JP2001094283A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem of a jet duct structure in which cooling air is reparately supplied to a plurality of heat generating devices mounted on a substrate in series or in parallel, that the amount of cooling air to the heat generating devices can not be equally distributed and larger amount of cooling air is supplied to the downstream heat generating devices, and the position of the heat generators and heat generation distribution matching the speed of distribution of the cooling air jet from holes is not considered at all. SOLUTION: Partitions having a some degree of height and width downstream of jet holes for cooling heal generators of a jet duct part are provided partition boards are placed in the central upper part of semiconductor devices mounted in parallel with the direction of flow, the area of opening of the jet holes for cooling the heat generators is made smaller in the downstream of the cooling air, and steps are provided in a stair form as advancing to the downstream side of the cooling air, or the parts where high-temperature heat is generated inside the semiconductors of jet duct are placed downstream of the cooling air.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a cooling device.

[0002]

2. Description of the Related Art A plurality of substrates on which a plurality of semiconductor elements are mounted are provided in an electronic apparatus such as a computer. In some cases, semiconductor elements are mounted on the substrate in series in the flow direction of the cooling air, and the cooling air is individually supplied to each semiconductor element.

As a method of this individual cooling, a jet duct structure capable of supplying cooling air from above each heating element is used. For example, as described in Japanese Patent Application No. 5-229847, the nozzle portion of the jet is extended to the sealed heating element so that the exhaust air flows through this portion. Also,
As described in Japanese Patent Application No. 8-319271, in order to secure redundancy when a failure occurs in a cooling fan,
A duct is configured from the second cooling fan so as to supply cooling air to the heating element having the first fan and the cooling fins,
A cooling air path is formed.

Further, as described in Japanese Patent Application No. 62-503796, a comb-shaped jet duct is provided at a position corresponding to the position of the package so that cooling air is jetted from the jet holes.

[0005]

The prior art described above has a jet duct structure for individually supplying cooling air to a plurality of heating elements mounted in series or in parallel on a substrate. Can not be evenly distributed, supply a large amount of cooling air to the downstream heating element, and consider the position and heat distribution of the heating element that matches the velocity distribution of the cooling air from the ejecting holes. Not.

SUMMARY OF THE INVENTION It is an object of the present invention to uniformly distribute cooling air to each heating element in a jet duct structure and to improve cooling performance corresponding to the heat distribution of each heating element.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device mounted on a substrate, a plurality of fins mounted on the semiconductor device, and a cooling duct having a hole in an upper portion of each of the fins. This is achieved by providing a partition plate having a predetermined height on the downstream side of the small hole in the cooling duct in the air.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the embodiment of the present invention and its operation and effect will be described below. First, FIG. 1 is a perspective view of one embodiment of the present invention in which four semiconductor elements (hereinafter referred to as heating elements) are mounted on a substrate 4. The heat radiating fins 10 that can ensure highly efficient cooling performance are mounted on the heating element 2. Although the direction of the radiation fins 10 and the direction of the flow direction of the cooling air 12 are orthogonal to each other, they may be parallel. A jet duct 1 for ventilating the cooling air 12 is provided above the radiation fins 10. The supply of the cooling air 12 to the radiation fins 10 is performed through the jet holes 5 opened in the jet duct 1.
The jet duct 1 also includes a central partition plate 7 for dividing the cooling air passage into two in the flow direction, an upstream partition plate 8 immediately after the upstream jet holes 5, and a downstream partition plate immediately after the downstream jet holes 5. A partition plate 9 is attached. The central partition plate 7 is provided at a position equally dividing the air path of the jet duct 1 in FIG.
The central partition plate 7 is installed at a position proportional to the amount of heat generated by the heating elements mounted on the substrate 4. Also, the upstream partition plate 8
Is such that the temperatures of the upstream heating element 2 and the downstream heating element 2 are substantially the same. For example, when the heating values of the upstream and downstream heating elements are substantially the same, one half of the area of the air passage divided by the central partition plate 7 is the area of the upstream partition plate 8. Also, the calorific value is on the upstream side,
If different on the downstream side, the area of the upstream partition plate 8 has a shape proportional to the heat generation ratio. Upstream and downstream heating elements 2
And the height of the jet duct 1 is 15m
m, and the duct width is 280 mm, the shape of the upstream partition plate 8 is 13 mm in height and 80 mm in width. By providing the partition plate immediately after the jet hole, the cooling air 12 colliding with the partition plate
Is converted into a static pressure, the static pressure in the vicinity of the jet hole is increased, and the cooling air 12 flowing out from the jet hole can be increased.

