1315176 竹年？月丨B修(/j正替換頁 九、發明說明： 【發明所屬之技術領域】 - 本發明涉及一種散熱裝置，尤係指一種用於電 子元件散熱之散熱裝置。 - 【先前技術】 電子元件（如中央處理器）運行時産生大量 熱，使其本身及系統溫度升高，繼而導致其運行性 能下降。爲確保電子元件能正常運行，通常於電子 β元件上安裝散熱裝置，排出其所産生之熱量。 傳統散熱裝置一般包括與電子元件接觸一底 ' 板、設於底板之複數散熱片及安裝於散熱片頂部之 ' 一風扇。電子元件運行産生之熱量被底板吸收後， 再通過散熱片散發到周圍環境以冷卻電子元件，風 扇運行産生氣流吹向散熱片加速熱量散發。傳統散 熱裝置一般具有較大表面積以便增大散熱片與氣 φ流間熱交換面積。爲提升散熱性能，常通過增加散 熱片尺寸來增加散熱裝置表面積。然而，增加散熱 片尺寸一方面增加散熱片重量，另一方面受到加工 工藝限制。 * 此外，傳統散熱裝置中由於散熱片頂部距離電 - 子元件較遠，電子元件産生之熱量經底板不能快速 由散熱片之底部傳向頂部，散熱片頂部利用率低， 影響散熱裝置整體散熱性能。 【發明内容】 1315176 \ηψ- ^ w I ΰ |·; _ v, * - - . 一— ^ ； 有鑒於此，有必要提供一種能快速^將熱量由散 熱片底部傳至其頂部之散熱裝置。 ' 本發明散熱裝置包括一底板，貼設於底板上複 -- 數散熱片，連接底板及散熱片頂部一熱管，貼設於 - 散熱片頂部一熱電冷卻元件及設於該熱電冷卻元 件上一鰭片組。 本發明散熱裝置中利用熱電冷卻元件製冷效 果，吸收散熱片頂部熱量，加快散熱片底部與頂部 ®間熱傳遞，有效提升散熱裝置整體散熱性能。 【實施方式】 請參閱第一圖至第三圖，本發明散熱裝置1包 ' 括一散熱器10、一風扇20、一冷卻體30及一風罩 40 ° 該散熱器10包括與一電子元件接觸之底板 1 2、設於底板1 2之複數散熱片1 4及熱連接底板 _ 12與散熱片14之三支熱管16。每一熱管16包括 一蒸發段及設置於散熱片14頂部一冷凝段。底板 12下表面設有容置熱管1 6蒸發段之三個狹長槽 (圖未示），散熱片14頂部設有容置熱管16冷凝 ' 段之溝槽（圖未示）。風扇20通過一風扇固定架 -22螺鎖於散熱器10 —側。 請參閱第四圖，該冷卻體30爲設置於散熱器 1 〇頂部一熱電製冷器，其底部與散熱片14頂部及 熱管16冷凝段熱接觸。該冷卻體30包括一熱電冷 7 I315176 , 的年$月丨日修(名土替换買 部元件3 2及垂直貼設I熱電冷卻牛3 ζ上表面之 ‘鳍片組3 4。該熱電冷卻元件3 2底部設有三條容置 熱官16冷凝段之凹槽320，一側邊設有用來與風 扇固定架22配合之一對螺孔326。該鰭片組34 — 對邊之邊緣靠近其底部分別設有與風罩40配合固 定之孔洞340。同時參閱第五圖，該熱電冷卻元件 32包括一冷端3 22及相對於冷端3 22之熱端3 24， °亥冷端322直接貼設於散熱片14頂部及熱管1 6冷 破段上表面。該熱電冷卻元件32係利用帕爾帖效 應來傳遞熱量之系統：當外部一電流通過熱電冷卻 凡件32時，冷端322吸收熱量傳向熱端324，於 熱電冷卻元件32兩端産生溫差。 該風罩4〇相對風扇20固定於散熱器1〇另一 側，该風罩40包括一長條狀本體42、沿本體c 兩端延伸之—對支撐部44及由本體42長邊、 底板12延伸且相對於本體42傾 σ 益士# ^ 保板46。 母一支撐邛44之末端設有對應於孔洞3叫 440。該支撐部44通過螺釘60順次穿過螺’、孔 孔洞340夾持散熱片14、鰭片組34 —側邊於^4〇、 同時本體340抵靠於該散熱片14侧邊。兮格、中， 引導由風扇20産生之氣流吹向底板12，二=板46 與底板12充分接觸。 胃強氣流 使用時，底板12吸收電子元件產 並通過埶管 1 & β & & & , <熟量， 14 、、s 16瘵發段將熱量傳遞到散熱只 …、乃14頂 8 1315176 叫年ί月丨日修(g)正替換頁 部。請參閱第五圖，該熱電冷卻元件32之冷端322 快速吸收散熱片14頂部及熱管1 6冷凝段之熱量， 同時傳至熱端324再通過其上鰭片組34散發到環 境中，加快底板12熱量經熱管16蒸發段傳遞到散 熱片14頂部再次被熱電冷卻元件3 2吸收，加速熱 管1 6傳熱效率，有效提高散熱片1 4頂部與底部間 熱傳效率。此外，風扇20産生之氣流吹過散熱片 1 4，加快熱量散發。1315176 Bamboo Year?丨 丨 B repair (/j is replacing page IX, invention description: [Technical field of invention] - The present invention relates to a heat sink device, in particular to a heat sink for heat dissipation of electronic components. - [Prior Art] Electronic components (such as the central processing unit) generates a lot of heat during operation, which causes itself and the temperature of the system to rise, which in turn leads to a decrease in its running performance. To ensure the normal operation of the electronic components, a heat sink is usually installed on the electronic beta component to discharge it. The conventional heat sink generally includes a bottom plate that is in contact with the electronic component, a plurality of heat sinks disposed on the bottom plate, and a fan mounted on the top of the heat sink. The heat generated by the operation of the electronic component is absorbed by the bottom plate and then passed through the heat sink. Dissipated to the surrounding environment to cool the electronic components, the fan operates to generate airflow to the heat sink to accelerate heat dissipation. Conventional heat sinks generally have a large surface area to increase the heat exchange area between the heat sink and the gas φ flow. Increase the size of the heat sink to increase the surface area of the heat sink. However, increase the size of the heat sink In addition, in the conventional heat sink, since the top of the heat sink is far from the