1296366 ， 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別涉及一種電子_ ^ 熱裝置。 兀件散 【先前技術】 電腦中央處理器、北橋晶片、顯卡等高功率電子元件 在運行時會產生大量之熱量，這些熱量如果不能被有^地 政去，將直接導致溫度急劇上升，而嚴重影響到電子元件 之正常運行。爲此，需要散熱裝置來對這些電子元件進行 散熱，傳統之散熱裝置（例如，鋁擠型散熱器）通常包括 •基座以及若干平行間隔佈置於基座頂部之散熱鰭片；其 中，基座用來吸收電子元件釋放之熱量，散熱鰭^可以增 加該政熱裝置與空氣之接觸面積。運行過程中，基座吸收 ，子元件釋放之熱量，然後再將熱量傳導至散熱鰭片，由 籲散熱鰭片將熱量散發到環境空氣中。 ^上述散熱裝置可以較好地散發一些發熱量不是很高之 電子元件釋放之熱量，但隨著電子技術之發展，電子元件 f運仃速度越來越高，其在運行時産生之熱量也越來越 而現有技術中由於制程（例如铭擠制程）之限制，散 二，片之咼寬比相對較低，因此，在散熱裝置之外形尺寸 疋的情況下，散熱鰭片之數量較少，因而散熱裝置之散 "、、面積也較小，相應地，其散熱性能也相對較弱。 【發明内容】 6 1296366 :雲於此’要提供_種散熱裝置，可以在外形尺 、疋的It况下提冋散熱面積，從而提高散熱效率。 一種散熱裝置，包括一篆 器；所述第-散熱器包括一二熱 =及-該第-基座上之第一散孰4·=干間隔排列於 M m ο t 第一基座上之第二散熱鰭 H斤基座與所述第二基座並排拼接在—起 苐-散熱鰭片與所述第二散熱鰭片《錯佈置。 第一散熱鰭片與第二散熱籍片交錯佈置，可以在 一定的情況下有效地增加散熱面積， 從而楗而散熱裝置之散熱效率。 【實施方式】 圖1至圖4示出了本發明—個實施例中之散 其特別適合於爲電子元彳半「彳丨1 ^置 曰片鹿士(例如，電腦中央處理器、北橋 :片U卡）進行散熱。如圖所示，該散熱裝置工主要包 1〇|第第一散熱器1G、—第二散熱器2G以及兩將第—散教器 解散熱器20並排拼接在一起之拼接板30。可以理 、疋，爲增加散熱效果，可以在散執 部增加一風扇。 ……之頂部或侧 第一散熱器1〇採用導熱性能良好之 鋁）製成，其主要包括一第一基座u :，銅、 列於該第—基座^上之第—散切^及右干平行間隔排 辦3,, 第政熱鰭片12。第一基座11大 形板狀，其底部靠向側緣面m處凸設有—大體呈 !296366 直角二角形之第—導熱塊112。第 成有-橫向設置之第_凹入部113，第二 =部各形 有—螺孔114,用以供螺絲40螺合 入/ 13上開設 第—基座11 lil —— 肘斩接板30之一端與 1 口疋在一起。第一散熱鰭片12包 第-基座11正上方之第—本體部121以及 於該 121侧部朝第二散熱器20延伸出之第一擴展部： 125。另外，爲了使第一散熱器1〇與第二散熱器工 扯 配合，在第一基座11之兩端還分別向上延伸出一第一浐板 二第-撐板Π之側緣面131與第一基座u之側= 第二散熱器20也採用導熱性能良好之材料（例如 紹）製成，其主要包括一第二基座21以及若干平行間隔排 列於該第二基座21上之第二散熱鰭片22。第二基座u也 大體呈矩形板狀，其長度與第一基座^之長度相^等；第二 散熱鰭片22與第一散熱鰭片12排列之方向相同，但位置 錯開，亦即第二散熱鰭片22在散熱裝置丄中盘第一散熱鰭 片之間之第一間隙125相對。第二基座2；；底部靠^ 緣面211處也設置有一大體呈直角三角形之第二導熱塊 212,第二導熱塊212與第一導熱塊112配合，形成一矩形 導熱塊組合。第二基座21之兩端部各形成有一橫向設置^ 第二凹入部213,第二凹入部213上開設有一螺孔214，用 以供螺絲40螺合，將拼接板30之另一端與第二基座21固 定在一起。第二散熱鰭片22包括一位於該第二基座21正 1296366 上方之第二本體部221以及-從該第二本體22i側部朝第 -散熱器1〇延伸出之第二擴展部如，相鄰第二散熱縛片 22之第二本體部221之間形成第二間隙⑵。另外，爲了 使第二散熱器20與第-散熱器1G更好地配合，也在第二 基座之兩端還分別向上延伸出—第二擋板23，第二擔板 23之侧緣面231與第一散熱器1〇之第一擋心之 131對應。 ，#接板3G包括-用於將第—基座^與第二基座相 連之本體部3ί以及兩自該本體部31延伸出之定位臂32， 本體部3ί上開設有可供螺絲4〇穿置之通孔3ιι，定位臂 32上開設有可供扣具（未圖示”置之定位孔奶。 在散熱裝置！中，第一散熱鰭片12與第二散熱韓片Μ ，錯佈置’亦即第-散熱鰭片12之第一擴展部123伸入 到第-散熱鰭片22之第二間隙225中，而第二散埶鰭2 之第二擴展部223伸入到第一散熱鰭片12之第」間^a%2 2，以在散熱裝置i外形尺寸—定之情況下，達到增加散 ::面積之效果’從而可提高散熱效率，這一點對於成本比 :低廉之鋁擠型散熱器來說效果更爲明顯。本實施例中， 第'散熱鰭片12之第一擴展部123之橫向 片22之第二本體部™長度，第二散熱2 弟一擴展部223之橫向長度小於第一散熱鰭片12之第— 部121之橫向長度’以便側向佈置風扇時，可以加 二氣流動之紊流效果。 綜上所述，本發明符合發明專利要件，麦依法提出專 9 1296366 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明一個實施例中散熱裝置之組合圖 圖2係圖1所示散熱裝置之分解圖。 圖3係圖1所示散熱裝置底部朝上時之組合圖 圖4係圖1所示散熱裝置底部朝上時之分解圖 【主要元件符號說明】 散熱裝置 第一基座 11 第一導熱塊 112 螺孔 114 、 214 第一本體部 121 第一間隙 125 第二散熱器 20 卓—散熱鰭片 22 第二凹入部 213 第一擴展部 223 第一擔板 23 本體部 31 第一散熱器 10 側緣面 111 、 131 211 、 231 第一凹入部 113 第一散熱鰭片 12 第一擴展部 123 第一擋板 13 第二基座 21 第二導熱塊 212 第二本體部 221 第二間隙 225 拼接板 30 通孔 311 1296366 321 定位臂 32 定位孔 螺絲1296366, IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to an electronic _^ heat device. [Previous technology] High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If these heats cannot be removed, they will directly cause a sharp rise in temperature To the normal operation of electronic components. To this end, heat sinks are needed to dissipate these electronic components. Conventional heat sinks (eg, aluminum extruded heat sinks) typically include a base and a plurality of heat sink fins spaced parallel to the top of the base; It is used to absorb the heat released by the electronic components, and the heat dissipation fins can increase the contact area between the thermal device and the air. During operation, the susceptor absorbs the heat released by the sub-components and then conducts the heat to the fins, which dissipate the heat to the ambient air. ^ The above heat dissipating device can better dissipate heat released by electronic components that are not very hot, but with the development of electronic technology, the electronic component f is moving at a higher