JP3006361B2 - Heat sink, electronic device using the same, and electronic computer using the electronic device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a plurality of heat-generating semiconductor components and an electronic computer using the same, and is suitable for cooling the heat-generating semiconductor components with a heat sink by flowing a refrigerant such as air. Electronic devices and electronic computers.

[0002]

2. Description of the Related Art In electronic devices, a plurality of heat-generating semiconductor components mounted on a circuit board such as a printed circuit board or a ceramic substrate are cooled by air. In many cases, cooling air is supplied from the side of the heat-generating semiconductor component, and the heat-generating semiconductor component is sequentially cooled. However, recently, since the calorific value of the heat-generating semiconductor component tends to increase remarkably, such a system has a problem that the air temperature rise becomes large and the cooling performance becomes worse on the downstream side. Therefore, as a method of solving this problem, a high-performance fin having a large heat-dissipating surface is mounted on the heat-generating semiconductor component, and the cooling air supplied from the blower is supplied through a chamber or a nozzle provided above the fin. A method has been proposed in which individual fins are individually blown so as to prevent air leakage. As an example of this, there is an air cooling system described in JP-A-2-34993.

FIG. 32 shows the conventional air-cooled heat radiator.
This will be described with reference to FIG. In FIG. 32, a large number of LSIs 2 as heating elements are mounted on a substrate 1. LSI
A heat sink 3 composed of fins is provided on the surface 2, and the LSI 2 is cooled by cooling air supplied through the chamber 4 and the nozzle 5. The exhaust gas 7 from the heat sink is exhausted from the opening 6 and the heat sink 3
It is discharged through the exhaust space 8 between the heat sink 3 and the heat sink 3.

As shown in FIG. 33, the LSIs 2 and the heat sinks 3 are arranged in a grid pattern, and the exhaust 9 from each of the heat sinks 3 is combined into a discharge direction and discharged as an exhaust 10.

As described above, in the conventional electronic device, the LSI
The gap between the two or the heat sink 3 serves as an exhaust passage for circulating and discharging the combined exhaust.

[0006]

In the above-mentioned conventional electronic device, the heat-generating semiconductor components are mounted very densely on a plane and the heat-generating semiconductor components are adjacent to each other as the speed and density of the electronic device increase. If placed, it is not possible to secure a sufficient gap between the heat-generating semiconductor components to discharge the exhaust flow,
There were the following problems.

Since it is not possible to secure a sufficient gap for discharging the exhaust flow between the heat-generating semiconductor components or between the heat sinks, when a predetermined amount of cooling air is caused to flow to each heat sink, the exhaust flow from each heat sink at the discharge portion. The air flow increases one after another, and the wind speed of the combined exhaust gas flow becomes remarkably large, and thereby the flow resistance becomes remarkably large. Also, when the wind speed increases, fluid noise may be generated. Further, when the blowing power is limited to a certain extent, a predetermined air volume cannot be flowed, and the cooling performance of the heat sink deteriorates.

Further, when the flow resistance in the exhaust part becomes large, the cooling air sufficiently flows through the heat sink having a short exhaust path to the outlet, while the cooling air sufficiently flows through the heat sink having a long exhaust path to the outlet. As a result, the cooling air flow among the heat-generating semiconductor components becomes non-uniform. Further, due to the non-uniform cooling air flow, a non-uniform temperature distribution occurs between the heat-generating semiconductor components.

The disadvantages described above are caused not only by the fact that the heat-generating semiconductor components are mounted very densely on a flat surface and it is not possible to ensure a sufficient gap between the heat-generating semiconductor components to exhaust air. It also occurs when the amount is very large.

In the conventional electronic device, the cross-sectional area of the exhaust passage is determined by the gap between the heat-generating semiconductor components or the gap between the heat sinks. Therefore, the cross-sectional area of the exhaust passage is determined to some extent by the arrangement of the heat-generating semiconductor components. Therefore, the direction of the main flow of the exhaust merge is substantially defined by the position of the exhaust port provided in the housing of the electronic device and the arrangement of the heat-generating semiconductor components, and it is difficult to define the main flow direction by the structure of the heat sink or the structure of the duct or nozzle. .

Further, in the conventional electronic device, since the gap between the heat-generating semiconductor components or the heat sink serves as an exhaust passage for circulating and discharging the combined exhaust gas, the warmed air discharged from the heat sink on the upstream side is heated. The air may directly contact the heat sink or the heat-generating semiconductor component on the downstream side, and may deteriorate the cooling performance on the downstream side.

Further, in the conventional electronic device, the warmed exhaust gas flow after cooling the heat sink flows out to another part in the electronic device housing and re-enters the blower for supplying the cooling air. In some cases, electronic components were heated.

The present invention has been made in view of such technical problems, and provides an electronic device with improved cooling performance.
The purpose is to do.

A heat sink with improved cooling performance
Another purpose is to provide.

Further, an electronic computer with improved cooling performance is provided.
It is yet another purpose to provide.

[0016]

[0017]

In order to achieve the above object, a plurality of heat-generating semiconductor components mounted on a substrate, and a flow of a refrigerant such as air, which is mounted on each of the heat-generating semiconductor components by being thermally connected thereto. And a heat sink that defines a discharge direction, and an exhaust chamber that collectively circulates the refrigerant discharged from each of the heat sinks, wherein the flow and discharge directions of the refrigerant in each of the heat sinks are substantially the same. The heat sinks are disposed so as to be in contact with the end surfaces of the heat sinks opposite to the heat-generating semiconductor component mounting side, and nozzles for supplying the refrigerant to the heat sinks are provided, and the refrigerants defined by the heat sinks are provided. The width of the nozzle in the flow and discharge directions of the heat sink is smaller than the width of the corresponding heat sink.

Further, in the electronic device of the present invention, the heat sink is mounted so that the flow direction and the discharge direction of the refrigerant in the heat sink are parallel to each other between the plurality of heat generating semiconductor components, and the heat sink is on the opposite side to the heat generating semiconductor components. A nozzle for supplying a coolant to the heat sink is provided on one end surface of the heat sink, and a discharge merge that combines the flows of the coolant after being discharged from the plurality of heat sinks flows adjacent to the one end surface of the heat sink opposite to the heat-generating semiconductor component. The discharge merge flows adjacent to the nozzle surface in a direction orthogonal to the flow and discharge directions of the coolant of the heat sink, and the direction of the exhaust merge and the flow and discharge direction of the refrigerant of the heat sink are substantially orthogonal to each other. .

Further, the nozzle width in the direction perpendicular to the direction of flow and discharge of the refrigerant of the heat sink is made larger than the width of the heat sink, and the nozzle width in the direction of flow and discharge of the refrigerant of the heat sink is made smaller than the width of the heat sink. Things.

Further, the gap between the plurality of nozzles in a direction parallel to the direction of flow and discharge of the refrigerant from the heat sink is made larger than the gap between the plurality of nozzles orthogonal to the same direction.

Further, in order to prevent the heated exhaust stream from flowing out to another portion in the electronic device housing, the electronic device of the present invention uses the refrigerant discharged from the heat sink to surround the heat-generating semiconductor components and the like. It has a partition that leads to a refrigerant discharge port to the outside of the device housing and separates the discharged refrigerant from other components of the electronic device.

Further, nozzles for supplying a coolant to the heat sink are provided on the end faces of the heat sinks opposite to the heat-generating semiconductor component mounting side, and the coolant supplied from the nozzles is supplied to the nozzle and the supply side. It is characterized in that it is configured to discharge through a discharge passage formed by being independently partitioned.

In addition, a nozzle is provided in each of the heat sinks for flowing out from the coolant supply passage in a direction substantially orthogonal to the heat generating semiconductor component, and the refrigerant flowing out of the nozzles flows along the heat generating semiconductor component by the respective heat sinks. As described above, the nozzle and the supply side are configured to be discharged through a discharge passage formed as a partition wall independently of the nozzle and the supply side.

