JP2006203014A - Heat radiating component - Google Patents

Heat radiating component Download PDF

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Publication number
JP2006203014A
JP2006203014A JP2005013636A JP2005013636A JP2006203014A JP 2006203014 A JP2006203014 A JP 2006203014A JP 2005013636 A JP2005013636 A JP 2005013636A JP 2005013636 A JP2005013636 A JP 2005013636A JP 2006203014 A JP2006203014 A JP 2006203014A
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heat
shape
separation region
graphite
heat dissipation
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JP2005013636A
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Japanese (ja)
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JP4529703B2 (en
Inventor
Norihiro Kawamura
典裕 河村
Kazuhiko Kubo
和彦 久保
Etsuro Habata
悦朗 幅田
Masashi Senba
正志 船場
Yoshikazu Hori
義和 堀
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To further enhance heat radiation efficiency in a heat radiating component used for measures against heat radiation in a heat generation electronic component. <P>SOLUTION: The heat radiating component 6 comprises a plurality of graphite sheets 7, a superposition region 9 in which the plurality of graphite sheets 7 are superposed is set to be a heat transport section 12 and a heat reception section 11, a separation region 10 in which a prescribed space is provided between the graphite sheet 7 is set to be a heat radiation section 13, and a shape maintaining means 8 for maintaining the shape of the separation space is provided in the separation region 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は発熱電子部品の放熱対策に用いられる放熱部品に関する。   The present invention relates to a heat dissipation component used for heat dissipation of heat-generating electronic components.

一般にノート型パソコンに用いられるＩＣなどの発熱電子部品はその温度上昇に伴いそれらを用いた電子機器に対して悪影響を及ぼしてしまうため、その放熱対策として発熱電子部品とそのヒートシンクなる部材との間に熱伝導シートが設けられている。   Generally, heat generating electronic components such as ICs used in notebook computers have an adverse effect on electronic devices using them as the temperature rises. Therefore, as a heat dissipation measure, between the heat generating electronic components and the heat sink member. Is provided with a heat conductive sheet.

そして、発熱電子部品を用いた電子機器の小型化が進められる中、熱伝導部材自体をヒートシンクとしての役割を付加する形態として、図６に示されるようにグラファイトシート１の先端部分にスリット２を形成しその表面積を増すことにより、グラファイトシート１による放熱機能を確保する構造が提案されている。   As the electronic equipment using the heat generating electronic components is being reduced in size, the slit 2 is formed at the tip of the graphite sheet 1 as shown in FIG. A structure that secures a heat dissipation function by the graphite sheet 1 by forming and increasing the surface area thereof has been proposed.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開平７−１０９１７１号公報 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-7-109171

しかしながら、ノート型パソコンのＩＣに代表されるように発熱電子部品を搭載する電子機器の高機能化や薄型化が進む中、発熱電子部品の発熱量の増大や発熱電子部品から機器表面との間隔が狭くなるといった種々の要因から、放熱部品にさらなる放熱特性が要求されるようになり、先に述べた放熱構造では十分な対応が困難なものとなっていた。   However, as electronic devices equipped with heat generating electronic components are becoming more sophisticated and thinner as represented by notebook PC ICs, the amount of heat generated by the heat generating electronic components is increased and the distance from the heat generating electronic components to the device surface. Due to various factors such as narrowing, further heat dissipation characteristics are required of the heat dissipation component, and it has been difficult to sufficiently cope with the heat dissipation structure described above.

そこで、本発明はグラファイトシートを用いた放熱部品の放熱効率をさらに高めることを目的とする。   Accordingly, an object of the present invention is to further increase the heat dissipation efficiency of a heat dissipation component using a graphite sheet.

