JP2011002175A - Cooling system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling system capable of improving heat radiation characteristics of a heating apparatus with a large calorific value by reducing the deviation of calorific values between heating apparatuses, and using a heat radiation capacity of the heating apparatus with a small calorific value.SOLUTION: The cooling system cools a heating system having a plurality of heat receiving plates receiving heat from a heating element. The cooling system includes: a heat pipe for heat radiation having an evaporating part and a condensing part on respective heat receiving plates of the plurality of heat receiving plates, and transporting heat from the respective heat receiving plates to the outside of the heating system; and a heat exchanger transporting heat between the plurality of heat receiving plates aside from the heat pipe for heat radiation.

Description

  The present invention relates to a cooling system for cooling a heating element, in particular, the heating element is brought into close contact with a heat receiving part of a heat pipe to transfer heat, and the fins of the heat pipe radiating part are air-cooled to indirectly cool the heating element. The present invention relates to a cooling system for cooling.

  There is a heat sink as a cooling device for cooling a heating element, and a heat sink that transports heat to the heat sink has been proposed. In a heat sink using a conventional heat pipe, the heat pipe is embedded in the base surface of the heat sink provided with fins, and cooling is performed by thermally diffusing the heat of a plurality of heating elements (for example, Patent Document 1 and Patent Document 2). ).

JP 2000-269676 (page 7, FIG. 1) Japanese Patent Laying-Open No. 2005-76979 (page 4, FIG. 1)

  In a heat sink using a conventional heat pipe, heat is diffused by a heat pipe embedded in a base plate portion and cooled by fins. In such a cooling device, heat is diffused by a heat sink in each heat generating device, and sufficient cooling cannot be performed for heat generation exceeding the cooling capacity of the heat generating device alone.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a cooling system capable of cooling more than the limited cooling capacity of a single heating device.

  The cooling system according to the present invention is a cooling system for cooling a heat generating system having a plurality of heat receiving plates that receive heat from the heat generating element, and has an evaporation section and a condensing section on each of the heat receiving plates of the plurality of heat receiving plates. Each of the heat receiving plates includes a heat dissipating heat pipe for transporting heat from the heat generating system to the outside, and further includes a heat exchanger for transporting heat between the plurality of heat receiving plates.

  According to the present invention, heat is transferred from a heat receiving plate that receives heat from a heating element with a large amount of heat generation to a heat receiving plate that receives heat from a heating element with a small amount of heat generation, and the heat dissipation plate provided in the heat receiving plate with a small amount of heat reception. By utilizing the heat transport by the heat pipe for use, it is possible to obtain a cooling system with improved heat dissipation characteristics in the heat receiving plate having a large heat receiving amount.

It is a perspective view which shows the structure of the cooling system by Embodiment 1 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 1 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 2 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 3 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 4 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 5 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 6 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 7 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 8 of this invention. It is the rear view and side view which show the structure of the other cooling system by Embodiment 8 of this invention. It is the rear view and side view which show the structure of the other cooling system by Embodiment 9 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 10 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 11 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 12 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 13 of this invention. It is the rear view and side view which show the structure of the other cooling system by Embodiment 13 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 14 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 15 of this invention. It is the rear view and side view which show the structure of the cooling system by Embodiment 16 of this invention.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a configuration of a cooling system according to Embodiment 1 of the present invention. FIG. 2 is a diagram showing the configuration of the cooling system according to the first embodiment of the present invention, the left is a rear view, and the right is a side view (also in the following embodiments, the left is the same as FIG. Rear view, right side is side view). As the heat generating devices, two electronic devices 1A and 1B are provided. The electronic devices 1A and 1B are devices for electronically controlling a machine tool, for example. The electronic devices 1 </ b> A and 1 </ b> B have a housing 2, and a heat receiving plate 3 is disposed on the back surface of the housing 2. As the heat receiving plate 3, a metal plate such as copper or aluminum which is a good heat conductive material is used. The housing 2 has a heating element 10 such as a power semiconductor, for example, and the heating element 10 is disposed so as to be in close contact with the heat receiving plate 3 via a heat conductive material 13.

  Each of the heat receiving plates 3 of the electronic devices 1A and 1B includes a heat radiating heat pipe 4, and the evaporating portion 5 of the heat radiating heat pipe 4 is disposed so as to be in close contact with the heat receiving surface of the heat receiving plate 3. 10 is in close contact with the heat conductive material 13 and the heat receiving plate 3. The thermally conductive material 13 is, for example, thermal grease or a thermal sheet.

