JP2005166923A - Cooler for electronic apparatus - Google Patents

Cooler for electronic apparatus Download PDF

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JP2005166923A
JP2005166923A JP2003403233A JP2003403233A JP2005166923A JP 2005166923 A JP2005166923 A JP 2005166923A JP 2003403233 A JP2003403233 A JP 2003403233A JP 2003403233 A JP2003403233 A JP 2003403233A JP 2005166923 A JP2005166923 A JP 2005166923A
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fan
heat sink
cooling air
fin
cooling
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JP2005166923A5 (en
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Gouji Kan
剛司 貫
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Priority to JP2003403233A priority Critical patent/JP2005166923A/en
Priority to PCT/JP2004/017559 priority patent/WO2005055689A1/en
Publication of JP2005166923A publication Critical patent/JP2005166923A/en
Publication of JP2005166923A5 publication Critical patent/JP2005166923A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooler which effectively guides a blast from a fan between the fans, thereby enhancing cooling capability, and can consequently be miniaturized. <P>SOLUTION: A heatsink 1 comprises a pin fin 2 and a flat plate fin 3, and a fan 4 makes cool air 6 flow from the pin fin 2 to the flat plate fin 3. Further, the fan 4, the pin fin 2 and the flat plate fin 3 are disposed in series to make the cool air 6 of the fan 4 flow to the heatsink 1 in parallel. Further, the fan 4 is disposed above the heatsink 1 to make the cool air 6 flow to the pin fin 2 vertically and downward. Further, the cool air 6 is made to flow toward the pin fin 2 obliquely and downward at a depression angle 45°. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ヒートシンクとファンからなる強制対流式の電子機器用冷却装置に関するものである。 The present invention relates to a forced convection type electronic device cooling apparatus including a heat sink and a fan.

電子部品から発生する熱を放熱フィンを備えたヒートシンクに伝え、ファンで発生させた冷却風Ｗを前記放熱フィンに吹き付けて冷却する強制対流式の電子機器用冷却装置が知られている。近年、電子機器の高密度化に伴い、冷却装置の高性能化と小型化の要請が強くなっている。そのため、ヒートシンクの放熱面積を増やしたり、強制対流による冷却のためのファンの性能を向上させることにより、冷却能力を向上させている（特許文献１、特許文献２）。   2. Description of the Related Art A forced convection type electronic device cooling device is known that transmits heat generated from an electronic component to a heat sink provided with heat radiation fins and cools the heat radiation fins by blowing cooling air W generated by a fan. In recent years, with the increase in the density of electronic devices, there is an increasing demand for higher performance and smaller size of the cooling device. Therefore, the cooling capacity is improved by increasing the heat dissipation area of the heat sink or by improving the performance of the fan for cooling by forced convection (Patent Document 1, Patent Document 2).

図４は従来の一般的な冷却装置の例を示す説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。図において、１０１は発熱部品１０２に密着して取り付けられたヒートシンクである。ヒートシンク１０１は平板フィン１０３を有し、また、ヒートシンク１０１の近傍にはファン１０４が取り付けられ、ファン１０４から吐出される冷却風１０５が平板フィン１０３の間に流入する。発熱部品１０２から発生した熱は、ヒートシンク１０１の平板フィン１０３に伝わり、さらに平板フィン１０３の表面から冷却風に放熱される。
特開平１１−９７８７２号公報 特開平１０−１５４８８９号公報 4A and 4B are explanatory views showing an example of a conventional general cooling device, where FIG. 4A is a top view and FIG. 4B is a side view. In the figure, reference numeral 101 denotes a heat sink attached in close contact with the heat generating component 102. The heat sink 101 has flat plate fins 103, and a fan 104 is attached in the vicinity of the heat sink 101, and cooling air 105 discharged from the fan 104 flows between the flat plate fins 103. Heat generated from the heat generating component 102 is transmitted to the flat fins 103 of the heat sink 101 and further radiated from the surface of the flat fins 103 to the cooling air.
Japanese Patent Laid-Open No. 11-97872 Japanese Patent Laid-Open No. 10-154889

