1330315 · 099年05’月21自後正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別係指一種用於電子元件 散熱之散熱裝置° 【先前技術】 [0002] 隨著資訊技術之飛速發展，電腦中央處理器之運算速度 越來越快，其產生之熱量也越來越多’而過多之熱量若 不及時排出，將嚴重影響中央處理器運行時之穩定性。 為此，業界通常在中央處理器頂面裝設一散熱裝置，以 協助排除熱量。 · [0003] 現有散熱裝置往往包括一散_避，該散熱I包括一具有 一定厚度之板狀金屬導熱底形成於該底座上之複數 散熱籍片’由於該底座係實體金屬板體，其存在厚度、 熱阻等因素之影響’容易導致傳熱速度慢、散熱不均勾 .’、、量集中在中央處理器之梦熱帶處，從而影響該散熱 裝置之整體散熱效果。 [0004] [0005] 【發明内容】 Φ 本發月曰在提供_種傳熱快、散熱均勻之散熱裝置。 種散熱裝置，用於對一電子元件散熱，包括一與該電 子70件接觸之基板、複數第-、第二散熱韓片及位於該 基板與第一、第- 乐一散熱鰭片之間之一彎曲熱管，該等第 散*、鰭片夾置於該等第-散熱鰭片之間，該等第-、 096115856 I二散熱鰭片之底部均具有平整之底面’該熱管包括結 °於第—散_片底面之第-、第二傳熱段及連接第-第傳熱&之連接段，該連接段與該等第一散熱縛片 表單編號Α0101 第4頁/共丨4頁 0993177402-0 1330315 [0006] [0007] [0008] [0009] 096115856 099年05月21日梭正替換頁 之底面接觸。 本發明散熱裝置通過基板、熱管與散熱鰭片之合理排佈 ’使散熱裝置均勻、快速地對電子元件進行散熱。 【實施方式] 請參閱圖1和圖2，本發明散熱裝置用於安裝於一電路板（ 圖未示）上，以對該電路板上之電子元件（圖未示）如中央 處理器進行散熱。該散熱裝置包括一用於與中央處理器 接觸之基板10、一散熱鰭片組20及夹置於散熱鰭片組2〇 與基板10之間之熱管組30，以將基板1〇之熱量傳送至整 個散熱鰭片組20。該熱管組30包括一第一熱管31與第二 熱管32« ' 基板10為矩形薄片狀，其由導熱性佳之金屬材料做成， 如銅或叙。該基板10具有結合第一熱管31、第二熱管32 之平整頂面110及一以與中央處理器直接接觸之平整底面 120。在本實施例中，基板10:大義翁覆蓋中央處理器之上 表面而不超出散熱鰭片組20之底部邊緣。 散熱鰭片組20包括複數第一散熱鰭片22與複數第二散熱 鰭片24。其中第二散熱鰭片24位於該散熱鰭片組2〇之中 部，第一散熱鰭片22位於該散熱鰭片組20之兩側。第一 散熱鰭片22與第二散熱鰭片24相互平行且垂直於第—、 第二熱管31、32及基板10設置。每一第一、第二散熱韓 片22、24均呈“凸”字形，因此散熱鰭片組20向上凸設 一縱長之凸出部230，以及該散熱鰭片組20之底部包括二 水平向兩側伸出之凸出端（圖未標）。在散熱鰭片組2〇 中，第二散熱鰭片24之底部（圖未標）均低出於第一散 表單編號A0101 第5頁/共U頁 0993177402-0 1330315 099年05月21自修正替换頁1330315 · 0599 05' month 21 from the beginning of the replacement page six, the invention description: [Technical field of the invention] [0001] The present invention relates to a heat sink device, in particular to a heat sink for electronic components heat sink ° Technology] [0002] With the rapid development of information technology, the computer central processing unit is running faster and faster, and the heat generated by it is increasing. 'If too much heat is not discharged in time, it will seriously affect the central processing unit. Stability at runtime. To this end, the industry typically installs a heat sink on the top surface of the central processor to assist in the removal of heat. [0003] The existing heat dissipating device often includes a scatter, the heat dissipating I includes a plate-shaped metal heat-conducting bottom having a certain thickness formed on the pedestal of the plurality of heat-dissipating pieces 'Because the base is a solid metal plate body, the existence thereof The influence of thickness, thermal resistance and other factors 'is easy to cause slow heat transfer and uneven heat dissipation.', and the amount is concentrated in the dream tropical zone of the central processor, thus affecting the overall heat dissipation effect of the heat sink. [0004] [Abstract] Φ This is a heat sink that provides fast heat transfer and uniform heat dissipation. The heat dissipating device is configured to dissipate heat from an electronic component, including a substrate in contact with the electronic component 70, a plurality of first and second heat dissipating Korean films, and between the substrate and the first and first music-cooling fins. a heat pipe, the fins are interposed between the first heat sink fins, and the bottoms of