The heat dissipating heat pipe 4 is bent into a substantially L shape, and the condensing part 6 is located above the top plate of the casing 2 (so as to be above the direction of gravity), that is, above the heat receiving plate 3. And it is arranged to extend in the horizontal direction. A plurality of plate-like fins 7 are provided in the condensing part 6 of the heat radiating heat pipe 4 in parallel to the vertical direction with respect to gravity. An oil pan 12 is provided on the top plate of the housing 2, that is, below the condensing part 6 and the fins 7 of the heat-radiating heat pipe 4.

  A heat exchanger 8 is in close contact with a surface of the heat receiving plate 3 on the opposite side of the heat receiving plate 3 attached to the heat receiving plate 3 on the back of the electronic devices 1A and 1B with a screw 11 via a heat conductive material 13, and the electronic device 1A. The heat receiving plate 3 and the heat receiving plate 3 of 1B are in a thermally bonded state. The heat exchanger 8 is made of, for example, a metal plate such as copper or aluminum, which is a good heat conductive material, and one or more heat exchange heat pipes 9 are provided on the metal plate in a substantially horizontal direction. The heat exchanger 8 may be provided with a groove for attaching the heat exchange heat pipe 9. The heat exchange heat pipe 9 may be flattened in order to increase the heat receiving area. Further, the heat exchange heat pipe 9 is not limited to being substantially horizontal, and may be disposed obliquely. That is, the heat transport direction of the heat radiating heat pipe 4 and the heat transport direction in the heat exchanger 8 are different from each other. In the case of FIGS. A cooling liquid is sealed inside the heat dissipating heat pipe 4 and the heat exchanging heat pipe 9 and kept in a vacuum state. For example, water is used as the refrigerant.

  According to the electronic devices 1 </ b> A and 1 </ b> B configured as described above, the heat of the heating element 10 moves to the evaporation unit 5 of the heat pipe 4 for heat dissipation. The cooling liquid sealed inside by the heat transmitted to the evaporation unit 5 boils and becomes steam. The steam moves to the condensing part 6 of the heat radiating heat pipe 4 and air-cools the fins 7, so that the steam condenses into a liquid and returns to the evaporating part 5. That is, the heat generating member 10 attached to the heat receiving plate 3 is cooled by the heat radiation heat pipe 4 transporting the heat of the heat generating member 10 into the air through the fins 7.

  Here, when the heat generation amounts of the heating elements 10 of the electronic devices 1A and 1B are different, the heat exchange heat pipe 9 of the heat exchanger 8 operates. For example, when the heat generation amount of the heating element 10 of the electronic device 1A is larger than the heat generation amount of the heating element 10 of the electronic device 1B, the heat exchange heat pipe 9 is in close contact with the heat receiving plate 3 of the electronic device 1A. The part which becomes is an evaporation part, and a refrigerant | coolant evaporates by the heat input from the heat generating body 10 of 1 A of electronic devices. The steam moves to the electronic equipment 1B side of the heat exchanging heat pipe 9, and the portion of the heat exchanging heat pipe 9 that is in close contact with the heat receiving plate 3 of the electronic equipment 1B becomes a condensing part to condense the vapor. Heat moves to the heat radiating heat pipe 4. As described above, when the heat generation amounts are different, the heat of the heat receiving plate 3 provided in the electronic device 1A having a large heat generation amount by the heat exchanger 8 is transported to the heat receiving plate 3 provided in the electronic device 1B having a small heat generation amount. Therefore, the fins 7 provided in the electronic device 1B that generates a small amount of heat are effectively used, and the heat dissipation characteristics can be improved as compared with the case where the electronic device 1A is used alone.

  As described above, each of the electronic device 1A and the electronic device 1B is provided with a heat receiving plate that receives heat from the heating element, and each heat receiving plate is provided with a heat dissipation heat pipe, and the heat from the heat receiving plate is radiated into the air. In addition, a heat exchanger for transporting heat between the heat receiving plates was provided. With this configuration, when the heat generation amount of each electronic device is different, heat dissipation from the electronic device having a large heat generation amount to the air is provided in a heat dissipation heat pipe disposed on the heat receiving plate of the electronic device having a large heat generation amount. The amount of heat generated is not only from the fins, but also from the fins provided on the heat-dissipating heat pipes arranged on the heat receiving plate of the electronic device with a small amount of heat generation through the heat receiving plate of the electronic device with a small amount of heat generation. The heat dissipation characteristics are improved as compared with the case of using a large electronic device alone.