しかしながら従来の冷却装置では、ファンから吐出される冷却風は旋回流であり、そのため、冷却風がフィンにぶつかって乱流が発生するので、冷却風を効率良くフィン間に導くことが出来ないという問題があった。そのためヒートシンク全体での通風抵抗が大きくなり、ファンからの冷却風の流量が減少するという問題があった。また、フィン間を流れる冷却風の流量と速度がフィン間ごとに異なり、一様な放熱能力にならず、冷却能力が十分に得られない問題もあった。さらに、ヒートシンクやファンが小型化できず、電子機器全体が小型化できない問題があった。
本発明はこのような問題点に鑑みてなされたものであり、ファンからの送風を効率よくフィン間に導くことにより冷却能力を向上させ、その結果小型化することができる冷却装置を提供することを目的とするものである。 However, in the conventional cooling device, the cooling air discharged from the fan is a swirling flow, so that the cooling air hits the fins and turbulent flow is generated, so that the cooling air cannot be efficiently guided between the fins. There was a problem. Therefore, there is a problem that the ventilation resistance in the entire heat sink increases, and the flow rate of the cooling air from the fan decreases. In addition, the flow rate and speed of the cooling air flowing between the fins differ from fin to fin, resulting in a problem that the heat radiation capacity is not uniform and the cooling capacity cannot be sufficiently obtained. Furthermore, there is a problem that the heat sink and the fan cannot be reduced in size, and the entire electronic device cannot be reduced in size.
The present invention has been made in view of such problems, and provides a cooling device capable of improving cooling capacity by efficiently guiding the air blown from the fan between the fins and, as a result, downsizing. It is intended.

上記の課題を解決するために、本発明は、ヒートシンクとファンからなる強制対流式の電子機器用冷却装置において、前記ヒートシンクはピンフィンと平板フィンを備え、前記ファンは冷却風を前記ピンフィンから前記平板フィンに向けて流すものである。また、前記ファンと前記ピンフィンおよび前記平板フィンを、直列に配置して、前記ファンの冷却風を前記ヒートシンクに平行に流すものである。また、前記ファンを前記ヒートシンクの上部に配置して、冷却風を前記ピンフィンに向けて垂直下向きに流すものである。また、冷却風を前記ピンフィンに向けて俯角４５°で斜め下向きに流すものである。   In order to solve the above-described problems, the present invention provides a forced convection type electronic device cooling apparatus including a heat sink and a fan, wherein the heat sink includes a pin fin and a flat fin, and the fan sends cooling air from the pin fin to the flat plate. It flows toward the fins. The fan, the pin fin, and the flat fin are arranged in series so that the cooling air of the fan flows in parallel to the heat sink. In addition, the fan is disposed on the heat sink, and the cooling air is directed vertically downward toward the pin fin. In addition, the cooling air is directed obliquely downward at a depression angle of 45 ° toward the pin fin.

請求項１および請求項２に記載の発明によれば、ファン近傍にピンフィンを配置して、ピンフィンから平板フィンに向けて冷却風を流することにより、通風抵抗を減少させ、ファンからの冷却風を有効に活用することによって冷却能力を向上することができ、冷却装置全体を小型化することができるという効果がある。
また、請求項３に記載の発明によれば、冷却風をピンフィンに向けて垂直下向きに吹き付けるので、ファン直近の流速の大きい冷却風をピンフィンとヒートシンクのベース面に導くことができるため、更に冷却能力が向上する効果がある。
また、請求項４に記載の発明によれば、冷却風をピンフィンに向けて俯角４５°で斜め下向きに吹き付けるので、請求項２の発明と請求項３の発明の中間の特性が得られ、各電子装置に合わせた、高性能で小型の冷却装置が得られる効果がある。 According to the first and second aspects of the present invention, the pin fins are arranged in the vicinity of the fan, and the cooling air is caused to flow from the pin fins toward the flat plate fins, thereby reducing the ventilation resistance and cooling air from the fan. By effectively utilizing this, the cooling capacity can be improved, and the entire cooling device can be reduced in size.
According to the third aspect of the present invention, since the cooling air is blown vertically downward toward the pin fin, the cooling air having a large flow velocity in the immediate vicinity of the fan can be guided to the base surface of the pin fin and the heat sink. It has the effect of improving ability.
Further, according to the invention described in claim 4, since the cooling air is blown obliquely downward at a depression angle of 45 ° toward the pin fin, characteristics intermediate between the invention of claim 2 and the invention of claim 3 are obtained. There is an effect that a high-performance and small-sized cooling device adapted to the electronic device can be obtained.