The downstream partition plate 9 is located immediately after the jet hole 5 to supply the cooling air 12 to the most downstream heating element 2, and, like the upstream partition plate 8, reduces the dynamic pressure of the cooling air 12 to a static pressure. And the cooling air 12 flowing out of the jet holes can be increased. Furthermore, since it is the most downstream heating element, there is no jet hole downstream therefrom. Therefore, the downstream partition plate 9 becomes a downstream wall of the jet duct 1.

Next, FIG. 2 shows a plan view of the perspective view of FIG. 1 as viewed from the surface on which the heating element 2 is mounted.

In FIG. 2, a heating element 2 is provided on a substrate 4.
And a radiation fin 10 is mounted on each of them. The jet hole 5 is a rectangular hole that is long in the flow direction, and is orthogonal to the direction of the radiation fin 10. In this embodiment, since the amounts of heat generated between the four heating elements 2 are the same, the shapes of the jet holes are the same. The central partition plate 7 is located at the center of the jet duct 1, which is the upper center of the heating elements 2 mounted in parallel,
The height and width of the upstream partition plate 8 are the same. The downstream partition plate 9 also serves as a downstream wall of the jet duct 1.

Next, FIG. 3 shows an embodiment viewed from the AA section of FIG.

Referring to FIG. 3, an outline of the flow of the cooling air 12 will be described. The cooling air 12 flowing into the jet duct 1 first
The cooling air 12 flows out to the radiating fins 10 mounted on the upstream heating element 2 and flows out in a direction orthogonal to the main flow of the cooling air 12. Next, the cooling air 12 supplied to the heating element 2 on the downstream side is the cooling air 12 in a region outside the upstream partition plate 8, collides with the downstream partition plate 9, and all the remaining cooling air 12 flows downstream. To the cooling fin 10 on the side. The cooling air 12 flows out in a direction orthogonal to the main flow. The exhaust air from the upstream radiation fins 10 and the downstream radiation fins 10 merge and flow out to the downstream side of the substrate 4.

Next, FIGS. 4 and 5 show an embodiment in which the pressure loss at the inlet of the cooling air 12 of the jet duct 1 is reduced for the purpose of improving the cooling performance of FIGS. FIG. 5 is a sectional view taken along line BB of FIG. Only the points different from the cases of FIGS.

In FIGS. 4 and 5, an inlet taper 18 is provided at the inlet of the jet duct 1 to prevent the cooling air from being released at the inlet of the jet duct 1. As a result, the pressure loss at the inlet of the jet duct 1 can be reduced, and when matching with the cooling fan is considered, the amount of cooling air can be increased.

In addition, without using the partition plate used in the case of FIGS.
6 and 7 show an embodiment in which a step is provided. FIG. 7 is a sectional view taken along line CC of FIG.

6 and 7, in FIG. 7, a step is provided immediately after the cooling jet hole 5 of the upstream side heating element 2 to form the step 19, so that the cooling air flows through the step of the step 19. Collision causes the cooling air 12 to blow out to the cooling fins 10 on the upstream side. The cooling air 12 flows out in a direction orthogonal to the main flow.
The downstream side is the same as in FIGS.

Next, a description will be given with reference to FIGS. FIG. 9 is a sectional view taken along line DD of FIG.

8 and 9, when the second heat generating element having a different (low) heat generation amount is mounted on the substrate 4 and the heat radiating fin 11 for the second heat generating element having a low fin height is mounted. This is an embodiment of the present invention. Thus, in the upstream jet duct 1, the height of the jet duct is the same as the height of the second heat-generating element radiating fins 11, and the jet duct is located immediately after the jet hole 5 for the second heat-generating element. There is a step. Therefore, as in the case of FIGS. 6 and 7, the amount of cooling air corresponding to the amount of generated heat can be supplied to the second heating element 3 on the upstream side and the heating element 2 on the downstream side.

Further description will be made with reference to FIGS.
FIG. 11 is a sectional view taken along line EE of FIG.