the first and the 096115856 I heat sink fins have a flat bottom surface. a first-, a second heat-transfer section of the bottom surface of the first-scattering sheet, and a connecting section connecting the first heat-transfers, the connecting section and the first heat-dissipating tab form number Α0101, page 4/total 4 pages 0993177402-0 1330315 [0006] [0007] [0009] 096115856 On May 21, 099, the shuttle was replacing the bottom surface of the page. The heat dissipating device of the present invention allows the heat dissipating device to dissipate the electronic components uniformly and quickly through the reasonable arrangement of the substrate, the heat pipe and the heat dissipating fins. [Embodiment] Referring to FIG. 1 and FIG. 2, the heat dissipating device of the present invention is mounted on a circuit board (not shown) for dissipating heat from electronic components (not shown) such as a central processing unit on the circuit board. . The heat dissipating device includes a substrate 10 for contacting the central processing unit, a heat dissipating fin set 20, and a heat pipe group 30 sandwiched between the heat dissipating fin group 2 and the substrate 10 to transfer heat of the substrate 1 To the entire heat sink fin set 20. The heat pipe group 30 includes a first heat pipe 31 and a second heat pipe 32 « ' The substrate 10 has a rectangular sheet shape, and is made of a metal material having good thermal conductivity, such as copper or copper. The substrate 10 has a flat top surface 110 that combines the first heat pipe 31, the second heat pipe 32, and a flat bottom surface 120 that is in direct contact with the central processing unit. In the present embodiment, the substrate 10: the sinister covers the upper surface of the central processing unit without exceeding the bottom edge of the heat dissipation fin group 20. The heat dissipation fin set 20 includes a plurality of first heat dissipation fins 22 and a plurality of second heat dissipation fins 24. The second heat dissipation fins 24 are located at the middle of the heat dissipation fin group 2, and the first heat dissipation fins 22 are located at two sides of the heat dissipation fin group 20. The first heat dissipation fins 22 and the second heat dissipation fins 24 are disposed parallel to each other and perpendicular to the first and second heat pipes 31 and 32 and the substrate 10. Each of the first and second heat-dissipating fins 22 and 24 has a convex shape, so that the heat-dissipating fin group 20 protrudes upwardly from a longitudinal projection 230, and the bottom of the heat-dissipating fin set 20 includes two horizontal levels. Projecting ends that protrude to the sides (not shown). In the heat sink fin group 2, the bottom of the second heat sink fin 24 (not shown) is low because of the first form number A0101 page 5 / total page 0 0993177402-0 1330315 099 May 21 self-correction Replacement page
