JP2001102786A - Radiator of electronic part and manufacturing method therefor - Google Patents
Radiator of electronic part and manufacturing method thereforInfo
- Publication number
- JP2001102786A JP2001102786A JP28108999A JP28108999A JP2001102786A JP 2001102786 A JP2001102786 A JP 2001102786A JP 28108999 A JP28108999 A JP 28108999A JP 28108999 A JP28108999 A JP 28108999A JP 2001102786 A JP2001102786 A JP 2001102786A
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- electronic component
- plane
- side edge
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、たとえばトランジ
スタやＩＣやＬＳＩやダイオードやサイリスタなどの発
熱を伴う電子部品を取り付け、これらの電子部品で発生
する熱を伝導伝熱させ、放熱フィンから放熱させるよう
にした電子部品の放熱器および放熱器の製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting heat-generating electronic components such as transistors, ICs, LSIs, diodes, and thyristors, and conducting and transferring the heat generated by these electronic components to radiate heat from radiating fins. The present invention relates to a radiator for an electronic component and a method for manufacturing the radiator.
【０００２】[0002]
【従来の技術】図９は放熱フィン片が千鳥配列の格子状
になった電子部品の放熱器の製造方法を示すものであ
り、まず、図９の（ａ）に示すように、アルミニウムな
どの金属板を櫛歯状に打ち抜くことにより、一側縁部１
０ａに複数の放熱フィン片１０ｂが連接された放熱フィ
ン１０を形成する。なお、１０ｃは一側縁部１０ａに穿
設した後述する連結ピンの挿入孔である。つぎに、図９
の（ｂ）に示すように、放熱フィン１０，１０の間に、
その一側縁部１０ａに穿設した連結ピンの挿入孔１０ｃ
に対応する位置に連結ピンの挿入孔１１ａが穿設された
アルミニウムなどの金属製のスペーサー１１を介在させ
て積層配列する。つぎに、図９の（ｃ）に示すように、
前記のように積層配列したスペーサー１１の連結ピンの
挿入孔１１ａと放熱フィン１０の連結ピンの挿入孔１０
ｃに連結ピン１２を挿入して、この連結ピン１２の両端
をかしめ押圧して、電子部品の放熱器の製造が完了す
る。図１０は前記のようにして製造された放熱フィン片
が千鳥配列の格子状になった電子部品の放熱器の斜視図
である。2. Description of the Related Art FIG. 9 shows a method of manufacturing a radiator for an electronic component in which radiating fin pieces are arranged in a staggered lattice pattern. First, as shown in FIG. By punching a metal plate into a comb shape, one side edge 1
The heat radiation fin 10 in which a plurality of heat radiation fin pieces 10b are connected to each other is formed at 0a. Reference numeral 10c denotes an insertion hole for a connecting pin, which will be described later, formed in the one side edge 10a. Next, FIG.
(B), between the radiation fins 10,
An insertion hole 10c for a connecting pin formed in one side edge 10a.
Are arranged in a stacked manner with a spacer 11 made of metal such as aluminum provided with a hole 11a for insertion of a connecting pin at a position corresponding to. Next, as shown in FIG.
The insertion holes 11a of the connection pins of the spacers 11 and the insertion holes 10 of the connection pins of the radiation fins 10 which are stacked as described above.
Then, the connecting pin 12 is inserted into the connector c, and both ends of the connecting pin 12 are crimped and pressed to complete the manufacture of the radiator of the electronic component. FIG. 10 is a perspective view of a radiator of an electronic component in which the radiating fin pieces manufactured as described above are arranged in a staggered lattice.