speed, and the heat generated during operation is more In the prior art, due to the limitation of the process (for example, the process of squeezing the process), the width ratio of the film to the film is relatively low. Therefore, in the case of a shape 疋 outside the heat sink, the number of heat dissipation fins is small. Therefore, the heat dissipation device has a small area and a small area, and accordingly, the heat dissipation performance is relatively weak. SUMMARY OF THE INVENTION 6 1296366: Clouds here to provide a kind of heat-dissipating device, which can improve the heat-dissipating area under the condition of the ruler and the It of the ,, thereby improving the heat dissipation efficiency. A heat dissipating device includes a buffer; the first heat sink includes a heat source and/or a first heat sink 4 on the first base is disposed on the first base of the M m ο t The second heat-dissipating fins are arranged side by side with the second base, and the heat-dissipating fins and the second heat-dissipating fins are misaligned. The first heat dissipating fins are arranged in a staggered manner with the second heat dissipating fins, so that the heat dissipating area can be effectively increased under certain conditions, thereby reducing the heat dissipating efficiency of the heat dissipating device. [Embodiment] Figs. 1 to 4 show that the embodiment of the present invention is particularly suitable for the electronic 彳 彳丨 ^ ^ ^ ^ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The chip U card) performs heat dissipation. As shown in the figure, the heat sink device mainly packs 1〇|the first heat sink 1G, the second heat sink 2G, and the two first-scatterer heat sinks 20 are arranged side by side. The splicing plate 30 can be rationally and sturdy. In order to increase the heat dissipation effect, a fan can be added to the stray portion. The top or side first heat sink 1 is made of aluminum with good thermal conductivity, and mainly includes one. The first pedestal u:, copper, the first-scattered and the right-hand parallel spaced row 3 on the first pedestal ^, the first heat fin 12. The first pedestal 11 has a large plate shape The bottom portion is convexly disposed toward the side edge surface m—the first heat-emitting block 112 having a right-angled shape of 296366 right-angled dihedron. The first---the laterally disposed first-recessed portion 113, and the second-shaped portion has a snail a hole 114 for screwing the screw 40 into the / 13 to open the first base 11 lil - one end of the elbow joint plate 30 and one port together. The heat sink fin 12 includes a first body portion 121 directly above the first base 11 and a first extension portion extending toward the second heat sink 20 at a side of the 121: 125. In addition, in order to make the first heat sink 1 Cooperating with the second heat sink, the side edges 131 of the first slab-and-slab slab and the side of the first pedestal u are respectively extended upward at the two ends of the first pedestal 11 respectively. The heat sink 20 is also made of a material having good thermal conductivity, such as a second base 21 and a plurality of second heat dissipation fins 22 arranged in parallel on the second base 21. The second base The seat u is also generally in the shape of a rectangular plate, and the length thereof is equal to the length of the first pedestal ^; the second heat-dissipating fins 22 are aligned in the same direction as the first heat-dissipating fins 12, but the positions are staggered, that is, the second heat-dissipating The fin 22 is opposite to the first gap 125 between the first heat sink fins of the heat sink 。. The second pedestal 2; the second bottom edge 211 is