A nozzle is provided in each of the heat sinks for flowing out of the refrigerant supply passage in a direction substantially orthogonal to the heat-generating semiconductor component, and the refrigerant flowing out of the nozzles is supplied to the heat sink and the heat sink. An exhaust guide plate formed on the outside forms a U-shaped heat shield.
The nozzle and the supply side are configured so as to be directed upward, and are configured to be discharged through a discharge passage formed by partitioning independently of the nozzle and the supply side.

In the electronic device, the gap between the ends of the plurality of heat sinks in the direction of the flow of the coolant of the heat sink and the direction of discharge of the heat sink is larger than the gap between the heat generating semiconductor components in the same direction.

In order to achieve the above object, a gap between a plurality of nozzles in a flow direction and a discharge direction of a coolant of a heat sink in an electronic device is made larger than a gap between a plurality of heat sinks in the same direction. .

Also, a plurality of heat-generating semiconductor components mounted on the substrate, a heat sink which is thermally connected to each of the heat-generating semiconductor components and regulates a flow direction and a discharge direction of a refrigerant such as air; In an electronic device having an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink, the heat sinks are disposed so that the flow and the discharge directions of the refrigerant in the respective heat sinks are substantially the same, A nozzle for supplying a refrigerant to the heat sink is provided in contact with an end surface of the heat sink opposite to the heat-generating semiconductor component mounting side, and the plurality of nozzles in a flow direction and a discharge direction of the refrigerant defined by the heat sink are provided. The pitch is smaller than the pitch of the heat sink.

Further, the electronic device includes a heat sink in which the width of the heat sink is smaller than the width of the heat-generating semiconductor component in the direction of circulation and discharge of the refrigerant from the heat sink.

Further, the nozzle width of the heat sink in the direction of flow and discharge of the refrigerant is smaller than the heat sink width.

The nozzle width of the heat sink in the direction of circulation and discharge of the refrigerant is set to approximately half the width of the heat sink in the same direction.

Further, the gap between the nozzles in the x direction is set to 0.5 to 0.8 times the interval between the heat generating semiconductor components.

Further, in order to achieve the above object, the electronic device has a shape in which the width of the heat sink in the direction of circulation and discharge of the refrigerant from the heat sink gradually decreases from the heat-generating semiconductor component side to the chamber side. It is.

In the electronic device, the width of the nozzle for supplying the coolant to the heat sink in a direction perpendicular or parallel to the direction of flow and discharge of the coolant from the heat sink is set at the lower end of the nozzle connected to the heat sink from the upstream of the nozzle. The tapered nozzle shape gradually becomes smaller toward.

A plurality of heat-generating semiconductor components mounted on the substrate, a heat sink which is thermally connected to each of the heat-generating semiconductor components and regulates the flow and discharge directions of a refrigerant such as air; An electronic device including an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink, and a refrigerant supply unit that supplies the refrigerant to the exhaust chamber,
In a computer having a chamber for guiding a refrigerant supplied by the refrigerant supply unit to an electronic device, and a housing for storing the electronic device and the refrigerant supply unit, the electronic device is stored in an upper part of the housing. The chamber and the electronic device are juxtaposed, the coolant supply means is provided vertically below the chamber, and the exhaust chamber is provided above the electronic device with a nozzle for supplying a coolant to the plurality of heat generating semiconductor components, An exhaust hole for the refrigerant is provided on the upper surface of the housing.

In addition, air is sucked in by a refrigerant supply means for supplying air from a lower portion of the main body of the computer, and the air is guided to an air supply section of the electronic device through a chamber passage. Are thermally connected to the plurality of heat generating semiconductor components mounted on the substrate, respectively, and are guided to the respective heat sinks by nozzles provided respectively on the heat sinks. The partition walls are independent of the nozzles and the air supply unit. The electronic device is cooled by flowing out to the upper part of the computer through the exhaust chamber.

Further, the refrigerant or air supplied to each of the nozzles is provided at the upper part of the computer main body.

[0037]

A plurality of heat-generating semiconductor components mounted on the substrate, a heat sink which is thermally connected to each of the heat-generating semiconductor components and regulates the flow and discharge directions of a coolant such as air; In an electronic device having an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink, the heat sinks are respectively disposed so that the flow and the discharge direction of the refrigerant in the respective heat sinks are substantially the same. A partition surrounding a plurality of heat sinks and a nozzle for supplying a coolant to the heat sink in contact with an end surface opposite to the heat-generating semiconductor component mounting side are provided, and the nozzle and the partition are integrally formed.

Further, the electronic device of the present invention is provided with a press-in blower individually for each heat-generating electronic component.

[0040]

[Action] A heat sink is attached to each of the heat generating semiconductor parts,
A nozzle is provided in contact with the heat sink, and an exhaust chamber is provided around the nozzle to circulate exhaust gas from the heat sink, so that the heat-generating semiconductor components are mounted very densely on a plane, and between the heat-generating semiconductor components or between the heat sinks. Even if there is not enough space to exhaust the exhaust air,
In the space adjacent to the upper surface of the heat sink, which is the one end surface of the heat sink opposite to the heat-generating semiconductor component, and the nozzle surface in the direction perpendicular to the direction of circulation and discharge of the coolant of the heat sink, a space sufficient to discharge exhaust gas is provided. Can be secured. Thereby, the main stream of the discharge merge is discharged using this space, and the flow velocity of the discharge merge can be reduced. Therefore, it is possible to reduce the flow resistance of the exhaust passage, improve the cooling performance of the heat sink, and reduce the noise. Furthermore, if the flow resistance can be reduced by reducing the flow velocity of the exhaust flow path, cooling air can be sufficiently supplied to the heat sink having a long exhaust path to the outlet, and uniform cooling air volume distribution between the heat generating semiconductor components and uniformity can be achieved. Temperature distribution can be realized. In addition, since the flow of the refrigerant bends into a right angle or a U-turn shape many times, noise generated in the blower, the heat sink, or the flow path is absorbed in the flow path, resulting in low noise.

Even when the heat generated by the heat-generating semiconductor components is very large, the space formed between the heat-generating semiconductor components or the gap between the heat sinks and the space adjacent to the upper end surface of the heat sink and the nozzle surface are not required. In addition, since it can be used as a space for discharging exhaust gas, the flow resistance of the exhaust passage can be reduced, and the cooling performance of the heat sink and the noise can be reduced.

Further, since the main stream of the discharge merging flows in the space adjacent to the upper end surface of the heat sink and the nozzle surface, the warmed air discharged from the upstream heat sink almost completely flows to the downstream heat sink or the heat generating semiconductor component. Since there is no contact, the cooling performance of the heat sink on the downstream side can be prevented from lowering.

Further, since the gap between the nozzles in the direction of flow and discharge of the refrigerant defined by the heat sink is made larger than the gap in the direction perpendicular thereto, the gap between the nozzles in the direction of flow and discharge of the refrigerant defined by the heat sink is discharged. The main stream of the merge flows, and the direction of the main stream of the exhaust merge can be defined by the structure of the heat sink or the structure of the duct or the nozzle.

Further, since the partition wall is formed so as to surround the heat generating semiconductor component, the refrigerant discharged from the heat sink can be efficiently guided to the refrigerant discharge port provided in the housing of the electronic device. Further, since the discharged refrigerant heated by the heat exchange can be prevented from being mixed into the cooling-unnecessary components, the heated exhaust gas does not adversely affect other components of the electronic device.

Further, the gap between the heat sinks in the direction of flow and discharge of the refrigerant defined by the heat sink is made smaller than the gap between the heat-generating semiconductor components, so that the gap between the ends of the plurality of heat sinks can be made larger than before. The flow resistance when the refrigerant discharged from the nozzle flows out in a U-turn shape toward the discharge space adjacent to the upper surface of the heat sink and the nozzle surface can be reduced. Furthermore, when the fin height of the heat sink is reduced toward the end, the gap between the ends increases toward the top of the heat sink, so that the flow resistance when flowing out in a U-turn shape can be further reduced.

Since the position of the nozzle on the heat-generating semiconductor component is closer to the inner side as the nozzle is provided on the outer heat-generating semiconductor,
The flow resistance of the refrigerant decreases as the heat sink on the outside,
Sufficient refrigerant is supplied to the outside which has been difficult to flow conventionally, and a uniform air volume distribution can be achieved. Further, since the nozzle has a tapered nozzle shape, the flow resistance when the refrigerant flows from the chamber to the nozzle can be reduced.

