US20090314476A1 - Heat radiating component - Google Patents
Heat radiating component Download PDFInfo
- Publication number
- US20090314476A1 US20090314476A1 US12/461,824 US46182409A US2009314476A1 US 20090314476 A1 US20090314476 A1 US 20090314476A1 US 46182409 A US46182409 A US 46182409A US 2009314476 A1 US2009314476 A1 US 2009314476A1
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- Prior art keywords
- heat radiating
- heat
- radiating fins
- fins
- radiating component
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the embodiments discussed herein are related to a heat radiating component that includes plural heat radiating fins which are arranged with spaces therebetween, and radiates heat from the heat radiating fins to air flowing through the spaces.
- a heat radiating component carrying out heat radiation for a such large LSI also is required to deliver increasingly high performance of heat radiation.
- a heat radiating structure in which a number of heat radiating fins arranged with spaces therebetween are provided, air is flown into the spaces in the heat radiating fins to conduct heat from the heat radiating fins to the air so that the air with a raised temperature is exhausted outside the apparatus.
- Japanese Laid-open Patent Publications No. H08-88301 and No. H11-103183 describe structures in which shapes and arrangements of the heat radiating fins are devised to obtain higher heat radiating performance.
- a major problem with a heat radiating component provided with a number of heat radiating fins arranged with spaces therebetween as described above is the following. While an electronic apparatus mounted with such heat radiating component has been used for a long time, the heat radiating fins are attached with dust in air inflow ends thereof so that the air flow is impaired and the heat radiating performance is deteriorated. As a result, for example, a heat generating component serving as an object for heat radiation such as a large LSI is less cooled and thus has a high temperature, thereby causing the heat radiating component to malfunction or deteriorate. In the end, the heat radiating component may be damaged and the electronic apparatus may stop in operation.
- a heat radiating component includes plural heat radiating fins which are arranged with spaces therebetween so that the heat radiating component radiates heat from the plural heat radiating fins to air flowing through the spaces between the plural heat radiating fins.
- the heat radiating fins have such notch shapes that portions that are at least one of alternately and cyclically different in an arrangement direction of the plural heat radiating fins are notched.
- the heat radiating component of the invention includes the notch shape described above in the air inflow side of the beat radiating fins, an aperture of air inflow in the air inflow side edges is substantially widened and dust attaching is reduced while the heat radiating performance is maintained.
- FIG. 1 illustrates a perspective view of a heat radiating component as a first embodiment according to the invention
- FIG. 2 illustrates a top view of the heat radiating component illustrated in FIG. 1 ;
- FIG. 3 illustrates a front view of the heat radiating component illustrated in FIG. 1 ;
- FIG. 4 illustrates a side view of the heat radiating component illustrated in FIG. 1 ;
- FIG. 5 illustrates an enlarged view of a portion indicated by the circle R 1 illustrated in FIG. 1 ;
- FIG. 6 illustrates an enlarged view of a portion indicated by the circle R 2 illustrated in FIG. 3 ;
- FIG. 7 illustrates a perspective view of a heat radiating component as a second embodiment according to the invention.
- FIG. 8 illustrates a side view of the heat radiating component illustrated in FIG. 7 ;
- FIG. 9 illustrates an enlarged view of a portion indicated by the circle R 3 illustrated in FIG. 8 ;
- FIG. 10 illustrates an outline perspective view of a heat absorbing plate included in the heat radiating component illustrated in FIG. 7 ;
- FIG. 11 is a schematic diagram illustrating a shape of a heat pipe included in the heat radiating component illustrated in FIG. 7 .
- FIG. 1 illustrates a perspective view of a heat radiating component 10 as a first embodiment according to the invention.
- FIG. 2 illustrates a top view of the heat radiating component 10 illustrated in FIG. 1 .
- FIG. 3 illustrates a front view of the heat radiating component illustrated 10 in FIG. 1 .
- FIG. 4 illustrates a side view of the heat radiating component 10 illustrated in FIG. 1 .