FIGS. 10 and 11 show an embodiment in which three heating elements 2 are mounted on the substrate 4 in the flow direction of the cooling air 12 unlike the cases of FIGS. Only the points different from those in FIGS. A midstream partition plate 20 is provided in the second row in the flow direction of the cooling air 12. The shape of the middle part partition plate 20 is higher than the height of the upstream part partition plate 8 and wider than its width. Collision occurs at the upstream partition plate 8, and the upstream jet holes 5
The cooling air 12 flowing out of the nozzle causes a decrease in air volume in the jet duct in the middle stream. Therefore, the cross-sectional wind speed in the midstream jet duct 1 decreases from the upstream side. The reduced dynamic pressure due to the reduced wind speed of the cooling air 12 can be supplemented by increasing the dew area of the partition plate, and the amount of cooling air supplied to each heating element 2 can be equalized.

Next, FIGS. 12 and 13 show an embodiment in which a step is provided in the jet duct 1 and a step 19 is formed instead of the partition plate used in FIGS. FIG. 13 shows F in FIG.
It is -F cross section.

In FIGS. 12 and 13, the same effects as in the embodiment of FIGS. 6 and 7 are obtained.

Further, six heating elements 2 having different heating values are provided,
14 and 15 show an embodiment in the case of mounting. FIG. 15 is a GG cross section of FIG.

In FIGS. 14 and 15, the same effects as in the embodiment of FIGS. 8 and 9 were obtained.

Next, an embodiment in which a heat generation distribution is obtained in the heat generating element 2 will be described with reference to FIGS. FIG. 16 is a cross-sectional view when the heat generating element 2 is mounted on the substrate 4 and the heat radiating fins 10 are mounted on the heat generating element 2.

In FIG. 16 and FIG.
A jet duct 1 is provided at the upper part of the nozzle, and the jet duct 1 is provided with a jet hole 5. Cooling air 12 is jetted from the jet holes to the radiation fins 10. The opening area of the jet hole 5 is the same in the flow direction of the cooling air 12. FIG. 17 shows FIG.
6 shows a calorific value profile 13 inside the heating element 2, a wind velocity profile 14 at the outlet of the jet hole, and a temperature profile 15 inside the heating element 2. The amount of heat generated in the chip of the heating element is higher on the downstream side of the cooling air 12. Further, when the jet duct 1 is configured, the wind velocity at the outlet of the jet hole converts dynamic pressure into static pressure.
It becomes faster on the downstream side. Therefore, the heat transfer with the cooling air becomes better on the downstream side, and the temperature inside the chip of the heating element 2 can be made uniform.

Next, FIG. 18 shows an embodiment in which the opening area of the jet hole 5 is reduced in the flow direction.

In FIG. 18, unlike the cases of FIGS. 16 and 17, the wind speed at the outlet of the jet hole is almost the same value, and the heat transfer between the radiation fins 10 is almost the same. Therefore, when there is almost no heat distribution in the heat generating element, and even when there is a heat distribution in the heat generating element, the temperature distribution in the heat generating element can be made substantially uniform when the temperature is uniform at the base of the radiation fin 10.

Next, FIG. 19 shows a memory 21, a bus controller, and a small capacitor 2 in addition to the high-heat-generating elements.
3. Processor board 3 with large capacitor 22
0 shows a plan view.

In FIG. 19, a memory 21 plays a role of recording data, a bus controller exchanges data between central processing units, and a capacitor plays a role of stabilizing power supplied to a semiconductor element. A radiator fin 27 for the bus controller is mounted on the bus controller, and the direction of the fin is orthogonal to the direction of the radiator fin 10 of the heat-generating element that generates high heat, so that the cooling air 12 does not interfere with each other. The power supply connector 2 is provided on the processor board 30.
6. There is a data communication connector 25 from which power is supplied and data is taken in and out. Cooling air 12
Is only different from the above description.
Above the radiating fins 27 for the bus controller, a jet hole 28 for the bus controller and a rectangular hole long in a direction perpendicular to the main flow direction of the cooling air 12 are formed. Cooling air is supplied from the holes to the radiating fins 27 for the bus controller. Furthermore, the shape (height, width) of the upstream partition plate 8 is determined so that the downstream bus controller jet holes 28 are not affected by the separation of the flow of cooling air from the upstream partition plate 8. ing. The remaining heating elements, ie, the memory 21, the large condenser 22, and the small condenser 21, can be cooled by the high heat generating element and the cooling air used for cooling the bus controller, but can be cooled even if the jet duct 1 is provided with a small hole.

