1329257 九、發明說明： •【發明所屬之技術領域】 • 本發明涉及一種散熱裝置，尤係指一種用於電子元件 上之散熱裝置。 【先前技術】 隨著資訊技術之飛速發展，電腦中央處理器之運算速 度越來越快，其產生之熱量也越來越多，而過多熱量若無 •法及時排出，將嚴重影響中央處理器運行時之穩定性。^ 此，業界通常在中央處理器頂面裝設一散熱裝置疋以協助 排除熱量。 .. 習知散熱裝置組合，往往包括一散熱體，該散熱體包 括一散熱底座及形成於該底座上之散熱鰭片，由於該底座 ，實體金屬，容易導致散熱不均勻，熱量集中在中^處理 器之發熱帶處且散熱速度慢，從而影響整體散熱效果。 • 針對上述問題，業界可採用增加熱管之方法，如中國 專利公告第2612068Y號中揭露一散熱裝置，該散熱裝置包 括一散熱體及至少一熱管，該散熱體具有一基座，該基座 上形成有複數散熱鰭片，這些散熱鰭片之頂端還形成有一 平板，上述熱管之-端容置在該基座中，另一端容置於該 基板中。該散熱裝置通過熱管將基座之熱量轉移，但是中 央處理器之熱量還是通過基板傳至熱管及散熱韓片，實體 金屬之基座影響了整個散熱裝置散熱速度。並且，由於基 座具有-定之厚度，無形中增加了整個散熱裝置之體積， 6 13.29257 降低了散熱裝置之在不同系統中之適應性 -【發明内容】 本發明旨在提供-種散熱快、體積小之散熱裝置。 -種散熱裝置，用於對一電子元件散熱，包括複數散 ’’’、鰭片及至少—熱官’該等熱管包括吸熱段及連接該等 熱韓片之放熱段，該等吸熱段呈平板狀且共面設置，並下1329257 IX. Description of the invention: • [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic component. [Prior Art] With the rapid development of information technology, the computer central processing unit is running faster and faster, and the heat generated by it is increasing. If too much heat is discharged in time, it will seriously affect the central processing unit. Stability at runtime. ^ Therefore, the industry usually installs a heat sink on the top surface of the CPU to help remove heat. The conventional heat sink assembly often includes a heat dissipating body, and the heat dissipating body includes a heat dissipating base and heat dissipating fins formed on the base. Due to the base, the solid metal is liable to cause uneven heat dissipation, and the heat is concentrated in the middle. The heat dissipation of the processor is slow and the heat dissipation is slow, which affects the overall heat dissipation. For the above problems, the industry may adopt a method of adding a heat pipe. For example, a heat sink is disclosed in the Chinese Patent Publication No. 2612068Y. The heat sink includes a heat sink and at least one heat pipe. The heat sink has a base on the base. A plurality of heat dissipating fins are formed, and a top plate is formed at a top end of the heat dissipating fins. The end of the heat pipe is received in the base, and the other end is received in the substrate. The heat sink transfers the heat of the susceptor through the heat pipe, but the heat of the central processor is transmitted to the heat pipe and the heat sink through the substrate, and the base of the solid metal affects the heat dissipation speed of the entire heat sink. Moreover, since the susceptor has a certain thickness, the volume of the entire heat dissipating device is invisibly increased, 6 13.29257 reduces the adaptability of the heat dissipating device in different systems - [Summary] The present invention aims to provide a fast heat dissipation and volume Small heat sink. a heat dissipating device for dissipating heat to an electronic component, including a plurality of heat sinks, fins, and at least a heat officer, wherein the heat pipes include a heat absorption section and an exothermic section connecting the hot Korean sheets, and the heat absorption sections are Flat and coplanar, and under
表面用以與電子元件直接接觸，其上表面與該等散熱韓片 焊接。 本發明散熱裝置將該等扁平熱管用作散熱裝置之底座 而，電子元件接觸’既使散熱裝置之傳熱性能提高，又未 顯著增加製造成本，同時使整個散熱裝置之體積減少，更 有效之利用系統空間。 '【實施方式】 請參閱圖1至圖4,本發明散熱裝置1〇〇安裝於一電路 籲板（圖未不）上，用以對該電路板上之電子元件（圖未示卜如 中央處理器進行散熱。該散熱裝置1〇〇包括一散熱鰭片組 2〇及連接該散熱鰭片組20與中央處理器之複數熱管1Q’ 該散熱裝置100還包括二扣具50,該等扣具5〇焊接於散熱 鰭片組20底部兩側以將散熱裝置1〇〇固定於電路板上。 熱管10均呈U形。每一熱管1〇包括一水平之吸熱段 12、一平行于該吸熱段12之放熱段14及一連接該吸熱段 12與放熱段14之連接段13。其中’該等吸熱段12壓成扁 平後相互並排且共同形成一上表面120與下表面125。各熱 7 ‘ 10之吸熱段12相互緊密接觸 # ^ , ^ ^ f也拱觸，以用作一平板狀之基座， ，史，、與中央處理器之上表面 ;咕 > 丧嘴以及與散熱鰭片組20之底 •面焊接。熱管1〇之放埶 ^ …仅Μ處於同一平面且彼此相隔， …用以穿设於散熱鰭片組2〇中。 散熱鰭片組20由複數單—散熱㈣21相互平行間隔 下扣形成，每一散埶轉片2] a + zu·。 