  Moreover, in this Embodiment, since the fin 7 is arrange | positioned above the top plate of the electronic devices 1A and 1B, since the front opening below the fin 7 is wide and the amount of inflow air increases, it is possible to improve the heat dissipation characteristics. It becomes possible.

Here, numerical examples are shown. As a result of operating the electronic device 1A as a device with a heating element having a heating value of 500 W and the electronic device 1B as a device with a heating element having a heat generation amount of 100 W, the following results were obtained. When the heat exchanger 8 was not provided, the temperature rise of the heating element of the electronic device 1A was 73 ° C., and the temperature rise of the heating element of the electronic device 1B was 17 ° C. However, when the heat exchanger 8 was provided, 50 ° It can be seen that the temperature rise of the heating element of the electronic apparatus 1A is reduced by 20 ° C. or more by providing the heat exchanger 8, and the cooling capacity is greatly improved.

  In the first embodiment, an oil pan 12 is provided above the housing 2 and below the fins 7. When used in a factory or the like, oil mist contained in the air adheres to the fins 7 and flows down, so that oil can be collected by the oil pan 12 and prevented from adhering to the electronic devices 1A and 1B. Although an example in which an oil pan is provided is shown here, it goes without saying that the oil pan 12 is not necessary when used in an environment where oil mist is not contained in the air.

  In addition, here, the heat pipe for heat dissipation has been described with respect to the heat pipe provided with the air-cooling fins 7 in the condensing unit 6. However, the heat dissipating heat pipe is not limited to the structure for radiating heat to the air. The heat-dissipating heat pipe may be configured to transport heat from the heat receiving plate 3 to a portion other than the heat-generating device main body such as an electronic device.

Embodiment 2. FIG.
FIG. 3 is a block diagram showing a cooling system according to Embodiment 2 of the present invention. 3, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts. As shown in FIG. 3, in the cooling system of the second embodiment, the evaporation portion of the heat dissipating heat pipe 4 of the first embodiment is a flattened evaporation portion 14 having an increased width. According to such a configuration, the contact thermal resistance between the evaporating portion 14 of the heat radiating heat pipe 4 and the heating element 10 is reduced, and the heat radiation characteristics can be improved.

Embodiment 3 FIG.
FIG. 4 is a block diagram of a cooling system according to Embodiment 3 of the present invention. 4, the same reference numerals as those in FIGS. 1, 2, and 3 denote the same or corresponding parts. In the first and second embodiments, there is one heat exchanger 8, but in the cooling system of the third embodiment, two heat exchangers 8 are installed as shown in FIG. According to such a configuration, the heat resistance in the heat exchanger 8 between the electronic devices 1A and 1B can be reduced even if the heating elements 10 of the electronic devices 1A and 1B are respectively arranged above and below, and the heat dissipation characteristics Will improve.

  Note that three or more heat exchangers may be installed because the heat exchangers may be installed corresponding to the arrangement of the heating elements 10. Further, one large heat exchanger having a large vertical dimension may be installed.

Embodiment 4 FIG.
FIG. 5 is a block diagram of a cooling system according to Embodiment 4 of the present invention. 5, the same reference numerals as those in FIGS. 1, 2, and 3 denote the same or corresponding parts. As shown in FIG. 5, the cooling system of the fourth embodiment includes three electronic devices. The heat exchanger 8 heats the heat receiving bodies 3 of the electronic devices 1A, 1B, and 1C by the heat exchanger 8. Are joined together. According to such a configuration, even when three electronic devices are installed, heat can be transferred between the electronic devices 1A, 1B, and 1C, and heat dissipation characteristics can be improved. In addition, it is good also as a structure which joined 4 or more electronic devices with the heat exchanger 8. FIG.

  Here, if the height dimension of all the electronic devices is made the same, the heat receiving plates of all the electronic devices arranged by the heat exchanger 8 according to the number of the arranged electronic devices can be thermally connected. That is, according to the present invention, one electronic device is unitized as one unit of the heat generating device, and there is an effect that a flexible configuration can be realized as a cooling system.