【０００３】[0003]
【発明が解決しようとする課題】前記のような従来の放
熱フィン片が千鳥配列の格子状になった電子部品の放熱
器においては、一側縁部１０ａに放熱フィン片１０ｂが
連接して形成された放熱フィン１０と、金属製のスペー
サー１１と、連結ピン１２とを用意し、放熱フィン１０
と金属製のスペーサー１１とを交互に積層して、これら
に穿設した連結ピンの挿入孔１０ｃ，１１ａに連結ピン
１２を挿入し、この連結ピン１２の両端を押圧してかし
め固定して製造しなければならないので、放熱フィン１
０とスペーサー１１とを交互に積層する工程が面倒で、
製造コストが高くなるなどの問題があった。本発明は、
前記従来のような問題をなくすため、構成部品が少な
く、構成および製造が簡単で、製造コストを安くするこ
とができるような電子部品の放熱器および放熱器の製造
方法を提供することを目的としたものである。In a conventional radiator for electronic parts in which the radiating fin pieces are arranged in a staggered lattice as described above, the radiating fin pieces 10b are connected to one side edge 10a. The radiation fin 10, the metal spacer 11, and the connection pin 12 are prepared.
And metal spacers 11 are alternately laminated, and the connection pins 12 are inserted into the insertion holes 10c and 11a of the connection pins formed in these, and both ends of the connection pins 12 are pressed and caulked and fixed. Radiating fins 1
The step of alternately laminating 0 and spacers 11 is troublesome,
There were problems such as an increase in manufacturing cost. The present invention
An object of the present invention is to provide a radiator of an electronic component and a method of manufacturing a radiator that can reduce the number of components, reduce the number of components, simplify the configuration and manufacture, and reduce the manufacturing cost. It was done.
【０００４】[0004]
【課題を解決するための手段】前記目的を達成するため
に、請求項１に係る発明は、１枚の直角四辺形の金属板
Ｗの打ち抜きにより櫛歯状に同一形状のものが２枚形成
された、側縁部１ａで連結された複数の放熱フィン片１
ｂを有する放熱フィン１を複数枚用意し、金属基板２の
平面上に形成した平行な複数の溝２ａに、前記放熱フィ
ン１の側縁部１ａを嵌合固定して構成したことを特徴と
する電子部品の放熱器としたものである。In order to achieve the above object, according to the first aspect of the present invention, two pieces each having the same shape in a comb shape are formed by punching a single rectangular quadrangular metal plate W. Radiating fin pieces 1 connected at the side edge 1a
b, a plurality of heat dissipating fins 1 having a plurality of heat sink fins 1 are prepared, and side edges 1a of the heat dissipating fins 1 are fitted and fixed to a plurality of parallel grooves 2a formed on a plane of the metal substrate 2. It is used as a radiator for electronic components.
【０００５】また、請求項２に係る発明は、前記金属基
板２の平面上に形成した平行な複数の溝２ａに、前記放
熱フィン１の側縁部１ａを、前記放熱フィン片１ｂが斜
め対向して千鳥配列の格子状になるように嵌合固定した
ことを特徴とする請求項１に記載の電子部品の放熱器と
したものである。According to a second aspect of the present invention, the side edges 1a of the radiating fins 1 and the radiating fin pieces 1b are obliquely opposed to a plurality of parallel grooves 2a formed on the plane of the metal substrate 2. 2. A radiator for an electronic component according to claim 1, wherein the radiator is fitted and fixed in a staggered lattice.
【０００６】また、請求項３に係る発明は、前記金属基
板２の平面上に形成した平行な複数の溝２ａに、前記放
熱フィン１の側縁部１ａを、前記放熱フィン片１ｂが対
向して格子状になるように嵌合固定したことを特徴とす
る請求項１に記載の電子部品の放熱器としたものであ
る。According to a third aspect of the present invention, the heat dissipating fin pieces 1b face the side edges 1a of the heat dissipating fins 1 to a plurality of parallel grooves 2a formed on the plane of the metal substrate 2. 2. A radiator for an electronic component according to claim 1, wherein the radiator is fitted and fixed so as to form a lattice.
