JP4841575B2 - Cooling system - Google Patents

Description

The present invention relates to a cooling device for cooling a heat generating electronic component provided inside a communication device or the like.

  As a result of increasing the communication speed of the communication device and integrating the circuits, the heating elements constituting the communication device tend to be smaller and higher in heat generation. However, since the heat generated by the operation of the heating element itself causes a failure or malfunction of the communication device, a cooling mechanism such as a radiator is required to satisfy the performance of the communication device. As a cooling mechanism in the communication device, there are a cooling mechanism that cools by heat conduction via a substrate or a metal plate to which a heating element is attached, and a cooling mechanism that cools by heat transfer via air that is in contact with the heating element. . A general cooling mechanism is based on heat transfer. The heat generated from the heat generating element itself is added with a radiator (heat dissipating fin) in order to increase the amount of heat transfer to the air. The contact area is increased. For this reason, as the amount of heat generated by the heat generating element increases, a large heat sink is required, which hinders downsizing of the communication device.

  Also, assuming that the air flow in the communication device is windward and leeward, when the heating element is arranged along the direction of air flow, the atmosphere temperature of the air tends to increase as the air flows from the windward to leeward. If the heating elements having the same heat generation amount are arranged on the leeward side and the leeward side, there is a problem that the temperature difference between the air ambient temperature and the allowable temperature is smaller in the leeward side heating element. As a countermeasure, in Patent Document 1, a base plate and fins having a thermal resistance from the heating element to the air layer on the leeward side are lower than the thermal resistance from the heating element to the air layer on the leeward side. The thermal resistance to the layer is configured to be lower than the thermal resistance from the heating element to the air layer on the windward side.

JP 2003-188321 A

  Since the conventional radiator is configured as described above, the radiator to be attached to the leeward side heating element is configured to be small and the radiator to be attached to the leeward side heating element is configured to be large. It is necessary to change the shape and material of the heat radiator, which complicates the shape or material of the heat radiator, and further increases the size of a device for mounting the heat radiator.

The present invention has been made to solve the above-described problems, and efficiently dissipates the heat of the heat dissipating element located on the leeward side without changing the shape or material of the radiator on the leeward or leeward side. It is an object of the present invention to provide a cooling device that can be used.

The cooling device according to the present invention includes at least two heat dissipating members configured by a base material that contacts the heat generating element and conducts heat of the heat generating element and a projecting portion that dissipates the heat conducted to the base material, and a plate-like partition member forming the first flow path and second flow path is a flow path of air of the laminated structure in a casing for storing the heat radiating member, said first flow path, said Formed on one surface side of the partition member, the second flow path is formed on the other surface side of the partition member, and the first heat radiating member located on the windward side of the air flow path is the disposed in the first flow path, the second heat radiating member located on the leeward side of the flow path of the air, of the projecting portion at least a portion of said substrate located in the first flow path as at least partially exposed in the second flow path, it is arranged over the first channel and the second flow path Is shall.

According to the present invention, at least two heat dissipating members composed of a base material that contacts the heat generating element and conducts heat of the heat generating element, and a protrusion that dissipates the heat conducted to the base material, and the heat dissipation And a plate-like partition member that forms a first flow path and a second flow path that are air flow paths having a laminated structure in a housing for storing the member, wherein the first flow path is formed by the partition member. The second flow path is formed on the other surface side of the partition member, and the first heat dissipating member located on the windward side of the air flow path is the first heat dissipating member. disposed in the flow path, the second heat radiating member located on the leeward side of the flow path of the air, at least a portion of said substrate located in the first flow path within said projection of at least a parts so as to expose the second flow path, so that is disposed across the first flow path and the second flow path Since it is configured, in the second flow path where the ambient temperature is not increased by the leeward heat dissipation member, the leeward heat dissipation member can dissipate heat, and the heat dissipation efficiency can be improved. Miniaturization of the member can be realized.

Embodiment 1 FIG.
Below, it demonstrates as what arrange | positions the cooling device based on this invention in a communication apparatus. 1 is a perspective view showing a configuration of a communication apparatus having a cooling apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 3 is a sectional view taken along line BB in FIG. 2, and FIG. 4 is a sectional view taken along line CC in FIG.
The housing 1 constituted by a communication device having a hexahedral box shape sucks the cooling air X from the side surface provided with the vent hole 2 and exhausts the air X from the side surface provided with the fan 3. A plurality of high-density and high-heat-generating elements are provided in the housing 1, and in the first embodiment, the windward-side heat-generating element 4 located upstream of the air X flow and the air X-flow downstream The leeward side heating element 5 is provided.