  Further, when an electronic device having a very large heat generation amount is used, the housing 2 without the heating element 10 may be arranged. For example, when the calorific values of the electronic devices 1A and 1B are large, a heat dissipating plate 3 having no heat generating element 10 and a heat dissipating heat pipe 4 having fins 7 are disposed in the housing 2 instead of the electronic device 1C. Then, by connecting the electronic devices 1A and 1B with the heat exchanger 8, it is possible to cool the electronic devices 1A and 1B having a large heat generation amount.

Embodiment 5 FIG.
FIG. 6 is a block diagram of a cooling system according to Embodiment 5 of the present invention. 6, the same reference numerals as those in FIGS. 1, 2, and 3 indicate the same or corresponding parts. As shown in FIG. 6, the cooling system of the fifth embodiment is provided with heat radiation fins 15 that are perpendicular to the heat exchanger 8 and parallel to the vertical direction. According to such a configuration, it is possible to radiate heat from the heat exchanger 8, and it is possible to improve the overall radiating characteristics. In a cold region, the heat pipe may be frozen at the start of operation, and heat can be radiated by the heat radiating fins 15 of the heat exchanger 8 even when the fins 7 above the top plate cannot be used.

Embodiment 6 FIG.
FIG. 7 is a block diagram of a cooling system according to Embodiment 6 of the present invention. 7, the same reference numerals as those in FIGS. 1, 2, and 3 denote the same or corresponding parts. As shown in FIG. 7, in the cooling system of the sixth embodiment, the heat receiving plate 3 is arranged so as to straddle the electronic devices 1A, 1B, 1C arranged in the vertical direction, and the surface opposite to the heat receiving surface of the heat receiving plate 3 Is provided with a heat exchanger 8. Here, each heat receiving plate 3 has the heat pipe 4 for heat dissipation in which the fin 7 was provided in the condensation part 6, respectively.
Although all the embodiments of the present invention include a plurality of heat receiving plates, in the present invention, a group of devices including a plurality of heat receiving plates that receive heat from the heating elements is also referred to as a heat generation system.

  According to such a configuration, when a plurality of electronic devices are arranged in the vertical direction, for example, in cooling a server rack or the like, the deviation of the amount of heat generated between the electronic devices 1A, 1B, and 1C is determined by the heat dissipation heat of the heat receiving plate 3. It becomes possible to improve the heat dissipation characteristics by relaxing with the pipe 4. In addition, when the amount of heat received by each heat receiving plate 3 is different, by providing the heat exchanger 8, the deviation of the amount of heat radiation between the heat radiation heat pipes 4 can be reduced, and the heat radiation characteristics can be improved. That is, when each heat receiving plate 3 receives a different amount of heat from the heat generating body 10, heat is transported between the heat receiving plates 3 by the heat exchanger 8, and the heat from the heat receiving plate 3 that receives a large amount of heat from the heat receiving body 10 generates heat. Since heat is effectively radiated through the heat radiating heat pipe 4 provided on the heat receiving plate 3 that receives a small amount of heat from the body 10, the heat radiation characteristics are improved.

Embodiment 7 FIG.
FIG. 8 is a block diagram of a cooling system according to Embodiment 7 of the present invention. 8, the same reference numerals as those in FIGS. 1, 2, and 3 denote the same or corresponding parts. As shown in FIG. 8, in the cooling system of the seventh embodiment, the heat exchanger for heat exchange bent twice as a substantially Z-shape as a heat exchanger for transporting heat between the two heat receiving plates 3. 20 is used. The substantially Z-shaped heat exchanging heat pipe 20 as a heat exchanger does not use a metal plate as in the previous embodiments, and the heat receiving plate 3 of each of the electronic devices 1A and 1B has a heat conductive material. The fixing plate 21 and the screw 11 are in direct contact with each other through 13. At this time, a groove may be provided in the heat exchange heat pipe 20 mounting portion of the heat receiving plate 3. Note that the heat exchange heat pipe may be a straight heat pipe attached obliquely instead of a substantially Z-shaped heat pipe.