熱鰭片22之底部（圖未標），因此散熱鰭片組20底部中 央向下形成一凸出部240。每一第一、第二散熱鰭片22、 24由金屬薄片彎折而成，均包括一本體（圖未標）及從 自該本體頂部邊緣、底部邊緣垂直延伸一折緣270。第一 、第二散熱鰭片22、24頂部之折緣270相互抵接共同形成 散熱鰭片組20之頂面（圖未標）。第一散熱鰭片22底部 之折緣270在第二散熱鰭片24之兩侧形成二底面（圖未標 )，該等二底面位於同一平面内。第二散熱鰭片24底部 之折緣270相互抵接共同形成散熱鰭片組20凸出部240之 底面（圖未標）。其中該凸出部240之底面低於該等第一 散熱鰭片22之二底面。該凸出部240之底面設有四相互平 行之溝槽245，以收容第一、第二熱管31、32。如圖2所 示，該每一溝槽245之底部設有一平面形接觸面2450，該 接觸面2450與第一散熱鰭片22之底面共面。該凸出部 240之底面大於基板10之頂面110。 [0010] 第一熱管31呈U形設置，並具有壓平之上表面及下表面。The bottom of the heat fin 22 (not shown), so that a central portion of the bottom portion of the heat dissipating fin group 20 forms a convex portion 240 downward. Each of the first and second heat dissipation fins 22, 24 is bent from a metal foil, and includes a body (not shown) and a flange 270 extending perpendicularly from the top edge and the bottom edge of the body. The flanges 270 of the top portions of the first and second heat dissipation fins 22, 24 abut each other to form a top surface of the heat dissipation fin group 20 (not shown). The flange 270 at the bottom of the first heat dissipation fin 22 forms two bottom surfaces (not labeled) on both sides of the second heat dissipation fin 24, and the two bottom surfaces are located in the same plane. The flanges 270 at the bottom of the second heat dissipation fins 24 abut each other to form a bottom surface (not shown) of the protrusions 240 of the heat dissipation fin group 20. The bottom surface of the protruding portion 240 is lower than the bottom surfaces of the first heat dissipation fins 22. The bottom surface of the protruding portion 240 is provided with four mutually parallel grooves 245 for receiving the first and second heat pipes 31, 32. As shown in FIG. 2, a bottom surface of each of the trenches 245 is provided with a planar contact surface 2450 that is coplanar with the bottom surface of the first heat dissipation fins 22. The bottom surface of the protruding portion 240 is larger than the top surface 110 of the substrate 10. [0010] The first heat pipe 31 is disposed in a U shape and has a flat upper surface and a lower surface.
第一熱管31包括相互分離且平行之第一傳熱段314、第二 傳熱段318及一連接該第一傳熱段314與第二傳熱段318 之弧形連接段316。第二熱管32之形狀與第一熱管31之形 狀相似，包括相互分離平行之第一傳熱段324、第二傳熱 段328及一連接該第一傳熱段324與第二傳熱段328之弧 形連接段326。第一、第二熱管31、32之第一傳熱段314 、324均比第二傳熱段318、328長。 [0011] 請一併參閱圖3，該散熱裝置組裝時，第一、第二熱管31 、32之第一、第二傳熱段314、318、324、328通過焊接 096115856 表單編號A0101 第6頁/共14頁 0993177402-0 Γ330315 099年05月21日修正替換頁 等方式結合至散熱鰭片組20之溝槽245内，其與該散熱鰭 片組20之接觸面2450熱傳導緊密結合。該等第一、第二 熱管31、32之弧形連接段316、326與第一散熱鰭片22之 底面焊接。該等第一、第二熱管31、32之底面與散熱鰭 片組20之凸出部240之底面共面。該基板10之上表面110 同時與第一、第二熱管31、32之底面以及散熱鰭片組20 之凸出部240之底面焊接在一起。該第一、第二熱管31、The first heat pipe 31 includes a first heat transfer section 314 that is separated from and parallel to each other, a second heat transfer section 318, and an arcuate connecting section 316 that connects the first heat transfer section 314 and the second heat transfer section 318. The shape of the second heat pipe 32 is similar to that of the first heat pipe 31, and includes a first heat transfer section 324 that is parallel to each other, a second heat transfer section 328, and a first heat transfer section 324 and a second heat transfer section 328. The arcuate connecting section 326. The first heat transfer sections 314, 324 of the first and second heat pipes 31, 32 are each longer than the second heat transfer sections 318, 