TWM249104U - Heat dissipating device using heat pipe - Google Patents

Description

M249104

V. Creation Instructions (1) [Technical Field to which the New Type belongs]: This creation is about a heat dissipation device, a heat pipe cooling device to be used to generate heat from electronic components.

With the rapid and rapid development of the electronics industry, Liaobu has continued to increase the demand for industrial applications along with the eight guards. 戍 Circuit technology continues to violate the operating frequency of sub-components. The frequency of operation is getting higher and higher. However, the faster the processor runs, the more it is updated continuously. The heat accumulation will cause the heat generated by the electronic components to run within a period of time including performance degradation. Therefore, two = high, As a result, its heat is dissipated. At present, heat dissipation has become a problem that must be solved when it is introduced in a timely manner. On the other hand, the generation of high-speed processors is a general trend, and the space of computer systems is increasing. Increasingly denser parts are becoming smaller, which makes it more difficult to dissipate heat. Electronic components on circuit boards In the industry, electronic components such as central processing units ^ are used to help dissipate heat. As women's clothing becomes more and more supplementary in smaller and smaller spaces, it is necessary to increase the degree of heat generated by dissipating elements, small size and high heat dissipation efficiency. Because; now ^% ^ makes it have a high set of radiators using different principles continue to appear.目 ^ ’various structures and

Traditional radiators usually consist of a plurality of heat dissipation fins on a seat that is in contact with a heat source. The base and fins = the base and the extension are manufactured on the base. Simply using metal conduction to shape = σ-body can also dissipate heat. The fins are further dissipated to the surrounding environment, and the heat received is transferred to the lower edge, which gradually guides the elastase. Thanks from the cooling fins

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M249104 V. Creative Instructions (2) Low ’The heat exchange amount with the surrounding is small and the utilization rate is low. Under the metal thermal conductivity coefficient = = 利, half of the efficiency is increased, so the heat dissipation area is required to be increased :: To increase its heat dissipation energy is often accompanied by an increase in size. It is getting smaller today. The invention and application of more encrypted heat pipes around components around the processor make this kind of application win. " The structural design is flexible and changeable, which can improve the dispersion: j to k, which allows the radiator to obtain a higher heat dissipation capacity in a smaller volume, the utilization rate of each part so that the temperature remains unchanged during the transition between the two liquid states ° The heat pipe system uses the principle of liquid-in-gas to change the traditional radiator single = burial: it absorbs or emits a large amount of heat with limited efficiency. The heat pipe system is suitable for heat dissipation by metal thermal conduction. High heat transfer, good fluidity, and chemical properties. Low-pressure tube-shaped housings contain complaints such as water, ethanol, and acetone. However, during the transition between the gas and liquid states, the liquid material that absorbs Z is heated and cold heat is quickly transferred from one end of the pipe to the other, ^, a large amount of heat can pass through ordinary metals, and its thermal conductivity is roughly equivalent: In short, the thermal conductivity is far more than 100 times. The industry company connected one end of the heat pipe to the heat dissipation fins of aluminum, which constituted a heat sink. The heat sink was formed by the other end of the base and the base 4 combined with the multi-pipe to the heat dissipation fins and then emitted, and the seat absorbed the heat. Through heat, the overall heat dissipation efficiency of the radiator is greatly improved. Due to the fast liquid circulation speed, a large number of applications have been obtained. Q ’The current heat pipe cooling device This creation is to provide a heat dissipation device using the demon general [content] ..., g. Use a heat pipe to dissipate electronic components

The purpose of this creation is to provide a great heat pipe cooling device that can generate heat with a small volume. This creative heat pipe cooling device has a first heat conducting plate and a second heat conducting plate. The first heat conducting plate and the second heat conducting plate are arranged horizontally and opposite to each other at a certain distance, and a plurality of upright first heat dissipation fins are arranged therebetween. A plurality of second heat dissipation fins are provided on a surface of the second heat conducting plate facing away from the first heat conducting plate, and at least one heat pipe connects the first heat conducting plate and the second heat conducting plate.

Due to the high heat transfer performance of the heat pipe, the heat absorbed by the first heat conducting plate can be quickly transferred to the second heat conducting plate, and the first and second heat conducting plates conduct heat from both sides to the first heat sink fin, compared with traditional heat sinks. The heat conduction of the base to the heat dissipation fins is greatly enhanced, and the heat dissipation fins are evenly absorbed. The utilization rate of the heat dissipation fins is greatly improved, and the heat conduction fins are also provided on the surface of the second heat conduction plate facing away from the first heat conduction plate. , So that the heat conducted by the heat pipe can be quickly dissipated. The design of the creative structure makes the heat conduction performance of the heat pipe better, and can achieve efficient heat dissipation in a small volume. [Embodiment] This creative heat pipe heat sink is used to be installed on the surface of a heating electronic component (not shown) such as a central processing unit to assist heat dissipation, and includes a first heat conducting plate 10, a second heat conducting plate 20, two heat pipes 30, and a plurality of first , Second heat sink fin 40,

50 ° Please refer to the first and second figures at the same time. The first heat conducting plate 10 and the second heat conducting plate 20 are horizontal plates, which are parallel to each other and spaced a certain distance. The first heat conducting plate 10 is located below and its lower surface. 1 2 Contact with heat-generating electronic components to absorb heat. The opposite surfaces of the two heat conducting plates 10 and 20 are two parallel grooves corresponding to the upper surface 14 of the first heat conducting plate 10 and the lower surface 22 of the second heat conducting plate 20 respectively.