Further, the electronic device is housed in the upper part of the housing, the chamber and the electronic device are juxtaposed, a coolant supply means is provided vertically below the chamber, and a nozzle for supplying a coolant to a plurality of heat generating semiconductor parts and the electronic device are connected. An exhaust chamber is provided in the upper part, and a refrigerant exhaust hole is provided in the upper surface of the housing, so that the cold refrigerant sucked from a low position sequentially rises in temperature and becomes lighter and rises, so that the warmed refrigerant mixes with other parts. Is prevented and cooling can be performed efficiently.

In the heat sink, the fin height of the inner fin is made higher and the fin height of the outer fin is made smaller, so that the flow resistance of the refrigerant at the heat sink can be reduced, and heat can be efficiently radiated. Becomes

Further, since the nozzle and the partition are integrally formed, the positioning of the nozzle with respect to the heat-generating semiconductor component is facilitated, the exhaust passage can be secured, and the workability during maintenance and inspection is improved.

In addition, since a plurality of heat-generating electronic components are individually provided with push-in type blowers so that cooling air can be sent to each nozzle independently, it is possible to control the rotation speed of each blower independently. Can be arbitrarily changed.

[0051]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a first embodiment of the electronic device will be described with reference to FIGS.

FIG. 1 is a bottom sectional view of this embodiment. A substrate 20 such as a printed wiring board or a ceramic substrate has L
A large number of heat-generating semiconductor components 21 typified by an electronic circuit module or the like on which one or more SIs are mounted are mounted in close proximity. A heat sink 22 for effectively transmitting the heat to the cooling air is mounted on the heat generating semiconductor component 21. The heat sink 22 is, for example, a flat plate fin in which a number of flat plates are juxtaposed, and a space formed between the flat plates defines a flow and a discharge direction of the cooling air flow. Here, the material of the heat sink is preferably made of a material having good heat conductivity, such as copper, aluminum, or high heat conductive ceramic.

The heat-generating semiconductor component 21 and the heat sink 22 are integrated and thermally connected via, for example, a thermally conductive grease, a thermally conductive sheet, or a thermally conductive adhesive. Cooling air is applied to the surface of the heat sink 22 opposite to the substrate, that is, the upper end surface.
Are provided in close contact with each other so as not to leak air. Above the nozzle 23, a chamber 2 for distributing cooling air from a blower (not shown) to each nozzle.
4 are connected. The air flow 25 in the chamber sent from a blowing means such as a blower (the symbol with a cross in the circle is a flow in a direction perpendicular to the paper surface and a flow in a direction penetrating from the front side to the back side of the paper surface). Is distributed to the air flow 26 in each nozzle, flows into the heat sink 22, and becomes the air flow 27 in the heat sink. Then, after colliding with the heat-generating semiconductor component 21 and being cooled, the U-turn makes a U-turn and flows into the exhaust space 36, and the exhaust from each heat sink becomes the combined exhaust gas 28, and flows out toward the outlet.

FIG. 2 is a front sectional view of the embodiment of FIG. The heat sinks 22 attached to the heat generating semiconductor components 21 are arranged very close to each other in a grid pattern. The airflow 27 flowing in the heat sink 22 is supplied from the nozzle 23 to the center of the heat sink 22, collides with the bottom surface of the heat sink 22, and is discharged separately from right and left. Here, the heat sink 22 is provided with an air flow 27 in the heat sink.
Are arranged so as to be parallel to each other between the heat sinks 22.

In this embodiment, since the flow in the heat sink 22 is defined by the flat fins, the heat sink is attached to each heat generating semiconductor component so that the directions of the flat fins of each heat sink are parallel to each other. As shown in FIG. 2, the nozzle width in the direction (y direction) perpendicular to the air flow 27 in the heat sink is larger than the width of the heat sink 22 in the same direction, and further, in the direction (x The width of the nozzle in the direction (direction) is smaller than the width of the heat sink 22 in the direction. Air flow 27 in the heat sink discharged from each heat sink
Joins one after another to form an exhaust merge 28, and the exhaust space 3
The exhaust gas 30 passes through 6 and is exhausted out of the housing. As described above, the flow direction of the exhaust gas confluence 28 depends on the heat sink 2.
It is substantially orthogonal to the air flow and discharge direction 27 (x direction) in the inside 2.

A set of heat-generating semiconductor components 21 (5 × 5)
Around the (set of four), there is a partition wall 29 that guides the air exhausted from the heat sink 22 to an exhaust port connected to the electronic device housing. Is separated. This prevents the heated exhaust stream from flowing out to other parts in the electronic device housing. When the heat generation amount of the heat generating semiconductor component 21 is large, the temperature of the exhaust gas becomes high and the air flow increases for cooling, so that the wind speed increases. For this reason, when exhaust gas flows out to another portion in the electronic device housing, it is one factor for increasing the temperature of other electronic components, which causes a reduction in reliability. Therefore, the partition wall 29 is an effective means for improving reliability. The partition 29 is also important for preventing dust from scattering to other components of the electronic device.

FIG. 3 is a right side sectional view of this embodiment.
A chamber 24 is provided above a nozzle 23 for supplying cooling air to each heat sink 22.
Is connected to a blower box 31 containing a blower 32. The inlet airflow 33 passes through the filter 34 and reaches the blower 32, which is pressurized by this blower, flows into the chamber 24 after the wind speed distribution in the cross section of the ventilation is uniformly adjusted by the wind baffle 35. The air that has flowed into the chamber 24 is distributed to the respective nozzles 23 as a flow 37 and cools the heat sink 22. Heat sink 22
Is discharged into the exhaust space formed between the nozzles by making a U-turn, flows in, and merges with the cooling air flow discharged from the upstream or downstream heat sink 22 to form an exhaust merge 28, and the exhaust 30 And discharged from the electronic device.

As described above, in this embodiment,
The cooling air flows discharged from the plurality of heat sinks 22 are combined into an exhaust merging 28, and a main portion of the exhaust merging 28 is adjacent to a fin upper end surface which is one end surface of the heat sink 22 in a direction perpendicular to the nozzle (y direction). And circulates adjacent to the nozzle surface. In other words, the main part of the exhaust merging 28 flows through the exhaust space 36 formed in the gap between the nozzles 23 and is exhausted. for that reason,
Even if the heat-generating semiconductor components can be mounted very densely on a flat surface, and even if a sufficient gap cannot be secured between the heat-generating semiconductor components or between the heat sinks, it is sufficient to discharge the exhaust into the exhaust space 36. Space can be secured.

As a result, the main part of the exhaust gas confluence 28 is discharged using this space, and the flow velocity of the exhaust gas confluence 28 decreases. Therefore, the flow resistance of the exhaust passage can be reduced, and the cooling performance of the heat sink is improved and the noise is reduced.
Furthermore, if the flow resistance of the exhaust flow path is reduced, the cooling air can be sufficiently flown even to the heat sink where the exhaust path to the outlet is long and the cooling air has been difficult to flow.
Uniform cooling air volume distribution between the heat generating semiconductor components and uniform temperature distribution can be realized.

Furthermore, even when the heat-generating semiconductor components are not so densely mounted, if the heat-generating amount of the heat-generating semiconductor components 21 themselves is very large, the heat-generating semiconductor components 21 or the heat sinks may be disposed between the heat-generating semiconductor components 21 themselves. The space formed in the gap and the exhaust space 36 adjacent to the heat sink upper end surface and the nozzle surface can be used as an exhaust discharge space. Therefore, the flow resistance of the exhaust passage can be reduced, so that the air volume can be increased as a whole, and the cooling performance of the heat sink can be improved and the noise can be reduced.

Since the main part of the exhaust gas confluence 28 flows through the exhaust space 36, only a part of the heated air discharged from the upstream heat sink contacts the downstream heat sink or the heat-generating semiconductor component. Therefore, it is possible to prevent the cooling performance of the heat sink on the downstream side from lowering.

In the present embodiment, the substrate 20 is installed vertically, and the cooling air is circulated from below to above. However, it goes without saying that the substrate 20 may be installed horizontally.

