JP2016178285A - Cooling structure and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure and device capable of improving the cooling performance of a heat radiating portion on a leeward side.SOLUTION: A cooling structure 101 is equipped with: a housing 140 which is disposed so as to cover a heat radiating portion 130, and forms an air-guiding path guiding wind from a blowing portion between the heat radiating portion 130 and the housing 140; and a wind directing portion 160 which is disposed at a predetermined position of the air-guiding path, and directs wind to the heat radiating portion 130. A notch portion is provided at a position corresponding to the wind directing portion 160. The cooling structure 101 has the air-guiding path, so that it is possible to send wind to a leeward side by using a space of an outer periphery of the heat radiating portion 130, in addition to the inside of the head radiating portion 130. The cooling structure 101 can send wind passing through the air-guiding path toward the heat radiating portion 130 by the wind directing portion 160.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cooling structure and an apparatus.

  In recent years, high performance has been advanced in devices such as personal computers (for example, electronic devices). As a result, the number of integrated circuits is increasing in electronic devices. In electronic devices, the amount of heat generated by integrated circuits is also increasing. In order to cool a plurality of these integrated circuits, a technique using a heat sink is generally known. Specifically, in this technique, a heat sink is placed on a plurality of integrated circuits, and heat generated from the plurality of integrated circuits is dissipated by the heat sink. This technique cools the heat sink by sending air to the heat sink by a fan. As a result, this technology facilitates the transfer of heat generated from the plurality of integrated circuits to the heat sink, and enhances the cooling effect of the plurality of integrated circuits.

  As described above, for example, Patent Document 1 discloses a technique related to a stack structure of a semiconductor power conversion device as a technique for increasing the cooling effect of an integrated circuit by sending air to a heat sink. The technique described in Patent Document 1 includes deflectors (cooling air guide plates) 28 and 29 as illustrated in FIG. 1 of this document. In the technique described in Patent Document 1, cooling air is applied to the electrolytic capacitor 20 located on the windward side by the deflector 28, and cooling air is applied to the electrolytic capacitor 21 located on the leeward side by the deflector 29. As described above, the technique described in Patent Literature 1 applies wind to the electrolytic capacitor 21 located on the leeward side.

  Patent Document 2 discloses a technique related to a control unit. As illustrated in FIG. 1 of this document, the technique described in Patent Document 2 includes a current plate 13 that guides cooling air to the first heat sink 2 and the second heat sink 5. In the technique described in Patent Document 2, the first heat sink 2 and the second heat sink 5 are enclosed by the rectifying plate 13, and cooling air is taken into the enclosed area. As described above, in the technique described in Patent Document 2, the cooling air is taken into the enclosed region, and the air is also sent to the first heat sink 2 located on the leeward side.

JP 2004-180424 A Japanese Patent Laid-Open No. 10-150284

  However, the technique described in Patent Document 1 applies the wind that has passed through the heat generating part (electrolytic capacitor) on the leeward side to the heat generating part (electrolytic capacitor) on the leeward side. For this reason, since the technique described in Patent Document 1 sends the wind whose temperature has increased by passing through the heat generating part on the leeward side to the heat generating part on the leeward side, the heat generating part on the leeward side can be efficiently cooled. There is a technical problem that is difficult.

  Further, in the technique described in Patent Document 2, the wind that has passed through the leeward heat radiating part (second heat sink) is applied to the leeward heat radiating part (first heat sink) as in the technique described in Patent Document 1. to be sending. For this reason, since the technique described in Patent Document 2 also sends the wind that has risen in temperature by passing through the radiant section on the leeward side to the radiant section on the leeward side, the cooling performance of the radiant section on the leeward side is reduced. There is a technical problem.

  As described above, in the technologies described in Patent Documents 1 and 2, since the wind whose temperature has increased by passing through the leeward heat radiating portion is placed in the leeward heat radiating portion, it is difficult to cool the leeward heat radiating portion. There is a technical problem.

  Accordingly, an object of the present invention is to provide a cooling structure and an apparatus capable of improving the cooling performance of the leeward heat radiating portion in view of the above-described actual situation.

