JP2001267477A - Fin for heat dissipation and its mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure adhering strength, to improve a quality and to lower a cost by simplifying structure, facilitating production, securing sufficient strength and realizing soldering and automatic mounting to a substrate, etc. SOLUTION: A fin for heat dissipation 1 obtained by bending a metallic plate is provided with plural fin 3 and a connection plane 4 integrally by bending the metallic plate. Furthermore, after bending the metallic plate to form the fin for heat dissipation, the fin for heat dissipation is soldered entirely and next, the fin for heat dissipation is heated to adhere and integrate solder to the fin soldering surface of the substrate, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiating fin for dissipating heat generated in a substrate or the like, for example, a semiconductor element, an electronic component, an electric component, or the like, and a mounting method thereof.

[0002]

2. Description of the Related Art This kind of heat dissipating fin is formed by extruding aluminum, a metal plate having a plurality of pores, a metal fin is inserted into and fixed to the pores, and a metal thick plate is machined. Various structures have been proposed, such as those formed by fins, and those formed by bending a thin metal plate. Conventionally, assuming that a thin metal plate is bent, a fin portion 31 is formed by bending an aluminum thin plate in a wave shape as shown in FIGS. 13 and 14, and a base plate 32 is joined to one of the fin portions 31. On the other hand, there is one in which a wire mesh 33 is joined to form a heat dissipating fin 30 (see JP-A-10-313080).

The radiating fin 30 has a fin portion 32 integrally joined to a base plate 32 and a wire net 33 by brazing at the same time. And this heat radiation fin 3
Most of the conventional heat dissipating fins as well as the heat dissipating fins are made of aluminum having a high thermal conductivity, so that they cannot be soldered. Therefore, when these fins 30 and the like are fixed to the semiconductor element, it is difficult to automatically mount them, and at present, the bonding strength is increased by performing screw bonding after conducting silicon bonding.

[0004]

In the prior art described in the above publication, the surface of the fin portion 31 to be bonded to the base plate 32 is corrugated and in line contact, so that the brazing operation is troublesome and sufficient bonding is required. In addition to difficulty in obtaining strength, heat dissipation is not performed efficiently due to poor contact, which may cause deterioration in characteristics of semiconductor elements, electronic components, and the like. Further, there is a problem in productivity such as high cost because soldering cannot be performed, and automatic mounting on a substrate such as a semiconductor element cannot be performed.

The present invention has been made in view of the above circumstances, has a simple structure, is easy to manufacture, can secure sufficient strength, can be soldered to a base, etc., and can be easily mounted automatically. With sufficient adhesive strength to improve quality.
It is an object of the present invention to provide a heat dissipating fin capable of reducing costs and a mounting method thereof.

[0006]

According to the present invention, the following technical measures have been taken in order to achieve the above object. That is, the heat radiation fin according to the present invention is a heat radiation fin formed by bending a metal plate having a high thermal conductivity that can be adhered to a base or the like, and the metal plate can be soldered or soldered. It is made of a metal material that cannot be used, and is characterized in that a plurality of fin portions and a flat surface portion to be joined to the base or the like are integrally provided by bending a metal plate.

In this case, the metal plate is made of copper, brass, iron,
A metal having a high thermal conductivity that can be soldered, such as stainless steel, is preferable, and a metal sheet that can be bent and formed mechanically by a press machine or the like is preferable. As a result, automatic mounting on a base or the like by soldering becomes possible, thereby improving productivity and reducing costs. In addition, with this configuration, the metal plate is bent and formed by a press machine, and the fin portion and the joining flat portion connecting the fin portion can be integrally and easily provided. Even if it is not necessary, the flat portion can be directly fixed to a joining surface (a solderable metal surface) of a base or the like by soldering.

Further, the rigidity can be increased by forming a part of the fin portions in a two-ply shape, or the bent corner portion can be formed in a sharp shape to secure the contact area of the joint flat portion with the base or the like. Therefore, there is no possibility of causing poor adhesion to the substrate or the like, and sufficient adhesive strength can be obtained and rigidity can be increased to improve quality and durability. The heat-dissipating fin according to the present invention is formed of a metal material to which the metal plate can be soldered or cannot be soldered, and a plurality of fin portions and a flat surface portion joined to the base or the like are integrally formed by bending. , And is characterized in that at least a part of the facing surface of the fin portion is provided with one or a plurality of protrusions bulging toward the facing surface.