Further, as shown in FIG. 2, the gap between the nozzles 23 in the direction of flow of air in the heat sink 22 and the discharge direction 27 (x direction) is made larger than the gap between the nozzles 23 in the direction perpendicular to it (y direction). Therefore, the main part of the exhaust gas confluence 28 flows through the gap (x direction) between the nozzles, and the direction of the exhaust gas confluence 28 can be defined by the structure of the heat sink or the structure of the duct or the nozzle. This facilitates the design of the ventilation path.

In the case of this embodiment, the air flow from the blower 32 becomes a flow 37 which is bent 90 ° toward the nozzle 23 in the chamber 24. Further, the air flow becomes a flow 27 in the heat sink, and becomes a U-turn shape.
After being bent by 80 ° and flowing into the exhaust space 36, it is turned into a flow 28 toward the outlet and bent by 90 °. in this way,
Since the air flow is bent many times in the flow path,
Noise generated in the blower, the heat sink, or the flow path is absorbed in the flow path, and is less likely to go outside the housing. for that reason,
A low-noise electronic device can be provided.

FIG. 4 shows the heat sink 22 viewed from a direction (y direction) perpendicular to the flow and discharge of air in the heat sink.
It is an enlarged view of the periphery. FIG. 5 is an enlarged view of the periphery of the heat sink 22 viewed from a direction (x direction) parallel to the direction of air flow and discharge in the heat sink. Further, FIG.
3 is a three-dimensional perspective view of two adjacent heat sinks 22. FIG.

The present embodiment will be described with reference to these figures. The heat sink 22 includes the base plate 40 and the fins 4.
1 and a cover plate 42. A large number of fins 41 are joined on the base plate 40 at regular intervals.
The cover plate 42 is joined to the upper part 1. The connection between the base plate 40 and the fins 41 may be performed by soldering, brazing, caulking, or the like, or may be integrally formed by machining or extrusion. The cover plate 42 is provided to prevent the cooling air flow from the nozzle 23 from flowing into the exhaust space 36 through a short path, to allow the cooling air flow to reach near the base plate, and to improve the cooling performance. At the same time, the cover plate 42 serves as a spacer that fixes the fins at the upper end surfaces of the fins and keeps the fins at equal intervals.

The cooling air flow 26 from the nozzle flows between the fins at a high speed, flows near the base plate 40 as the air flow 27 in the nozzle, and then flows out into the gap between the heat sinks. Here, the gas flows merge with the exhaust gas flowing out of the adjacent heat sink and become a flow 43 in the exhaust space 36 formed in the gap between the nozzles. Then, the exhaust gas merges with the exhaust gas merge 44 from the heat sink located on the upstream side and the exhaust gas merge 46 from the heat sink located on the downstream side and is exhausted outside the electronic device.

As described with reference to FIG. 2, the nozzle width in the direction (y direction) perpendicular to the air flow 27 in the heat sink is equal to or larger than the width of the heat sink 22 in the same direction. The reason for this is that if the nozzle width in the y direction is reduced, the cooling air does not flow to the portion of the fin gap protruding from the nozzle 23. In addition, the nozzle 23 has a direction (x) parallel to the airflow 27 in the heat sink.
The nozzle width in the direction (direction) is made smaller than the width of the heat sink 22 in the same direction. The first reason is that, by reducing the nozzle width, the air flow velocity in the nozzle 23 is increased, and the cooling air can reach the vicinity of the fin base having a large temperature difference from the air. This is because the heat exchange efficiency is enhanced. Another object is to improve the heat transfer coefficient with air by utilizing the effect of the jet. That is, the cooling performance of the heat sink 22 can be improved. The second reason is that when the nozzle width is reduced,
This is because the width of the exhaust space 36 formed in the gap between the nozzles 23 can be increased, so that the flow resistance in the exhaust portion can be reduced.

As shown in FIG. 4, the width of the fins 41 is smaller than the width of the base plate 40, and the direction (x
The gap between the discharge ends 51 of the heat sink in the direction (direction) is made larger than the gap between the heat-generating semiconductor components 21 in this direction. By doing so, it is possible to reduce the combined flow loss when the exhaust gas discharged from the discharge end portion 51 of the heat sink merges with the exhaust flow flowing out from the discharge end portion 51 of the adjacent heat sink. Exhaust space 36
It can be flowed smoothly.

It has already been described that the cooling performance of the heat sink is improved when the nozzle width in the direction (x direction) parallel to the air flow in the heat sink is smaller than the heat sink width in the same direction. Now, how much the size should be reduced will be described with reference to FIG. The width of the nozzle in the direction (x direction) parallel to the air flow in the heat sink is W (mm), and the width of the heat sink in the same direction is L (mm). In the figure, the horizontal axis is the ratio of W to L, W / L, and the vertical axis is the heat resistance Rh (° C.) of the heat sink.
/ W) is a dimensionless quantity obtained by dividing Rh by the value of W / L = 1.0. In addition, this value was based on the experimental value evaluated by constant blowing power. As is clear from the figure, W / L
It can be seen that the thermal resistance is minimized around = 0.5, and that the cooling performance of the heat sink is the best when the nozzle width is almost half of the heat sink width.

FIG. 8 shows how the width in the x direction of the exhaust passage formed between the two nozzles should be set.
This will be described with reference to FIG. The space between the two nozzles 23 in the x direction is E (mm), and the space between the semi-heated semiconductor components 21 in the x direction, that is, the pitch, is P (mm). In FIG. 24, the horizontal axis is the ratio E / P between the gap E and the pitch P, and the vertical axis is the heat resistance R of the heat sink.
h (° C./W) is rendered dimensionless by the ratio to its maximum value and displayed. Here, the values shown in FIG. 8 indicate the experimental values evaluated at a constant blowing power. As is clear from FIG. 8, when E / P is in the range of 0.5 to 0.8, the thermal resistance becomes small, and the gap between the nozzles is reduced to 0.5 to 0. If you set about 8 times,
It can be seen that the cooling performance of the heat sink is improved.

A second embodiment of the electronic device according to the present invention will be described with reference to FIGS. This embodiment is an example in which the first embodiment of the electronic device is incorporated in a housing.

FIG. 9 is a front sectional view of this embodiment, and FIG.
Reference numeral 0 is a side sectional view of the present embodiment. Each component such as the substrate 20, the chamber 24, the blower box 31, and other electronic components 61 is mounted on the frame 60. Although not shown in the drawing, an outer wall plate is attached around the housing constituted by the frame 60, so that the inside of the housing is isolated from the outside. The cooling air is taken in from the vicinity of the floor having a relatively low temperature as the floor intake 63 even in the room. If you have underfloor air conditioning, such as a computer room, it is best to take in underfloor air directly. The introduced air is filtered by a filter 34 to remove dust that may cause a failure, and the blower 3 in the blower box 31 is removed.
2

The air pressurized by the blower 32 is sent to the chamber 24 after the air velocity distribution is uniformly adjusted by the air baffle 35. Inside the chamber 24, a sound absorbing material 62 for preventing noise is provided on the entire surface. The air flowing in from the nozzles 23 exchanges heat with the heat sink 22, and as described in the first embodiment, forms an exhaust merge 28 and is exhausted toward the ceiling. In this way, if the air intake, blower, heat sink, and exhaust are arranged in a straight line and the flow of the wind is from the bottom to the top, the air from the inside of the electronic device housing to the exit can be obtained. The flow of air becomes smooth, the flow resistance in the housing of the electronic device can be reduced, and low-temperature air can be taken in, so that the cooling performance is improved and the noise is reduced.

In the first and second embodiments described above,
The arrangement of the heat-generating semiconductor components is 5 rows in the horizontal direction and 4 rows in the vertical direction.
Although the explanation has been made with the columns, it is obvious that four columns in the horizontal direction and four columns in the vertical direction
The present invention can be applied as it is even if the configuration is changed as in the column. In addition, the present invention can be applied as it is even if there is a part in which the heat generating semiconductor component is not mounted in the middle. Further, in the first and second embodiments, the flat fins have been described as the heat sinks. However, any heat sink in which the flow and discharge directions of the air flow are defined may be, for example, a heat sink such as a pin fin. Even
The present invention can be applied.

