TWM353628U - Heat dissipation device for interface card - Google Patents

Heat dissipation device for interface card Download PDF

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Publication number
TWM353628U
TWM353628U TW97219564U TW97219564U TWM353628U TW M353628 U TWM353628 U TW M353628U TW 97219564 U TW97219564 U TW 97219564U TW 97219564 U TW97219564 U TW 97219564U TW M353628 U TWM353628 U TW M353628U
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TW
Taiwan
Prior art keywords
heat
item
interface card
fan
socket
Prior art date
Application number
TW97219564U
Other languages
Chinese (zh)
Inventor
Yuan-Zheng Fang
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW97219564U priority Critical patent/TWM353628U/en
Publication of TWM353628U publication Critical patent/TWM353628U/en
Priority to DE200920014131 priority patent/DE202009014131U1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M353628 五、新型說明: 【新型所屬之技術領域】 一種用於介面卡 本創作係有關於一種散熱裝置,尤指 之散熱裝置。 【先前技術】 通常在介面卡上皆安裝有散熱裝置,用以散除介面卡 二時::生之高熱,藉此,以降低介面卡之溫;:; 卡在-溫度較低之空間下進行運算,以避免介 因南熱而發生當機或毀損。 如習知用於介面卡之散熱袭置,該介 片,該散熱裝置主要包括一承亦 百固疋 给—匕枯承座、一散熱片組以及一風 二=片組安裝於該承座’該散熱片 堆疊的散熱片所構成,該犛Λ 攸双邳立 所述固定… 熱片分別呈橫向排列並對應M353628 V. New description: [New technology field] One type of interface card This book is about a heat sink, especially a heat sink. [Prior Art] Generally, a heat dissipating device is installed on the interface card to dissipate the interface card: the high heat of the interface, thereby reducing the temperature of the interface card;:; being stuck in a space with a low temperature Perform calculations to avoid a crash or damage caused by the South Heat. For example, it is conventionally used for the heat dissipation of the interface card. The heat sink is mainly composed of a bearing, a sturdy bearing, a heat sink, and a wind slab. 'The fins are stacked on the heat sink, and the 牦Λ 攸 邳 所述 所述 固定 ... ... ... ... ... ... ... ... ... ... ... ... 热 热 热

Maun而該風扇則^於該承座上 散熱片組之一側;藉此,以M 並位在該 缺工 以構成此一散熱裝置。 然而,習知用於介面卡之 存在有以下的缺失,因該#散心、在實際使用上仍 固定片配置,當該風扇對該等散呈f向排列並對應 則會被所述固定片阻播,俾'甘、’仃散熱時,其氣流 低該介面卡之使用壽命。纟其散熱效能不佳,進而降 有鑑於此’本創作人係為改 特潛心研究並配合學理之運 龙解決上述之缺失,乃 有效改善上述缺*之本創作。終於提出—種設計合理且 3 M353628 【新型内容】 裝置lit,,在於可提供-種用於介面卡之散埶 裝置’其藉由風扇對分別呈斜向排列配置之多數散 散熱體進行散熱’以順利帶走介面卡運算時所產生: 二Γ提昇介面卡之散熱效能並延長其使用壽命 本創作之另一目的,在於可提供一種用於介面 :裝置’其藉由第二散熱體疊設於第一散熱體上,進而“ 昇介面卡之散熱效能並延長其使用壽命。’ 為了達成上述之目的’本創作係提供—種用於介 7熱裝置,係由-承座、—第—散熱體以及—第 體所構成;該承座具有—側邊;該第-散熱體安震於糾 座’該第-散熱體係由複數相互堆疊的散熱片所構成,該 等散熱片分別相對於該侧邊呈傾斜排列配置;該第二散熱Maun and the fan is on one side of the heat sink group on the socket; thereby, the M is positioned in the absence to form the heat sink. However, it is conventionally used for the existence of the interface card, which has the following drawbacks, because the #小心, in the actual use, still fixes the sheet configuration, and when the fan is arranged in the f direction and correspondingly, the fixed chip is blocked. Broadcasting, when 'Gan,' 仃 heat, its airflow is lower than the service life of the interface card. The heat dissipation performance is not good, and in view of this, the creator is trying to improve the above-mentioned shortcomings by resolving the above-mentioned shortcomings. Finally proposed - a reasonable design and 3 