【０００７】また、請求項４に係る発明は、１枚の直角
四辺形の金属板Ｗから、側縁部１ａで連結された複数の
放熱フィン片１ｂを有する放熱フィン１が、櫛歯状に同
一形状のものが２枚形成されるように打ち抜き形成する
工程と、金属基板２の平面上に平行な複数の溝２ａを形
成する工程と、前記金属基板２の平面上に形成した複数
の溝２ａに、前記放熱フィン１の側縁部１ａを嵌合して
固定する工程とよりなることを特徴とする電子部品の放
熱器の製造方法としたものである。According to a fourth aspect of the present invention, the heat dissipating fins 1 having a plurality of heat dissipating fin pieces 1b connected by the side edges 1a are formed into a comb-like shape from a single rectangular metal plate W. A step of punching and forming two pieces of the same shape, a step of forming a plurality of parallel grooves 2a on the plane of the metal substrate 2, and a plurality of grooves formed on the plane of the metal substrate 2. And a step of fitting and fixing the side edge portion 1a of the heat radiation fin 1 to the heat radiation fin 2a.
【０００８】[0008]
【発明の実施の形態】以下、本発明に係る電子部品の放
熱器および放熱器の製造方法の実施の形態について図面
を参照しながら詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a radiator of an electronic component and a method of manufacturing the radiator according to the present invention will be described in detail with reference to the drawings.
【０００９】本発明の請求項１に係る電子部品の放熱器
は、たとえば熱伝導の良好なアルミニウムなどの１枚の
直角四辺形の金属板Ｗの打ち抜きにより櫛歯状に同一形
状のものが２枚形成された、側縁部１ａで連結された複
数の放熱フィン片１ｂを有する放熱フィン１を複数枚用
意し、アルミニウムなどの金属基板２の平面上に形成し
た平行な複数の溝２ａに、前記放熱フィン１の側縁部１
ａを嵌合固定して構成した電子部品の放熱器としたもの
である。このように、電子部品の放熱器を構成すること
により、構成部品が少なく、構成が簡単で、製造コスト
が安くなる。A radiator for an electronic component according to a first aspect of the present invention is a radiator having the same shape in a comb shape by punching a single rectangular quadrangular metal plate W made of, for example, aluminum having good heat conductivity. A plurality of radiating fins 1 having a plurality of radiating fin pieces 1b connected by a side edge portion 1a are prepared, and a plurality of parallel radiating grooves 2a formed on a plane of a metal substrate 2 such as aluminum are prepared. Side edge 1 of the radiation fin 1
a is a radiator of an electronic component configured by fitting and fixing a. By configuring the radiator of the electronic component in this way, the number of components is small, the configuration is simple, and the manufacturing cost is low.
【００１０】図１は本発明の請求項２に係る電子部品の
放熱器の実施の形態の正面図、図２は図１のＸ−Ｘ線に
おける水平断面図、図３はこの電子部品の放熱器の斜視
図である。この請求項２に係る発明の実施の形態は、前
記金属基板２の平面上に形成した平行な複数の溝２ａ
に、前記放熱フィン片１ｂが斜め対向して千鳥配列の格
子状になるように、前記放熱フィン１の側縁部１ａを嵌
合固定して電子部品の放熱器を構成したものである。こ
のように、電子部品の放熱器を構成することにより、前
記放熱フィン片１ｂが斜め対向して千鳥配列の格子状に
なるので、放熱フィン片１ｂの間の空気の流通が良くな
り、放熱効果が良くなる。FIG. 1 is a front view of an electronic component radiator according to a second embodiment of the present invention, FIG. 2 is a horizontal sectional view taken along line XX of FIG. 1, and FIG. It is a perspective view of a container. According to the embodiment of the present invention, a plurality of parallel grooves 2a formed on a plane of the metal substrate 2 are provided.
Further, the heat dissipating fins 1b are obliquely opposed to each other and the side edges 1a of the heat dissipating fins 1 are fitted and fixed so as to form a lattice shape in a staggered arrangement, thereby forming a heat dissipator for an electronic component. In this way, by forming the radiator of the electronic component, the radiating fin pieces 1b are obliquely opposed to form a staggered lattice shape, so that the flow of air between the radiating fin pieces 1b is improved, and the heat radiation effect is improved. Will be better.