- FIG. 5 illustrates an enlarged view of a portion indicated by the circle R 1 illustrated in FIG. 1 .
- FIG. 6 illustrates an enlarged view of a portion indicated by the circle R 2 illustrated in FIG. 3 .
- This heat radiating component 10 includes a heat absorbing plate 11 , multiple heat radiating fins 12 arranged with spaces therebetween.
- the heat absorbing plate 11 is made of metal having a high heat conduction efficiency such as copper.
- the heat absorbing plate 11 plays a role that a bottom surface of the heat absorbing plate 11 is attached to a heat generating component (not illustrated) to absorb heat from the heat generating component, and a role that the heat absorbing plate 11 holds the multiple heat radiating fins 12 in a crimped state to conduct to the heat to the multiple heat radiating fins 12 .
- the multiple heat radiating fins 12 are also formed by a material having a high thermal conduction efficient such as aluminum or copper.
- Heat conducted from the heat generating component to the heat absorbing plate 11 is further conducted to the heat radiating fins and then to air flowing through the spaces in the multiple heat radiating fins 12 .
- Air, which has absorbed heat and is in a high temperature, is exhausted outside an electronic apparatus and the like in which the heat generating component and the heat radiating component 10 are housed.
- each one of the heat radiating fins 12 has the notch shape in which the ends are notched to form projections 12 a and depressions 12 b repeatedly, and in the example discussed here, the projections 12 a and 12 b between adjacent heat radiating fins of the plural heat radiating fins do not overlap each other, and as illustrated in FIG. 6 , the projections 12 a are formed in alternately different positions such that gaps f and gaps g between the projections 12 a and the projections 12 b are formed.
- the opening gaps f and g between the projections are formed as illustrated in FIG. 6 .
- the projections are formed alternately such that the projections partially overlaps each other, the widening of substantial apertures as a whole of the air inflow ends and the air outflow ends of the heat radiating fins is ensured. Therefore, these gaps f and g are not necessarily formed.
- the heat radiating fins have the notch shapes in the three sides excluding the side crimped by the heat absorbing plate 11 .
- the adjacent fins are notched in alternately different portions.
- the notch shapes may be formed in cyclically different portions, i.e., the notch shapes are repeatedly formed in same positions every three or four of the heat radiating fins.
- FIG. 7 illustrates a perspective view of a heat radiating component 20 as a second embodiment according to the invention.
- FIG. 8 illustrates a side view of the heat radiating component illustrated in FIG. 7 .
- FIG. 9 illustrates an enlarged view of a portion indicated by the circle R 3 illustrated in FIG. 8 .
- FIG. 10 illustrates an outline perspective view of a heat absorbing plate 21 included in the heat radiating component 20 illustrated in FIG. 7 .
- FIG. 11 is a schematic diagram illustrating a heat pipe 25 included in the heat radiating component 20 illustrated in FIG. 7 .
- the heat radiating component 20 serving as the second embodiment is provided with a heat absorbing plate 21 in a bottom end thereof.
- This heat absorbing plate 21 includes, as illustrated in FIG. 10 , a heat absorbing section 211 to absorb heat from a heat generating component (not illustrated), and four of arm sections 212 to fix the heat radiating component 20 illustrated in FIG. 7 .
- the heat absorbing section 211 is formed from copper in order to ensure a good heat absorbing performance.
- the arm sections 212 made of aluminum are crimped at its four corners.
- the heat absorbing section 211 is formed with two grooves 211 a, in which the heat pipe 25 described later (see FIG. 11 ) is arranged.
- the four arm sections 212 are provided with mounting openings 212 a penetrating vertically through the arm section 212 . As illustrated in FIG. 7 , screw parts 22 go through the mounting openings 212 a .
- the heat radiating component 20 is fixed to a casing or the like of an electronic apparatus in a state where a top face of the heat generating component is pressed onto a bottom face of the heat absorbing section 211 .
- spring members 23 are provided to make it possible to stably mount the heat radiating component 20 to the casing or the like in a state where the bottom face of the heat radiating component 20 is attached to the heat generating component.