M353628 [new content] device lit, is to provide a kind of diverting device for the interface card 'the heat dissipation of the majority of the scattered heat sinks arranged in a diagonal arrangement by the fan' In order to smoothly take away the interface card operation: Secondly, improve the heat dissipation performance of the interface card and extend its service life. Another object of the present invention is to provide an interface for the device to be stacked by the second heat sink. On the first heat sink, and then "the thermal performance of the riser card and extend its service life." In order to achieve the above purpose, the author provides a kind of thermal device for the 7th thermal device, which is the -bearer, - the first The heat sink and the first body are configured; the socket has a side edge; the first heat sink body is mounted on the correcting seat. The first heat dissipation system is composed of a plurality of heat sinks stacked on each other, and the heat sinks are respectively opposed to the heat sink The side edges are arranged in an inclined arrangement; the second heat dissipation

體疊設於該第一散熱體上’該第二散熱體則包含複數;熱 片。 、 此外,本創作亦提供一種用於介面卡之散熱裝置,係 由一承座、一第一散熱體、一第二散熱體以及至少—埶瞢 所構成;該承座具有一侧邊;該第一散熱體安裝於該承 座,該第一散熱體係由複數相互堆疊的散熱片所構成,該 專散熱片分別相對於該側邊呈傾斜排列配置;該第二散熱 體疊設於該第一散熱體上,該第二散熱體包含複數散熱 片;該熱管具有被夾掣在該承座與該第一散熱體之間的一 蒸發段以及從該蒸發段延伸出並穿接該第二散熱體的一冷 4 M353628 凝段 本創狀又一目的,在於可提供一種用於介面卡 …、裝置,其藉由熱管之蒸發段被夹$ ^ …货仅傲处I在第一散熱體與承座 之間’而其冷凝段則穿接於第二散熱體上 介面卡之散熱效能。 早進步&幵 本創作之再-目的,在於可提供—則於介面卡之散 ,裝置’其藉由在第—散熱體與承座之間另外央擎有 管,以增進介面卡之散熱效能。 ‘、、、 【實施方式】 有關本創作之詳細說明及技術内容,配合圖式說明如 下,然而所附圖式僅提供參考與說明用,並非用來對 作加以限制者。 請參閱第-圖及第二圖,本創作用於介面卡之散熱裝 置1,係由一承座1〇、一第一散熱體2〇以及一第二散熱體 30所構成。 ^ 該承座10包含一固定板U、嵌入該固定板_固定的 一導熱塊12以及從該固定板n所凸伸出的至少一螺柱13, 該固定板11具有一側邊14,而該導熱塊丨2可為一矩形導熱 塊12且其外露出表面並可與該固定板U之表面齊平,所述 該導熱塊12可為一銅塊或銘塊,但不限制。 該第一散熱體20安裝於該承座1〇並與該導熱塊12表面 貼接’該第一散熱體20係由複數散熱片21所構成,該等散 熱片21分別相對於該側邊14呈傾斜排列配置。 5 M353628 該第二散熱體30疊設於該第一散熱體20上,該第二散 熱體30包含複數個散熱片3卜該等散熱片&分別相對於該 側邊呈平行排列配置。 _於本實施例中,更可包括一風扇40,該風扇40安裝於 該承座10並位在該第一散熱體2〇及該第二散熱體刈的一 側,該風扇40開設有至少一穿孔4卜該穿_分別對應該 承座10之3亥螺柱13設置,以分別藉由至少一螺絲π分別穿 設該穿孔41並螺接於該螺柱13上,所述該風㈣可為一離 〜扇或軸流扇者,但不限制。 ▲於本實施例中,更可包括連接該承座1〇之一風罩5〇, 該風罩50係罩合該第一、第二散熱體20、30與該風扇40, 該風罩50開設有對應該風扇4〇設置的一進風孔^,並在該 風罩50之一侧開設有一出風口诏。 應用本創作於一介面卡2時,如第三圖所示,該介面 卡2具有一電路板2〇〇、設於該電路板2⑼表面的一發熱 鲁兀件201以及設於該電路板2〇〇 一端的一固定片2〇2,本 -創作散熱裝置1之該導熱塊12係對應所述該發熱元件2〇1 •貼接(如第四圖所示),所述該介面卡2可為顯示卡、音 效卡、繪圖卡或網路卡等,但不限制。 使用本創作時,請參閱第五圖及第六圖,當該介面卡 2運作時,該發熱元件2〇1所產生之高熱傳導至該導熱塊 12後並以该第一散熱體20、該第二散熱體30以及該風扇 4〇,除其熱能,其中於第五圖中,該風扇4〇運轉時所產生 之氣流通過該第一散熱體2〇後被導引至該風罩50 —側之該 6 M353628 出風口 52而流出,故不會被該介面卡2之該固定片202阻 擋丄俾可順利帶走該介面卡2運算時所產生的高熱,而於 第/、圖中,a亥風扇4〇運轉時所產生之氣流通過該第二散熱 體30後,因該第二散熱龍設置較高,其氣流亦不會被該 介面卡2之3亥固疋片202阻擔,亦可順利排出該介面卡2 所產生之高熱,因此,使用本創作俾有效增加介面卡2之 政熱效月b進而延長其使用壽命。 研參閱第七圖及第八圖,係為本創作之另一實施例 圖,本實施例與前述實施例之差別在於本實施例更包括至 少一熱管60,並在該第二散熱體3〇上開設有一穿槽犯;該 熱管60可為一 u型之熱管,且其斷面可呈矩形者,而該熱 管60係具有被夾掣在該承座1〇與該第一散熱體2〇之間並貼 接該導熱塊12的一蒸發段61以及從該蒸發段61延伸出並穿 接組配於該穿槽32内的一冷凝段62,藉此,以進一步提昇 介面卡2之散熱效能。 於前一實施例中,更可包括至少一導熱管7〇,並在該 固定板11上則開設有一凹槽15 ;該導熱管7〇可為—u型之 熱管,且其斷面可呈矩形者,而該導熱管7〇則具有被夾掣 在該承座10與該第一散熱體20之間並貼接該導熱塊12的一 受熱段71以及從該受熱段71所延伸出並嵌入組配於該凹槽 15内的一放熱段72,藉此,可更進一步提昇介面卡2之散 熱效能。 綜上所述,應用本創作可達到有效提昇介面卡2之散 熱效能並延長其使用壽命’以解決習知技術之種種缺失, M353628 實已具備高度產業利用價值。 【圖式簡單說明】 第一圖為本創作之立體分解示意圖。 第二圖為本創作之立體組合示意圖。 第二圖為本創作應用於介面卡之立體圖。 