以下、本発明の具体的実施態様について、図に基づいて説明する。   Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の第１実施例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。図において、１はヒートシンクである。ヒートシンク１には放熱フィンとして、ピンフィン２と平板フィン３を備えている。４はファンであり、通風方向がヒートシンク１の通風方向と同方向を保ち、かつピンフィン２の直近に固定されている。５は発熱部品である。発熱部品５はヒートシンク１に密着し、熱をヒートシンク１に伝達する。６はファン４から吹き出す冷却風である。
ファン４から吐出された冷却風６はピンフィン２に吹き付けられ、ピンフィン間を流れる。ピンフィン２では、ファン直近の流速の大きい冷却風が流れるため、効率良く放熱される。ピンフィン２を通過する間に冷却風６は整流され、整流された冷却風６が平板フィン３にスムーズに流入していく。平板フィン３から冷却風６に放熱され、冷却風６はヒートシンク１から抜けていく。 FIG. 1 is an explanatory view of a cooling device according to a first embodiment of the present invention, in which (a) is a top view and (b) is a side view. In the figure, 1 is a heat sink. The heat sink 1 includes pin fins 2 and flat plate fins 3 as heat radiation fins. Reference numeral 4 denotes a fan, which maintains the same ventilation direction as the ventilation direction of the heat sink 1 and is fixed in the immediate vicinity of the pin fin 2. Reference numeral 5 denotes a heat generating component. The heat generating component 5 is in close contact with the heat sink 1 and transfers heat to the heat sink 1. Reference numeral 6 denotes cooling air blown from the fan 4.
The cooling air 6 discharged from the fan 4 is blown to the pin fins 2 and flows between the pin fins. In the pin fin 2, since the cooling air with a large flow velocity near the fan flows, the heat is efficiently radiated. While passing through the pin fins 2, the cooling air 6 is rectified, and the rectified cooling air 6 flows smoothly into the flat fins 3. Heat is radiated from the flat fins 3 to the cooling air 6, and the cooling air 6 escapes from the heat sink 1.

図２は、本発明の第２実施例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。前記第１実施例と共通する構成要素には同一の符号を付したので、説明を省略する。ファン４はヒートシンク１の上部のピンフィン２の先端の直近に固定され、冷却風６をピンフィン２及びヒートシンク１のベース面７に向けて、垂直下向きに吹付ける。そのため、ファン４直近の流速の大きい冷却風６が、ピンフィン２間およびヒートシンク１のベース面７上を流れ、効率良く放熱される。また、ピンフィン２を通過する間に冷却風６は整流され、整流された冷却風６が平板フィン３にスムーズに流入していく。さらに、平板フィン３の表面から冷却風６に放熱され、冷却風６はヒートシンク１から抜けていく。   FIG. 2 is an explanatory view of a cooling device showing a second embodiment of the present invention, in which (a) is a top view and (b) is a side view. Components that are the same as those in the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted. The fan 4 is fixed in the immediate vicinity of the tip of the pin fin 2 at the top of the heat sink 1, and the cooling air 6 is blown vertically downward toward the pin fin 2 and the base surface 7 of the heat sink 1. Therefore, the cooling air 6 having a large flow velocity in the immediate vicinity of the fan 4 flows between the pin fins 2 and on the base surface 7 of the heat sink 1 and is efficiently radiated. Further, the cooling air 6 is rectified while passing through the pin fins 2, and the rectified cooling air 6 smoothly flows into the flat fins 3. Further, heat is radiated from the surface of the flat fin 3 to the cooling air 6, and the cooling air 6 escapes from the heat sink 1.

図３は、本発明の第３実施例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。前記第１および第２実施例と共通する構成要素には同一の符号を付したので、説明を省略する。ファン４はヒートシンク１の上部のピンフィン２の先端の直近に斜め４５°に固定され、ピンフィン２もファン４の傾きに合わせて一方が高く他方が低くなっている。ファン４は冷却風６をピンフィン２及びヒートシンク１のベース面７に向けて、俯角４５°で斜め下向きに吹付ける。そのため、ファン４直近の流速の大きい冷却風６が、ピンフィン２間およびヒートシンク１のベース面７上を流れ、効率良く放熱される。また、ピンフィン２を通過する間に冷却風６は整流され、整流された冷却風６が平板フィン３にスムーズに流入していく。さらに、平板フィン３の表面から冷却風６に放熱され、冷却風６はヒートシンク１から抜けていく。   FIG. 3 is an explanatory view of a cooling device showing a third embodiment of the present invention, in which (a) is a top view and (b) is a side view. Constituent elements common to the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted. The fan 4 is fixed at an angle of 45 ° in the immediate vicinity of the tip of the pin fin 2 at the top of the heat sink 1. The fan 4 blows the cooling air 6 toward the pin fins 2 and the base surface 7 of the heat sink 1 obliquely downward at a depression angle of 45 °. Therefore, the cooling air 6 having a large flow velocity in the immediate vicinity of the fan 4 flows between the pin fins 2 and on the base surface 7 of the heat sink 1 and is efficiently radiated. Further, the cooling air 6 is rectified while passing through the pin fins 2, and the rectified cooling air 6 smoothly flows into the flat fins 3. Further, heat is radiated from the surface of the flat fin 3 to the cooling air 6, and the cooling air 6 escapes from the heat sink 1.