On the upper side of the windward side heating element 4 and the leeward side heating element 5, a windward side radiator (first heat radiating member) 6 for radiating the heat generated by the heating elements 4 and 5 and a leeward side radiator (first 2 heat dissipating member) 7 is provided. In addition, a lower layer substrate 8 and an upper layer substrate (substrate) 9 that divide the flow of the air X into a lower layer portion (first flow path) 11 and an upper layer portion (second flow path) 12 are disposed in the housing 1. Has been. As shown in FIG. 2, the windward heating element 4, the windward radiator 6 and the leeward heating element 5 are arranged on the lower layer substrate 8, and the upper end portion of the leeward radiator 7 penetrates the upper layer substrate 9 and forms the upper layer portion. 12 to be exposed.

As shown in FIG. 4, a through hole 9a is formed at a position corresponding to the leeward radiator 7 of the upper substrate 9, and the fin 7b of the leeward radiator 7 described later is inserted into the through hole 9a. . The lower substrate 8 and the upper substrate 9 are mounted with a plurality of component parts 10 constituting a communication device or the like. However, the component part 10 having a large calorific value is mounted on the lower substrate 8, and the lower layer part 11 is mounted. Each component 10 is arrange | positioned so that the temperature rise of the air which flows through the upper layer part 12 can be suppressed compared with the flowing air.

Next, the details of the windward side radiator 6 and the leeward side radiator 7 will be described. FIG. 5 is a partially enlarged view showing the configuration of the cooling device according to Embodiment 1 of the present invention. On the upper side of the windward side heating element 4 and the leeward side heating element 5, a windward side radiator 6 and a leeward side radiator 7 are provided, respectively. The windward side radiator 6 and the leeward side radiator 7 are formed so as to contact the heat generating elements 4 and 5 and conduct heat, and to protrude from the base materials 6a and 7a. It is composed of a plurality of fins 6b and 7b that radiate heat conducted to the base materials 6a and 7a. The fins 6b and 7b are arranged in parallel at equal intervals substantially in parallel to each other.

The heat Y generated in the windward heating element 4 is conducted to the base material 6a of the windward radiator 6 through the path indicated by the arrow in FIG. 5, and further flows from the surface of the fin 6b to the lower layer part 11 as heat radiation Y ′. Heat is released to the air. On the other hand, the heat Y generated in the leeward side heat generating element 5 is conducted to the base material 7a of the leeward side radiator 7 through the path indicated by the arrow in FIG. Then, heat is radiated to the air flowing through the upper layer portion 12. Thus, the heat generated in the leeward heating element 4 is radiated only to the lower layer part 11, and the heat generated in the leeward heating element 5 is radiated to both the lower layer part 11 and the upper layer part 12. Therefore, compared with the case where the heat generated in the upper heating element 4 and the leeward heating element 5 is radiated only to the lower layer part 11, the heat radiation efficiency can be improved.

As described above, according to the first embodiment, the heat generated in the leeward side heating element is radiated not only to the lower layer part but also to the air flowing through the upper layer part. Can be improved. Furthermore, by improving the heat dissipation efficiency, it is possible to reduce the size of the radiator provided on the leeward side, and it is possible to reduce the size of the device on which the cooling device is mounted.

Furthermore, according to this Embodiment 1, since it has comprised so that each component may be arrange | positioned so that the temperature rise of the air which flows through an upper layer part may be suppressed, the heat dissipation efficiency of a leeward side radiator is improved more. Can do.

In the first embodiment described above, a configuration is shown in which a through hole is formed in the upper substrate, and the entire plurality of fins are inserted into the through hole at once. However, the through hole corresponds to each of the plurality of fins. A plurality of them may be provided. By inserting the fins into the plurality of through holes, the air flow between the upper layer portion and the lower layer portion can be further suppressed.

Embodiment 2. FIG.
FIG. 6 is a cross-sectional view of a communication device having a cooling device according to Embodiment 2 of the present invention. 7 is a sectional view taken along line DD in FIG. 6, and FIG. 8 is a sectional view taken along line EE in FIG. This cooling device is configured by replacing the planar upper substrate 9 in the cooling device according to the first embodiment shown in FIGS. 2 to 4 with an upper substrate 13 provided with a stepped portion recessed on the lower substrate 8 side. Yes. In the following, the same reference numerals as those used in Embodiment 1 are used, and the description thereof is omitted or simplified.