In this case, it is preferable that the protruding portion is easily provided by step-pressing with a press machine, and is provided at a location where a rib-like shape can be provided with a reinforcing effect and a better heat radiation effect can be exhibited. Therefore, the protrusion is provided at a connection portion between the fin portion and the joint plane portion, that is, at a corner, or is provided between the fin portion opposing surfaces at right angles to the joint plane portion, so that the reinforcing and heat dissipation effects are provided. You can expect both. By providing the protruding portion on the fin portion and / or the joining flat portion, a change in convection of air flowing in the vicinity of the fin portion in parallel with the fin portion is generated, and a better heat radiation effect can be obtained. In addition,
Also in this case, the metal plate is preferably made of a material that can be soldered.

According to this structure, the structure is simple, the production is easy, and sufficient strength can be obtained, the cost can be reduced, and the reinforcement and heat radiation effects can be sufficiently exhibited to improve the quality. It is possible to achieve. Further, the heat radiation fin according to the present invention is characterized in that the fin is plated with solder. By adopting such a configuration, when soldering to the base or the like, there is no need to separately sandwich solder between the base and the like and the bonding flat portion, and only by applying heat to the radiating fins, the base or the like can be soldered. The heat radiation fins can be fixed, and automatic mounting can be easily performed. As a result, it is possible not only to improve the productivity but also to reduce the cost.

Further, according to the method of mounting the heat dissipating fins on the base or the like according to the present invention, the joining surface portion of the heat-dissipating fins to which the solder plating has been applied is contacted with the fin joint surface of the base or the like. In this state, heat is applied to the fins (for example, the fins are heated by energizing the fins) so that the solder plating layer on the bonding surface is bonded and integrated with the fin bonding surface of the base or the like. According to the heat dissipating fin mounting method of the present invention, fin mounting of a semiconductor element on a base or the like can be easily and automatically performed, and not only can productivity be reduced but also cost can be reduced. .

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment of a heat radiation fin 1 according to the present invention, and FIG. 1 shows a state of adhesion to a base 2 and the like. This heat radiation fin 1
Is formed by bending a single metal sheet made of a metal material capable of being soldered, for example, copper, brass, iron, stainless steel, or the like by a press machine, and forming a plurality of fin portions 3 parallel to each other;
A U-shaped groove is formed in a state in which the U-shaped grooves are arranged in the width direction with the joint flat portion 4 connecting the bases of the fin portions 3. Of the fin portions 3, the fin portions 3 except for both ends in the width direction are closely overlapped with each other, and the rigidity of the fin 1 is increased.

The fin portion 3 and the joining flat portion 4 to the base 2 and the like are perpendicular to each other, and the corners are sharply bent. The contact area is increased. The heat-radiating fins 1 integrally formed in this manner are finished by solder plating (doughing, slicing, galvanizing, etc.). As a result, the entire heat dissipating fin 1 is plated with solder. When the fin 1 is bonded to the base 2 or the like, the method of the present invention can be adopted. That is, by bringing the joint flat portion 4 into contact with the fin bonding surface of the base 2 or the like and applying heat to the fins 1 to apply heat, the solder plating layer on the lower surface of the joint flat portion 4 melts, 4, a soldering layer 5 is formed on the surface of the base 2 or the like, and is bonded and integrated.

Therefore, as in the conventional example, the work of interposing a plate-shaped solder between the heat radiation fin and the base can be omitted, so that the automatic mounting can be performed simply, efficiently and reliably. . . According to the first embodiment, the structure of the fin 1 is extremely simple and easy to manufacture, and furthermore, the rigidity is high and tough, so that not only the productivity and the cost of the fin are reduced, but also the bonding area is sufficient. And the bonding flat portion 4 of the fin 1 can be directly soldered to the bonding surface of the base 2 or the like, so that a significant improvement in productivity by automatic mounting can be expected.

The rigidity of the fins 1 can be further increased by further folding and doubling the outer sides of the fins 3 as shown in FIG.
FIG. 5 shows a second embodiment of the heat dissipating fin 1 according to the present invention, which is different from the first embodiment in that the joint flat portion 4 is provided only at the center in the left-right width direction, and the fin portions 3 on both sides thereof are provided. Then, an oblique fin portion 3a connected to this at an acute angle is provided. In this embodiment, the total bonding area of the bonding flat portion 4 is smaller than that of the first embodiment, but since the bonding portions 6 are also formed on both outer sides in the left-right width direction, the desired bonding area and bonding strength can be reduced. Obtainable.

Also in the second embodiment, since the metal thin plate is made of a metal material that can be soldered, it can be finished by solder plating after molding.
As in the first embodiment, soldering to the base 2 and the like and automatic mounting can be performed, and the same operational effects can be expected. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals in FIG. 1 and the detailed description is omitted. FIG.
FIG. 8 shows a third embodiment of the heat dissipating fin 1 according to the present invention.
A rib-like reinforcing projection 7 swelling from the lower side between the opposing surfaces of the fins 3 at the time of press molding at the connection corners of the joint flat portion 4 and the joining flat portion 4 by step pressing.

