JPH1065076A - Heat sink of semiconductor heat-generating element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink that is used for a semiconductor heat- generating element in a printed circuit board, has improved heat radiating effect, is compact and light, and has a low material cost. SOLUTION: A plurality of thin-plate materials 4 are partially overlapped and fixed as the mounting surface of a semiconductor heat-generating element 8 of a heat sink 1, a plurality of thin-plate materials 4 are formed in one piece, air flow in/out are avoided and heat resistance between the thin-plate materials is reduced and heat conduction is improved, and at the same time the thin-plate materials 4 other than a semiconductor heat-generating element mounting part 2 of the heat sink 1 is formed as a heat radiating part that forms an independent thin-plate-shaped fin shape, and a wide surface area is constituted and contact convection with air is made, thus increasing heat radiating effect.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for a semiconductor heating element on a printed circuit board.

[0002]

2. Description of the Related Art A power supply on a printed circuit board conventionally used for various electric devices and a semiconductor heating element used for each circuit such as horizontal / vertical deflection, audio and video are generally made of aluminum which is called a heat sink. Screws or springs on extruded products or radiators processed from aluminum plate
Alternatively, a measure is taken to suppress the rise in temperature by attaching it with a fixing means such as an adhesive and to alleviate the temperature, thereby preventing thermal runaway or thermal destruction of the semiconductor heating element.

[0003]

However, in the above-mentioned conventional heat radiator on a printed circuit board, when a semiconductor heat generating element is mounted on the radiator and mounted on the printed circuit board, the heat radiator is heavy and the printed circuit board is soldered when the printed circuit board is soldered. In some cases, warping or bending occurs, which has a large adverse effect on solderability.

Further, in order to assure quality due to dropping or vibration of the product, it is necessary to mount a terminal or the like on a radiator and mount it on a printed circuit board, and to solder the terminal to the printed circuit board firmly. It is necessary to suppress the temperature rise by changing the volume of the radiator in response to the change in the power consumption of the element, that is, the change in the heat generation temperature. In addition to the soldering of the terminal, it was necessary to apply eyelet or plating to the terminal mounting hole and then solder the terminal mounting hole.

In addition, when a large radiator is mounted, it is difficult to perform a work during circuit adjustment and inspection, so that the number of working steps increases, and the cost also increases.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and to provide a radiator of a semiconductor heating element which is small and lightweight and has an appropriate heat radiation effect.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention aims at reducing the size and weight of a radiator, stacking a plurality of thin plate members cut to a required area, and partially fixing the semiconductor radiator. And heat is radiated by conducting heat from the semiconductor heating element to all of the plurality of thin plate members.

The plurality of thin plates other than the mounting portion of the semiconductor heating element are separated and independently formed as fin-shaped heat radiating portions to effectively radiate heat by increasing the contact area with air and changing convection. Things.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention provides a radiator to which a semiconductor heating element is mounted to enhance a heat radiation effect, wherein the radiator comprises a plurality of thin plates of various sizes and shapes. By providing a mounting portion for the semiconductor heating element formed by superposition and a heat radiating portion for suppressing a temperature rise of the semiconductor heating element, heat can be radiated from the semiconductor heating element. The heat radiation temperature suitable for the semiconductor heating element to be used can be changed by changing the area, the number of superimposed sheets, the interval, the shape, and the like.

As a second aspect of the present invention, a plurality of thin plate members are partially adhered or adhered to each other as a mounting portion of the semiconductor heat generating element of the radiator by surface-to-surface adhesion or surface-adhesion, and are fixed by overlapping. One sheet material is partially integrated,
By avoiding inflow and outflow of air and the like, the thermal resistance between the individual sheet materials can be reduced, and the heat conduction can be improved.

According to a third aspect of the present invention, each of the thin plate members other than the mounting portion of the semiconductor heat generating element of the radiator has a separate and independent thin plate fin shape, and has a surface area as large as possible. Then, the heat radiation effect is increased by contact convection with air, and the heat radiation temperature can be arbitrarily set by variously changing the fin shape and the interval between the fins.

Further, as described in claim 4, the plurality of thin plates constituting the radiator are made of a metal having good heat conductivity, such as aluminum, aluminum die cast, copper, or iron. Effective heat conduction can be performed.

Further, by providing the radiator mounting terminal on a part of the thin plate material, the radiator can be easily mounted on the printed circuit board.

In practicing the present invention, the surface area of the thin plate material can be changed by increasing or decreasing the vertical and horizontal dimensions as needed, and furthermore, by increasing or decreasing the number of superposed thin plate materials, the heat radiation effect of the radiator can be improved. It is also possible to control the area occupied on the printed circuit board.

Therefore, according to the present invention, it is possible to easily secure a surface area several times as large as that of the conventional radiator, and at the same time, it is possible to greatly reduce the weight and to attach the product to a printed circuit board against dropping, vibration, etc. It is possible to implement a radiator that is small and lightweight and has an excellent heat radiation effect without special measures for guaranteeing the strength.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a radiator to which a semiconductor heating element according to an embodiment of the present invention is attached, FIG. 2 is a perspective view showing a plurality of thin plates constituting the radiator, and FIGS. FIG. 4C is a top view showing a different embodiment of the semiconductor heat generating element mounting portion of the radiator, and FIGS. 4A to 4C are top views showing different embodiments of the fin shape which is the heat radiating portion of the radiator.

1 to 4, reference numeral 1 denotes a semiconductor heat-generating element mounting portion 2, a radiator having a fin-shaped heat radiating portion 3, 4 a thin plate material, 5 a fixing agent such as an adhesive or a wax or a solder. Reference numeral 6 denotes a fixed body such as a rivet, reference numeral 7 denotes a reinforcing plate, and reference numeral 8 denotes a semiconductor heating element, which is mounted on the semiconductor heating element mounting portion 2 by a mounting screw 9. Reference numeral 10 denotes a radiator mounting terminal.