本発明は、ヒートシンクとファンからなる強制対流式の電子機器用冷却装置に関するとして有用である。   The present invention is useful as a forced convection type electronic device cooling apparatus including a heat sink and a fan.

本発明の第１実施例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。It is explanatory drawing of the cooling device which shows 1st Example of this invention, (a) is a top view, (b) is a side view. 本発明の第２実施例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。It is explanatory drawing of the cooling device which shows 2nd Example of this invention, (a) is a top view, (b) is a side view. 本発明の第３実施例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。It is explanatory drawing of the cooling device which shows 3rd Example of this invention, (a) is a top view, (b) is a side view. 従来技術の例を示す冷却装置の説明図であり、（ａ）は上面図であり、（ｂ）は側面図である。It is explanatory drawing of the cooling device which shows the example of a prior art, (a) is a top view, (b) is a side view.

符号の説明Explanation of symbols

１ ヒートシンク、２ ピンフィン、３ 平板フィン、４ ファン、５ 発熱部品、６ 冷却風、７ ベース面、
１０１ ヒートシンク、１０２ 発熱部品、１０３ 平板フィン、１０４ ファン、１０５ 冷却風
1 heat sink, 2 pin fin, 3 flat plate fin, 4 fan, 5 heat generating component, 6 cooling air, 7 base surface,
101 heat sink, 102 heat generating component, 103 flat fin, 104 fan, 105 cooling air

Claims (4)

ヒートシンクとファンからなる強制対流式の電子機器用冷却装置において、前記ヒートシンクはピンフィンと平板フィンを備え、前記ファンは冷却風を前記ピンフィンから前記平板フィンに向けて流すことを特徴とする電子機器用冷却装置。 In a forced convection type electronic device cooling apparatus comprising a heat sink and a fan, the heat sink includes pin fins and flat plate fins, and the fan flows cooling air from the pin fins toward the flat plate fins. Cooling system. 前記ファンと前記ピンフィンおよび前記平板フィンは、直列に配置され、前記ファンの冷却風が前記ヒートシンクに平行に流れることを特徴とする請求項１に記載の電子機器用冷却装置。 2. The electronic apparatus cooling device according to claim 1, wherein the fan, the pin fin, and the flat fin are arranged in series, and cooling air of the fan flows in parallel to the heat sink. 前記ファンは前記ヒートシンクの上部にあって、冷却風を前記ピンフィンに向けて垂直下向きに流すことを特徴とする請求項１に記載の電子機器用冷却装置。 2. The electronic apparatus cooling apparatus according to claim 1, wherein the fan is above the heat sink and allows cooling air to flow vertically downward toward the pin fin. 前記ファンは前記ヒートシンクの上部にあって、冷却風を前記ピンフィンに向けて俯角４５°で斜め下向きに流すことを特徴とする請求項１に記載の電子機器用冷却装置。

2. The electronic device cooling apparatus according to claim 1, wherein the fan is above the heat sink and causes cooling air to flow obliquely downward at a depression angle of 45 ° toward the pin fin. 3.

JP2003403233A 2003-12-02 2003-12-02 Cooler for electronic apparatus Pending JP2005166923A (en)

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JP2003403233A JP2005166923A (en) 2003-12-02 2003-12-02 Cooler for electronic apparatus
PCT/JP2004/017559 WO2005055689A1 (en) 2003-12-02 2004-11-26 Cooler for electronic apparatus

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JP2020057720A (en) * 2018-10-03 2020-04-09 日産自動車株式会社 Cooling device
JPWO2019107358A1 (en) * 2017-11-30 2021-01-14 株式会社村田製作所 Sealed electronic device
JP2021048199A (en) * 2019-09-17 2021-03-25 日立オートモティブシステムズ株式会社 Electronic controller

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011008983A (en) * 2009-06-24 2011-01-13 U-Tec Corp Ion generator
JPWO2019107358A1 (en) * 2017-11-30 2021-01-14 株式会社村田製作所 Sealed electronic device
JP2020057720A (en) * 2018-10-03 2020-04-09 日産自動車株式会社 Cooling device
JP7236235B2 (en) 2018-10-03 2023-03-09 日産自動車株式会社 Cooling system
JP2021048199A (en) * 2019-09-17 2021-03-25 日立オートモティブシステムズ株式会社 Electronic controller
JP7245756B2 (en) 2019-09-17 2023-03-24 日立Astemo株式会社 electronic controller

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