According to such a configuration, the heat exchange heat pipe 20 operates when the heat generation amounts of the heating elements 10 of the electronic devices 1A and 1B are different. For example, when the heating element 10 of the electronic device 1A generates a larger amount of heat, the portion of the heat exchange heat pipe 20 that is in close contact with the heat receiving plate 3 of the electronic device 1A becomes an evaporation section, and the heat generation of the electronic device 1A. The refrigerant evaporates due to heat input from the body 10. The steam condenses at the portion of the heat exchange heat pipe 20 that is in close contact with the heat receiving plate 3 of the electronic device 1B, and the heat moves to the heat radiating heat pipe 4 provided on the heat receiving plate 3 of the electronic device 1B. As described above, when the calorific values are different, the heat of the electronic device 1A can be transferred to the electronic device 1B by the substantially Z-shaped heat pipe 20 as a heat exchanger. By effectively using the fins 1B, it is possible to improve the heat dissipation characteristics as compared with the case where the electronic device 1A is used alone.

Embodiment 8 FIG.
9 and 10 are configuration diagrams of a cooling system according to an eighth embodiment of the present invention. 9 and 10, the same reference numerals as those in FIGS. 1, 2, 3 and 8 denote the same or corresponding parts. As shown in FIG. 9, in the cooling system of the eighth embodiment, the electronic devices 1A and 1B are thermally connected by intersecting two heat pipes for heat exchange 202 having a substantially Z-shape. According to such a configuration, the amount of heat transported by the two substantially Z-shaped heat exchange heat pipes 20 increases, and the heat dissipation characteristics can be improved. Further, in the case of the seventh embodiment shown in FIG. 8, when the heat generation amount of the electronic device 1B is larger, the heat transfer heat pipe 20 having a substantially Z shape has an evaporation portion on the upper side and the amount of heat transfer is reduced. As shown in FIG. 9, two substantially Z-shaped heat exchange heat pipes 20 are arranged so that either of the heat generation amounts of the electronic devices 1A and 1B is large. It is possible to use the lower part as an evaporation unit, and the amount of heat transfer can be increased.

  Further, as shown in FIG. 10, not only two electronic devices but also three or more electronic devices may be connected by two approximately Z-shaped heat exchange heat pipes 20.

Embodiment 9 FIG.
FIG. 11 is a configuration diagram of a cooling system according to the ninth embodiment of the present invention. 11, the same reference numerals as those in FIGS. 1, 2, 3 and 8 denote the same or corresponding parts. As shown in FIG. 11, the cooling system of the ninth embodiment connects a heat receiving plate 3 between not only electronic devices but also remote electronic devices to heat transfer plates 20 that are substantially Z-shaped. We are exchanging. According to such a configuration, a plurality of substantially Z-shaped heat exchanging heat pipes 20 are combined in accordance with the deviation of the calorific value, even if an electronic device having a large calorific value and a small electronic device are installed apart from each other. Thus, it is possible to cool efficiently. Note that the cooling performance can be improved by combining a plurality of substantially Z-shaped heat exchange heat pipes 20 even when there are four or more electronic devices, not limited to three electronic devices.

Embodiment 10 FIG.
FIG. 12 is a configuration diagram of a cooling system according to the tenth embodiment of the present invention. 12, the same reference numerals as those in FIGS. 1, 2, 3 and 8 denote the same or corresponding parts. As shown in FIG. 12, the cooling system of the tenth embodiment uses a substantially U-shaped heat exchange heat pipe 22. The substantially U-shaped heat exchange heat pipe 22 is in close contact with the heat receiving plate 3 of the electronic devices 1 </ b> A and 1 </ b> B with the fixing plate 21 and the screw 11 via the heat conductive material 13. At this time, a groove may be provided in the attachment portion of the heat pipe 22 for heat exchange of the substantially U shape of the heat receiving plate 3. According to such a configuration, when the heating element 10 of the electronic device 1A has a larger heat generation amount, the heat generating plate 10 of the substantially U-shaped heat exchange heat pipe 22 is in close contact with the heat receiving plate 3 of the electronic device 1A. The portion becomes an evaporation portion, and the refrigerant evaporates due to heat input from the heating element 10 of the electronic apparatus 1A. The steam condenses at a portion of the substantially U-shaped heat exchange heat pipe 22 that is in close contact with the heat receiving plate 3 of the electronic device 1B, and heat is transferred to the heat radiating heat pipe 4 of the electronic device 1B. On the contrary, when the heating element 10 of the electronic device 1B generates a larger amount of heat, the portion of the substantially U-shaped heat exchanging heat pipe 22 that is in close contact with the heat receiving plate 3 of the electronic device 1B becomes the evaporation portion. The refrigerant evaporates due to heat input from the heating element 10 of the electronic device 1B. The steam condenses at the portion of the substantially U-shaped heat exchange heat pipe 22 that is in close contact with the heat receiving plate 3 of the electronic device 1A, and the heat moves to the heat radiation heat pipe 4 of the electronic device 1A. As described above, when the heat generation amount is different, the heat generating plate of the electronic device having a large heat generation amount is passed through the heat receiving plate from the heat receiving plate 3 in close contact with the heat generating member of the electronic device having the small heat generation amount to the heat radiating heat pipe 4. Since heat can be transferred, the heat dissipation characteristics can be improved more effectively than when a single electronic device with a large amount of heat generation is used by effectively utilizing the fins 7 provided in the electronic device with a small amount of heat generation. Is possible.