第四圖為第三圖之組合圖。 第五圖為第四圖之5-5的剖面示意圖。 第六圖為第四圖之6-6的剖面示意圖。 第七圖為本創作之另一實施例圖。 第八圖為第七圖之組合圖。 【主 1 . 10 · 11 . 要元件符號說明】 •··.散熱裝置 •·.·承座 13 . ...固定板 12 · ·. ••導熱塊 15 · 20 . ’ · ·螺柱 • · · ·凹槽 14 · · · ..侧邊 30 . 31 . .· ·第一散熱體 •.··第二散熱體 21 · ·. ••散熱片 40 . 41 · ....散熱片 •··.風扇 32 ·-. ••穿槽 5〇 . •...穿孔 .· . ·風罩 42 · ·. • •螺絲 M353628 51 · · · ••進風孔 52 · • · · •出風口 60 · · · • •執管 61 · · · ••蒸發段 62 · •···冷凝段 70 · · · ••導熱管 71 · · · ••受熱段 72 · •···放熱段 2 · · · • •介面卡 200 . · ••電路板 201 · • · ·發熱元件 202 .. ••固定片The body is superposed on the first heat sink. The second heat sink comprises a plurality of heat sheets. In addition, the present invention also provides a heat dissipating device for an interface card, which is composed of a socket, a first heat sink, a second heat sink, and at least a crucible; the socket has one side; The first heat dissipating body is mounted on the socket, and the first heat dissipating system is formed by a plurality of heat sinks stacked on each other, wherein the special heat dissipating fins are respectively arranged obliquely with respect to the side edges; the second heat dissipating body is stacked on the first heat dissipating body a heat sink comprising a plurality of heat sinks; the heat pipe having an evaporation section sandwiched between the socket and the first heat sink and extending from the evaporation section and piercing the second heat sink A cold 4 M353628 condensing section of the heat sink is another purpose of providing a device for the interface card, the device is clamped by the evaporation section of the heat pipe, and the goods are only proud of the first heat sink. Between the socket and the socket, the condensation section is connected to the heat dissipation performance of the interface card on the second heat sink. Early Progress & 幵 创作 创作 创作 - - - - - - - - - - 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 创作 装置 装置 装置 装置 装置 装置 装置 装置 装置 装置 装置 装置 装置efficacy. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Referring to the first and second figures, the heat dissipating device 1 for the interface card is composed of a socket 1 , a first heat sink 2 , and a second heat sink 30 . The holder 10 includes a fixing plate U, a heat conducting block 12 embedded in the fixing plate _ and a stud 13 protruding from the fixing plate n, the fixing plate 11 having one side 14 The heat conducting block 丨2 can be a rectangular heat conducting block 12 and its exposed surface can be flush with the surface of the fixing plate U. The heat conducting block 12 can be a copper block or an inscription block, but is not limited. The first heat sink 20 is mounted on the socket 1 and is in contact with the surface of the heat conducting block 12 . The first heat sink 20 is composed of a plurality of heat sinks 21 , and the heat sinks 21 are respectively opposite to the side 14 . Arranged in a slanting arrangement. 