- the heat radiating component 20 illustrated in FIG. 7 and FIG. 8 are arranged with a number of heat radiating fins 24 crimped to the heat absorbing section 211 .
- a top face covered by a fan 26 , and both side faces of these heat radiating fins 24 have notch shapes as illustrated in FIG. 9 .
- the notch shapes themselves are equivalent to the notch shapes of the heat radiating fins 21 included in the heat radiating component 10 serving as the first embodiment. Thus, a redundant explanation will be avoided.
- the heat radiating component 20 is provided with the heat pipe 25 having a shape as illustrated in FIG. 11 .
- One end side of the heat pipe 25 is to be engaged in the groove 21 formed in the heat absorbing section 211 of the heat absorbing plate 21 , and extends from there, then curves to turn and extends in the arrangement direction of the heat radiating fins 24 to penetrate the heat radiating fins 24 .
- the heat radiating component 20 illustrated in FIG. 7 and FIG. 8 is provided with the fan 26 in a position where the heat radiating component 20 covers a top end of the heat radiating fins 24 .
- the fan 26 blows air toward from the top ends of the heat radiating fins 24 to the heat radiating fins 24 .
- Air blown into the spaces of the heat radiating fins 24 from the top ends of the heat radiating fins 24 by the fan 26 absorbs heat from the heat radiating fins 24 while going through the spaces of the heat radiating fins 24 , and further, blows to the heat absorbing plate 21 to directly absorb heat also from the heat absorbing plate 21 and then exhausted from the both side ends of the heat radiating fins 24 .
- the top ends of the heat radiating fins 24 also have notch shapes similar to those formed in the side ends of the heat radiating fins 24 . Thus, dust attaching to the air inflow ends serving as the top ends of the heat radiating fins 24 is reduced.
- the fan 26 of the second embodiment is explained as a fan which blows air toward the heat radiating fins 24 .
- this fan 26 may be a fan which blows air in a direction of suctioning air from the heat radiating fins 24 .
- the both side ends of the heat radiating fins 24 become air inflow ends.
- the heat radiating fins 24 have the notch shapes also in both side ends. Thus, also in this case, dust attaching to the both side ends serving as the air inflow ends is reduced.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a heat radiating component that includes plural heat radiating fins which are arranged with spaces therebetween and radiate heat from the plural heat radiating fins to air flowing through the spaces between the plural heat radiating fins. Air inflow ends of the plural heat radiating fins have such notch shapes in that alternately or cyclically different portions in an arrangement direction where the plural heat radiating fins are arranged are notched.
Description
- This is a continuation application of PCT/JP2007/053613, filed on Feb. 27, 2007.
- The embodiments discussed herein are related to a heat radiating component that includes plural heat radiating fins which are arranged with spaces therebetween, and radiates heat from the heat radiating fins to air flowing through the spaces.
- As an electronic apparatus has been increasingly advanced recently, it is provided with a large LSI having a high computing performance therein. The amount of generated heat has been increased with the improvement of the computing performance. Accordingly, a heat radiating component carrying out heat radiation for a such large LSI also is required to deliver increasingly high performance of heat radiation. To such heat radiating component is usually applied a heat radiating structure in which a number of heat radiating fins arranged with spaces therebetween are provided, air is flown into the spaces in the heat radiating fins to conduct heat from the heat radiating fins to the air so that the air with a raised temperature is exhausted outside the apparatus. Japanese Laid-open Patent Publications No. H08-88301 and No. H11-103183 describe structures in which shapes and arrangements of the heat radiating fins are devised to obtain higher heat radiating performance.
- Here, a major problem with a heat radiating component provided with a number of heat radiating fins arranged with spaces therebetween as described above is the following. While an electronic apparatus mounted with such heat radiating component has been used for a long time, the heat radiating fins are attached with dust in air inflow ends thereof so that the air flow is impaired and the heat radiating performance is deteriorated. As a result, for example, a heat generating component serving as an object for heat radiation such as a large LSI is less cooled and thus has a high temperature, thereby causing the heat radiating component to malfunction or deteriorate. In the end, the heat radiating component may be damaged and the electronic apparatus may stop in operation.