Embodiment 11 FIG.
FIG. 13 is a configuration diagram of a cooling system according to the eleventh embodiment of the present invention. 13, the same reference numerals as those in FIGS. 1, 2, and 3 denote the same or corresponding parts. As shown in FIG. 13, the cooling system of the eleventh embodiment is provided with large fins 16 so as to connect the condensing portions 6 of the heat pipes 4 for heat radiation of the electronic devices 1A, 1B, and 1C. According to such a configuration, since the fins common to the electronic devices 1A, 1B, and 1C are used, it is possible to perform heat equalization between the condensing portions 6 of the heat dissipating heat pipes and to improve the heat dissipating characteristics. . Further, when there is a margin in the space on both sides of the large fin 16, the large fin 16 can be extended to the left and right, and the heat dissipation characteristics can be further improved.

Embodiment 12 FIG.
FIG. 14 is a configuration diagram of a cooling system according to Embodiment 12 of the present invention. 14, the same reference numerals as those in FIGS. 1, 2, and 3 indicate the same or corresponding parts. As shown in FIG. 14, the cooling system of the twelfth embodiment includes two or more heat radiation heat pipes 4 in each heat receiving plate 3, and a condensing part of the heat radiation heat pipe 4 provided in each heat receiving plate 3. Are arranged so that their height positions are different. Furthermore, the heat-dissipating heat pipes 4 of different heat receiving plates are arranged so that the height positions of the respective condensing portions are substantially the same. Since the fins are provided in the condensing unit 6 on that, the fins form fin groups having different heights. That is, the lower large fins 17 are provided in the lower condensation unit 6 to form a lower fin group, and the upper large fins 18 are provided in the upper condensation unit 6 to form an upper fin group. A partition plate 19 is provided between the lower fin group and the upper fin group. Note that the number of fin groups is not limited to two but may be three or more.

  According to such a configuration, when the heat generation amount is large and a desired heat dissipation characteristic cannot be obtained with a single-stage fin, the cooling performance is improved by increasing the number of fin stages, and heat dissipation is possible even when the heat generation amount is large. It becomes. In addition, it is not essential to provide the partition plate 19, but by providing the partition plate 19, it is possible to prevent the air that has been used for cooling the lower fin 17 from flowing into the air intake portion of the upper fin 18 that has been heated, A decrease in the cooling performance of the upper large fin 18 can be prevented.

Embodiment 13 FIG.
15 and 16 are configuration diagrams of a cooling system according to Embodiment 13 of the present invention. 15 and 16, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts. As shown in FIG. 15, the cooling system of the thirteenth embodiment divides the heat dissipation heat pipe into a heat receiving side heat pipe 23 and a heat dissipation side heat pipe 26. The evaporation part 24 of the heat receiving side heat pipe is disposed so as to be in close contact with the heat receiving surface of the heat receiving plate 3, and is also in close contact with the heating element 10 via the heat conductive material 13. Further, the condensing part 25 of the heat receiving side heat pipe is also arranged so as to be in close contact with the heat receiving plate 3. The condensing part 25 of the heat receiving heat pipe is in close contact with the evaporation part 27 of the heat radiation side heat pipe through the heat conductive material 13. Further, the evaporation portion 27 of the heat radiation side heat pipe is fixed so as to be in close contact with the heat radiation side heat pipe connection plate 29, and the heat receiving plate 3 and the heat radiation side heat pipe connection plate 29 are closely fixed via the heat conductive material 13. It is configured. The condensation part 28 of the heat radiation side heat pipe is provided on the top plates of the electronic devices 1A and 1B, and a plurality of fins 7 are provided.