5 M353628 The second heat dissipating body 30 is stacked on the first heat dissipating body 20, and the second heat dissipating body 30 includes a plurality of fins 3, and the fins are mounted in parallel with respect to the side. In this embodiment, a fan 40 is further disposed on the socket 10 and disposed on a side of the first heat sink 2 and the second heat sink body. The fan 40 is open at least a perforation 4 is provided for each of the 3 sets of the studs 13 of the socket 10 to respectively pass through the through holes 41 and screwed onto the studs 13 respectively by the at least one screw π, the wind (4) Can be a fan away from the fan or the axis, but not limited. In the embodiment, the hood 50 is connected to the hood 1 , and the hood 50 covers the first and second heat sinks 20 , 30 and the fan 40 . The hood 50 An air inlet hole corresponding to the fan 4 is provided, and an air outlet port is opened on one side of the air hood 50. When the interface card 2 is applied to the interface card 2, as shown in the third figure, the interface card 2 has a circuit board 2, a heat generating reed member 201 disposed on the surface of the circuit board 2 (9), and the circuit board 2 a fixing piece 2〇2 at one end of the crucible, the heat conducting block 12 of the present heat-dissipating device 1 corresponds to the heating element 2〇1 • is attached (as shown in the fourth figure), the interface card 2 can be a display card, sound card, graphics card or network card, etc., but not limited. When using the present invention, please refer to the fifth and sixth figures. When the interface card 2 is operated, the high heat generated by the heating element 2〇1 is transmitted to the heat conducting block 12 and the first heat sink 20 is used. The second heat dissipating body 30 and the fan 4〇, in addition to the thermal energy thereof, wherein in the fifth figure, the airflow generated by the fan 4〇 is guided to the hood 50 through the first heat dissipating body 2 The side of the 6 M353628 air outlet 52 flows out, so it is not blocked by the fixing piece 202 of the interface card 2, and the high heat generated by the operation of the interface card 2 can be smoothly taken away, and in the figure /, After the airflow generated by the operation of the second fan 4 is passed through the second heat sink 30, the airflow is not blocked by the interface block 202 of the interface card 2 because the second heat sink is set higher. The high heat generated by the interface card 2 can also be smoothly discharged. Therefore, the use of the present invention effectively increases the thermal efficiency of the interface card 2 and further prolongs its service life. FIG. 7 and FIG. 8 are diagrams of another embodiment of the present invention. The difference between this embodiment and the foregoing embodiment is that the embodiment further includes at least one heat pipe 60 and the second heat sink 3 The heat pipe 60 can be a U-shaped heat pipe, and the cross-section can be rectangular, and the heat pipe 60 is clamped on the socket 1 and the first heat sink 2 An evaporation section 61 of the heat conducting block 12 is attached and extended from the evaporation section 61 and penetrates a condensation section 62 assembled in the through slot 32, thereby further improving the heat dissipation of the interface card 2. efficacy. In the previous embodiment, at least one heat pipe 7〇 is further included, and a groove 15 is defined in the fixing plate 