【００１１】図４は本発明の請求項３に係る電子部品の
放熱器の実施の形態の正面図、図５は図４のＹ−Ｙ線に
おける水平断面図、図６はこの電子部品の放熱器の斜視
図である。この請求項３に係る発明の実施の形態は、前
記金属基板２の平面上に形成した平行な複数の溝２ａ
に、前記放熱フィン片１ｂが対向して格子状になるよう
に、前記放熱フィン１の側縁部１ａを嵌合固定して電子
部品の放熱器を構成したものである。このように、電子
部品の放熱器を構成しても、前記放熱フィン片１ｂが対
向した間を空気が流通することによって、放熱効果を得
ることができる。FIG. 4 is a front view of an electronic component radiator according to a third embodiment of the present invention, FIG. 5 is a horizontal sectional view taken along line YY of FIG. 4, and FIG. It is a perspective view of a container. According to the embodiment of the present invention, a plurality of parallel grooves 2a formed on a plane of the metal substrate 2 are provided.
Then, the heat dissipating fin pieces 1b are opposed to each other and the side edges 1a of the heat dissipating fins 1 are fitted and fixed so as to form a lattice shape, thereby forming a radiator for an electronic component. As described above, even when the radiator of the electronic component is configured, the air can be radiated between the radiating fin pieces 1b facing each other, so that a radiating effect can be obtained.
【００１２】なお、前記放熱フィン１の一側縁１ａを、
前記金属基板２の平面上の平行な溝２ａに嵌合固定する
には、前記一側縁１ａが容易に上方から嵌合し得るよう
に前記溝２ａを形成し、各溝２ａに各放熱フィン１の一
側縁１ａを嵌合した後に、前記溝２ａ間を押圧工具で押
圧することによって嵌合固定することができる。また、
前記金属基板２の平面上の溝２ａに放熱フィン１の一側
縁１ａを嵌合固定する他の実施の形態として、前記溝２
ａに放熱フィン１の一側縁１ａを接着剤または“ろう”
を介して嵌合して、接着または“ろう”付けして固定す
ることができる。It is to be noted that one side edge 1a of the radiation fin 1 is
To fit and fix the parallel grooves 2a on the plane of the metal substrate 2, the grooves 2a are formed so that the one side edge 1a can be easily fitted from above, and each radiating fin is formed in each groove 2a. After the one side edge 1a is fitted, it can be fitted and fixed by pressing between the grooves 2a with a pressing tool. Also,
As another embodiment in which one side edge 1a of the radiation fin 1 is fitted and fixed in a groove 2a on a plane of the metal substrate 2, the groove 2a
a one side edge 1a of the radiation fin 1 with an adhesive or "wax"
And secured by gluing or "brazing".
【００１３】また、請求項４に係る発明の実施の形態
は、１枚の直角四辺形のアルミニウムなどの金属板Ｗか
ら、側縁部１ａで連結された複数の放熱フィン片１ｂを
有する放熱フィン１が、櫛歯状に同一形状のものが２枚
形成されるように打ち抜き形成する工程と、金属基板２
の平面上に平行な複数の溝２ａを形成する工程と、前記
金属基板２の平面上に形成した複数の溝２ａに、前記放
熱フィン１の側縁部１ａを嵌合して固定する工程とより
なる電子部品の放熱器の製造方法としたものである。A fourth embodiment of the present invention is directed to a heat dissipating fin having a plurality of heat dissipating fin pieces 1b connected by a side edge 1a from a single rectangular metal plate W made of aluminum or the like. (1) a step of punching and forming such that two sheets having the same shape in a comb shape are formed;
Forming a plurality of parallel grooves 2a on the plane of the metal substrate 2, and fixing the side edges 1a of the heat radiation fins 1 to the plurality of grooves 2a formed on the plane of the metal substrate 2. And a method of manufacturing a radiator for an electronic component.