  On the lower layer substrate 8 constituted by a plane, the windward side heating element 4 located on the windward side of the air X flow and the leeward side heating element 5 located on the leeward side of the air X flow are arranged. The windward radiator 6 provided on the upper side of the windward heating element 4 has the base 6a and the fins 6b located below the upper substrate 9, and the heat radiated from the fins 6b is transferred to the air flowing through the lower layer part 11. Heat is dissipated. On the other hand, the upper layer substrate 13 is formed with a stepped portion 13a that is recessed toward the lower substrate 8 in the vicinity of the leeward heating element 5, and the stepped portion 13a is provided with a through hole 13b into which the fin 7b can be inserted. The base material 7a of the leeward radiator 7 is disposed so as to be positioned below the upper substrate 9a, but most of the fins 7b pass through the through holes 13b and are exposed to the upper layer portion 12.

  Thus, the heat generated in the leeward heat generating element 4 forms a path for radiating heat to the lower layer portion 11 via the fins 6a of the leeward heat sink 6, and the heat generated in the leeward heat generating element 5 is radiated on the leeward side. A path for radiating heat mainly to the upper layer portion 12 through the fins 7a of the vessel 7 is formed. Further, similarly to the first embodiment, the component 10 having a large calorific value is mounted on the lower layer substrate 8 to suppress the temperature rise of the air flowing through the upper layer part 12 as compared with the air flowing through the lower layer part 11. Since each component 10 is arrange | positioned so that it can do, the thermal radiation efficiency of the lee side radiator 7 can be improved.

As described above, according to the second embodiment, a stepped portion is formed by denting a part of the upper layer substrate toward the lower layer substrate side, and the fin of the leeward radiator is penetrated through the stepped portion. Since the part is exposed to the upper layer side, the heat generated in the leeward side heating element can be radiated to the upper layer part having a lower ambient temperature than the lower layer part, and the heat dissipation efficiency of the leeward side radiator can be increased. Can be improved. Furthermore, by improving the heat dissipation efficiency, it is possible to reduce the size of the radiator provided on the leeward side, and it is possible to reduce the size of the device on which the cooling device is mounted.

In the second embodiment described above, a configuration is shown in which a through hole is formed in the upper substrate and a plurality of fins are inserted into the through hole all together. However, the through hole corresponds to each of the plurality of fins. A plurality of them may be provided. By inserting the fins into the plurality of through holes, the air flow between the upper layer portion and the lower layer portion can be further suppressed.

Embodiment 3 FIG.
FIG. 9 is a cross-sectional view of a communication device having a cooling device according to Embodiment 3 of the present invention. 10 is a cross-sectional view taken along line FF in FIG. 9, and FIG. 11 is a cross-sectional view taken along line GG in FIG. In the cooling device according to Embodiment 3 of the present invention, a heat transfer plate that is in contact with the upper surface of the fin 7b and the lower surface of the upper substrate 9 is interposed between the fin 7b and the upper substrate 9 of the leeward radiator 7. It is composed. In the following, the same reference numerals as those used in Embodiment 1 are used, and the description thereof is omitted or simplified.

  The fins 6b of the windward radiator 6 and the fins 7b of the leeward radiator 7 are substantially the same, and both the windward radiator 6 and the leeward radiator 7 are located in the lower layer part 11 and are located on the upper layer part 12 side. Is not exposed. A heat transfer plate 14 made of a heat conductive material is disposed between the fin 7 b and the upper layer substrate 9, and the heat transfer plate 14 is in contact with both the upper surface of the fin 7 b and the lower surface of the upper layer substrate 9. . As the heat conductive material constituting the heat transfer plate 14, for example, each member satisfactorily contacts by using a flexible material capable of filling the gap by pressurizing, for example, heat conductive silicon rubber or a compound.

Next, details of the leeward radiator 7 and the heat transfer plate 14 will be described. FIG. 12 is a partially enlarged view showing the configuration of the cooling device according to Embodiment 3 of the present invention. The upper surfaces of the fins 7 b of the leeward side radiator 7 provided on the upper side of the leeward side heating element 5 are in contact with the heat transfer plate 14. The heat transfer plate 14 is in contact with the lower surface of the upper substrate 9. The heat Y generated in the leeward side heat generating element 5 is conducted to the base material 7a of the leeward side radiator through the path of the arrow shown in FIG. 12, and a part of the heat Y is radiated from the surface of the fin 7b as heat radiation Y ′. Heat is radiated to the air flowing through the section 11.