11; the heat pipe 7〇 can be a U-shaped heat pipe, and the cross section can be a heat-receiving tube 7B having a heat-receiving portion 71 sandwiched between the socket 10 and the first heat-dissipating body 20 and attached to the heat-conducting block 12 and extending from the heat-receiving portion 71 The heat dissipation section 72 is disposed in the recess 15 and the heat dissipation performance of the interface card 2 can be further improved. In summary, the application of this creation can effectively improve the heat dissipation performance of the interface card 2 and prolong its service life. To solve the various shortcomings of the prior art, the M353628 has high industrial utilization value. [Simple description of the diagram] The first diagram is a three-dimensional decomposition diagram of the creation. The second picture is a three-dimensional combination diagram of the creation. The second figure is a perspective view of the creation applied to the interface card. The fourth picture is a combination of the third figure. The fifth figure is a schematic cross-sectional view of 5-5 of the fourth figure. The sixth figure is a schematic cross-sectional view of 6-6 of the fourth figure. The seventh figure is a diagram of another embodiment of the creation. The eighth figure is a combination diagram of the seventh figure. [Main 1.10·11. Description of component symbols] •··. Heat sink •··· Seat 13 ... Fixing plate 12 · ·. •• Thermal block 15 · 20 . ' · · Stud • · · · Groove 14 · · · .. Side 30 . 31 . . . · First heat sink ····The second heat sink 21 · ·.•• Heat sink 40 . 41 · .... Heat sink •··. Fan 32 ·-. ••Slotting 5〇. •...Perforation·· . ·Wind hood 42 · ·. • • Screw M353628 51 · · · •• Air inlet 52 · • · · • Air outlet 60 · · · • • Executive tube 61 · · · • • Evaporation section 62 · •··· Condensation section 70 · · · •• Heat pipe 71 · · · •• Heated section 72 · •··· Heat release section 2 · · · • • Interface card 200 . • • • Circuit board 201 · • · · Heating element 202 .. •• Fixed piece

Claims (1)

M353628 六、申請專利範圍·· 1. -種用於介面卡之散熱裝置,包括: 承座,具有一側邊; —第一散熱體,安妒於 複數散熱片所構成,該等散=f,該第—散熱體係由 斜排列配置, ·以及 熟片刀別相對於該側邊呈傾 第一放熱體,疊設於該一 熱體包含複數散熱片。 政熱體上,該第二散 2.:=第1項所述之用於介面 =熱體之該等―“側 3.如請求項第丨項所 安裝於該承座並位在該第卡之散熱裝置,更包括 側的一風扇。 第一散熱體及該第二散熱體之- 項第3項所述之用於 風扇係為一離心扇或軸流扇 之放熱裝置’其中該 =項第3項所述之用:介 連接该承座之一風罩, &熱褒置,更包括 體與該風扇。 …罩係罩合該第-、第二散熱 6.如凊求項第5項所述之用於 風罩開設有對應該風扇設置的 政熱裝置’其中該 一側開設有一出風口。 、進風孔,並在該風罩之 汝口月求項第3項所述之 承座包含1定板以及士 卡之散熱褒置,其中該 疋板以及嵌入該固定板内固定的一導熱 M353628 塊 8.如請求項笛7 第7項所述之用於介面卡之 導熱塊係貼接該第一散熱體。 (,,、裳置’其甲該 9.如請切第7項所述之 導熱魏係為-鋼塊或_。卡之撕置’其中該 讥如請求項第7項所述之用於介 承座更包含從該固定板所凸伸出的至::=,其:該 -螺絲穿設鎖固。 穿孔’以分別藉由至少 11. -種用於介面卡之散熱裝置,包括·· 承座,具有一側邊; 一第—散熱體,連接該承座, 數散熱片所構成,該耸卑# u 該第一散熱體係由複 排列配置; Μ’月…片分別相對於該側邊呈傾斜 一第二散熱體,疊設於該第一 熱體包含複數散熱片;以及 …、i,該第二散 Η至夕熱官,具有被夹擎在該承座盥該第-散軌體 之間的-蒸發段以及從該蒸發段延伸出並連::熱: 熱體的一冷凝段。 遷接該第一政 請求項第11項所述之用於介面卡 =散熱體之該等散熱片分別相對於該側邊二 13.如請求項第U項所述之用於介面卡 安裝於該承座並位在該第 月又…装罝更0祜 放*、,、體及該第二散熱體之一 11 M353628 侧的一風扇。 14. 如請求項第13項所述之用於介面卡之散熱裝置,其中該 風扇係為一離心扇或軸流扇。 15. 如請求項第13項所述之用於介面卡之散熱裳置,更包括 連接該承座之一風罩,該風罩係星人 第二散熱 、;丨田下之散熱 連接該承座之一風罩,該風罩係罩合該第 體與該風扇。 16·如請求項第15項所述之用於介面卡之散熱裝置,其中該 風罩開設有對應該風扇設置 -侧開設有-出風口。 钱孔,結該風罩之 17. rrt:第13項所述之用於介面卡之散熱裝置,其中該 座包含-固定板以及嵌入該固定板内固定的一導Γ 18. 