  In order to achieve the above object, a cooling structure according to the present invention is disposed so as to cover a heat radiating portion, and a housing that forms an air guide path for guiding the wind from the air blowing portion between the heat radiating portion and the air guide. And a wind direction portion that directs the wind toward the heat radiating portion, and has a cutout portion at a position corresponding to the wind direction portion.

  In order to achieve the above object, an apparatus according to the present invention comprises the above cooling structure and a heat generating portion disposed in thermal connection with the cooling structure.

  According to the present invention, it is possible to improve the cooling performance of the radiant side radiating section.

1 is a perspective view illustrating a configuration of a cooling structure according to an embodiment (first embodiment) of the present invention and an electronic device (apparatus) including the cooling structure. It is a disassembled perspective view which shows the structure of the cooling structure which concerns on one Embodiment (1st Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure. It is a top view which shows the structure of the cooling structure which concerns on one Embodiment (1st Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure. FIG. 4 is a cross-sectional view taken along line II ′ in FIG. 3. It is sectional drawing which shows line II-II 'in FIG. It is sectional drawing which shows line III-III 'in FIG. It is a perspective view which shows the structure of the cooling structure which concerns on other embodiment (2nd Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure. It is a disassembled perspective view which shows the structure of the cooling structure which concerns on other embodiment (2nd Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure. It is a top view which shows the structure of the cooling structure which concerns on other embodiment (2nd Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure. It is sectional drawing which shows line II 'in FIG. It is sectional drawing which shows line II-II 'in FIG. It is sectional drawing which shows line III-III 'in FIG. It is sectional drawing which shows line IV-IV 'in FIG. It is a disassembled perspective view which shows the structure of the cooling structure which concerns on other embodiment (3rd Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure. It is a disassembled perspective view which shows the structure of the cooling structure which concerns on other embodiment (4th Embodiment) of this invention, and an electronic device (apparatus) which comprises this cooling structure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
An embodiment (first embodiment) of the present invention will be described with reference to FIGS. 1 to 3 are a perspective view, an exploded perspective view, and a plan view showing a configuration of a cooling structure 101 according to this embodiment (first embodiment) and an electronic apparatus (device) 100 including the cooling structure 101. FIG. It is. 4 to 6 are cross-sectional views showing line II ′, line II-II ′, and line III-III ′ in FIG.

  The cooling structure 101 includes a heat dissipation unit 130 and a housing 140. The heat radiating section 130 radiates heat generated from the heat generating section 120. The housing 140 is disposed so as to cover the heat radiating unit 130. The housing 140 defines an air guide path 150 that guides wind from a blower (not shown) between the housing 140 and the heat radiating unit 130. The wind direction portion 160 is disposed at a predetermined position of the air guide path 150 and directs the wind toward the heat radiating portion 130.

  As described above, since the cooling structure 101 of the present embodiment has the air guide path 150, in addition to the inside of the heat radiating unit 130, the air can be sent to the leeward side using the space on the outer periphery of the heat radiating unit 130. It becomes possible. Further, the cooling structure 101 can send the wind passing through the air guide path 150 toward the heat radiating unit 130 by the wind direction unit 160. Therefore, according to the cooling structure 101 of the present embodiment, it is possible to improve the cooling performance of the leeward heat radiation unit 130.

  Similarly, since the electronic device 100 of the present embodiment has the air guide path 150, it is possible to send the wind to the leeward side using the space on the outer periphery of the heat radiating unit 130 in addition to the inside of the heat radiating unit 130. It becomes. In addition to the inside of the heat radiating unit 130, the electronic device 100 can send the wind sent to the leeward side using the space on the outer periphery of the heat radiating unit 130 toward the heat radiating unit 130 by the wind direction unit 160. Therefore, according to the electronic device 100 of the present embodiment, the cooling performance of the leeward heat radiation unit 130 can be improved.

(Second Embodiment)
Another embodiment (second embodiment) of the present invention will be described with reference to FIGS. First, the structure of the cooling structure 201 of this embodiment and the electronic device (apparatus) 200 including the cooling structure 201 will be described with reference to FIGS. 7 to 9. 3 to 5 are a perspective view, an exploded perspective view, and a plan view showing a configuration of a cooling structure 201 according to the present embodiment (second embodiment) and an electronic device 200 including the cooling structure 201. FIG.