μ，"、曰月1為大致呈ϋ形設置之金屬片， 且該專散熱,If片21垂直於兮望细a ^ 玉罝於该等熱官10之吸熱段12及放埶 &14。散熱韓片組20底面中部形成一凸出部221，該凸出、 部221兩側對稱形成二容置空間以收容二扣具％。每一散 熱鰭片21底部均設有同向弯折之折緣22〇,225，盆中各折 緣225組成之平面與熱管1〇之吸熱段12之上表面㈣焊 •接’處於折緣225 ^側之折緣22()所組成之平面與二扣具 K)焊# 散熱H片21兩側靠近頂部分別形成一折緣 25。該等折緣25、220及225共同將散熱鰭片2 i間隔相同 距離以形成散熱通風道。每一散熱鰭片21上均勻間隔嗖有 四孔210,散熱韓片、组2〇上之孔21〇共同組成四通道（圖又未 標）以收容熱管1〇之放熱段14。 每一扣具50包括一焊接於散熱鰭月組20之折緣22〇 上之定位板52及從定位板52兩端呈角度向外延伸之 扣合板54。每一扣合板54上設有一通孔（圖未標），方便螺 釘或鉚釘60等穿過從而將該散熱裝置1〇〇固定到電路板 上。 私 使用時’將該散熱裝置100之底面即熱管1〇之吸熱段 12組成之基座直接與中央處理器接觸，該中央處理器產生 1329257 之熱量由與其接觸之熱管10之吸熱段12下表面125吸收； 些熱官10之吸熱段12吸收之熱量，一部分直接傳遞至 與吸熱段12直接接觸之散熱鰭片組2〇之底部；另一部分 則通過熱官10之連接段13及放熱段14將吸熱段12之熱 量傳遞至傳遞至散熱韓片組20之中央部分；最後，這些傳 遞至散熱鰭片組20之熱量從散熱鰭片組2〇散發至空氣 中’從而實現對中央處理器之散熱。 本發明之熱管10之吸熱段12經壓扁後面積增大，斑散 熱韓片組2G焊接後直接與中央處理ϋ接觸，與f知技術相 比痛去了與巾央處理器接觸之基座，其取代了基座，直接 與散熱‘鰭片組2〇接觸從而快速吸熱及傳遞熱量。並且整個 之體積因省去基座而具有了更大之適應性，能 在更多之系統中靈活安裝。 利申ί上戶Γ，本發明符合發明專利要件，爰依法提出專 在袭依本發明精神所作之等效修飾 變化a應涵盍於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1散熱裝置倒置之立體分解圖。 圖3係圖1散熱裝置之組合圖。 圖4係圖2散熱裝置之組合圖。 【主要元件符號說明】 9 13.29257 散熱裝置 100 執管 10 吸熱段 12 上表面 120 下表面 125 連接段 13 放熱段 14 散熱鰭片組 20 散熱鰭片 21 子L 210 折緣 220 、 225 、 25 凸出部 221 扣具 50 定位板 52 扣合板 54 鉚釘 60The surface is for direct contact with the electronic component, and the upper surface thereof is soldered to the heat sink. The heat dissipating device of the present invention uses the flat heat pipe as the base of the heat dissipating device, and the electronic component contacts 'even the heat transfer performance of the heat dissipating device is improved, and the manufacturing cost is not significantly increased, and the volume of the entire heat dissipating device is reduced, which is more effective. Take advantage of system space. [Embodiment] Referring to FIG. 1 to FIG. 4, the heat dissipating device 1 of the present invention is mounted on a circuit board (not shown) for electronic components on the circuit board (not shown in the center) The heat dissipating device 1 includes a heat dissipating fin set 2 and a plurality of heat pipes 1Q ′ connecting the heat dissipating fin set 20 and the central processing unit. The heat dissipating device 100 further includes two buckles 50 , the buckles The heat pipes 10 are all U-shaped. Each heat pipe 1 includes a horizontal heat absorption section 12, and a parallel to the heat dissipation fins 1 is fixed on the circuit board. The heat-dissipating section 14 of the heat-absorbing section 12 and a connecting section 13 connecting the heat-absorbing section 12 and the heat-releasing section 14 wherein the heat-absorbing sections 12 are flattened and then side by side and together form an upper surface 120 and a lower surface 125. 7 '10's endothermic section 12 is in close contact with each other # ^ , ^ ^ f is also arched to serve as a flat base, history, and the upper surface of the central processor; 咕 > slap and heat The bottom of the fin set 20 • the surface is welded. The heat pipe is placed on the same plane. The distance between the ... is used to be disposed in the heat dissipating fin group 2 . The heat dissipating fin group 20 is formed by a plurality of single heat-dissipating heat-dissipating (four) 21s which are parallel to each other, and each of the diffusing fins 2] a + zu·. μ, ", 曰月1 is a metal sheet that is roughly in the shape of a dome, and the heat is specifically cooled, and the If piece 21 is perpendicular to the 兮 细 a ^ 罝 罝 in the heat absorption section 12 of the heat officer 10 and the 埶 & A convex portion 221 is formed in the middle of the bottom surface of the heat dissipating film group 20, and two accommodating spaces are formed on the two sides of