FIG. 20 is a sectional view taken along the line HH of FIG.

In FIG. 20, the height of the large capacitor 22 is higher than the height of the bus controller 24 and the radiating fins 24 for the bus controller. Therefore, the radiation fins 27 for the bus controller and the jet holes 28 for the bus controller are located at the same position as the large condenser in the flow direction of the cooling air 12.
Is long, and there is a possibility that the cooling air 12 cannot be sufficiently supplied to the radiation fins, which may cause a decrease in cooling performance.

Next, an embodiment of the present invention which solves this problem is shown in FIG.

In FIG. 21, the point different from FIG. 19 is that the jet duct 1 is close to the bus controller radiation fins 27 up to the upstream bus controller radiation fins 27. Immediately after the bus controller jet hole 28, the jet flow duct 1 has a stepped shape, and the jet duct 1 stands up.

FIG. 22 is a sectional view taken along the line II of FIG.

In FIG. 22, as described with reference to FIG. 21, the jet duct 1 is connected to the bus controller radiation fins 2 up to the upstream bus controller radiation fins 27.
7 and immediately after the bus controller jet hole 28, the jet flow duct 1 rises. As a result, the wind speed at the inlet of the jet duct 1 is reduced as compared with the case of FIG. 21, and the throttle loss here can be reduced. Considering the matching with the cooling fan, the operation cooling air volume becomes high and the cooling performance can be improved.

FIG. 23 is a sectional view as seen from the plane JJ of FIG.

In FIG. 23, the duct width of the jet duct 1 above the large condenser 22 is reduced. on the other hand,
The width of the other ducts is widened, and the average cross-sectional wind speed here is reduced, and the throttle loss can be reduced.

FIG. 24 shows an embodiment in which eight high performance computers 29 are equipped with the processor boards 30 shown in FIG. 19 or FIG.

In FIG. 24, front, side and ceiling covers are removed. The cooling air 12 is supplied to the cooling fan 3
Due to 2, it is sucked from the ceiling surface and released to the floor surface.
In order to prevent dust from being sucked into the computer 29, an air filter 34 is provided at the upper part of the housing. Thereby, a plurality of processor boards 30 can be efficiently cooled, and a high-performance and highly reliable computer 29 can be achieved.

According to the present embodiment, a partition plate having a certain height and width is provided downstream of the cooling jet hole of each heating element inside the jet duct, so that the cooling air collides with the partition plate. By changing the dynamic pressure due to the wind speed of the cooling air to static pressure, the cooling air can be ejected from the jet holes, and the problem that the cooling air volume increases toward the downstream of the jet duct is solved, and the flow direction is Supply air volume can be equalized to match the calorific value.

By providing a partition plate at the upper center of the semiconductor element mounted in parallel in the flow direction, the amount of air supplied to each heating element mounted in parallel in the flow direction of the cooling air can be equalized.

Further, by making the opening area of the cooling jet holes of each heating element narrower toward the downstream side of the cooling air, the problem that the cooling air volume increases at each jet hole toward the downstream side is solved. Cooling air can be jetted uniformly in the flow direction of each jet hole.

Further, by providing a step-like step toward the downstream side of the cooling air, the cooling air collides with the step portion,
By changing the dynamic pressure of the cooling air to the static pressure, the cooling air can be ejected from the jet holes, and the problem that the cooling air volume increases toward the downstream of the jet duct is solved, and the flow direction is supplied to each heating element. The air volume can be equalized to match the calorific value.

Further, by providing a position where high heat is generated inside the semiconductor on the downstream side, it is possible to cope with the wind speed distribution in which the cooling air velocity flowing out from the jet hole is higher toward the downstream side, and to make the temperature distribution inside the heating element uniform. .

[0047]

According to the present invention, it is possible to provide an electronic device which can cope with the wind speed distribution in which the cooling wind speed flowing out from the jet holes is higher toward the downstream side, and which can make the temperature distribution inside the heating element uniform.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of the present invention, in which four heating elements are mounted in series and in parallel on an electronic substrate.

FIG. 2 is a plan view of FIG. 1 as viewed from above a heating element.