  The electronic device 200 includes a substrate 210, a heat generating part 220, and a cooling structure 201. The cooling structure 201 includes a heat dissipation unit 230 and a housing 240. In addition to the substrate 210, the heat generating unit 220, the heat radiating unit 230, and the housing 240, the electronic device 200 includes a blower unit (not shown) that sends air into the heat radiating unit 230 and the housing 240.

  Since the substrate 210 is a well-known technique, a specific description thereof is omitted, but the substrate 210 is formed in a plate shape using a phenol resin, an epoxy resin, or the like. A plurality of heat generating portions 220 are disposed on the surface of the substrate 210 formed in a plate shape.

  Since the heat generating unit 220 is a well-known technique, a detailed description thereof is omitted, but is an integrated circuit element such as a CPU, IC, LSI, MPU, or the like. The heat generating part 220 generates heat during operation. In order to dissipate the heat generated by the heat generating unit 220, the heat dissipating unit 230 is placed on the heat generating unit 220. “IC” is an abbreviation for “Integrated Circuit”. “LSI” is an abbreviation for “Large Scale Integration”. “CPU” is an abbreviation for “Central Processing Unit”. “MPU” is an abbreviation for “Micro Processing Unit”.

  The heat radiating part 230 is for radiating heat generated from the heat generating part 220, and is, for example, a heat sink. Since this heat sink is a well-known technique, a specific description is omitted, but it is formed using a metal member such as aluminum, iron, or copper having good thermal conductivity. An example of this heat sink is a fin type heat sink. This fin-type heat sink includes a base and a plurality of fins, and the base is provided with a plurality of fins. Moreover, the heat sink extends these fins along the direction of the wind blown from the blower. For this reason, when wind is sent to the heat sink by the blower, the wind passes between the fins, and the entire heat sink can be cooled. Thus, the heat sink enhances the heat dissipation effect of the heat generated from the heat generating part 220.

  In the present embodiment, the heat radiating part 230 has a gap 234 at a position corresponding to a wind direction part 260 described later. The description of the gap 234 of the heat radiating unit 230 will be described later with reference to FIGS. 10 to 13. A casing 240 is disposed on the outer periphery of the heat radiating unit 230 in order to suppress wind leakage of the air blown to the heat radiating unit 230.

  The outer shape of the housing 240 is formed in a rectangular shape. The housing 240 is disposed so as to cover the radiator 230. Thereby, the housing | casing 240 is suppressing the wind leak of the wind ventilated by the ventilation part 230 by the ventilation part as mentioned above. In addition, description of the housing | casing 240 is later mentioned using FIG. 10 thru | or FIG. 13 with the description of the clearance gap 234 of the thermal radiation part 230 below.

  The gap 234 and the housing 240 of the heat dissipation unit 230 will be described with reference to FIGS. 10 to 13. 10 to 13 are cross-sectional views showing a line II ′, a line II-II ′, a line III-III ′, and a line IV-IV ′ in FIG.

  As described above, the outer periphery of the heat radiating unit 230 is covered with the housing 240. In the present embodiment, an air guide path 250 that guides wind from a blower (not shown) is defined between the heat radiating unit 230 and the housing 240. As a result, it is possible to send the wind blown from the blower to the leeward side using the space on the outer periphery of the heat dissipating unit 230 in addition to the inside of the heat dissipating unit 230. Hereinafter, in addition to the inside of the heat radiating part 230, the wind passing through the outer space of the heat radiating part 230 is referred to as fresh air.

  In addition, when the air guide path 250 is viewed in a cross-section in a direction perpendicular to the direction of the wind blown by the blower unit, the space between the heat dissipator 230 and the housing 240 is extended over the upper region and the side region of the heat dissipator 230. It is good to make it substantially the same interval. Thereby, it becomes possible to suppress the deviation of the flow rate of fresh air in the upper region and the side region of the heat radiating unit 230. In the present embodiment, it is preferable that the distance between the heat radiating unit 230 and the housing 240 be substantially the same. However, the present invention is not limited to this, and the length of the upper region and the side region of the heat radiating unit 230 is the same. The interval may be determined accordingly. Thereby, the area of the air guide path 250 in the upper region and the side region of the heat radiating unit 230 is made the same area, and the deviation of the flow rate of fresh air can be further suppressed.