- Here, for reducing dust attaching to the heat radiating fins, there may be some such ideas that the spaces between the heat radiating fins are widened, or that the quantity of air may be decreased. However, such measures are undesirable because such ideas result in deterioration of heat radiating performance when the improvement of the heat radiating performance has been increasingly required as heat radiating quantity of the heat radiating component has been increased.
- According to one aspect of the invention, a heat radiating component includes plural heat radiating fins which are arranged with spaces therebetween so that the heat radiating component radiates heat from the plural heat radiating fins to air flowing through the spaces between the plural heat radiating fins. And the heat radiating fins have such notch shapes that portions that are at least one of alternately and cyclically different in an arrangement direction of the plural heat radiating fins are notched.
- Because the heat radiating component of the invention includes the notch shape described above in the air inflow side of the beat radiating fins, an aperture of air inflow in the air inflow side edges is substantially widened and dust attaching is reduced while the heat radiating performance is maintained.
- The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
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FIG. 1 illustrates a perspective view of a heat radiating component as a first embodiment according to the invention; -
FIG. 2 illustrates a top view of the heat radiating component illustrated inFIG. 1 ; -
FIG. 3 illustrates a front view of the heat radiating component illustrated inFIG. 1 ; -
FIG. 4 illustrates a side view of the heat radiating component illustrated inFIG. 1 ; -
FIG. 5 illustrates an enlarged view of a portion indicated by the circle R1 illustrated inFIG. 1 ; -
FIG. 6 illustrates an enlarged view of a portion indicated by the circle R2 illustrated inFIG. 3 ; -
FIG. 7 illustrates a perspective view of a heat radiating component as a second embodiment according to the invention; -
FIG. 8 illustrates a side view of the heat radiating component illustrated inFIG. 7 ; -
FIG. 9 illustrates an enlarged view of a portion indicated by the circle R3 illustrated inFIG. 8 ; -
FIG. 10 illustrates an outline perspective view of a heat absorbing plate included in the heat radiating component illustrated inFIG. 7 ; and -
FIG. 11 is a schematic diagram illustrating a shape of a heat pipe included in the heat radiating component illustrated inFIG. 7 . - Hereafter, embodiments according to the invention will be explained with reference to the drawings.
-
FIG. 1 illustrates a perspective view of aheat radiating component 10 as a first embodiment according to the invention.FIG. 2 illustrates a top view of theheat radiating component 10 illustrated inFIG. 1 .FIG. 3 illustrates a front view of the heat radiating component illustrated 10 inFIG. 1 .FIG. 4 illustrates a side view of theheat radiating component 10 illustrated inFIG. 1 . - Further,
FIG. 5 illustrates an enlarged view of a portion indicated by the circle R1 illustrated inFIG. 1 .FIG. 6 illustrates an enlarged view of a portion indicated by the circle R2 illustrated inFIG. 3 . - This
heat radiating component 10 includes aheat absorbing plate 11, multipleheat radiating fins 12 arranged with spaces therebetween. Theheat absorbing plate 11 is made of metal having a high heat conduction efficiency such as copper. Theheat absorbing plate 11 plays a role that a bottom surface of theheat absorbing plate 11 is attached to a heat generating component (not illustrated) to absorb heat from the heat generating component, and a role that theheat absorbing plate 11 holds the multiple heat radiating fins 12 in a crimped state to conduct to the heat to the multiple heat radiating fins 12. The multipleheat radiating fins 12 are also formed by a material having a high thermal conduction efficient such as aluminum or copper. Heat conducted from the heat generating component to theheat absorbing plate 11 is further conducted to the heat radiating fins and then to air flowing through the spaces in the multiple heat radiating fins 12. Air, which has absorbed heat and is in a high temperature, is exhausted outside an electronic apparatus and the like in which the heat generating component and theheat radiating component 10 are housed. - Here, in top ends and both side ends of the multiple
heat radiating fins 12 included in theheat radiating component 10, notch shapes are formed as enlargedly illustrated inFIG. 5 . That is, each one of theheat radiating fins 12 has the notch shape in which the ends are notched to formprojections 12 a anddepressions 12 b repeatedly, and in the example discussed here, theprojections FIG. 6 , theprojections 12 a are formed in alternately different positions such that gaps f and gaps g between theprojections 12 a and theprojections 12 b are formed. - Thus, substantial apertures at the air inflow ends where air to the spaces in the heat radiating fins 12 flows in and at the air outflow ends where air from the spaces in the heat radiating fins 12 flows out are wide, and dust attaching to the air inflow ends is reduced. And simultaneously, the resistance of air flowing the spaces of the heat radiating fins is also reduced and air flows more smoothly, contributing to preventing dust attaching, and in addition, leading to improvement of the heat radiating performance.