そして、この目的を達成するために本発明は、特に複数のグラファイトシートからなり、複数のグラファイトシートを重畳した重畳領域を熱移送部あるいは受熱部として、グラファイトシート間に所定の空間を設けた分離領域を放熱部とするとともに、分離領域において分離空間の形状を維持する形状維持手段を設けた構造としたのである。   In order to achieve this object, the present invention is particularly composed of a plurality of graphite sheets, and a separation region in which a predetermined space is provided between the graphite sheets, with the overlapping region where the plurality of graphite sheets are superimposed as a heat transfer unit or a heat receiving unit. The region is a heat radiating portion, and a shape maintaining means for maintaining the shape of the separation space in the separation region is provided.

この構成によれば、複数のグラファイトシートを重畳したことにより、この重畳領域における熱移送効率や熱分散効率が高められ、また放熱部となる分離領域における表面積を確保できるとともに、分離領域における空間形状が形状維持手段により維持されることにより放熱特性の安定化が図られるので、結果として放熱部品の放熱効率をさらに高めることが出来るのである。   According to this configuration, by superimposing a plurality of graphite sheets, the heat transfer efficiency and heat dispersion efficiency in the overlap region can be increased, and the surface area in the separation region serving as a heat radiating portion can be secured, and the spatial shape in the separation region Is maintained by the shape maintaining means to stabilize the heat dissipation characteristics, and as a result, the heat dissipation efficiency of the heat dissipation component can be further increased.

以下、本発明の一実施形態について図を用いながら説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１は本発明の放熱部品６の断面を示したもので、図２に示されるようにノート型パソコンに用いられるＩＣなどの発熱電子部品３から局所的に生じた熱を電子機器内における実装基板４上に実装された他の電子部品５の密集度が低く放熱性の高い領域へ放熱部品６を介して拡散させながら放熱する構造となっており、ノート型パソコンのように電子機器自体が薄型化や高機能化のため、電子機器内にヒートシンクを設け難くなってきた状況において、従来の発熱電子部品３とヒートシンクとの熱伝達に用いられていた熱伝導部材に放熱構造を取り入れたものである。   FIG. 1 shows a cross section of a heat dissipation component 6 of the present invention. As shown in FIG. 2, heat generated locally from a heat generating electronic component 3 such as an IC used in a notebook computer is mounted in an electronic device. Other electronic components 5 mounted on the substrate 4 are structured to dissipate heat while diffusing through the heat radiating component 6 to a region where the density is low and heat dissipation is high, and the electronic device itself is like a notebook computer. In a situation where it is difficult to provide a heat sink in an electronic device due to thinning and high functionality, a heat-dissipating structure is incorporated into a heat conduction member used for heat transfer between a conventional heat-generating electronic component 3 and the heat sink It is.

そして、この放熱部品６は図１に示されるように複数のグラファイトシート７と、このグラファイトシート７の形状を維持する形状維持手段８とからなり、複数のグラファイトシート７を重畳した重畳領域９と、重畳方向において扇型に拡開させ隣接するグラファイトシート７間に所定の空間を設けた分離領域１０とで構成されている。   As shown in FIG. 1, the heat dissipating component 6 includes a plurality of graphite sheets 7 and shape maintaining means 8 for maintaining the shape of the graphite sheets 7, and an overlapping region 9 in which the plurality of graphite sheets 7 are superimposed. The separation region 10 is formed in a fan shape in the overlapping direction and provided with a predetermined space between the adjacent graphite sheets 7.

なお、グラファイトシート７としてはポリイミド等の高分子樹脂シートを１２００度以上の温度で炭化させ、その後、２６００度以上の温度でグラファイト化し、図３に示されるよう炭素が２次元的に密に結合した炭素層の多層構造体とし、炭素の結合面内において高い熱伝導特性を示すものや、膨張黒鉛をシート状に成形したものや、グラファイトファイバーをシート状に成形したものなどが挙げられる。   As the graphite sheet 7, a polymer resin sheet such as polyimide is carbonized at a temperature of 1200 ° C. or higher, and then graphitized at a temperature of 2600 ° C. or higher, and carbon is two-dimensionally closely bonded as shown in FIG. Examples of the multi-layered carbon layer structure include those exhibiting high thermal conductivity in the carbon bonding plane, those obtained by forming expanded graphite into a sheet shape, and those obtained by forming graphite fiber into a sheet shape.