On the other hand, the heat Z conducted from the fins 7b to the heat transfer plate 14 is conducted to the upper substrate 9 through the path indicated by the arrow shown in FIG. 12, and the air flowing from the surface of the upper substrate 9 through the upper layer portion 12 as the heat radiation Z ′. Heat is dissipated. Thus, by dissipating heat from the surface of the upper layer substrate 9, the surface area in contact with the air flowing through the upper layer portion 12 can be increased. Further, similarly to the first embodiment, the component 10 having a large calorific value is mounted on the lower layer substrate 8 to suppress the temperature rise of the air flowing through the upper layer part 12 as compared with the air flowing through the lower layer part 11. Since each component 10 is arrange | positioned so that it can do, the thermal radiation efficiency of the lee side radiator 7 can further be improved.

As described above, according to the third embodiment, the heat transfer plate is disposed so as to be in contact with the upper surface of the fin of the leeward radiator and the lower surface of the upper layer plate, and the heat generated in the leeward heating element is Since heat is transferred to the upper layer plate through the heat transfer plate to dissipate heat, the contact area between the heat radiated from the upper layer plate and air can be increased, and the heat dissipation efficiency of the leeward side radiator is improved. be able to. Furthermore, by improving the heat dissipation efficiency, it is possible to reduce the size of the radiator provided on the leeward side, and it is possible to reduce the size of the device on which the cooling device is mounted.

In the first to third embodiments described above, the configuration in which the air flow path is divided into two layers, the lower layer and the upper layer, and the configuration in which two heating elements are arranged are shown as examples. However, the present invention is not limited to this. It is not something.

It is a perspective view which shows the structure of the communication apparatus which has a cooling device which concerns on Embodiment 1 of this invention. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is CC sectional view taken on the line in FIG. It is the elements on larger scale which show the structure of the cooling device which concerns on Embodiment 1 of this invention. It is sectional drawing of the communication apparatus which has a cooling device concerning Embodiment 2 of this invention. It is the DD sectional view taken on the line in FIG. It is the EE sectional view taken on the line in FIG. It is sectional drawing of the communication apparatus which has a cooling device concerning Embodiment 3 of this invention. It is the FF sectional view taken on the line in FIG. It is the GG sectional view taken on the line in FIG. It is the elements on larger scale which show the structure of the cooling device which concerns on Embodiment 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Housing | casing, 2 ventilation hole, 3 fan, 4 windward side heating element, 5 leeward side heating element, 6 windward side radiator, 6a, 7a base material, 6b, 7b fin, 7 leeward side radiator, 8, 8a lower layer Substrate, 9, 13 Upper layer substrate, 9a, 13b Hole, 10 Component, 11 Lower layer, 12 Upper layer, 13a Stepped portion, 14 Heat conduction plate, X air, Y, Z heat, Y ', Z' Heat dissipation.

Claims (6)

At least two heat dissipating members composed of a base material that contacts the heat generating element and conducts heat of the heat generating element and a protrusion that dissipates the heat conducted to the base material;
A plate-shaped partition member that forms a first flow path and a second flow path that are air flow paths in a laminated structure in a housing that houses the heat dissipation member;
The first flow path is formed on one surface side of the partition member,
The second flow path is formed on the other surface side of the partition member,
The first heat radiating member located on the windward side of the flow path of the air is disposed in the first flow path,
Second heat radiating member located on the leeward side of the flow path of the air is at least partially the second flow path of the projecting portion at least a portion of said substrate located in the first flow path to be exposed on said first flow path and a cooling device according to claim Rukoto disposed across the second flow path. The cooling device according to claim 1, wherein the partition member has an insertion portion on a leeward side of the air flow path, and the protruding portion of the second heat radiating member passes through the insertion portion. The partition member has a stepped portion recessed on the first flow path side to the leeward side of the air flow path,
Said second heat radiating member, the cooling device of claim 1, wherein more than at least half of the protrusion is equal to or exposed to the second flow path and through the stepped portion. The cooling device according to claim 3, wherein the partition member has an insertion portion in the stepped portion, and the protruding portion of the second heat radiating member passes through the insertion portion. At least two heat dissipating members composed of a base material that contacts the heat generating element and conducts heat of the heat generating element and a protrusion that dissipates the heat conducted to the base material;
A plate-shaped partition member that forms a first flow path and a second flow path that are air flow paths in a laminated structure in a housing that houses the heat dissipation member;
The first flow path is formed on one surface side of the partition member,
The second flow path is formed on the other surface side of the partition member,
With arranging the second heat radiating member located on the leeward side of the first heat radiation member and the flow path of the air which is located on the windward side of the flow path of the air in the first flow path, the second A cooling device comprising a heat transfer plate in contact with the protrusion and the partition member between the protrusion of the heat radiating member and the partition member . The cooling device according to any one of claims 1 to 5, wherein the partition member is a substrate on which an electronic component is mounted.

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