- Incidentally, it is preferable that, in the present example, the opening gaps f and g between the projections are formed as illustrated in
FIG. 6 . However, even though as these gaps f and g do not exist, for example, the projections are formed alternately such that the projections partially overlaps each other, the widening of substantial apertures as a whole of the air inflow ends and the air outflow ends of the heat radiating fins is ensured. Therefore, these gaps f and g are not necessarily formed. - In addition, in the present example, without the air inflow ends and the air outflow ends being differentiated each other, the heat radiating fins have the notch shapes in the three sides excluding the side crimped by the
heat absorbing plate 11. However, in a case where the air inflow ends and the air outflow ends are known in advance, it is acceptable that only the air outflow ends have the notch shapes. As dust is attached in the air inflow ends, dust attaching is decreased, as far as the air inflow ends have the above described notch shapes. - Further, in the example explained here, the adjacent fins are notched in alternately different portions. However, for example, the notch shapes may be formed in cyclically different portions, i.e., the notch shapes are repeatedly formed in same positions every three or four of the heat radiating fins.
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FIG. 7 illustrates a perspective view of aheat radiating component 20 as a second embodiment according to the invention.FIG. 8 illustrates a side view of the heat radiating component illustrated inFIG. 7 . -
FIG. 9 illustrates an enlarged view of a portion indicated by the circle R3 illustrated inFIG. 8 . - Further,
FIG. 10 illustrates an outline perspective view of aheat absorbing plate 21 included in theheat radiating component 20 illustrated inFIG. 7 .FIG. 11 is a schematic diagram illustrating aheat pipe 25 included in theheat radiating component 20 illustrated inFIG. 7 . - The
heat radiating component 20 serving as the second embodiment is provided with aheat absorbing plate 21 in a bottom end thereof. - This
heat absorbing plate 21 includes, as illustrated inFIG. 10 , aheat absorbing section 211 to absorb heat from a heat generating component (not illustrated), and four ofarm sections 212 to fix theheat radiating component 20 illustrated inFIG. 7 . - In this embodiment, the
heat absorbing section 211 is formed from copper in order to ensure a good heat absorbing performance. Thearm sections 212 made of aluminum are crimped at its four corners. Theheat absorbing section 211 is formed with twogrooves 211 a, in which theheat pipe 25 described later (seeFIG. 11 ) is arranged. In addition, the fourarm sections 212 are provided with mountingopenings 212 a penetrating vertically through thearm section 212. As illustrated inFIG. 7 , screwparts 22 go through the mountingopenings 212 a. Using thesescrew parts 22, theheat radiating component 20 is fixed to a casing or the like of an electronic apparatus in a state where a top face of the heat generating component is pressed onto a bottom face of theheat absorbing section 211. Incidentally,spring members 23 are provided to make it possible to stably mount theheat radiating component 20 to the casing or the like in a state where the bottom face of theheat radiating component 20 is attached to the heat generating component. - In addition, the
heat radiating component 20 illustrated inFIG. 7 andFIG. 8 are arranged with a number ofheat radiating fins 24 crimped to theheat absorbing section 211. A top face covered by afan 26, and both side faces of theseheat radiating fins 24 have notch shapes as illustrated inFIG. 9 . The notch shapes themselves are equivalent to the notch shapes of theheat radiating fins 21 included in theheat radiating component 10 serving as the first embodiment. Thus, a redundant explanation will be avoided. - In addition, the