如請求項第17項所述之用於介面 第二散熱體開設有供該冷凝段嵌 的、- 蒸發段則被夾掣在該第—散 冑槽’㈣ 19 政熱體與該導熱塊之間。 .如研求項第17項所述之用於介面卡 導熱塊係為-銅塊或銘塊。 U置’八中該 2〇.如請求項第17項所述之用於 承座更包含從該固定板所凸 <散熱裝置,其中該 扇則開設有對應該螺挺之至少螺、柱該風 一螺絲穿設鎖固。 孔,以分別藉由至少 21·如請求項第11項所述之用於 熱管係為一ϋ型熱管。 之政熱裝置,其中該 汉如請求項第η項所述之用於 下之散熱裝置,其中該 12 M353628 熱管之斷面係呈矩形。 如請求項第17項所述Μ於介面卡之散熱μ,更包括 23. 24. 至少-導熱管,該導熱管具有被夾掣在該承座與該第一 散熱體之間的一受熱段及一放熱段。 如請求項第23項所述之用於介面卡之散熱裝置, 該固定板上開設有供該放熱段嵌人組配的—、 受熱段則貼接該導熱塊。 θ 25.M353628 VI. Application for Patent Range·· 1. A heat sink for the interface card, including: a socket having one side; a first heat sink, which is formed by a plurality of heat sinks, the same The first heat dissipation system is arranged in an oblique arrangement, and the cooked chip cutter is inclined to the first heat release body with respect to the side edge, and the heat body is stacked on the heat body to include a plurality of heat sinks. On the political body, the second scatter 2.: = the one described in item 1 for the interface = the hot body - "side 3. If the request item is installed in the seat and is in the first The heat dissipating device of the card further comprises a fan on the side. The first heat dissipating body and the second heat dissipating body - the heat radiating device for the fan is a centrifugal fan or an axial fan according to item 3, wherein the = Item 3: The hood is connected to the hood of the socket, and the thermal venting device further includes a body and the fan. The cover system covers the first and second heat dissipation 6. If the item is requested The windshield according to item 5 is provided with a heating device corresponding to the fan setting, wherein one side of the hood is provided with an air outlet. The air inlet hole is in the third item of the month of the hood. The socket includes a fixed plate and a heat dissipation device of the card, wherein the plate and a heat conducting M353628 block embedded in the fixing plate are used for the interface card as described in Item 7 of claim 7 The heat conducting block is attached to the first heat sink. (,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The tearing of the container is as described in claim 7 for the socket further including the protrusion from the fixing plate to::=, which: the screw is threaded to lock. By using at least 11. - a heat sink for the interface card, including a socket, having one side; a first heat sink, connecting the socket, and a plurality of heat sinks, the shrug # u The first heat dissipating system is configured by a plurality of rearrangements; the Μ's slabs are respectively inclined with respect to the side edges by a second heat dissipating body, and the first heat body is stacked to include a plurality of heat dissipating fins; and ..., i, the second dispersing body Η 夕 热 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The heat sinks for the interface card=heat sink described in Item 11 of the first claim are respectively opposite to the side edges. 