FIG. 3 is a plan view as viewed from a plane AA in FIG. 2;

FIG. 4 is a plan view showing one embodiment of the present invention, in which four heating elements are mounted on an electronic board in series and in parallel, and a taper is provided at an inlet of a jet duct.

FIG. 5 is a plan view as viewed from plane BB in FIG. 4;

FIG. 6 is a plan view showing one embodiment of the present invention, in which four heating elements are mounted in series and in parallel on an electronic substrate, and a jet duct has a stepped shape.

FIG. 7 is a plan view as viewed from plane CC in FIG. 6;

FIG. 8 shows two high heating elements, showing one embodiment of the present invention;
It is a top view in case two low heat generating elements are mounted in series and in parallel on an electronic board, and a jet duct becomes step-like.

FIG. 9 is a plan view as seen from the plane DD in FIG. 8;

FIG. 10 is a plan view showing one embodiment of the present invention, in which six heating elements are mounted on an electronic substrate in series and in parallel.

FIG. 11 is a plan view as seen from plane EE in FIG. 10;

FIG. 12 is a plan view showing one embodiment of the present invention, in which six heating elements are mounted on an electronic board in series and in parallel, and a jet duct has a step shape.

FIG. 13 is a plan view as seen from plane FF of FIG.

FIG. 14 is a plan view showing one embodiment of the present invention, in which six heating elements having different heating values are mounted in series and in parallel on an electronic board, and a jet duct has a stepped shape.

FIG. 15 is a plan view as viewed from the plane GG of FIG. 14;

FIG. 16 is a plan view showing one embodiment of the present invention, in which one heating element is mounted on an electronic substrate and a jet duct is formed above the heating element.

FIG. 17 is a graph showing the heat generation in the chip, the wind velocity at the outlet of the jet hole, and the temperature distribution in the chip with respect to the cooling air flow direction of the semiconductor element in FIG.

FIG. 18 is a plan view showing one embodiment of the present invention, in which four heating elements are mounted on an electronic substrate in series and in parallel, and an opening area of a jet hole is reduced in a flow direction.

FIG. 19 is a plan view showing an embodiment of the present invention, in which a jet duct is provided on a processor board on which a number of heating elements are mounted, and a partition plate is provided on the jet duct.

FIG. 20 is a plan view seen from the HH plane in FIG. 19;

FIG. 21 is a plan view showing an embodiment of the present invention, in which a jet duct is provided on a processor board on which a large number of heating elements are mounted, and the jet duct has a stepped shape and a partition plate. .

FIG. 22 is a plan view seen from the II plane in FIG. 21;

FIG. 23 is a plan view seen from the plane JJ in FIG. 21;

FIG. 24 is a perspective view of a high-performance computer mounted with eight processor boards according to an embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Jet duct, 2 ... Heating element, 3 ... Second heating element,
4 ... substrate, 5 ... jet hole, 7 ... central partition plate, 8 ... upstream partition plate, 9 ... downstream partition plate, 10 ... radiation fin, 11 ...
Second heat-dissipating fins for heat-generating elements, 12: cooling air, 13: calorific value profile inside the heat-generating element, 14: wind velocity profile at the outlet of the jet hole, 15: temperature profile inside the heat-generating element, 16: duct height, 17: duct width, Reference numeral 18: taper at the entrance, 19: stairs, 20: partition plate at the middle part, 21: memory, 22: large capacitor, 23: small capacitor, 24: bus controller, 25: connector for data communication, 27: radiation fin for bus controller, 28: Jet hole for bus controller, 29: High performance computer, 30: Processor board, 31: Power supply for processor power supply, 32: Cooling fan,
33: Front panel, 34: Air filter.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takahiro Oguro 1st Horiyamashita, Hadano-shi, Kanagawa Prefecture, in the Enterprise Server Division of Hitachi Ltd. F term in the Machinery Research Laboratory (reference) 5E322 AA01 BA01 BA03 BA04

Claims (1)

[Claims] A plurality of semiconductor elements mounted on a substrate;
In an electronic apparatus including a heat dissipating fin attached to the semiconductor element and a cooling duct having a hole in an upper portion of each of the heat dissipating fins, a predetermined height is set downstream of the small holes in the cooling duct on the air side. Electronic device provided with a partition plate.