A third embodiment of the present invention will be described with reference to FIGS. FIG. 11 is a side sectional view of the present embodiment, and FIG. 12 is a longitudinal sectional view of the present embodiment viewed from the front.

This embodiment is different from the second embodiment in that the blower 32 is installed in the upper part of the housing and the air blowing system is a suction system. Other configurations are substantially the same as those of the second embodiment.

In the present embodiment thus configured, the cooling air is sucked from under the floor by the blower 32 at the upper part of the housing, and is introduced into the housing from the lower part of the housing as intake air 63 from the floor. It is supplied to the chamber 24 through the duct 100. The air supply duct 100 is provided to prevent cooling air from absorbing heat of other electronic components 61 and the like. The cooling air is distributed to each of the nozzles 23 as indicated by reference numeral 25 and, after cooling the heat sink 22, forms a junction 28 on the exhaust side and is sucked into the blower 32 through an exhaust passage between the nozzles 23. In order to prevent the blower 32 from sucking wind other than the exhaust flow, the exhaust duct 101 closely contacts the exhaust passage between the nozzle and the nozzle.

When the blower is used in the suction system as in this embodiment, the following advantages are obtained. First, intake duct 1
00 and a uniform flow with little turbulence in the chamber 24 can be realized, and the pressure loss of the ventilation system can be made lower than in the push-in system. Further, there is no fear that the high-temperature exhaust gas discharged from the heat sink flows out and adversely affects other electronic components.

Next, a fourth embodiment of the electronic apparatus according to the present invention will be described with reference to FIGS. In this embodiment, the directions of the nozzle and the heat sink of the electronic device described in the first embodiment are rotated by 90 °. FIG. 13 is a front sectional view of the present embodiment, and FIG. 14 is a bottom sectional view of the present embodiment. FIG. 15 is a right side sectional view of this embodiment.

The heat-generating semiconductor component 21 and the heat sink 22 attached thereto are arranged very close to each other in a grid pattern as in the first embodiment, and the air flow in the heat sink is Are arranged so as to be parallel to each other. However, as shown in FIG. 13, the nozzle 2 is moved so that the exhaust gas confluence 28 flows horizontally.
3 are configured. Since the exhaust outlet is provided above the part defined by the partition 29, the exhaust confluence 28
Flows horizontally horizontally from the center of the exhaust space between the nozzles, flows out into the space between the heat sink 22 and the partition wall 29, is bent at right angles to the outlet direction, and the other exhaust confluence 28
It is exhausted while joining.

In this way, in the first or second embodiment, the exhaust gas confluence 28, which has flowed vertically downward from the upper side, flows horizontally right and left from the center of the substrate in the present embodiment. become. However, even when the electronic device is configured as in the present embodiment, the same operation and effect as in the first embodiment can be expected.

FIG. 16 shows a modification of the present invention in which the width of the fin 41 is gradually reduced from the heat-generating semiconductor component 21 side to the opposite side, that is, the side where the nozzle 23 is mounted. It is. In this embodiment, the fin width on the side of the nozzle 23 is the same as the nozzle width, and the base 40
The width is linearly increased toward. In this manner, the gap between the discharge ends 51 gradually increases from the base 40 toward the nozzle 23, so that the exhaust gas 27 flows out in a U-turn shape and merges with the exhaust flow from the adjacent heat sink 22. Thus, the flow resistance when flowing into the exhaust space 36 can be reduced.

Further, the area of the gap between the discharge ends 51 increases, and the exhaust confluence 73 between the discharge ends can flow as a part of the exhaust confluence 28 as it is.
The flow resistance in the exhaust part can be reduced. With such a fin configuration, the surface area of the fin itself becomes small, but the fin in the removed portion is a portion that has a low temperature and does not significantly contribute to heat exchange, so that the cooling performance of the heat sink 22 does not decrease much. In the embodiment shown in FIG. 17, the shape of the nozzle for supplying the coolant to the heat sink 22 is changed. That is, the tapered nozzle 74 has a nozzle width that gradually decreases from the upstream portion of the nozzle toward the lower end portion of the nozzle connected to the heat sink. Air sent from a cooling air supply, such as a blower, passes through chamber 24 and flows smoothly into tapered nozzle 74 as airflow 75. The upper end of the nozzle is smoothly connected to the wall surface of the chamber 24. Therefore, the air flow is
When the cooling air flows into the nozzle, the flow resistance does not occur even at the corners, so that the flow resistance when the cooling air flows from the chamber 24 to the nozzle can be greatly reduced. Here, it has been described that the shape of the nozzle in the direction parallel to the fins (x direction) is a tapered nozzle shape, but the shape of the nozzle in the direction perpendicular to the fins (y direction) may be a tapered nozzle shape. The flow resistance can be further reduced by using. The shape of the portion of these tapered nozzles in contact with the heat sink 22 has a y shape as shown in the embodiment of FIG.
The width in the direction is larger than the heat sink.

FIG. 18 is a perspective view showing another embodiment of the chamber and the nozzle. In this embodiment, nozzles installed adjacent to each other are connected to form an integrated nozzle 76. The integral nozzle 76 is made of one box, and one surface is connected to the chamber 24. A large number of air outlets 77 are provided on the surface opposite to the chamber 24 in accordance with the position of the heat sink 22. The airflow 25 flowing in the chamber 24 flows into the integrated nozzle 76 as an inflow airflow 78, and is ejected from the air ejection port 77 as a discharge airflow 79 toward the heat sink 22. In this way, by integrating the nozzle, the nozzle side surface, which is the wall surface of the exhaust space where the exhaust merge flows, has no seam, and the exhaust is more smoothly exhausted. Therefore, the flow resistance can be reduced. Further, the number of parts for manufacturing the nozzle can be reduced, and the manufacturing cost can be reduced.

The following embodiment is a modification of the above-described embodiment.
The non-uniformity of the amount of cooling air supplied to each heat sink is controlled by the position and shape of the nozzle to make the distribution of the amount of air uniform. FIG. 19 is a bottom sectional view of the present embodiment, and FIG. 20 is a front sectional view of the present embodiment. As is clear from FIG. 20, in the present embodiment, the first type described in FIG.
This embodiment has the same configuration as that of the embodiment except that the position of the nozzle 23 in the horizontal direction is changed. In the embodiment shown in FIG. 1, the exhaust space between the outermost heat sink and the partition wall 29 has a larger cross-sectional area than the exhaust space between the other nozzles. The more the heat sink of the part, the harder it flows.
Therefore, the cooling air volume becomes uneven in the horizontal direction. This situation becomes more pronounced without the partition 29. Therefore, in this embodiment, as shown in FIGS.
Is set at a position closer to the inside of the nozzle of the heat sink closer to the partition wall. Then, the air flow 81 in the outer heat sink that flows out to the exhaust space 80 adjacent to the partition wall has a longer flow path in the heat sink, and is less likely to flow out. Although the effect is small for the second heat sink from the outside, a similar phenomenon occurs. With the above configuration, the distribution of the air flow in the horizontal direction with respect to the heat sink can be made uniform.

Another embodiment will be described with reference to FIG. In this embodiment, in addition to equalizing the distribution of the air volume in the horizontal direction, the distribution of the air volume in the vertical direction from the bottom to the top is also equalized. In the case of the configuration shown in FIG. 20, the distribution of the air volume in the horizontal direction can be made uniform,
Since the heat sink 8 on the upstream side, that is, the heat sink on the lower side in the vertical direction is farther from the outlet of the exhaust gas, the flow distance of the exhaust gas increases, the flow resistance increases, and the cooling air hardly flows. Conversely, cooling air flows more easily toward the upper heat sink. Therefore, as shown in FIG. 21, in addition to the nozzle configuration described in FIG. 20, if the width of the nozzle in the horizontal direction is reduced from the lower side to the upper side, the passage of the nozzle on the upper side becomes more severe. Since the area is reduced and air does not easily flow through the heat sink, the flow rate distribution of the heat sink in the vertical direction can be made uniform by appropriately adjusting the reduction in the nozzle width.