328. [0011] Referring to FIG. 3 together, when the heat dissipating device is assembled, the first and second heat transfer sections 314, 318, 324, and 328 of the first and second heat pipes 31 and 32 are welded by 096115856. Form No. A0101, page 6 / Total 14 pages 0993177402-0 Γ 330315 The modification of the replacement page on May 21, 099 is incorporated into the groove 245 of the heat dissipation fin group 20, which is thermally coupled to the contact surface 2450 of the heat dissipation fin group 20. The arcuate connecting sections 316, 326 of the first and second heat pipes 31, 32 are welded to the bottom surface of the first heat radiating fins 22. The bottom surfaces of the first and second heat pipes 31, 32 are coplanar with the bottom surface of the convex portion 240 of the heat dissipation fin group 20. The upper surface 110 of the substrate 10 is simultaneously welded to the bottom surfaces of the first and second heat pipes 31 and 32 and the bottom surface of the protruding portion 240 of the heat dissipation fin group 20. The first and second heat pipes 31,
32之開口相對並且相互交錯，即第一熱管31之第二傳熱 段318置於第二熱管32之第一傳熱段324、第二傳熱段 328之間；第二熱管32之第二傳熱段328置於第一熱管31 之第一傳熱段314、第二傳熱段31 8之間。該等第一、第 二熱管31、32之第一、第二傳熱段314、318、324、 328之兩端以及連接段316、326均超出基板10，且其底 面暴露於空氣中。 [0012] 使用時，該散熱裝置之基板10之底面直接與中央處理器 接觸。該中央處理器產生之熱量由基板10吸收。基板10 吸收之熱量一部分傳遞至第一、第二熱管31、32與基板 10接觸之部分，並迅速傳遞至第一、第二熱管31、32之 其他部分。進而，第一、第二熱管31、32所吸收之熱量 傳遞至散熱鰭片組20。基板10之另一部分熱量直接傳遞 至散熱鰭片組20。最後，這些傳遞至散熱鰭片組20之熱 量散發至空氣中，從而實現對中央處理器之散熱。 [0013] 在本實施例中基板10較薄，這樣減少了基板10之熱阻， 加快了熱量從中央處理器至第一、第二熱管31、32與散 熱鰭片組20之傳送速度，並減少散熱裝置之製造成本。 096115856 表單編號A0101 第7頁/共14頁 0993177402-0 1330315 099年05月21日’修正替换頁 散熱裝置通過與彎曲之第一、第二熱管31、32與第一、 第二散熱鰭片22、24接觸，增大了熱管組30與散熱鰭片 組20之接觸面積，使中央處理器之熱量可以迅速傳遞至 散熱鰭片組20而散發至空氣中。因此，散熱裝置之散熱 效率得到提高。另外，由於第一、第二熱管31、32之弧 形連接段316、326直接與第一散熱鰭片22之底面焊接， 散熱鰭片組20只需要設置容置熱管31、32之第一、第二 傳熱段314、318、324、328之直線形溝槽245，無需專 門加工容置連接段316、326弧形之較為複雜之溝槽，節 省整個散熱裝置之加工成本。 < [0014] 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0015] 圖1係本發明散熱裝置之立體分解圖。 [0016] 圖2係圖1散熱裝置倒置之立體分解圖。 1 [0017] 圖3係圖2散熱裝置之組合圖。 【主要元件符號說明】 [0018] 基板：10 [0019] 頂面：11 0 [0020] 底面：120 [0021] 散熱鰭片組：20 096115856 表單編號A0101 第8頁/共14頁 0993177402-0 1330315 [0022] 第一散熱鰭片：22 [0023] 凸出部：230、240 [0024] 第二散熱鰭片：24 [0025] 溝槽：245 [0026] 接觸面：2450 [0027] 折緣：270 [0028] 熱管組：30 [0029] 第一熱管：31 [0030] 第一傳熱段：314、 324 [0031] 連接段：316、326 [0032] 第二熱管：32 [0033] 第二傳熱段：318、 328 096115856 表單編號A0101 第9頁/共14頁 099年05月21日修正替換頁 0993177402-0The openings 32 are opposite and interdigitated, that is, the second heat transfer section 318 of the first heat pipe 31 is disposed between the first heat transfer section 324 and the second heat transfer section 328 of the second heat pipe 32; the second heat pipe 32 is second. The heat transfer section 328 is disposed between the first heat transfer section 314 and the second heat transfer section 318 of the first heat pipe 31. Both ends of the first and second heat transfer sections 314, 318, 324, 328 and the connection sections 316, 326 of the first and second heat pipes 31, 32 extend beyond the substrate 10, and the bottom surface thereof is exposed to the air. [0012] In use, the bottom