そして、この放熱部品６は重畳領域９を図２に示されるよう発熱電子部品３から発せられる局所的な熱を受ける部分を受熱部１１とし、受熱した熱を重畳したそれぞれのグラファイトシート７の面内方向に分散させながら分離領域１０に熱移送する部分を熱移送部１２とし、熱移送部１２により熱移送された熱を外部に放出する部分を放熱部１３とした構造としている。   In the heat dissipating component 6, as shown in FIG. 2, a portion that receives local heat generated from the heat generating electronic component 3 is used as the heat receiving portion 11, and the surface of each graphite sheet 7 on which the heat received is superimposed. A portion where heat is transferred to the separation region 10 while being dispersed inward is a heat transfer portion 12, and a portion where heat transferred by the heat transfer portion 12 is released to the outside is a heat dissipation portion 13.

すなわち、図６に示す従来の放熱部品６が単層のグラファイトシート１を用いて熱移送および放熱を行っていた構造であるのに対し、図１に示す放熱部品６が複数のグラファイトシート７を重畳した構成であることから熱移送効率や熱分散効率が向上したものとなり、さらに放熱部１３においては、図６に示す従来のものが単層のグラファイトシート１にスリット２を形成しその表面積を確保したものに比べ、図１に示すものが複数のグラファイトシート７の表面をそれぞれ空間に露出させた構造となるため、放熱部１３におけるグラファイトシート７の露出面積を確保でき放熱効率を向上させたものとなっている。   That is, the conventional heat dissipating component 6 shown in FIG. 6 has a structure in which heat transfer and heat dissipation are performed using the single-layer graphite sheet 1, whereas the heat dissipating component 6 shown in FIG. The heat transfer efficiency and the heat dispersion efficiency are improved due to the superposed structure. Further, in the heat dissipating part 13, the conventional one shown in FIG. 6 forms the slit 2 in the single-layer graphite sheet 1 to reduce the surface area. 1 has a structure in which the surfaces of the plurality of graphite sheets 7 are exposed to the spaces, respectively, so that the exposed area of the graphite sheet 7 in the heat radiating portion 13 can be ensured and the heat radiation efficiency is improved. It has become a thing.

なお、グラファイトシート７はそれ自体が非常に柔らかいものであるため、放熱部１３を形成する分離領域１０において、隣接するグラファイトシート７間の空間を維持しグラファイトシート７同士が当接することで露出面が減少することを抑制することが重要となるため、この放熱部１３においては形状維持手段８が設けられている。   In addition, since the graphite sheet 7 itself is very soft, in the separation region 10 forming the heat radiating portion 13, the space between the adjacent graphite sheets 7 is maintained and the exposed surfaces of the graphite sheets 7 come into contact with each other. Since it is important to suppress the decrease in the heat dissipation portion 13, the shape maintaining means 8 is provided in the heat radiating portion 13.

また、具体的な形状維持手段８としては図１に示されるようなグラファイトシート７全面に金属薄板を貼り付け、この金属薄板の塑性変形により放熱部１３の形状を維持させる手法や、予め所定形状に屈曲させた樹脂板にグラファイトシート７を貼り付ける手法が挙げられる。   Further, as a specific shape maintaining means 8, a metal thin plate is attached to the entire surface of the graphite sheet 7 as shown in FIG. 1, and the shape of the heat radiating portion 13 is maintained by plastic deformation of the metal thin plate, or a predetermined shape in advance. There is a technique in which the graphite sheet 7 is attached to a resin plate that is bent in a straight line.