The method of equalizing the air volume distribution described in the present embodiment and the previous embodiment is not only applicable to the first embodiment, but is widely applied to a planar mounting cooling system including a nozzle and a heat sink. It goes without saying that it can be applied. Also, needless to say, the two air volume equalization methods described in the present embodiment and the above-described embodiment can be independently performed.

In the above, the embodiments of the present invention have been described mainly with respect to the flat fins as the heat sink. However, the present invention is applicable to any heat sink that can regulate the flow and discharge direction of the air flow, such as a pin fin. it can. FIG. 22 shows another embodiment of the heat sink of the present invention.

Heating semiconductor components 21 such as LSI modules
A heat sink is mounted on top. In the heat sink, many pin-shaped fins 41 a are provided on the base plate 40. The pin fins 41a and the base plate 40 are made of a metal material having good heat conductivity such as copper or aluminum,
Alternatively, a material such as a heat conductive ceramic may be used. The pin fins 41a and the base plate 40 are joined by caulking, brazing, soldering, bonding with a heat conductive adhesive, or the like.
Further, the pin fins 41a and the base plate 40 may be integrally formed by machining such as cutting. Pin fin 41a
A nozzle 23 is provided in the upper part of the
Side plates 82 are attached to both side surfaces of 1a so as to be continuous with the nozzle surface. The side plate 82 regulates the flow and discharge direction of the air flow in the heat sink. Pin fin 4
1a is configured such that its height is gradually reduced toward the downstream side in the direction of air flow and discharge. As described above, by sequentially reducing the height of the pin fins 41a, the exhaust flow 27 flows out in a U-turn shape, merges with the exhaust flow from the adjacent heat sink, and reduces the flow resistance when flowing into the exhaust space. it can. Further, since the fins are formed in the shape of pin fins, the heat transfer area is larger than that of the flat fins, and the heat transfer coefficient is improved by the turbulent flow effect, so that the cooling performance is improved.

FIG. 23 is a perspective view showing a method of forming a nozzle duct and a chamber. And this nozzle duct 83
24 is shown in FIG. A heat-generating semiconductor component 21 such as an LSI module is mounted on a substrate 20, and a heat sink 22 is mounted on the LSI module. As shown in FIG. 24, the nozzle duct 83 includes a nozzle 23 that supplies cooling air to the heat sink 22 and a partition wall 29. The partition wall 29 guides exhaust air from the heat sink 22 toward the outlet, and separates the exhaust air from other components of the electronic device. The nozzle duct 83 has an opening for discharging exhaust gas on a surface orthogonal to the nozzle, and a heat sink 22 and an LSI module can be stored in the nozzle duct 83 on a surface facing the heat sink 22. Opening 84 is provided. The heat sink 22 is housed in the nozzle duct 83 and comes into contact with the nozzle 23. On the surface of the nozzle duct 83 facing the chamber 24, a number of nozzle holes are formed, and the surface is connected to the chamber surface.

When the nozzle duct 83 and the chamber 24 are configured as described above, the nozzle and the chamber can be configured separately, so that the positioning when connecting the nozzle and the heat sink is facilitated and the mounting work time is reduced. Further, since the nozzle and the chamber can be separated during maintenance or inspection, workability is improved.

Another embodiment of the present invention will be described with reference to FIGS. FIG. 25 is a horizontal cross-sectional view of the electronic device according to the present embodiment as viewed from below, FIG. 26 is a vertical cross-sectional view as viewed from the front, and FIG. 27 is a vertical cross-sectional view as viewed from the side.

As shown in FIG. 25, the structure of the nozzle 23, the heat sink 22, and the like, and the flow of cooling air there, are the same as in the other embodiments. The feature of the present embodiment is that the blowers 102 are individually attached to the upstream portions of the respective nozzles so that the cooling air can be supplied to each heat sink 22 independently. Each individual blower 1
The motors 103 are individually provided with motors 103 so that each blower can be operated independently.
Here, as the individual blower 102, a small and high-rotation type blower is suitable, and a sirocco type or turbo type blower is suitable.

With the configuration of this embodiment, the following effects can be expected. First, since the individual blower 102 can be installed in the air supply chamber 24, no other special blower box is required, and the housing can be made compact. Further, since the cooling air can be sent to each heat sink 22 independently, the heat sink 22 of the heat-generating semiconductor component having a large heat generation amount can be provided.
Alternatively, a blower having a higher power can be mounted on the heat sink 22 that does not generate an air volume to increase the air volume, and conversely, the heat volume can be reduced for the heat sink 22 that does not require a relatively large air volume. Also, since the rotation speed of each individual blower 102 can be easily changed by changing the voltage and frequency of the motor 103, the air volume distribution between the heat sinks 22 can be changed to an arbitrary distribution. Control can be performed so that the air volume distribution is suitable for cooling.

FIGS. 28 and 2 show another embodiment of the present invention.
9 will be described. FIG. 28 is an enlarged cross-sectional perspective view showing the heat sink of this embodiment, and FIG. 29 is a perspective view showing the structure of the housing.

In this embodiment, the structure of the heat sink 22 has the following features as compared with the other embodiments. As shown in FIG. 28, the heat sink 22 mounted on the heat-generating semiconductor component 21 on the substrate 20 is connected to the heat-generating semiconductor component 21.
Overhang type fin base 4 overhanging
0, a flat fin 41 having a small fin pitch and densely mounted on the fin base 40;
Exhaust guide plates 104 attached to both ends in the x-axis direction
Consists of The air flow 26 is supplied at a high speed into the high-density flat plate fins 22 from the nozzles 23 attached in close contact with the upper part of the heat sink 22, reaches near the fin base 40 as indicated by 27, and forms a U-turn. Fin 4
1 Discharged toward the top. Exhaust flow is exhaust guide plate 1
While being restricted by the flow 04, the fin 41 is slowly bent above the fin 41, is discharged from the exhaust port 105 to the exhaust flow path between the nozzles 23, and merges with the exhaust flow from the other heat sink 22 on the upstream side. The exhaust gas merges into the blower 32.

As shown in FIG. 29, the heat-generating semiconductor components 21 and the heat sink 22 are mounted on the substrate 20 fixed to the frame 60 in three rows in the X direction and two steps in the Y direction. . Cooling air is sucked from the floor by three blowers 32 mounted on the upper part of the housing, and the nozzles 23
To cool the heat sink 22 to form an exhaust merging 28, which flows through the exhaust space between the nozzles in the y direction, is sucked into the blower 32 through the suction duct 101, and is discharged out of the housing as indicated by 30. . Although not shown, an outer wall plate that separates the housing from the outside is attached around the frame.

Since the exhaust guide plate 104 is attached to the heat sink 22, the exhaust flow from the heat sink 22 joins the exhaust flow 28 without colliding with the exhaust flow from the heat sink 22 adjacent in the x direction. Since the guide plate has a curvature radius R so that the flow can be smoothly bent, the pressure loss in the exhaust can be reduced. The heat sink 22
Is of an overhang type larger than the heat-generating semiconductor component 21, so that a large heat radiation area can be taken and cooling performance can be improved.

FIGS. 30 and 3 show another embodiment of the present invention.
1 will be described. FIG. 30 is a vertical cross-sectional view of the present embodiment as viewed from the side, and FIG. 31 is a horizontal cross-sectional view as viewed from below.

This embodiment is the same as the other embodiments except for the heat sink 22. A feature of this embodiment is that the heat sink is a heat sink 108 having a cross section in which a trapezoidal shape is continuously formed. This heat sink 108 can be formed by bending flat plate fins continuously in a trapezoidal shape and mounting them alternately facing each other on the base plate 40, and the cross-sectional area of the air flow path between the fins faces the base plate 40 direction. Therefore, rapid expansion and contraction are repeated. The air flow passing between the fins of the heat sink 108 has a respiratory effect when passing through the flow path because the flow path is formed so as to expand and contract rapidly, thereby improving the heat transfer coefficient. be able to.