electro-sub-element, the heat generated by the electronic component cannot be quickly transferred from the bottom of the heat sink to the top through the bottom plate. The heat sink top utilization is low, which affects the overall heat dissipation performance of the heat sink. [Abstract] 1315176 \ηψ- ^ w I ΰ |·; _ v, * - - . I - ^ ; In view of this, it is necessary to provide a kind of energy A heat sink that transfers heat from the bottom of the heat sink to the top of the heat sink. The heat sink of the present invention includes a bottom plate that is attached to the bottom plate and has a plurality of heat sinks attached to the bottom plate and a heat pipe at the top of the heat sink. A thermoelectric cooling element on the top of the heat sink and a fin set on the thermoelectric cooling element. The heat dissipating device of the invention utilizes the cooling effect of the thermoelectric cooling element, absorbs heat from the top of the heat sink, and accelerates heat transfer between the bottom of the heat sink and the top®, effectively Improve the overall heat dissipation performance of the heat sink. [Embodiment] Referring to the first to third figures, the heat sink 1 of the present invention includes a heat sink 10 The heat sink 10 includes a bottom plate 1 in contact with an electronic component, a plurality of heat sinks 14 disposed on the bottom plate 12, and a heat connection bottom plate _ 12 and a heat sink 14 Three heat pipes 16. Each heat pipe 16 includes an evaporation section and a condensation section disposed at the top of the heat sink 14. The lower surface of the bottom plate 12 is provided with three elongated slots (not shown) for accommodating the evaporation section of the heat pipe 16 (not shown), the heat sink The top of the 14 is provided with a groove for condensing the section of the heat pipe 16 (not shown). The fan 20 is screwed to the side of the heat sink 10 through a fan holder-22. Referring to the fourth figure, the heat sink 30 is provided. At the top of the radiator 1 is a thermoelectric cooler whose bottom is in thermal contact with the top of the fin 14 and the condensation section of the heat pipe 16. The heat sink 30 includes a thermoelectrically cooled 7 I315176, the annual cost of the replacement of the component 3 2 and the vertically attached I thermoelectrically cooled the upper surface of the '3' fin assembly 34. The thermoelectric cooling The bottom of the component 3 2 is provided with three recesses 320 for accommodating the heat 16 converging section, and one side is provided with a pair of screw holes 326 for engaging with the fan holder 22. The fin set 34 is adjacent to the edge of the edge The bottom portion is respectively provided with a hole 340 which is fixedly coupled with the hood 40. Referring to the fifth figure, the thermoelectric cooling element 32 includes a cold end 3 22 and a hot end 3 24 with respect to the cold end 3 22, and the cold end 322 is directly It is attached to the top of the heat sink 14 and the upper surface of the cold-break section of the heat pipe 16. The thermoelectric cooling element 32 is a system for transferring heat by using the Peltier effect: when an external current passes through the thermoelectric cooling device 32, the cold end 322 absorbs The heat is transmitted to the hot end 324 to generate a temperature