JP2006203015A - Heat radiating component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further enhance heat radiation efficiency in a heat radiating component used for measures against heat radiation in a heat generation electronic component. <P>SOLUTION: The heat radiating component 6 comprises a plurality of graphite sheets 7, a superposition region 9 in which the plurality of graphite sheets 7 are superposed is set to be a heat transport section 12 and a heat reception section 11, a separation region 10 in which a prescribed space is provided between the graphite sheet 7 is set to be a heat radiation section 13, a shape maintaining means 8 for maintaining the shape of the separation space is provided in a separation region 10, and the shape maintaining means 8 is formed by a sheet of member made of metal. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat dissipating component used for heat dissipation measures of a heat generating electronic component.

  Generally, heat generating electronic components such as ICs used in notebook computers have an adverse effect on electronic devices using them as the temperature rises. Therefore, as a heat dissipation measure, between the heat generating electronic components and the heat sink member. Is provided with a heat conductive sheet.

  As the electronic equipment using the heat generating electronic components is being reduced in size, the slit 2 is formed at the tip of the graphite sheet 1 as shown in FIG. A structure that secures a heat dissipation function by the graphite sheet 1 by forming and increasing the surface area thereof has been proposed.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-7-109171

  However, as electronic devices equipped with heat generating electronic components are becoming more sophisticated and thinner as represented by notebook PC ICs, the amount of heat generated by the heat generating electronic components is increased and the distance from the heat generating electronic components to the device surface. Due to various factors such as narrowing, further heat dissipation characteristics are required of the heat dissipation component, and it has been difficult to sufficiently cope with the heat dissipation structure described above.

  Accordingly, an object of the present invention is to further increase the heat dissipation efficiency of a heat dissipation component using a graphite sheet.

  In order to achieve this object, the present invention is particularly composed of a plurality of graphite sheets, and a separation region in which a predetermined space is provided between the graphite sheets, with the overlapping region where the plurality of graphite sheets are superimposed serving as a heat transfer portion or a heat receiving portion. The area is a heat radiating portion, and shape maintaining means for maintaining the shape of the separation space in the separation area is provided, and the shape maintaining means is formed by a thin plate member made of metal.

  According to this configuration, by superimposing a plurality of graphite sheets, the heat transfer efficiency and heat dispersion efficiency in the overlap region can be increased, and the surface area in the separation region serving as a heat radiating portion can be secured, and the spatial shape in the separation region Is maintained by the shape maintaining means to stabilize the heat dissipation characteristics, and as a result, the heat dissipation efficiency of the heat dissipation component can be further increased.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a cross section of a heat dissipation component 6 of the present invention. As shown in FIG. 2, heat generated locally from a heat generating electronic component 3 such as an IC used in a notebook computer is mounted in an electronic device. Other electronic components 5 mounted on the substrate 4 are structured to dissipate heat while diffusing through the heat radiating component 6 to a region where the density is low and heat dissipation is high, and the electronic device itself is like a notebook computer. In a situation where it is difficult to provide a heat sink in an electronic device due to thinning and high functionality, a heat dissipation structure is incorporated into a heat conduction member used for heat transfer between the conventional heat generating electronic component 3 and the heat sink It is.

  As shown in FIG. 1, the heat dissipating component 6 includes a plurality of graphite sheets 7 and shape maintaining means 8 for maintaining the shape of the graphite sheets 7, and an overlapping region 9 in which the plurality of graphite sheets 7 are superimposed. The separation region 10 is formed in a fan shape in the overlapping direction and provided with a predetermined space between the adjacent graphite sheets 7.

  As the graphite sheet 7, a polymer resin sheet such as polyimide is carbonized at a temperature of 1200 ° C. or higher, and then graphitized at a temperature of 2600 ° C. or higher, and carbon is two-dimensionally closely bonded as shown in FIG. Examples of the multi-layered carbon layer structure include those exhibiting high thermal conductivity in the carbon bonding plane, those obtained by forming expanded graphite into a sheet shape, and those obtained by forming graphite fiber into a sheet shape.