13. The interface card is installed on the socket as described in claim U. And in the first month, the device is equipped with a fan of the side of the M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The heat sink for an interface card according to Item 13, wherein the fan is a centrifugal fan or an axial fan. 15. The heat sink for the interface card according to Item 13 of the claim, The utility model comprises a windshield connected to the socket, the windshield is a second heat dissipation of the star, and the heat dissipation under the field is connected to one of the windshields of the socket, the windshield covers the first body and the fan. The heat dissipating device for an interface card according to Item 15, wherein the hood is provided with a corresponding fan setting-side opening-air outlet. The money hole is connected to the hood 17. rrt: item 13 The heat dissipating device for the interface card, wherein the seat comprises a fixing plate and a guiding wire embedded in the fixing plate. The second heat dissipating body is provided for the interface as described in claim 17 The evaporating section embedded in the condensation section is sandwiched between the first heat sink and the heat conducting block. The thermal block used for the interface card as described in Item 17 of the research is - copper block or inscription block. U is set to [8]. The seat for use in claim 17 further includes a heat sink from the fixed plate, wherein the fan is provided with at least a screw and a column corresponding to the screw. The wind is screwed with a screw. The holes are respectively used by the heat pipe system as a heat pipe type as described in claim 11 of claim 11. The thermal device of the present invention, wherein the heat dissipation device is used in the item n, wherein the 12 M353628 heat pipe has a rectangular cross section. The heat dissipation μ of the interface card as recited in claim 17 further includes 23. 24. at least a heat pipe having a heated section sandwiched between the socket and the first heat sink. And a heat release section. The heat dissipating device for the interface card according to Item 23 of the claim, wherein the fixing plate is provided with the heat dissipating portion embedded in the assembly, and the heat receiving portion is attached to the heat conducting block. θ 25. =於介面卡之散熱裝 置,其中該 26. 如請求項第23項所述之用於介 導熱管之斷面係呈矩形。 政"、、聚置’其中§亥 13= heat sink for the interface card, wherein the section for the heat transfer tube as described in item 23 of the claim is rectangular. Politics ", gathers, where § hai 13
TW97219564U 2008-10-31 2008-10-31 Heat dissipation device for interface card TWM353628U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW97219564U TWM353628U (en) 2008-10-31 2008-10-31 Heat dissipation device for interface card
DE200920014131 DE202009014131U1 (en) 2008-10-31 2009-09-09 Heat sink for an interface card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97219564U TWM353628U (en) 2008-10-31 2008-10-31 Heat dissipation device for interface card

Publications (1)

Publication Number Publication Date
TWM353628U true TWM353628U (en) 2009-03-21

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TW (1) TWM353628U (en)

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CN107247493A (en) * 2017-06-06 2017-10-13 郑州云海信息技术有限公司 A kind of heat spreader structures for MINI PC products

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