【００１４】さらに、この電子部品の放熱器の製造方法
を図面を参照して説明する。まず、図７の（ａ）に示す
ように、アルミニウムなどの直角四辺形の金属板Ｗを用
意する。つぎに、図７の（ｂ）に示すように、１枚の直
角四辺形のアルミニウムなどの金属板Ｗの打ち抜きによ
り、側縁部１ａで連結された複数の放熱フィン片１ｂを
有する櫛歯状の放熱フィン１が２枚得られるように、打
ち抜き金型（図示しない）で打ち抜く。そうすると、図
７の（ｃ）に示すように、側縁部１ａで連結された複数
の放熱フィン片１ｂを有する櫛歯状の放熱フィン１が２
枚得られる。Further, a method of manufacturing a radiator for this electronic component will be described with reference to the drawings. First, as shown in FIG. 7A, a rectangular metal plate W such as aluminum is prepared. Next, as shown in FIG. 7B, a comb-like shape having a plurality of radiating fin pieces 1b connected at the side edges 1a by punching a single rectangular quadrangular metal plate W made of aluminum or the like. Is punched out by a punching die (not shown) so that two radiating fins 1 are obtained. Then, as shown in FIG. 7 (c), the comb-shaped radiating fins 1 having a plurality of radiating fin pieces 1b connected by the side edge portions 1a are 2 in number.
Can be obtained.
【００１５】つぎに、図８の（ａ）に示すように、予め
作っておいた金属基板２の平面上の平行な複数の溝２ａ
に、前記のように形成した放熱フィン１の側縁部１ａを
上方から嵌合する。なお、前記溝２ａは、放熱フィン１
の側縁部１ａが上方から容易に嵌合し得るように形成さ
れている。つぎに、図８の（ｂ）に示すように、放熱フ
ィン１の側縁部１ａを嵌合した前記複数の溝２ａの間に
形成した複数の溝２ｂにかしめ工具３の先端を押し当て
ることによって、前記放熱フィン１の側縁部１ａを嵌合
した溝２ａが押し狭められる。そうすると、図８の
（ｃ）に示すように、複数の放熱フィン１の側縁部１ａ
が抜け取れないように前記複数の溝２ａに嵌合固定され
る。なお、前記かしめ工具３の先端を押し当てる溝２ｂ
は、前記放熱フィン１の側縁部１ａを嵌合する溝２ａと
同一の形状であってもよく、そうでなくてもよい。ま
た、前記放熱フィン１の一側縁１ａを、前記金属基板２
の平面上の平行な溝２ａに嵌合固定するには、前記実施
の形態の他に、前記溝２ａに放熱フィン１の一側縁１ａ
を接着剤または“ろう”を介して嵌合して、接着または
“ろう”付けして固定することができる。この場合に
は、図８に示した溝２ｂを形成しなくてもよい。Next, as shown in FIG. 8A, a plurality of parallel grooves 2a on a plane of the metal substrate 2 which has been formed in advance.
Then, the side edge 1a of the radiation fin 1 formed as described above is fitted from above. In addition, the groove 2a is provided with the radiation fin 1.
Is formed so that the side edge portion 1a can be easily fitted from above. Next, as shown in FIG. 8B, the tip of the caulking tool 3 is pressed against a plurality of grooves 2b formed between the plurality of grooves 2a in which the side edges 1a of the radiation fins 1 are fitted. Thereby, the groove 2a in which the side edge portion 1a of the heat radiation fin 1 is fitted is narrowed. Then, as shown in FIG. 8C, the side edges 1a of the plurality of heat radiation fins 1 are formed.
Are fitted and fixed in the plurality of grooves 2a so as not to come off. A groove 2b for pressing the tip of the caulking tool 3
May have the same shape as the groove 2a in which the side edge portion 1a of the heat radiation fin 1 is fitted, or may not. Further, one side edge 1a of the radiation fin 1 is connected to the metal substrate 2
In order to fit and fix in the parallel groove 2a on the plane of the figure, in addition to the above-described embodiment, one side edge 1a of the radiation fin 1 is fitted in the groove 2a.