  The heat radiating component 6 has the overlapping region 9 as a heat receiving portion 11 that receives the local heat emitted from the heat generating electronic component 3 as shown in FIG. 2, and the surface of each graphite sheet 7 on which the received heat is superimposed. A portion where heat is transferred to the separation region 10 while being dispersed inward is a heat transfer portion 12, and a portion where heat transferred by the heat transfer portion 12 is released to the outside is a heat dissipation portion 13.

  That is, the conventional heat dissipating component 6 shown in FIG. 6 has a structure in which heat transfer and heat dissipation are performed using the single-layer graphite sheet 1, whereas the heat dissipating component 6 shown in FIG. The heat transfer efficiency and the heat dispersion efficiency are improved due to the superposed structure. Further, in the heat dissipating part 13, the conventional one shown in FIG. 6 forms the slit 2 in the single-layer graphite sheet 1 to reduce the surface area. 1 has a structure in which the surfaces of the plurality of graphite sheets 7 are exposed to the spaces, respectively, so that the exposed area of the graphite sheet 7 in the heat radiating portion 13 can be ensured and the heat radiation efficiency is improved. It has become a thing.

  In addition, since the graphite sheet 7 itself is very soft, in the separation region 10 that forms the heat radiating portion 13, the space between the adjacent graphite sheets 7 is maintained and the exposed surfaces of the graphite sheets 7 come into contact with each other. Since it is important to suppress the decrease in the heat dissipation portion 13, the shape maintaining means 8 is provided in the heat dissipation portion 13.

  Further, as a specific shape maintaining means 8, a thin plate member made of metal is formed on the entire surface of the graphite sheet 7 as shown in FIG. 1, and the shape of the heat radiating portion 13 is maintained by plastic deformation of the thin plate member. In addition, the loss in heat conduction between the superimposed graphite sheets 7 can be suppressed.

  In addition, as a forming method, the metal for forming the thin plate member on the graphite sheet 7 can be easily formed by plating.

  Further, as the shape of the heat radiating component 6, the graphite sheet 7 is sequentially bent in the heat radiating portion 13 as shown in FIG. 4 to form a shape like a heat radiating fin, or both ends of the heat radiating portion 13 as shown in FIG. 5. A structure in which a thin plate member serving as the shape maintaining means 8 is provided on the side portion and both end sides of the heat radiating portion 13 are substantially fixed to a structure such as an external housing is conceivable.

  The former structure shown in FIG. 4 in which the heat dissipating portion 13 is formed by sequentially bending the graphite sheet 7 can realize a fin shape corresponding to the empty area in the electronic device, so that the empty area in the electronic device is effective. In the structure in which the thin plate-like members serving as the shape maintaining means 8 are provided at both end portions of the heat dissipating part 13 shown in FIG. 5 which is the latter, the heat dissipating space is formed with the thickness of the multilayered graphite sheet 7. Therefore, it can be effectively used in electronic devices that have a strong demand for low profile.

  The present invention relates to a heat dissipation component used for heat dissipation of heat-generating electronic components, and has the effect of further improving the heat dissipation efficiency of the heat-dissipating components, and is particularly useful for electronic devices that require heat-generating electronic components.

Sectional drawing of the thermal radiation component in one Embodiment of this invention Schematic diagram of the internal structure of electronic equipment using the same heat dissipation component Schematic diagram showing the structure of the graphite sheet that composes the heat dissipation component Sectional drawing of the thermal radiation component in other embodiment Furthermore, sectional drawing of the thermal radiation component in other embodiment Perspective view of conventional heat dissipation component

Explanation of symbols

7 Graphite Sheet 8 Shape Maintenance Means 9 Overlapping Area 10 Separation Area 12 Heat Transfer Section 13 Heat Dissipation Section

Claims (3)

The separation region is composed of a plurality of graphite sheets, and includes an overlapping region in which the plurality of graphite sheets are superimposed, and a separation region in which a predetermined space is provided between the graphite sheets, and the separation region is used as a heat transfer unit or a heat receiving unit. A heat radiating component characterized in that the region is a heat radiating portion, and a shape maintaining means for maintaining the shape of the separation space is provided in the separation region, and the shape maintaining means is formed of a thin plate member made of metal. 2. The heat dissipating component according to claim 1, wherein the shape maintaining means is provided on substantially the entire surface of the graphite sheet. The heat radiating component according to claim 1, wherein shape maintaining means is provided at both ends of the separation region.

Images