In FIG. 1, the vicinity of the center of a plurality of thin plate members 4 is superimposed by using a fixing agent 5 or is brought into surface contact with ultrasonic bonding or the like and fixed to form a semiconductor heating element mounting portion 2.

Further, in the plurality of thin plate members 4, the heat radiating portion 3 having a fin shape is formed by separating and independently forming portions other than the semiconductor heat generating element mounting portion 2 substantially in a radial manner, thereby forming the radiator 1 as a whole. .

Next, a semiconductor heat generating element 8 is mounted on the semiconductor heat generating element mounting portion 2 of the heat radiator 1 with mounting screws 9, and a radiator mounting terminal 10 provided on the heat radiating portion 3 and a lead leg 8a of the semiconductor heat generating element 8 are provided. Is inserted into an insertion hole of a printed circuit board (not shown) and mounted.

FIG. 2 shows a state in which a plurality of thin plate members 4 are stacked, and FIG.
Is formed. 3 (a) to 3 (c) show different examples of the configuration of the semiconductor heating element mounting portion 2, respectively. FIG.
Are fixed together by using a fixing agent 5 such as an adhesive, a wax, or a soldering agent to form a semiconductor heating element mounting portion 2.

FIG. 3B shows a semiconductor heat-generating element mounting portion 2 in which the vicinity of the center of a plurality of thin plate members 4 is overlapped and fixed using a fixing member 6 such as a rivet. is there.

FIG. 3 (c) shows the vicinity of the center of the plurality of thin plate members 4 superimposed and fixed using a fixing body 6 via a reinforcing plate 7 or the like, and the semiconductor heating element mounting portion 2 is fixed. It is formed.

FIGS. 4A to 4C show examples of the shapes of the fins forming the heat radiating portion 3, respectively.
A plurality of thin plate members 4 other than the semiconductor heating element mounting part 2 are separated and made independent to form a fin shape.
FIG. 4A shows an example in which the tip is simply radial, FIG. 4B shows an example in which the tip is bent in a radial direction, and FIG. 4C shows an example in which the tip is bent in a right angle direction.

The fins serving as the heat radiating portions 3 are formed by first superposing a plurality of thin plate members 4 as shown in this embodiment, and then separating the two end portions of the thin plate members 4 into a fin shape and making them independent. It is needless to say that the plurality of thin plate members 4 may be processed in advance into a fin shape and then overlapped.

Further, in the present embodiment, the semiconductor heat generating element mounting portion 2 is formed by fixing near the center of a plurality of thin plate members 4 using a fixing agent 5, a fixing body 6, and the like. However, it goes without saying that the fixing means may be any means as long as it can perform surface adhesion or surface adhesion such as screwing or ultrasonic bonding, or surface welding.

[0028]

As described above, according to the present invention, a plurality of thin plate members are partially adhered or adhered to each other as a mounting portion of a semiconductor heat generating element of a radiator by superimposing and fixing them. Since the plurality of thin plate members are partially integrated, it is possible to avoid the inflow and outflow of air and the like, to reduce the thermal resistance between the individual thin plate members and improve the heat conduction,
The individual sheet materials other than the mounting part of the semiconductor heating element of the radiator shall be separated and independent thin plate fin shape,
The heat dissipation effect can be increased by configuring the surface area as large as possible to cause the contact convection with the air.

Further, since the radiator is constituted by using a plurality of thin plates, the material, area, number of superposed sheets, fin spacing, shape, etc. of the thin plates can be changed depending on the heat generation temperature of the semiconductor heating element. Accordingly, it is possible to set the heat radiation temperature suitable for the semiconductor heating element used.

Further, the shape of the radiator can be freely and easily changed, and the space factor at the time of mounting the printed circuit board is improved.

Furthermore, since a thin plate material is used, an advantageous effect is obtained that the size and weight can be reduced and the material cost can be reduced compared to the conventional product.

[Brief description of the drawings]

FIG. 1 is a perspective view of a radiator according to an embodiment of the present invention.

FIG. 2 is a perspective view of a plurality of thin plates constituting the radiator.

FIG. 3 is a top view showing a different configuration of a semiconductor heating element mounting portion of the radiator.

FIG. 4 is a top view showing a different configuration of a radiator having a fin shape of the radiator.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 radiator 2 semiconductor heat generating element mounting portion 3 heat radiating portion 4 thin plate material 5 fixing agent 6 fixed body 7 reinforcing plate 8 semiconductor heat generating element 8 a lead foot 9 mounting screw 10 radiator mounting terminal

Claims (5)

[Claims] 1. A semiconductor heating element comprising a stack of a plurality of thin plate members, comprising: a mounting section for a semiconductor heating element; and a heat radiating section for suppressing a temperature rise of the semiconductor heating element. Radiator. 2. A radiator for a semiconductor heating element according to claim 1, wherein a plurality of thin plate members are partially fixed to provide a mounting portion for the semiconductor heating element. 3. The heat-dissipating portion, wherein a plurality of thin plate members other than a portion constituting a mounting portion of the semiconductor heating element are formed as separate and independent fins.
Or a radiator of the semiconductor heating element according to 2. 4. The semiconductor heating element according to claim 1, wherein the material of the thin plate is a metal having good heat conductivity, such as aluminum, aluminum die-cast, copper, or iron. Radiator. 5. A radiator for a semiconductor heat generating element according to claim 1, wherein a radiator mounting terminal for mounting the radiator to a through hole of the printed circuit board is provided on a part of the thin plate material. .