In the third embodiment, the projections 7 can of course provide a reinforcing effect for the fins 1,
As shown in FIG. 8, a change occurs in the convection of the air around the fin 1, the heat radiation effect is further enhanced, and the heat radiation performance of the fin can be improved. Except for the reinforcement and the enhancement of the heat radiation effect, the configuration is the same as that of the first embodiment. Therefore, the same reference numerals as those in FIGS. 1 to 3 denote the same components, and a detailed description thereof will be omitted. 9 to 12 show a fourth embodiment of the heat radiation fin 1 according to the present invention.

The difference between the fourth embodiment and the third embodiment is that the protrusion 7 extends to the tip of each of the fins 3, which can further enhance the reinforcing and heat dissipation effects. Exerts the same operation and effect as the third embodiment. 9 and 10 show an example in which one projection 7 is provided in each fin 3, and FIG. 12 shows an example in which two projections 6 are provided in each fin 3. I have. The number of these protrusions 7 can be appropriately selected. These projections 7 can be easily formed by embossing with a press machine.

The present invention is not limited to the above embodiments. For example, the number and shape of the fins 3 can be arbitrarily set according to the size and shape of the base 2 and the like. The fins 1 may be formed by bending a metal plate made of a non-solderable metal material such as aluminum, and may be directly adhered to the base 2 or the like without finishing by solder plating. Each of them can be appropriately changed depending on the embodiment.

[0020]

As is clear from the above description, the radiating fin according to the present invention comprises a metal plate made of a metal material which can be soldered, and a plurality of fin portions formed by bending and attaching to the base member. Since the joint flat part is provided integrally, the structure is simple, easy to manufacture and sufficient strength can be secured, soldering to the base etc. is possible and the required bonding area , The heat dissipation efficiency can be prevented from lowering due to poor contact, and automatic mounting is possible, sufficient adhesive strength is obtained, and cost reduction can be achieved.

Further, according to the method of mounting the heat dissipating fins on the base or the like according to the present invention, the bonding surface portion of the soldered heat dissipating fins to the base or the like abuts on the fin joint surface of the base or the like. In this state, heat is applied to the fins to melt the solder plating layer at the joint surface and form a soldering layer on the fin joint surface of the base or the like to bond and integrate, so that mounting can be performed very easily and efficiently. As a result, the heat radiation fins can be automatically mounted on a base or the like, thereby improving the productivity and reducing the cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a heat-dissipating fin according to the present invention, in a state of being bonded to a base or the like.

FIG. 2 is a perspective view of the same embodiment.

FIG. 3 is an enlarged front view of the same embodiment.

FIG. 4 is a front view showing a partially modified example of the embodiment.

FIG. 5 is a perspective view showing a second embodiment of the heat radiation fin according to the present invention.

FIG. 6 is a front view showing a third embodiment of a heat radiation fin according to the present invention.

FIG. 7 is a bottom view of FIG. 6;

FIG. 8 is an operation explanatory view of the third embodiment.

FIG. 9 is a front view showing a fourth embodiment of the heat radiation fin according to the present invention.

FIG. 10 is a bottom view of FIG. 9;

FIG. 11 is an operation explanatory view of the fourth embodiment.

FIG. 12 is a bottom view showing a modification of the fourth embodiment.

FIG. 13 is an overall perspective view showing a conventional example.

FIG. 14 is a front view of the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat-dissipating fin 2 Base 3 Fin part 3a Fin part 4 Joint plane part 5 Soldering layer 6 Joint surface part 7 Projection

Claims (5)

[Claims] 1. A heat dissipating fin formed by bending a metal plate, wherein a plurality of fin portions and a joint flat portion are integrally provided by bending the metal plate. Fins. 2. A heat dissipating fin formed by bending a metal plate, wherein a plurality of fin portions and a joint flat portion are integrally provided by bending the metal plate, and at least one of the opposing surfaces of the fin portion is provided. A radiating fin characterized in that a protrusion protruding toward the facing surface is provided at one or a plurality of locations on the portion. 3. The heat dissipating fin according to claim 1, wherein the fin is solder-plated. 4. A mounting method for bonding a heat dissipating fin made of a metal plate to a base or the like, wherein the joint surface portion of the solder-plated heat dissipating fin to the base or the like contacts the fin joint surface of the base or the like. A method for mounting a radiating fin, comprising: applying heat to the fin in a state where the fin is in contact with the fin so as to bond and integrate the solder plating layer on the bonding surface with the fin bonding surface of the base or the like. 5. A heat radiation fin is formed by bending a metal plate, and then the entire heat radiation fin is subjected to solder plating, and then heat is applied to the heat radiation fin to apply the solder plating to the fin joint surface of the base or the like. A method for mounting a heat dissipating fin, which is integrated by bonding.