Further, a plate 106 for covering both end surfaces in the x direction of the heat sink 108 and an end surface in the z direction other than the nozzle portion is attached, and the cooling air supplied from the nozzle 23 is short-passed. Without reaching the fin base 40. For this reason, the cooling performance can be improved. The cooling air discharged from the heat sink 108 is
08 flows toward the nozzle 23 as indicated by 107, and is discharged as an exhaust merging 28. As described above, with such a configuration, the cooling performance of the heat sink can be improved.

As described above , according to the present invention, cooling
An electronic device with improved performance can be provided. Ma
Further, a heat sink having improved cooling performance can be provided.
Furthermore, it provides an electronic computer with improved cooling performance.
Can be

[Brief description of the drawings]

FIG. 1 is a bottom sectional view of a first embodiment of the present invention.

FIG. 2 is a front sectional view of the first embodiment of the present invention.

FIG. 3 is a side sectional view of the first embodiment of the present invention.

FIG. 4 is an enlarged view of a heat sink according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view in the orthogonal direction of FIG.

FIG. 6 is a perspective view of a heat sink according to the first embodiment of the present invention.

FIG. 7 is an explanatory diagram of an optimum value of a nozzle width according to the first embodiment of the present invention.

FIG. 8 is an explanatory diagram of an appropriate value of a nozzle interval according to the first embodiment of the present invention.

FIG. 9 is a front sectional view of a second embodiment of the present invention.

FIG. 10 is a side sectional view of a second embodiment of the present invention.

FIG. 11 is a side sectional view of a third embodiment of the present invention.

FIG. 12 is a front sectional view of a third embodiment of the present invention.

FIG. 13 is a front sectional view of a fourth embodiment of the present invention.

FIG. 14 is a bottom sectional view of a fourth embodiment of the present invention.

FIG. 15 is a side sectional view of a fourth embodiment of the present invention.

FIG. 16 is an enlarged view of a heat sink according to another embodiment of the present invention.

FIG. 17 is a bottom sectional view of another embodiment of the present invention.

FIG. 18 is a perspective view of another embodiment of the chamber and the nozzle.

FIG. 19 is a bottom sectional view of another embodiment of the present invention.

FIG. 20 is a front sectional view of another embodiment of the present invention.

FIG. 21 is a front sectional view of another embodiment of the present invention.

FIG. 22 is a perspective view of a heat sink according to another embodiment of the present invention.

FIG. 23 is a perspective view of a method of configuring a nozzle duct and a chamber according to another embodiment of the present invention.

FIG. 24 is a three-view drawing of a nozzle duct according to another embodiment of the present invention.

FIG. 25 is a bottom sectional view of another embodiment of the present invention.

FIG. 26 is a front sectional view of another embodiment of the present invention.

FIG. 27 is a front sectional view of another embodiment of the present invention.

FIG. 28 is an enlarged perspective view of a heat sink according to another embodiment of the present invention.

FIG. 29 is a perspective view of a housing according to another embodiment of the present invention.

FIG. 30 is a side sectional view of another embodiment of the present invention.

FIG. 31 is a bottom sectional view of another embodiment of the present invention.

FIG. 32 is a bottom sectional view of a conventional electronic device.

FIG. 33 is a front sectional view of a conventional electronic device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... LSI, 3 ... Heat sink, 4 ... Chamber, 5 ... Nozzle, 6 ... Opening, 7 ... Exhaust, 8 ... Exhaust space, 20 ... Substrate, 21 ... Heat-generating semiconductor component, 22 ... Heat sink, 23 ... Nozzle, 24 chamber, 25 air flow, 28 exhaust merge, 29 partition, 30 exhaust, 32
Blower, 36: exhaust space, 40: base plate, 41,
41a: fins, 44, 45, 46: exhaust merging, 51:
Discharge end, 82 ... side plate, 83 ... nozzle duct.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Nobuo Kawasaki 502, Kandate-cho, Tsuchiura-shi, Ibaraki Hitachi, Ltd.Mechanical Laboratory (72) Inventor Toshiki Iino 502-Kindachi-cho, Tsuchiura-shi, Ibaraki Within the research institute (72) Inventor Takahiro Oguro 1st Horiyamashita, Hadano City, Kanagawa Prefecture Within the General Purpose Computer Division, Hitachi, Ltd. (72) Inventor Tamotsu Tsukaguchi 1st General Horiyamashita, Hadano City, Kanagawa Prefecture Within the General Purpose Computer Division, Hitachi, Ltd. (72) Inventor Kenichi Kasai 1 Horiyamashita, Hadano-shi, Kanagawa Prefecture General Computer Division, Hitachi, Ltd. (56) References JP-A-2-34993 (JP, A) JP-A-1-733993 (JP, U.S.A.) (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 7/20 G06F 1/20 H01L 23/36 H01L 23/46 7

Claims (29)