  The wind guide path 250 is provided with a wind direction section 260 that directs the wind toward the heat radiating section 230. The wind direction portion 260 is located on the inner surface of the housing 240 and is formed together with the housing 240 by integral molding. In the present embodiment, the wind direction portion 260 is formed by integral molding together with the housing 240, but is not limited thereto, and may be bonded to the inner surface of the housing 240, for example.

  As described above, the airflow direction portion 260 is disposed at a predetermined position of the air guide passage 250 when formed integrally with the housing 240. Here, the predetermined position is not particularly limited. For example, if the heat generation amount of the third heat generating part 220c is the highest among the heat generating parts 220, the predetermined position is a position where the wind is directed to the third heat generating part 220c. . In addition, for example, if the heat generating portions 220 have the same heat generation amount, the heat is directed to the heat generating portion 220 located on the most leeward side. Thus, the position of the wind direction portion 260 of the present embodiment can be adjusted as appropriate according to the amount of heat generated by the heat generating portion 220, and the wind can be directed to a desired position of the heat radiating portion 230.

  Thus, since the airflow direction part 260 is provided in the air guide path 250, it becomes possible to send fresh air toward the heat radiating part 230. For this reason, fresh air is blown also to the leeward side of the heat radiating unit 230. Thereby, the heat dissipation effect on the leeward side of the heat dissipation part 230 is enhanced.

  In the present embodiment, the wind direction portion 260 includes a first wind direction portion 261, a second wind direction portion 262, and a third wind direction portion 263. The first wind direction part 261 is an upper region of the heat radiating part 230 and is disposed across the width direction of the heat radiating part 230. For this reason, fresh air will be sent over the width direction of the thermal radiation part 230. FIG.

  The second wind direction part 262 and the third wind direction part 263 are lateral regions of the heat radiation part 230 and are disposed over the height direction of the heat radiation part 230. For this reason, fresh air will be sent over the height direction of the heat radiator 230. Here, the 2nd wind direction part 262 and the 3rd wind direction part 263 are arrange | positioned in the side area | region of the both sides on the same cross section of the thermal radiation part 230 perpendicular | vertical to the ventilation direction ventilated from a ventilation part. For this reason, fresh air is sent into the inside of the heat radiating part 230 from both sides in the side region of the heat radiating part 230.

  The 1st wind direction part 261, the 2nd wind direction part 262, and the 3rd wind direction part 263 are arrange | positioned alternately toward a wind direction direction. In this manner, the first wind direction portion 161 located in the upper region and the second wind direction portion 262 and the third wind direction portion 263 located in the side region are alternately arranged, so that the region is located in one region. It suppresses that the wind is sent unevenly.

  In the present embodiment, the first wind direction portion 271 is disposed on the leeward side, and the second wind direction portion 262 and the third wind direction portion 263 are disposed on the leeward side. The wind direction portion 262 and the third wind direction portion 263 may be provided, and the first wind direction portion 261 may be provided on the leeward side.

  A gap 234 is formed in the heat dissipating part 230 at a position corresponding to the wind direction part 260. In the present embodiment, the gap 234 is formed by providing a notch in the fin. As described above, the gap 234 is formed in the heat radiating portion 230, so that fresh air can be sent into the heat radiating portion 230 through the gap 234. Thereby, not only the side surface of the heat radiating unit 230 but also the inside can be cooled. Therefore, the heat dissipation effect of the heat dissipation part 230 is enhanced.

  As described above, since the cooling structure 201 of the present embodiment includes the air guide path 250, it is possible to send fresh air to the leeward side. Further, since the electronic device 200 directs fresh air to the heat radiating portion 230 by the wind direction portion 260, it is possible to send fresh air to a portion located on the leeward side of the heat radiating portion 230.

  Therefore, according to this embodiment, it becomes possible to improve the heat radiation performance of the part located in the leeward side of the heat radiating part 230, and the high temperature of the heat generating part 220 located in the leeward side can be suppressed.

  As an example of the electronic device 200 of the present embodiment, the electronic device 200 is a card based on the PCIE standard. In general, there are full-size, short-size, low-profile, and the like as the PCIE standard card size. The card size based on the PCIE standard is defined as a full size, a height of 107 mm, and a length of 312 mm. Further, it is defined as a short size having a height of 107 mm and a length of 173 mm. “PCIE” is an abbreviation for “Peripheral Component Interconnect Express”.