surface of the substrate 10 of the heat sink is in direct contact with the central processing unit. The heat generated by the central processor is absorbed by the substrate 10. The heat absorbed by the substrate 10 is partially transferred to the portion where the first and second heat pipes 31, 32 are in contact with the substrate 10, and is quickly transferred to the other portions of the first and second heat pipes 31, 32. Further, the heat absorbed by the first and second heat pipes 31, 32 is transferred to the heat radiation fin group 20. Another portion of the heat of the substrate 10 is transferred directly to the heat sink fin set 20. Finally, the heat transferred to the heat sink fin set 20 is dissipated into the air to dissipate heat from the central processing unit. [0013] In the present embodiment, the substrate 10 is thinner, which reduces the thermal resistance of the substrate 10, and accelerates the transfer speed of heat from the central processing unit to the first and second heat pipes 31, 32 and the heat dissipation fin group 20, and Reduce the manufacturing cost of the heat sink. 096115856 Form No. A0101 Page 7 / Total 14 Page 0993177402-0 1330315 May 21, 2008 'Revised replacement page heat sink through and the first and second heat pipes 31, 32 and the first and second heat sink fins 22 The contact of 24 increases the contact area between the heat pipe group 30 and the heat dissipation fin group 20, so that the heat of the central processing unit can be quickly transmitted to the heat dissipation fin group 20 and is radiated into the air. Therefore, the heat dissipation efficiency of the heat sink is improved. In addition, since the arc-shaped connecting segments 316 and 326 of the first and second heat pipes 31 and 32 are directly welded to the bottom surface of the first heat-dissipating fins 22, the heat-dissipating fin group 20 only needs to be provided with the first heat-receiving heat pipes 31 and 32. The linear grooves 245 of the second heat transfer sections 314, 318, 324, and 328 do not need to be specially processed to accommodate the more complicated grooves of the curved connecting portions 316, 326, thereby saving the processing cost of the entire heat sink. [0014] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is an exploded perspective view of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1 inverted. [0017] FIG. 3 is a combination diagram of the heat sink of FIG. 2. [Main component symbol description] [0018] Substrate: 10 [0019] Top surface: 11 0 [0020] Bottom surface: 120 [0021] Heat sink fin group: 20 096115856 Form number A0101 Page 8 / Total 14 pages 0993177402-0 1330315 [0022] First heat sink fin: 22 [0023] Projection: 230, 240 [0024] Second heat sink fin: 24 [0025] Groove: 245 [0026] Contact surface: 2450 [0027] Folding edge: 270 [0028] Heat pipe group: 30 [0029] First heat pipe: 31 [0030] First heat transfer section: 314, 324 [0031] Connecting section: 316, 326 [0032] Second heat pipe: 32 [0033] Heat transfer section: 318, 328 096115856 Form number A0101 Page 9 / Total 14 pages 099 May 21 revised replacement page 0993177402-0