the protruding portion 221 to accommodate the two fasteners. The bottom of each of the heat dissipating fins 21 is provided with the same direction bending. Folding edge 22〇, 225, the plane formed by each flange 225 in the basin and the upper surface of the heat-absorbing section 12 of the heat pipe 1 (four) welding and connecting the plane 22 and the edge of the flange 225 ^ side Buckle K) Welding # The heat-dissipating H-piece 21 has a flange 25 formed on both sides of the heat-dissipating sheet 21 on both sides. The flanges 25, 220, and 225 collectively space the fins 2 i at the same distance to form a heat dissipation vent. Each of the heat dissipation fins 21 is evenly spaced by four holes 210, and the heat dissipation film and the holes 21 of the group 2 are collectively formed into four channels (not shown) to accommodate the heat release section 14 of the heat pipe 1 . Each of the fasteners 50 includes a positioning plate 52 welded to the flange 22 of the heat dissipation fin group 20 and a fastening plate 54 extending outward from the two ends of the positioning plate 52. Each of the fastening plates 54 is provided with a through hole (not shown) for facilitating the passage of screws or rivets 60 to fix the heat sink 1 to the circuit board. In private use, the base of the heat sink 100, which is the bottom surface of the heat sink 100, is directly in contact with the central processing unit. The central processor generates 1329257 of heat from the lower surface of the heat absorption section 12 of the heat pipe 10 in contact therewith. 125 absorption; some of the heat absorbed by the heat-dissipating section 12 of the heat officer 10, a part of which is directly transmitted to the bottom of the heat-dissipating fin group 2 which is in direct contact with the heat-absorbing section 12; the other part passes through the connecting section 13 of the heat officer 10 and the heat-dissipating section 14 The heat of the heat absorption section 12 is transferred to the central portion of the heat dissipation fin group 20; finally, the heat transferred to the heat dissipation fin group 20 is radiated from the heat dissipation fin group 2 to the air', thereby realizing the central processor Cooling. The heat absorbing section 12 of the heat pipe 10 of the present invention has an increased area after being crushed, and the spot heat-dissipating Korean film group 2G is directly contacted with the central processing cymbal after welding, and the pedestal which is in contact with the towel central processor is painfully compared with the f-known technology. It replaces the pedestal and directly contacts the heat-dissipating fin group 2 to quickly absorb heat and transfer heat. And the entire volume is more adaptable due to the elimination of the base, and can be flexibly installed in more systems. The invention is in accordance with the requirements of the invention patent, and the equivalent modification made in accordance with the spirit of the invention in accordance with the law is intended to be within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1 inverted. Figure 3 is a combination diagram of the heat sink of Figure 1. Figure 4 is a combination diagram of the heat sink of Figure 2. [Main component symbol description] 9 13.29257 Heat sink 100 Execution pipe 10 Heat absorption section 12 Upper surface 120 Lower surface 125 Connection section 13 Heat release section 14 Heat sink fin set 20 Heat sink fin 21 Sub L 210 Folding edge 220, 225, 25 Projection Part 221 buckle 50 positioning plate 52 fastening plate 54 rivet 60