(57) [Claims] 1. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks that are thermally connected to and attached to the heat-generating semiconductor components, respectively, and define a flow direction and a discharge direction of a refrigerant such as air. An exhaust chamber that collectively circulates the refrigerant discharged from the heat sink, wherein the heat sinks are disposed such that the refrigerant flows out and out of the heat sinks in substantially the same direction, Nozzles for supplying a coolant to the heat sinks are respectively provided on end faces of the heat sinks opposite to the side on which the heat-generating semiconductor components are mounted, and between the nozzles, substantially in the direction of flow and discharge of the coolant defined by the heat sinks. A return flow path for the refrigerant that has cooled the heat sink is provided above the heat sink opposite to the substrate in an orthogonal direction. An electronic device characterized by being formed. A plurality of heat-generating semiconductor components mounted on a substrate, a heat sink thermally connected to each of the heat-generating semiconductor components and mounted thereon for flowing and discharging a refrigerant such as air; In an electronic device having an exhaust chamber through which the discharged refrigerant is circulated collectively, nozzles for supplying a refrigerant to the heat sink are provided on end surfaces of the heat sinks opposite to the heat-generating semiconductor component mounting side, respectively. An electronic device, wherein a refrigerant supplied from a nozzle is discharged through a discharge passage formed by partitioning independently of the nozzle and the supply side. 3. A plurality of heat generating semiconductor components mounted on a substrate, a heat sink attached and thermally connected to each of the heat generating semiconductor components, for flowing and discharging a refrigerant such as air, and a heat sink for each of the heat sinks. An electronic device comprising: an exhaust chamber through which discharged refrigerant is collectively circulated; a nozzle for discharging the heat sink from the refrigerant supply passage in a direction substantially orthogonal to the heat-generating semiconductor component; An electronic device, wherein the cooled refrigerant is caused to flow out along the heat-generating semiconductor component by the respective heat sinks, and is discharged through a discharge passage formed by partitioning independently of the nozzle and the supply side. . 4. A plurality of heat-generating semiconductor components mounted on a substrate, a heat sink thermally connected to and attached to each of the heat-generating semiconductor components, and for circulating and discharging a refrigerant such as air; An electronic device comprising: an exhaust chamber through which discharged refrigerant is collectively circulated; a nozzle for discharging the heat sink from the refrigerant supply passage in a direction substantially orthogonal to the heat-generating semiconductor component; The cooled refrigerant is formed in a U-turn shape toward the upper side of the heat sink by the respective heat sinks and the exhaust guide plate formed outside the heat sink, and is formed so as to be separated from the nozzle and the supply side independently. An electronic device characterized in that the electronic device is configured to discharge through a defined discharge passage. 5. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks that are thermally connected to and attached to each of the heat-generating semiconductor components, and define a flow direction and a discharge direction of a refrigerant such as air, respectively. An exhaust chamber that collectively circulates the refrigerant discharged from the heat sink of the electronic device, wherein the heat sinks are arranged such that the flow and discharge directions of the refrigerant in the respective heat sinks are substantially the same, A nozzle for supplying a coolant to the heat sink is provided in contact with an end surface of the heat sink opposite to the heat-generating semiconductor component mounting side, and a width of the nozzle in a flow and a discharge direction of the coolant defined by the heat sink is set. An electronic device having a width smaller than a width of the corresponding heat sink. 6. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks that are thermally connected to and attached to each of the heat-generating semiconductor components, and define a flow direction and a discharge direction of a refrigerant such as air, respectively. An exhaust chamber through which the refrigerant discharged from the heat sink is collectively circulated, wherein the heat sinks are arranged such that the flow and discharge directions of the refrigerant defined by the heat sinks are substantially the same. A nozzle for supplying a coolant in contact with an end surface of the heat sink opposite to the heat-generating semiconductor component mounting side, wherein the nozzle has a substantially rectangular cross section parallel to the substrate, and has a short side of the rectangle. An electronic device is provided in the flow direction of the refrigerant defined by the heat sink. 7. A method according to claim 1, wherein a gap between the nozzles in a flow direction and a discharge direction of the refrigerant defined by the heat sink is larger than a gap between the nozzles in a direction orthogonal to the direction. The electronic device according to any one of the above. 8. The electronic device according to claim 1, wherein a partition surrounding said plurality of heat generating semiconductor components is provided, and said partition is provided with an opening. 9. Each of the heat sinks has a base plate on a side to be attached to the heat-generating semiconductor component, and a plurality of fins for dissipating heat generated by the heat-generating semiconductor component perpendicular to the base plate. 6. The electronic device according to claim 1, wherein the height from the plate is lower at the end of the heat sink than at the center of the heat sink in the direction of flow and discharge of the refrigerant defined by the heat sink. apparatus. 10. The electronic device according to claim 9, wherein the fin is a pin fin. 11. The electronic device according to claim 9, wherein said fin is a parallel plate fin. 12. The heat sink according to claim 1, wherein the distance between the outer walls of the adjacent nozzles in the direction of flow and discharge of the refrigerant defined by the heat sink is greater than the distance between the corresponding ends of the heat sink. An electronic device according to any one of the above. 13. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks which are thermally connected to and attached to each of the heat-generating semiconductor components, and define heat distribution and discharge directions of a refrigerant such as air. And an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink of the electronic device, wherein the heat sinks are disposed so that the flow and discharge directions of the refrigerant in the respective heat sinks are substantially the same. Nozzles for supplying a coolant to the heat sinks are provided in contact with end faces of the heat sinks opposite to the heat-generating semiconductor component mounting side, respectively, in a direction orthogonal to the coolant flow and discharge directions defined by the heat sink. Wherein the width of the nozzle is larger than the width of the corresponding heat sink. 14. The nozzle is connected to a refrigerant supply channel for supplying a refrigerant, and a cross-sectional area of a connection portion between the refrigerant supply channel and the nozzle is larger than a cross-sectional area of a contact portion between the nozzle and the heat sink. The electronic device according to claim 1, wherein a cross-sectional shape of the nozzle in a refrigerant flowing direction is a smooth curve. 15. The electronic device according to claim 14, wherein a nozzle width of the nozzle for supplying the coolant to the heat sink in a cross section in a coolant flowing direction is gradually reduced from the connection portion toward the contact portion. . 16. A heat sink for receiving heat from a heat generating semiconductor component, exchanging heat with a refrigerant such as air to radiate heat, and defining a flow direction and a discharge direction of the refrigerant, wherein a contact portion of the heat sink with the heat generating semiconductor component. On the opposite end face, a nozzle for supplying a coolant to the heat sink is provided, and a nozzle width in a direction orthogonal to a coolant flowing and discharging direction defined by the heat sink is formed to be larger than a width in a corresponding direction of the heat sink. ,
A heat sink, wherein a width of a nozzle defined by the heat sink in a flow direction and a discharge direction of a refrigerant is smaller than a width of the heat sink in a corresponding direction. 17. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks which are thermally connected to and attached to each of the heat-generating semiconductor components, and which define a flow direction and a discharge direction of a refrigerant such as air, respectively. An electronic device including an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink,
An electronic computer comprising: a refrigerant supply unit that supplies a refrigerant to the exhaust chamber; a chamber that guides the refrigerant supplied by the refrigerant supply unit to an electronic device; and a housing that stores the electronic device and the refrigerant supply unit. In the above, the electronic device is stored in the upper part of the housing, the chamber and the electronic device are juxtaposed, the coolant supply means is provided vertically below the chamber, and a nozzle for supplying a coolant to the plurality of heat generating semiconductor components. An electronic computer, wherein the exhaust chamber is provided above the electronic device, and a refrigerant exhaust hole is provided on the upper surface of the housing. 18. Air is sucked in by a refrigerant supply means for supplying air from a lower part of the main body of the computer, and the air thus drawn is guided to an air supply section of the electronic device through a chamber passage. Are thermally connected to the plurality of heat generating semiconductor components mounted on the substrate, respectively, and are guided to the respective heat sinks by nozzles provided respectively on the heat sinks. The partition walls are independent of the nozzles and the air supply unit. An electronic computer characterized in that the electronic device is caused to flow out to an upper part of the electric computer through the exhaust chamber, thereby cooling the electronic device. 19. The electronic device, wherein the heat sinks are arranged so that the directions of circulation and discharge of the refrigerant in the respective heat sinks are substantially the same, and the heat sink and the heat generating semiconductor component mounting side of the respective heat sinks are provided. A nozzle for supplying a coolant to the heat sink is provided in contact with the opposite end surface, and the width of the nozzle in the direction of flow and discharge of the coolant defined by the heat sink is smaller than the width of the corresponding heat sink. The electronic computer according to claim 17 or 18, wherein 20. The heat-generating semiconductor component according to claim 20, wherein the heat sink has a plurality of fins, and at least a part of a gap between outermost fins of the heat sink in a flow and a discharge direction of the coolant defined by the heat sink. 2. The gap between the gaps is larger than the gap between them.
Or the electronic device according to 5. 21. The heat sink has a base plate, and a gap between the base plates in a flow direction and a discharge direction of the refrigerant defined by the heat sink is made larger than a gap between the corresponding heat generating semiconductor components. The electronic device according to claim 1, wherein the electronic device is an electronic device. 22. The electronic device according to claim 1, wherein a width of the nozzle in a flow direction and a discharge direction of the refrigerant defined by the heat sink is substantially half of a width of the heat sink. 23. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks that are thermally connected to and attached to each of the heat-generating semiconductor components, and that define a flow direction and a discharge direction of a refrigerant such as air, respectively. In an electronic device having an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink, the heat sinks are disposed so that the flow and the discharge directions of the refrigerant in the respective heat sinks are substantially the same, A nozzle for supplying a coolant to the heat sink is provided in contact with an end surface of the heat sink opposite to the side on which the heat-generating semiconductor component is mounted, and the plurality of nozzles in a flow direction and a discharge direction of the coolant defined by the heat sink are provided. An electronic device, wherein a pitch is smaller than a pitch of the heat sink. 24. The electronic device according to claim 23, wherein the reference of the arrangement pitch of the nozzles is substantially the same as the central axis of the central heating semiconductor component among the plurality of heating semiconductor components. . 25. A plurality of heat-generating semiconductor components mounted on a substrate, heat sinks which are thermally connected to and attached to each of the heat-generating semiconductor components, and define a flow direction and a discharge direction of a refrigerant such as air, respectively. In an electronic device having an exhaust chamber that collectively circulates the refrigerant discharged from the heat sink, the heat sinks are disposed so that the flow and the discharge directions of the refrigerant in the respective heat sinks are substantially the same, A partition wall surrounding the plurality of heat sinks, and a nozzle for supplying a coolant to the heat sink in contact with an end surface opposite to the heat-generating semiconductor component mounting side are provided, and the nozzle and the partition wall are integrally formed. Electronic device. 26. The method according to claim 26, wherein the gap between the nozzles in the direction of flow and discharge of the coolant defined by the heat sink is 0.5 to 0.8 times the interval between the heat-generating semiconductor components in the same direction. The electronic device according to claim 1. 27. The apparatus according to claim 1, wherein a fan is provided upstream of each of the nozzles, and the flow rate of the refrigerant supplied to the nozzles is independently controlled by the fan. An electronic device according to any one of the above. 28. The apparatus according to claim 17, wherein a fan is provided upstream of each of the nozzles, and the flow rate of the refrigerant supplied to the nozzles is independently controlled by the fan. Electronic computer according to crab. 29. An electronic computer according to claim 17, wherein the refrigerant or air supplied to each of said nozzles is provided on an upper part of the computer main body.