissipating device in Fig. 3
基座 圖5係圖1中沿 主要元件符號說明】 穿孔 支撐架 空缺部 固定筒 安裝孔 10 120 14 142 146 1460 吸熱板 散熱片 缺u 18 22 24 V-V剖線之剖視圖 導熱板 定位凸緣 支撐板 凹槽 定位環 熱管 散熱片組 折邊 固定件 12 122 140 144 148 16 20 220 100Base diagram 5 is the main component symbol description in Figure 1. Perforated support frame vacant section fixed cylinder mounting hole 10 120 14 142 146 1460 Heat absorbing plate heat sink missing u 18 22 24 VV section line sectional view Thermal plate positioning flange support plate Groove positioning ring heat pipe fin group folding flange fixing member 12 122 140 144 148 16 20 220 100