heat radiating component 20 is provided with theheat pipe 25 having a shape as illustrated inFIG. 11 . One end side of theheat pipe 25 is to be engaged in thegroove 21 formed in theheat absorbing section 211 of theheat absorbing plate 21, and extends from there, then curves to turn and extends in the arrangement direction of theheat radiating fins 24 to penetrate theheat radiating fins 24. - Thanks to the existence of the
heat pipe 25, heat absorbed from the heat generating component by theheat absorbing section 211 is conducted effectively through theheat pipe 25 to theheat radiating fins 24. - Further, the
heat radiating component 20 illustrated inFIG. 7 andFIG. 8 is provided with thefan 26 in a position where theheat radiating component 20 covers a top end of theheat radiating fins 24. Thefan 26 blows air toward from the top ends of theheat radiating fins 24 to theheat radiating fins 24. Air blown into the spaces of theheat radiating fins 24 from the top ends of theheat radiating fins 24 by thefan 26 absorbs heat from theheat radiating fins 24 while going through the spaces of theheat radiating fins 24, and further, blows to theheat absorbing plate 21 to directly absorb heat also from theheat absorbing plate 21 and then exhausted from the both side ends of theheat radiating fins 24. - The top ends of the
heat radiating fins 24 also have notch shapes similar to those formed in the side ends of theheat radiating fins 24. Thus, dust attaching to the air inflow ends serving as the top ends of theheat radiating fins 24 is reduced. - Incidentally, the
fan 26 of the second embodiment is explained as a fan which blows air toward theheat radiating fins 24. However, thisfan 26 may be a fan which blows air in a direction of suctioning air from theheat radiating fins 24. In this case, the both side ends of theheat radiating fins 24 become air inflow ends. Theheat radiating fins 24 have the notch shapes also in both side ends. Thus, also in this case, dust attaching to the both side ends serving as the air inflow ends is reduced. - All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiments of the present inventions have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Claims (8)
1. A heat radiating component, comprising:
a plurality of heat radiating fins which are arranged with spaces therebetween so that the heat radiating component radiates heat from the plurality of heat radiating fins to air flowing through the spaces between the plurality of heat radiating fins, the heat radiating fins having such notch shapes that portions that are at least one of alternately and cyclically different in an arrangement direction of the plurality of heat radiating fins are notched.
2. The heat radiating component according to claim 1 , wherein the plurality of heat radiating fins further have air outflow ends that also have the notch shapes.
3. The heat radiating component according to claim 1 , wherein when the ends having the notch shapes of the plurality of heat radiating fins are viewed in the arrangement direction, a gap is formed between projected portions of adjacent heat radiation fins of the plurality of heat radiation fins.
4. The heat radiating component according to claim 1 , further comprising a heat absorbing plate that absorbs heat from a heat generating component that is an object to be cooled, the plurality of heat radiating fins being arranged to stand on the heat absorbing plate.
5. The heat radiating component according to claim 4 , further comprising a heat conduction member that contacts the heat absorbing plate and penetrates the plurality of heat radiating fins to conduct heat of the heat absorbing plate to the plurality of heat radiating fins.
6. The heat radiating component according to claim 1 , further comprising a fan that generates an air flow in the spaces between the plurality of heat radiating fins.
7. The heat radiating component according to claim 6 , wherein the fan is a fan that blows air into the spaces between the plurality of heat radiating fins.