Can be fitted together with an adhesive or "wax" to be glued or "brazed" and secured. In this case, the groove 2b shown in FIG. 8 need not be formed.
【００１６】このような電子部品の放熱器の製造方法と
したことにより、１枚の直角四辺形のアルミニウムなど
の金属板の打ち抜きにより、側縁部１ａで連結された複
数の放熱フィン片１ｂを有する櫛歯状の放熱フィン１
が、無駄なく２枚形成され、すなわち、アルミニウムな
どの金属板から前記のような櫛歯状の放熱フィン１を歩
留り良く形成することができ、かつ、この放熱フィン１
の側縁部１ａを、アルミニウムなどの金属基板２の平面
上に形成した平行な複数の溝２ａに嵌合固定して電子部
品の放熱器を作ることができるので、製造が比較的に簡
単で、製造コストが安くなる利点がある。なお、電子部
品（図示しない）は前記金属基板２の外面２ｃに取り付
ける。With this method of manufacturing a radiator for an electronic component, a plurality of radiating fin pieces 1b connected at the side edges 1a can be formed by punching a single rectangular quadrilateral metal plate such as aluminum. Comb-shaped heat radiation fins 1
Can be formed without waste, that is, the comb-shaped radiating fins 1 can be formed from a metal plate such as aluminum with a good yield, and the radiating fins 1 can be formed with good yield.
The side edge portions 1a, since the fitted to a plurality of parallel grooves 2a formed on the plane of the metal substrate 2 if fixed, such as aluminum can make radiator of the electronic components, manufacture a relatively simple There is an advantage that the manufacturing cost is reduced. An electronic component (not shown) is attached to the outer surface 2c of the metal substrate 2.
【００１７】[0017]
【発明の効果】請求項１に係る発明の電子部品の放熱器
は、以上説明したように構成したので、構成部品が少な
く、構成が簡単で、製造コストが安くなる。また、請求
項２に係る発明の電子部品の放熱器は、以上説明したよ
うに、前記放熱フィン片が斜め対向して千鳥配列の格子
状になるので、放熱フィン片の間の空気の流通が良くな
り、放熱効果が良くなる。また、請求項３に係る発明の
電子部品の放熱器は、以上説明したように、前記放熱フ
ィン片が対向して格子状になるので、放熱フィン片の間
の空気の流通により放熱効果を得ることができる。ま
た、請求項４に係る発明の電子部品の放熱器の製造方法
は、以上説明したような方法にしたので、電子部品の放
熱器の製造が比較的に簡単で、製造コストが安くなる利
点がある。The radiator of the electronic component according to the first aspect of the present invention is configured as described above, so that the number of components is small, the configuration is simple, and the manufacturing cost is low. In the radiator of the electronic component according to the second aspect of the present invention, as described above, since the radiating fin pieces are obliquely opposed to each other in a staggered lattice pattern, the flow of air between the radiating fin pieces is reduced. The heat radiation effect is improved. In the radiator of the electronic component according to the third aspect of the present invention, as described above, since the radiating fin pieces face each other in a lattice shape, a radiating effect is obtained by the flow of air between the radiating fin pieces. be able to. Further, since the method of manufacturing a radiator for an electronic component according to the fourth aspect of the present invention is the method described above, there is an advantage that the manufacture of a radiator for an electronic component is relatively simple and the manufacturing cost is low. is there.
【図１】請求項２に係る発明の電子部品の放熱器の正面
図である。FIG. 1 is a front view of a radiator of an electronic component according to a second aspect of the present invention.
【図２】図１のＸ−Ｘ線における水平断面図である。FIG. 2 is a horizontal sectional view taken along line XX of FIG.
【図３】請求項２に係る発明の電子部品の放熱器の斜視
図である。FIG. 3 is a perspective view of a radiator of the electronic component according to the second aspect of the present invention.
【図４】請求項３に係る発明の電子部品の放熱器の正面
図である。FIG. 4 is a front view of a radiator of an electronic component according to a third aspect of the present invention.