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The tube 30 is in the shape of [3], and the lower horizontal section 3 2 is placed on the first heat conducting plate 10 and welded to the first and second heat pipes 30 and the first guide frame structure. The first and second heat conducting plates 10, 20 The lower horizontal section 32 and the upper part are plural for the airflow to pass through the side-mounted fans (pictured heat effect. Each first plate 1 · 0, 2 0 groove 15 5, mouths 41, 42, the first scattered contact ^ —t *, The lower edges are held by 40 fins, and the edges of the first heat conducting plates 10, 41, 42 and the edges of the heat 41, 42 can form grooves 1, 5, 2. 5. Each heat 32 and a vertical connection 3 4 are The heat dissipation sections are respectively in the slots 15 and 25, and are connected by an integral body, so that the first and the second sheet 40 in a cymbal frame structure are formed by 200, which is perpendicular to the heat pipe 30, and the first fins 40 are interstitial. The fins 40 have equal air channels to enhance the first and second thermally conductive portions. Concave two thermally conductive plates 10 and 20 are formed at the edges 43 to allow adjacent first heat radiating fins 40 and the first to conduct. The above-mentioned notches can be contacted (the notches are folded at this time). The second heat-conducting plate 20 is shown on the table, and the second heat-dissipating fins 50 may be integrally extended, or may be added in advance. The lower horizontal section 34 is a heat absorbing section, and the upper horizontal section and the groove of the second heat conducting plate 20, the second heat conducting plate 10, 20 heat plate 10, and the second heat conducting plate heat radiating fin 40 are disposed between the frames. Each first radiating fin horizontal section 34, so that in the first air duct, can pass airflow through the radiating fin 40 corresponding to the protruding thermal fins 40 and the first heat fins 30 in the 25, corresponding to the first air duct. First, the fold has a fold 4 3, which folds a certain distance and increases the first 20 contact area to facilitate the heat pipe 30 not contacting. Of course, there are a plurality of first 24 which can be attached to the surface 30 of the heat pipe. Two heat radiating fins 50 are formed on the upper surface 24 of the second heat conducting plate 20 and are combined with the second heat conducting plate 20

In this creation, the heat-dissipating device for heat is absorbed by the first heat-conducting plate. Part of the heat is directly transferred to the first heat-dissipating fin 40, and part

Page 8 M249104 V. Creation instructions (5) The heat is conducted to the second heat-conducting plate 20 through the heat pipe 30. The second heat-conducting plate 20 conducts part of the heat to the first heat-dissipating fin 40 and the other part to the second heat-dissipation. Fin 50, because the heat transfer speed of the heat pipe 30 is extremely fast, the heat absorbed by the first heat conducting plate 10 can be quickly distributed to the second heat conducting plate 20, which is equivalent to the first heat conducting plate 10 and the second heat conducting plate. Both 20 are in contact with the heat source. More importantly, the upper and lower edges of the first heat sink fin 40 absorb heat at the same time to ensure that it is evenly heated and the utilization rate is greatly improved. At the same time, to improve the utilization rate of the second heat conduction plate 20 The upper surface 24 forms a second heat dissipation fin 50. Due to the use of the heat pipe 30 and the structural design of the overall heat dissipation device, it is possible to obtain the southern heat dissipation performance in a smaller volume. To sum up, this creation complies with the requirements for new patents, and a patent application was filed in accordance with the law. However, the above embodiments are merely preferred embodiments of the present writing, the case that whenever person familiar with the art, modifications or variations made equivalent Yuan Yi creative spirit of the present, are intended to be included within the scope of the patent.

M249104 Simple illustration of the drawing [Simple illustration of the drawing] The first drawing is a perspective view of the heat pipe cooling device of this creation. The second picture is a three-dimensional exploded view of the heat pipe cooling device of this creation. [Description of component symbols]

First-guide plate 10 lower surface 12 > 22 upper surface 14, 24 groove 15 > 25 second and second rail plate 20 holder / three tube 30 lower horizontal section 32 upper horizontal section 34 connection section 36 first heat radiation fin 40 Concave € 1 41 、 42 Flanged 43% Two Two Loose Rail Fins 50

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Claims (1)

M249104 6. Scope of patent application 1. A heat pipe heat sink device installed on the surface of a heating electronic component to assist its heat dissipation, including: two heat conducting plates parallel to each other and spaced a certain distance apart; at least one heat pipe connected to the two heat conducting plates; a plurality of parallel to each other The first heat radiating fins are formed between the two heat conducting plates and are thermally conductively connected to the two heat conducting plates respectively. The plurality of second heat radiating fins are formed on a surface of the at least one heat conducting plate facing away from the other heat conducting plate. 2. The heat pipe radiating device according to item 1 of the scope of patent application, wherein the opposite surfaces of the two heat conducting plates are provided with corresponding grooves. 3. The heat pipe radiating device as described in item 2 of the scope of patent application, wherein the heat pipe is 匚 -shaped and has two parallel sections, which are respectively accommodated in the grooves of the two heat conduction plates. The heat pipe cooling device described above, wherein the first heat dissipation fins are perpendicular to two parallel sections of the heat pipe. 5. The heat pipe radiating device according to item 1 of the scope of patent application, wherein the second radiating fins can be integrally extended from the heat conducting plate, or they can be formed in advance and then combined with them. 6. The heat pipe radiating device according to item 1 of the scope of patent application, wherein a contact edge of the first radiating fin and the two heat conducting plates is formed with a fold. 7. The heat pipe heat sink according to item 2 of the scope of patent application, wherein the first heat sink fin is provided with a notch corresponding to the groove position of the heat conducting plate. Page 11