さらに、放熱部品６の形状としても図４に示されるように放熱部１３においてグラファイトシート７を順次屈曲させ放熱フィンのような形状とすることや、図５に示されるように放熱部１３の両端側部分に形状維持手段８となる金属薄板や樹脂薄板を設け、この放熱部１３の両端側を実質的に外部筐体などの構造体に固定する構造が考えられる。   Further, as the shape of the heat radiating component 6, the graphite sheet 7 is sequentially bent in the heat radiating portion 13 as shown in FIG. 4 to form a shape like a heat radiating fin, or both ends of the heat radiating portion 13 as shown in FIG. 5. A structure in which a metal thin plate or a resin thin plate serving as the shape maintaining means 8 is provided on the side portion and both end sides of the heat radiating portion 13 are substantially fixed to a structure such as an external housing is conceivable.

なお、前者となる図４に示された放熱部１３をグラファイトシート７を順次屈曲させた構造では、電子機器内の空き領域に応じたフィン形状を実現できることから、電子機器内の空き領域を有効に活用でき、後者となる図５に示された放熱部１３の両端側部分に形状維持手段８となる金属薄板や樹脂薄板を設けた構造では、多層状となったグラファイトシート７の厚みをもって放熱空間をも構成できるため、特に低背化要望の強い電子機器において有効に活用できるのである。   The former structure shown in FIG. 4 in which the heat dissipating portion 13 is formed by sequentially bending the graphite sheet 7 can realize a fin shape corresponding to the empty area in the electronic device, so that the empty area in the electronic device is effective. In the structure in which the metal thin plate or the resin thin plate serving as the shape maintaining means 8 is provided at both end portions of the heat radiation portion 13 shown in FIG. Since the space can also be configured, it can be effectively used particularly in electronic devices that have a strong demand for low profile.

本発明は、発熱電子部品の放熱対策に用いられる放熱部品に関し、放熱部品の放熱効率をさらに高められるという効果を有し、特に発熱電子部品を要する電子機器に有用である。   The present invention relates to a heat dissipation component used for heat dissipation of heat-generating electronic components, and has the effect of further improving the heat dissipation efficiency of the heat-dissipating components, and is particularly useful for electronic devices that require heat-generating electronic components.

本発明の一実施形態における放熱部品の断面図Sectional drawing of the thermal radiation component in one Embodiment of this invention 同放熱部品を用いた電子機器の内部構造の模式図Schematic diagram of the internal structure of electronic equipment using the same heat dissipation component 同放熱部品を構成するグラファイトシートの構造を示す模式図Schematic diagram showing the structure of the graphite sheet that composes the heat dissipation component 他の実施形態における放熱部品の断面図Sectional drawing of the thermal radiation component in other embodiment さらに他の実施形態における放熱部品の断面図Furthermore, sectional drawing of the thermal radiation component in other embodiment 従来の放熱部品の斜視図Perspective view of conventional heat dissipation component

符号の説明Explanation of symbols

７ グラファイトシート
８ 形状維持手段
９ 重畳領域
１０ 分離領域
１２ 熱移送部
１３ 放熱部 7 Graphite Sheet 8 Shape Maintenance Means 9 Overlapping Area 10 Separation Area 12 Heat Transfer Section 13 Heat Dissipation Section

Claims (4)