8. The heat radiating component according to claim 6 , wherein the fan is a fan that blows air out of the spaces between the plurality of heat radiating fins.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2007/053613 WO2008105067A1 (en) | 2007-02-27 | 2007-02-27 | Heat radiation component |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2007/053613 Continuation WO2008105067A1 (en) | 2007-02-27 | 2007-02-27 | Heat radiation component |
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US20090314476A1 true US20090314476A1 (en) | 2009-12-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/461,824 Abandoned US20090314476A1 (en) | 2007-02-27 | 2009-08-25 | Heat radiating component |
Country Status (3)
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US (1) | US20090314476A1 (en) |
JP (1) | JP4998548B2 (en) |
WO (1) | WO2008105067A1 (en) |
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EP2937974A1 (en) * | 2012-12-21 | 2015-10-28 | Weg Equipamentos Elétricos S.A. - Motores | Heat exchange system for casings of rotary electric machines |
US10836113B2 (en) | 2015-01-22 | 2020-11-17 | Mitsubishi Engineering-Plastics Corporation | Laser welding member, and molded article |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6340729B2 (en) * | 2014-09-01 | 2018-06-13 | パナソニックIpマネジメント株式会社 | lighting equipment |
JP6821242B2 (en) * | 2016-07-12 | 2021-01-27 | 日本車輌製造株式会社 | Engine generator |
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US20060289150A1 (en) * | 2005-06-24 | 2006-12-28 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7289322B2 (en) * | 2005-10-24 | 2007-10-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0536787Y2 (en) * | 1989-06-29 | 1993-09-17 | ||
JP3015783U (en) * | 1995-03-14 | 1995-09-12 | 陳富英 洪 | Heat dissipation board for ultra-thin computer central processing unit |
JPH10126078A (en) * | 1996-10-22 | 1998-05-15 | Nippon Tekuraito:Kk | Heat radiation board and radiator |
JP2002305273A (en) * | 2001-04-05 | 2002-10-18 | Pfu Ltd | Heat sink apparatus |
-
2007
- 2007-02-27 WO PCT/JP2007/053613 patent/WO2008105067A1/en active Application Filing
- 2007-02-27 JP JP2009501070A patent/JP4998548B2/en not_active Expired - Fee Related
-
2009
- 2009-08-25 US US12/461,824 patent/US20090314476A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US6166904A (en) * | 1992-08-06 | 2000-12-26 | Pfu Limited | Heat generating element cooling device |
US5375655A (en) * | 1993-03-31 | 1994-12-27 | Lee; Yong N. | Heat sink apparatus |
US5701951A (en) * | 1994-12-20 | 1997-12-30 | Jean; Amigo | Heat dissipation device for an integrated circuit |
JP2001102786A (en) * | 1999-10-01 | 2001-04-13 | Mizutani Denki Kogyo Kk | Radiator of electronic part and manufacturing method therefor |
US20020189789A1 (en) * | 2001-06-18 | 2002-12-19 | Global Win Technology Co., Ltd | CPU cooling arrangement |
US20050217825A1 (en) * | 2004-04-01 | 2005-10-06 | Lian-Huang Chern | Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet |
US20060289150A1 (en) * | 2005-06-24 | 2006-12-28 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7289322B2 (en) * | 2005-10-24 | 2007-10-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2937974A1 (en) * | 2012-12-21 | 2015-10-28 | Weg Equipamentos Elétricos S.A. - Motores | Heat exchange system for casings of rotary electric machines |
EP2937974A4 (en) * | 2012-12-21 | 2016-08-10 | Weg Equipamentos Elétricos S A Motores | Heat exchange system for casings of rotary electric machines |
US10836113B2 (en) | 2015-01-22 | 2020-11-17 | Mitsubishi Engineering-Plastics Corporation | Laser welding member, and molded article |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008105067A1 (en) | 2010-06-03 |
JP4998548B2 (en) | 2012-08-15 |
WO2008105067A1 (en) | 2008-09-04 |
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Legal Events
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Owner name: FUJITSU LIMITED, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FUJIKAWA, HIDEYUKI;REEL/FRAME:023166/0288 Effective date: 20090629 |
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STCB | Information on status: application discontinuation |
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