also provided with a second heat conducting block 212 having a substantially right triangle. The second heat conducting block 212 cooperates with the first heat conducting block 112 to form a rectangular heat conducting block combination. The second base 21 A second recessed portion 213 is formed on each of the two ends, and a screw hole 214 is defined in the second recessed portion 213 for screwing the screw 40 to fix the other end of the splice plate 30 to the second base 21 The second heat dissipation fin 22 includes a second body portion 221 located above the second base 21 and 1296366, and a second extension extending from the side of the second body 22i toward the first heat sink 1 For example, a second gap (2) is formed between the second body portions 221 of the adjacent second heat dissipation tabs 22. In addition, in order to better fit the second heat sink 20 and the first heat sink 1G, the second base is also used. The two ends of the first baffle 23 correspond to the first stop 131 of the first heat sink 1 . The #板3G includes a body portion 3ί for connecting the first base 2 to the second base and two positioning arms 32 extending from the body portion 31. The body portion 3 is provided with a screw 4 Through the through hole 3 ιι, the positioning arm 32 is provided with a positioning hole for the buckle (not shown). In the heat sink!, the first heat sink fin 12 and the second heat sink Μ, the wrong arrangement 'That is, the first expansion portion 123 of the first heat dissipation fin 12 protrudes into the second gap 225 of the first heat dissipation fin 22, and the second expansion portion 223 of the second heat dissipation fin 2 protrudes into the first heat dissipation portion The first portion of the fin 12 is ^a%2 2, in order to achieve the effect of increasing the dispersion:: area in the case of the outer dimensions of the heat sink i, thereby improving the heat dissipation efficiency, which is a cost ratio: low aluminum extrusion The effect of the heat sink is more obvious. In this embodiment, the length of the second body portion TM of the transverse piece 22 of the first expansion portion 123 of the first heat dissipation fin 12, and the lateral direction of the second heat dissipation portion 2 of the expansion portion 223 The length is smaller than the lateral length of the first portion 121 of the first heat dissipation fin 12 so that two fans can be added when the fan is disposed laterally In view of the above, the present invention is in accordance with the requirements of the invention patent, and the application of the invention is only in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art are skilled in the art. The equivalent modifications or variations made in the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a combination diagram of a heat dissipating device according to an embodiment of the present invention. FIG. Figure 3 is an exploded view of the heat sink shown in Figure 1 with the bottom facing up. Figure 4 is an exploded view of the heat sink with the bottom of the heat sink shown in Figure 1. [Main component symbol description] First base of the heat sink 11 first heat conducting block 112 screw hole 114, 214 first body portion 121 first gap 125 second heat sink 20 Zhuo - heat sink fin 22 second recess portion 213 first expansion portion 223 first support plate 23 body portion 31 a heat sink 10 side edge surface 111, 131 211, 231 first concave portion 113 first heat dissipation fin 12 first expansion portion 123 first shutter 13 second base 21 second heat conduction block 212 second body portion 221 Second gap 225 Splice plate 30 Through hole 311 1296366 321 Positioning arm 32 Positioning hole Screw
1111