【図５】図４のＹ−Ｙ線における水平断面図である。FIG. 5 is a horizontal sectional view taken along line YY of FIG. 4;
【図６】請求項３に係る発明の電子部品の放熱器の斜視
図である。FIG. 6 is a perspective view of a radiator of the electronic component according to the third aspect of the present invention.
【図７】請求項４に係る発明の電子部品の放熱器の製造
方法の製造工程を示すものである。FIG. 7 shows a manufacturing process of a method for manufacturing a radiator of an electronic component according to a fourth aspect of the present invention.
【図８】請求項４に係る発明の電子部品の放熱器の製造
方法の製造工程を示すものである。FIG. 8 shows a manufacturing process of a method for manufacturing a radiator of an electronic component according to a fourth aspect of the present invention.
【図９】従来の電子部品の放熱器の製造工程を示すもの
である。FIG. 9 shows a process of manufacturing a conventional radiator for an electronic component.
【図１０】従来の電子部品の放熱器の斜視図である。FIG. 10 is a perspective view of a radiator of a conventional electronic component.
１ 放熱フィン １ａ 側縁部 １ｂ 放熱フィン片 ２ 金属基板 ２ａ 溝 ２ｂ 溝 ２ｃ 外面 ３ かしめ工具 Ｗ 金属板 REFERENCE SIGNS LIST 1 radiating fin 1a side edge 1b radiating fin piece 2 metal substrate 2a groove 2b groove 2c outer surface 3 swaging tool W metal plate
Claims (4)
り櫛歯状に同一形状のものが２枚形成された、側縁部で
連結された複数の放熱フィン片を有する放熱フィンを複
数枚用意し、金属基板の平面上に形成した平行な複数の
溝に、前記放熱フィンの側縁部を嵌合固定して構成した
ことを特徴とする電子部品の放熱器。1. A plurality of heat dissipating fins having a plurality of heat dissipating fin pieces connected by side edges, each of which is formed by punching a single rectangular quadrangular metal plate into a comb-like shape. A radiator for an electronic component, wherein a plurality of parallel grooves formed on a plane of a metal substrate are prepared, and side edges of the radiation fins are fitted and fixed.
数の溝に、前記放熱フィンの側縁部を、前記放熱フィン
片が斜め対向して千鳥配列の格子状になるように嵌合固
定したことを特徴とする請求項１に記載の電子部品の放
熱器。2. A side edge portion of the radiating fin is fitted into a plurality of parallel grooves formed on a plane of the metal substrate so that the radiating fin pieces are obliquely opposed to form a staggered lattice shape. The radiator of an electronic component according to claim 1, wherein the radiator is fixed.
数の溝に、前記放熱フィンの側縁部を、前記放熱フィン
片が対向して格子状になるように嵌合固定したことを特
徴とする請求項１に記載の電子部品の放熱器。3. The method according to claim 1, wherein side edges of the radiating fins are fitted and fixed to a plurality of parallel grooves formed on a plane of the metal substrate so that the radiating fin pieces face each other in a lattice shape. The radiator for an electronic component according to claim 1, wherein:
連結された複数の放熱フィン片を有する放熱フィンが、
櫛歯状に同一形状のものが２枚形成されるように打ち抜
き形成する工程と、金属基板の平面上に平行な複数の溝
を形成する工程と、前記金属基板の平面上に形成した複
数の溝に、前記放熱フィンの側縁部を嵌合して固定する
工程とよりなることを特徴とする電子部品の放熱器の製
造方法。4. A heat dissipating fin having a plurality of heat dissipating fin pieces connected by side edges from a single rectangular quadrilateral metal plate,
A step of punching and forming two pieces of the same shape in a comb shape, a step of forming a plurality of grooves parallel to a plane of the metal substrate, and a step of forming a plurality of grooves formed on the plane of the metal substrate. A method of fitting and fixing a side edge portion of the heat radiation fin to the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28108999A JP2001102786A (en) | 1999-10-01 | 1999-10-01 | Radiator of electronic part and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28108999A JP2001102786A (en) | 1999-10-01 | 1999-10-01 | Radiator of electronic part and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001102786A true JP2001102786A (en) | 2001-04-13 |