複数のグラファイトシートからなり、前記複数のグラファイトシートを重畳した重畳領域と、前記グラファイトシート間に所定の空間を設けた分離領域とを設け、前記重畳領域を熱移送部あるいは受熱部として、前記分離領域を放熱部とするとともに、前記分離領域に分離空間の形状を維持する形状維持手段を設けたことを特徴とする放熱部品。 The separation region is composed of a plurality of graphite sheets, and a separation region in which the plurality of graphite sheets are superimposed and a separation region in which a predetermined space is provided between the graphite sheets, and the separation region is used as a heat transfer unit or a heat receiving unit. A heat dissipating part characterized in that the region is a heat dissipating part and a shape maintaining means for maintaining the shape of the separation space is provided in the separation region. 形状維持手段を薄板状部材で形成したことを特徴とする請求項１に記載の放熱部品。 The heat dissipation component according to claim 1, wherein the shape maintaining means is formed of a thin plate member. 形状維持手段をグラファイトシートの略全面に設けたことを特徴とする請求項２に記載の放熱部品。 The heat dissipation component according to claim 2, wherein the shape maintaining means is provided on substantially the entire surface of the graphite sheet. 形状維持手段を分離領域の両端側に設けたことを特徴とする請求項２に記載の放熱部品。 The heat radiating component according to claim 2, wherein shape maintaining means is provided at both ends of the separation region.
JP2005013636A 2005-01-21 2005-01-21 Heat dissipation structure and heat dissipation parts Expired - Fee Related JP4529703B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2327542A1 (en) * 2009-11-27 2011-06-01 Kerafol Keramische Folien GmbH Multi-layer flexible heat conducting laminate
WO2016104759A1 (en) * 2014-12-25 2016-06-30 株式会社カネカ Heat transport structure and manufacturing method therefor
WO2017086241A1 (en) * 2015-11-20 2017-05-26 Jnc株式会社 Radiator, electronic device, illumination device, and method for manufacturing radiator
JP2017162807A (en) * 2016-03-03 2017-09-14 株式会社カネカ Heat dissipator, and structure including the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113166A (en) * 1977-03-25 1977-09-22 Hitachi Ltd Radiating fin for power transistor
JPH1065076A (en) * 1996-08-23 1998-03-06 Matsushita Electric Ind Co Ltd Heat sink of semiconductor heat-generating element
JPH10116942A (en) * 1996-10-09 1998-05-06 Fujikura Ltd Heat sink
JPH10126075A (en) * 1996-10-24 1998-05-15 Matsushita Electric Ind Co Ltd Heat sink and its manufacturing method
JPH1115566A (en) * 1997-06-24 1999-01-22 Hitachi Ltd Electronic equipment
JP2002329987A (en) * 2001-05-07 2002-11-15 Matsushita Electric Ind Co Ltd Radiator and manufacturing method therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113166A (en) * 1977-03-25 1977-09-22 Hitachi Ltd Radiating fin for power transistor
JPH1065076A (en) * 1996-08-23 1998-03-06 Matsushita Electric Ind Co Ltd Heat sink of semiconductor heat-generating element
JPH10116942A (en) * 1996-10-09 1998-05-06 Fujikura Ltd Heat sink
JPH10126075A (en) * 1996-10-24 1998-05-15 Matsushita Electric Ind Co Ltd Heat sink and its manufacturing method
JPH1115566A (en) * 1997-06-24 1999-01-22 Hitachi Ltd Electronic equipment
JP2002329987A (en) * 2001-05-07 2002-11-15 Matsushita Electric Ind Co Ltd Radiator and manufacturing method therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2327542A1 (en) * 2009-11-27 2011-06-01 Kerafol Keramische Folien GmbH Multi-layer flexible heat conducting laminate
WO2016104759A1 (en) * 2014-12-25 2016-06-30 株式会社カネカ Heat transport structure and manufacturing method therefor
JPWO2016104759A1 (en) * 2014-12-25 2017-11-24 株式会社カネカ Heat transport structure and manufacturing method thereof
US10710333B2 (en) 2014-12-25 2020-07-14 Kaneka Corporation Heat transport structure and manufacturing method thereof
WO2017086241A1 (en) * 2015-11-20 2017-05-26 Jnc株式会社 Radiator, electronic device, illumination device, and method for manufacturing radiator
JPWO2017086241A1 (en) * 2015-11-20 2018-09-06 Jnc株式会社 Radiator, electronic device, lighting device and method of manufacturing radiator
JP2017162807A (en) * 2016-03-03 2017-09-14 株式会社カネカ Heat dissipator, and structure including the same

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