According to such a configuration, it becomes possible to divide the heat dissipating part in which the casings 2 and the fins 7 of the electronic devices 1A and 1B are installed, and the installation on the devices becomes easy. Further, since the heat radiating part is relatively large, it can be easily transported by dividing it from the casing part.
Further, as shown in FIG. 16, the heat receiving side heat pipe connection plate 30 is brought into close contact with the heat receiving side heat pipe condensing unit 25 separately from the heat receiving plate 3, and the heat receiving side heat pipe connection plate 30 is placed on the top plate of the housing 2. It is good also as a structure which is closely attached to the heat radiating side heat pipe connection plate 29 through the heat conductive material 13. According to this configuration, the contact area between the heat receiving side heat pipe condensing unit 25 and the heat radiating side heat pipe evaporating unit 27 is enlarged, and the thermal resistance at the connection portion can be reduced.

Embodiment 14 FIG.
FIG. 17 is a configuration diagram of a cooling system according to Embodiment 14 of the present invention. 17, the same reference numerals as those in FIGS. 1, 2, and 15 indicate the same or corresponding parts. As shown in FIG. 17, in the cooling system of the fourteenth embodiment, the heat exchange plate 31 is arranged so as to straddle the heat receiving side heat pipe condensing parts 25 of the electronic devices 1A and 1B. A heat exchange heat pipe 32 is arranged in the horizontal direction on the heat exchange plate 31. The heat exchanging plate 31 is extended to one or both, and in the extended portion, the heat exchanging heat pipe 32 and the heat radiating side heat pipe connecting plate 29 are arranged so as to be in close contact with each other through the heat conductive material 13. Similarly to the thirteenth embodiment, the heat radiation side heat pipe 26 and the fins 7 are arranged on the heat radiation side heat pipe connection plate.

  According to such a configuration, the heat radiation side heat pipe 26 can be added to the sides of the electronic devices 1A and 1B, and the heat radiation characteristics can be improved by expanding the heat radiation area.

Embodiment 15 FIG.
FIG. 18 is a block diagram of a cooling system according to Embodiment 15 of the present invention. 18, the same reference numerals as those in FIGS. 1, 2, and 16 denote the same or corresponding parts. As shown in FIG. 18, in the cooling system of the fifteenth embodiment, electronic devices 1 </ b> A and 1 </ b> B are arranged inside a control panel 33. The heat receiving plate 3 is disposed outside the back surface of the control panel, and the inside and outside air of the control panel are sealed. The heat receiving side heat pipe connection plate 30 is disposed on the top plate of the control panel 33 and is in close contact with the heat radiation side heat pipe connection plate 27 via the heat conductive material 13.

  According to such a configuration, even when the electronic devices 1A and 1B are used in the control panel, the fins 7 can be disposed outside the control panel. In general, since the depth of the control panel 33 is larger than that of the electronic devices 1A and 1B, the heat radiation side heat pipe condensing portion 28 can be lengthened to increase the number of the fins 7, so that the heat radiation characteristics can be improved.

Further, by providing the oil drain 34 and storing the oil that has flowed down to the oil pan 12 in the oil drain 34, it is possible to easily dispose of the accumulated unnecessary oil.
Here, FIG. 18 shows an example in which the configuration shown in FIG. 16 of the thirteenth embodiment is arranged on the control panel 33. However, the present invention is not limited to this example, and the cooling system of another embodiment is not limited to the control panel. It is good also as a structure arrange | positioned outside 33. FIG.

Embodiment 16 FIG.
FIG. 19 is a configuration diagram of a cooling system according to the sixteenth embodiment of the present invention. 19, the same reference numerals as those in FIGS. 1, 2, and 3 denote the same or corresponding parts. In the previous embodiments, an example was shown in which the heat receiving plates were installed so as to be perpendicular to the direction of gravity. However, in the sixteenth embodiment, as shown in FIG. It is installed so as to be horizontal to the direction of gravity. As described above, in the present embodiment, the plurality of heat receiving plates 3 each having the heat radiating heat pipe 4 are installed so as to be horizontal with respect to the direction of gravity. A heat exchanger 8 is provided between the heat receiving plates 3 so that heat is transported in a direction different from that of the heat radiating heat pipe 4. With this configuration, when the heat generation amount of each electronic device is different, heat dissipation from the electronic device having a large heat generation amount to the air is performed by the heat receiving plate 3 of the electronic device having a large heat generation amount. Provided not only from the fins 7 provided on the pipe 4 but also to the heat-dissipating heat pipe 4 disposed on the heat-receiving plate 3 of the electronic device with a small amount of heat generation through the heat-receiving plate 3 of the electronic device with a small amount of heat generation. Since it is also performed from the fins, there is an effect that the heat radiation characteristics are improved as compared with the case of using an electronic device alone having a large calorific value.