(Third embodiment)
With reference to FIG. 14, another embodiment (third embodiment) of the present invention will be described. FIG. 14 is an exploded perspective view showing the configuration of the electronic device 300 according to the present embodiment (third embodiment). Note that the electronic device 300 of the present embodiment is different from the electronic device 200 of the second embodiment described above in that the heat dissipating unit 330 includes a plurality of heat dissipating units (a first heat dissipating unit 331, a second heat dissipating unit 332, and a second heat dissipating unit 332). 3 radiating portions 333), and the other points are the same. Accordingly, portions corresponding to those of the above-described second embodiment are denoted by the same or corresponding reference numerals, and description thereof is omitted.

  In the present embodiment, as described above, the electronic device 300 includes the first heat radiating unit 331, the second heat radiating unit 332, and the third heat radiating unit 333 as the heat radiating unit 330. A gap 334a is provided between the first heat radiating portion 331 and the second heat radiating portion 332. Further, a gap 334 b is provided between the second heat radiating portion 332 and the third heat radiating portion 333. As described above, the electronic device 300 makes the plurality of heat radiation units 330 independent of each other. For this reason, since the electronic device 300 makes it difficult to transfer the heat transmitted from the heat generating units 220 to the other heat radiating units 220, the heat dissipation performance of the electronic devices 300 is improved. Further, since the gaps 334 are provided between the heat radiating parts 330, it is possible to take in fresh air from the airflow direction part 260 from the gaps 334, and as in the second embodiment, It is possible to send fresh air inside.

(Fourth embodiment)
Another embodiment (fourth embodiment) of the present invention will be described with reference to FIG. FIG. 15 is an exploded perspective view showing the configuration of the electronic device 400 according to the present embodiment (fourth embodiment). Note that the electronic device 400 of the present embodiment is different from the electronic device 200 of the second embodiment described above in that the first wind direction portion 461, the second wind direction portion 462, and the third wind direction portion 463 are on the same cross section. The other points are the same. Accordingly, portions corresponding to those of the above-described second embodiment are denoted by the same or corresponding reference numerals, and description thereof is omitted.

  As described above, in the electronic device 400 of the present embodiment, the first wind direction portion 461, the second wind direction portion 462, and the third wind direction portion 463 are disposed on the same cross section, for example, the heat generating portion 220. Among them, it is possible to send fresh air toward the heat generating part 220 having the highest heat generation amount. Therefore, the electronic device 400 can improve the heat dissipation performance of the heat radiating portion 230 where the temperature becomes high, and can suppress the high temperature of the high temperature portion.

DESCRIPTION OF SYMBOLS 100 Electronic device 130 Heat radiation part 140 Case 150 Air guide path 160 Air direction part

Claims (8)

A housing that covers the heat dissipating part and forms an air guide path that guides air from the air blowing part between the heat dissipating part, and
A wind direction section that is disposed at a predetermined position of the air guide path and directs the wind toward the heat radiating section,
Having a notch at a position corresponding to the wind direction,
A cooling structure characterized by that. The wind direction part is located in an upper region of the heat dissipation part,
The cooling structure according to claim 1. The wind direction portion is located in a lateral region of the heat radiating portion,
The cooling structure according to claim 1 or 2, wherein The wind direction portion is alternately positioned in the upper region and the side region of the heat radiating portion toward the direction of the wind blown by the blower portion.
The cooling structure according to claim 3. The wind direction portion is located in the upper region and the side region on the same cross section when viewed in a direction perpendicular to the direction of the wind blown by the blower portion,
The cooling structure according to claim 4. The air guide path is formed with substantially the same width across the upper region and the side region when viewed in a cross-section in a direction perpendicular to the direction of the wind blown by the blower unit.
The cooling structure according to any one of claims 3 to 5, wherein: The heat radiating portion is constituted by a plurality of separate bodies, and a gap is provided between at least one of the separate bodies.
The cooling structure according to any one of claims 1 to 6, wherein The cooling structure according to any one of claims 1 to 7,
A heat generating portion disposed in thermal connection with the cooling structure,
A device characterized by that.

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