difference across the thermoelectric cooling element 32. The hood 4 is fixed to the other side of the heat sink 1 opposite to the fan 20, and the hood 40 includes an elongated body 42 along the body c. The two ends extend to the support portion 44 and extend from the long side of the body 42 and the bottom plate 12 and are opposite The body 42 is inclined to σ 士 士 士 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 46 ^ ^ ^ 46 46 46 46 46 46 46 46 46 46 46 46 The fin assembly 34 has a side edge at the same time, and the body 340 abuts against the side of the heat sink 14. The airflow generated by the fan 20 is directed to the bottom plate 12, and the second plate 46 and the bottom plate 12 are sufficient. When the stomach is in a strong airflow, the bottom plate 12 absorbs the electronic components and passes the heat transfer through the manifolds 1 &&&&&& It is 14 top 8 1315176 called year ί 月丨日修 (g) is replacing the page section. Referring to the fifth figure, the cold end 322 of the thermoelectric cooling element 32 quickly absorbs the heat of the top of the heat sink 14 and the condensation section of the heat pipe 16 At the same time, it is transmitted to the hot end 324 and then radiated to the environment through the upper fin group 34, and the heat of the bottom plate 12 is transferred to the top of the heat sink 14 through the evaporation section of the heat pipe 16 to be absorbed by the thermoelectric cooling element 32, thereby accelerating the heat transfer efficiency of the heat pipe 16. , effectively improve the heat transfer efficiency between the top and bottom of the fins 14. In addition, the fan 20 is generated The airflow blows through the heat sink 1 4 to accelerate heat dissipation.
本發明散熱裝置中熱電冷卻元件 32之冷端 322吸收散熱片14頂部之熱量並傳到熱端324，將 散熱片14頂部熱量快速轉移，加快散熱片14底部 與頂部之間及熱管1 6蒸發段與冷凝段之間熱傳遞 速度，提高散熱器10散熱性能。In the heat dissipating device of the present invention, the cold end 322 of the thermoelectric cooling element 32 absorbs heat from the top of the heat sink 14 and transmits it to the hot end 324, rapidly transferring heat from the top of the heat sink 14, accelerating evaporation between the bottom and the top of the heat sink 14 and the heat pipe 16 The heat transfer speed between the segment and the condensation section improves the heat dissipation performance of the heat sink 10.
綜上所述，本發明符合發明專利要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 第一圖係本發明散熱裝置之立體圖。 第二圖係第一圖另一角度之立體圖。 第三圖係第二圖之分解圖。 第四圖係第三圖中冷卻體與風罩之分解圖。 9 1315176 丄. 第五圖係第四圖中冷卻體之侧視圖。In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective view of a heat sink of the present invention. The second figure is a perspective view of another angle of the first figure. The third figure is an exploded view of the second figure. The fourth figure is an exploded view of the cooling body and the hood in the third figure. 9 1315176 丄. The fifth figure is a side view of the heat sink in the fourth figure.
【主要元件符號說明】 散熱器 10 散熱片 14 熱管 16 風扇 20 風扇固定 架 22 冷卻體 30 熱電冷卻 元件 32 鰭片組 34 凹槽 320 風罩 40 本體 42 支撐部 44 擋板 46 底板 12 冷端 322 熱端 324 螺孑L 326、 440孑L洞 340 螺釘 60[Main component symbol description] Heat sink 10 Heat sink 14 Heat pipe 16 Fan 20 Fan holder 22 Cooling body 30 Thermoelectric cooling element 32 Fin set 34 Groove 320 Windshield 40 Body 42 Support 44 Baffle 46 Base plate 12 Cold end 322 Hot end 324 Thread L 326, 440 孑L hole 340 Screw 60
1010