Family
ID=17634192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28108999A Pending JP2001102786A (en) | 1999-10-01 | 1999-10-01 | Radiator of electronic part and manufacturing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001102786A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616310B1 (en) | 2005-04-06 | 2006-08-28 | 주식회사 에이팩 | Manufaturing method of a heatsink for electronic equipment |
| WO2008105067A1 (en) * | 2007-02-27 | 2008-09-04 | Fujitsu Limited | Heat radiation component |
| CN101947609A (en) * | 2010-09-03 | 2011-01-19 | 联福生科技股份有限公司 | Riveting type production method of radiator |
| CN102554053A (en) * | 2012-01-16 | 2012-07-11 | 昆山能缇精密电子有限公司 | Edge extrusion riveting process of solar energy heat radiation base plate and riveting mold for edge extrusion riveting process |
| WO2014098214A1 (en) * | 2012-12-21 | 2014-06-26 | 京セラ株式会社 | Flow path member, and heat exchanger and semiconductor device using same |
| US9134076B2 (en) | 2009-11-17 | 2015-09-15 | Mitsubishi Electric Corporation | Radiator and method of manufacturing radiator |
| JP2015225908A (en) * | 2014-05-27 | 2015-12-14 | 株式会社Ｊｖｃケンウッド | heat sink |
| CN112911893A (en) * | 2020-12-25 | 2021-06-04 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
| CN113380737A (en) * | 2021-04-28 | 2021-09-10 | 西安交通大学 | Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and manufacturing method thereof |
| CN113498252A (en) * | 2020-10-09 | 2021-10-12 | 景旺电子科技(龙川)有限公司 | Electronic equipment, circuit board and preparation method thereof |
-
1999
- 1999-10-01 JP JP28108999A patent/JP2001102786A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616310B1 (en) | 2005-04-06 | 2006-08-28 | 주식회사 에이팩 | Manufaturing method of a heatsink for electronic equipment |
| WO2008105067A1 (en) * | 2007-02-27 | 2008-09-04 | Fujitsu Limited | Heat radiation component |
| US20090314476A1 (en) * | 2007-02-27 | 2009-12-24 | Fujitsu Limited | Heat radiating component |
| JP4998548B2 (en) * | 2007-02-27 | 2012-08-15 | 富士通株式会社 | Heat dissipation component |
| US9134076B2 (en) | 2009-11-17 | 2015-09-15 | Mitsubishi Electric Corporation | Radiator and method of manufacturing radiator |
| CN101947609A (en) * | 2010-09-03 | 2011-01-19 | 联福生科技股份有限公司 | Riveting type production method of radiator |
| CN102554053A (en) * | 2012-01-16 | 2012-07-11 | 昆山能缇精密电子有限公司 | Edge extrusion riveting process of solar energy heat radiation base plate and riveting mold for edge extrusion riveting process |
| WO2014098214A1 (en) * | 2012-12-21 | 2014-06-26 | 京セラ株式会社 | Flow path member, and heat exchanger and semiconductor device using same |
| JP2015225908A (en) * | 2014-05-27 | 2015-12-14 | 株式会社Ｊｖｃケンウッド | heat sink |
| CN113498252A (en) * | 2020-10-09 | 2021-10-12 | 景旺电子科技(龙川)有限公司 | Electronic equipment, circuit board and preparation method thereof |
| CN112911893A (en) * | 2020-12-25 | 2021-06-04 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
| CN113380737A (en) * | 2021-04-28 | 2021-09-10 | 西安交通大学 | Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and manufacturing method thereof |
| CN113380737B (en) * | 2021-04-28 | 2024-05-07 | 西安交通大学 | Y-shaped immersed capillary microchannel reinforced heat dissipation structure and manufacturing method thereof |
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