  The present invention is applicable to various systems having a plurality of heat generating devices having a heat generating element, such as a system having a plurality of electronic devices.

1A Electronic device A, 1B Electronic device B, 1C Electronic device C
2 Housing, 3 Heat-receiving plate, 4 Heat dissipating heat pipe, 5 Heat dissipating heat pipe evaporating part 6 Heat dissipating heat pipe condensing part, 7 Fin, 8 Heat exchanger 9 Heat exchanging heat pipe, 10 Heating element, 11 Screw, 12 Oil pan 13 Thermally conductive material, 14 Flat heat pipe evaporating part, 15 Radiation fin 16 Large fin, 17 Lower large fin, 18 Upper large fin, 19 Partition plate 20, 22 Heat exchange heat pipe, 21 Fixed plate ,
23 heat receiving side heat pipe, 24 heat receiving side heat pipe evaporating part 25 heat receiving side heat pipe condensing part, 26 heat radiating side heat pipe 27 heat radiating side heat pipe evaporating part, 28 heat radiating side heat pipe condensing part 29 heat radiating side heat pipe Connection plate, 30 Heat receiving side heat pipe connection plate 31 Heat exchange plate, 32 Heat exchange heat pipe, 33 Control panel 34 Oil drain

Claims (13)

A cooling system for cooling a heat generating system having a plurality of heat receiving plates for receiving heat from the heat generating elements, each of the plurality of heat receiving plates having an evaporation section and a condensing section, from each of the heat receiving plates A heat-dissipating heat pipe that transports the heat to the outside of the heating system,
And a heat exchanger for transporting heat between the plurality of heat receiving plates.   The cooling system according to claim 1, wherein the heat generating system is a system having a plurality of heat generating devices each provided with a heat receiving plate that receives heat from the heat generating element.   A plurality of heat generating devices having a heating element are thermally connected to each heat receiving plate of the plurality of heat receiving plates, and each heat generating device is thermally connected across the plurality of heat receiving plates. The cooling system according to claim 1.   The cooling system according to claim 1, wherein the direction of heat transport in the heat radiating heat pipe is different from the direction of heat transport in the heat exchanger.   The cooling system according to claim 4, wherein the direction of heat transport in the heat dissipating heat pipe and the direction of heat transport in the heat exchanger are substantially orthogonal to each other.   The cooling system according to claim 1, wherein the condensing part of the heat radiating heat pipe is disposed so as to extend in the horizontal direction above the heat receiving plate, and a plurality of fins are provided in the condensing part.   7. The heat-dissipating heat pipes provided on the plurality of heat receiving plates are arranged such that the heights of the condensing portions are substantially the same, and the condensing portions are connected by a plurality of fins. As described in the cooling system.   A plurality of heat receiving plates are provided with the same number of heat dissipating heat pipes of 2 or more, the height positions of the condensing portions of the heat dissipating heat pipes provided in one heat receiving plate are different, and heat dissipating heat of different heat receiving plates Each of the pipes is arranged so that the height position of one condensing part is substantially the same, so that the fins provided in the condensing part constitute a fin group with different heights, and these fin groups with different heights The cooling system according to claim 6, wherein a partition plate is provided between the two.   The heat-dissipating heat pipe is divided into a heat-receiving side heat pipe and a heat-dissipating side heat pipe each having an evaporation part and a condensing part, and the condensing part of the heat-receiving side heat pipe and the evaporation part of the heat-dissipating side heat pipe are in thermal contact with each other. The cooling system according to claim 1, wherein the evaporating part of the heat receiving side heat pipe is attached to a heat receiving plate and fins are attached to the condensing part of the heat radiating side heat pipe.   The cooling system according to claim 1, wherein the heat exchanger has a structure in which a heat pipe is thermally adhered to a metal plate.   The cooling system according to claim 1, wherein the heat exchanger is provided with heat radiation fins.   The cooling system according to claim 1, wherein the heat exchanger is a heat pipe for heat exchange.   The plurality of adjacent and separated heat receiving plates are connected by a heat exchange heat pipe, and two or more heat exchange heat pipes are arranged so as to intersect each other. Cooling system.

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