JP2013016569A - Cooling mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling mechanism capable of efficiently cooling with a heat removal fluid regardless of a fact that at least two heating bodies, being small and thin with different heating value, are mounted on the same module.SOLUTION: The cooling mechanism includes post-like and plate-like heat sinks that are thermally connected to heating bodies 201 and 202, with the heat sinks arranged relatively on the upper stream side in the distribution direction and the lower stream side in that of a heat removal fluid respectively. It includes a first duct 10 which applies a speed vector that inclines against the height direction of the post-like heat sink to the heat removal fluid, for cooling in collision jet the post-like heat sink, and a second duct 20 which applies a speed vector parallel to the length direction of the plate-like heat sink to the heat removal fluid, for cooling in laminar flow or in turbulence the plate-like heat sink. These ducts are connected together so that the heat removal fluid discharged from the first duct is pulled in for confluence with the heat removal fluid, for cooling in laminar flow or in turbulence.

Description

  The present invention relates to a cooling mechanism, and more particularly to a cooling mechanism that cools at least two heating elements (heat sources) that are arranged in the same module and have different heating values.

  As for the cooling mechanism of the heating element arranged inside the module, a heat sink shape, processing of the heat sink on the fin surface, and a method for optimizing the fin pitch interval are known (for example, refer to Patent Document 1 and Patent Document 2). . A cooling mechanism having a duct that enables the flow rate control of the heat removal fluid is also known (see, for example, Patent Document 3).

JP 2006-228888 A JP 2007-013052 A JP 2002-298771 A

  Patent Document 1 described above describes an element cooling heat sink for different heat generation regions. In the element cooling heat sink, different unevenness processing or through hole processing is applied to the surface of the heat sink fin for each different heat generation region. Furthermore, mention is made including adjustment of the fin pitch in order to reduce the pressure loss particularly in the latter stage. However, the element cooling heat sink can be applied only when the area of the fin is wide. When the structure to be cooled is small and the heat density is high, physical processing of the fin itself becomes difficult. End up.

  In Patent Document 2 described above, a once-through forced air-cooled heat sink is described. The once-through forced air-cooled heat sink has a plurality of fin shapes. There is one kind of component to be cooled by the once-through forced air-cooled heat sink. Triangular prism heat sinks are used to cool this particular component, but the other fins are primarily aimed at ensuring an optimal flow path for cooling air (heat removal fluid). Therefore, there is no mention of optimal cooling of a plurality of parts each having different heat generation amounts.

  Therefore, for the cooling of modules that are small and thin and have multiple components each with different heat generation, the optimal combination of impinging jet cooling and laminar or turbulent cooling, and each cooling Optimization by the interaction of the flow rate of the heat removal fluid used in is desirable, and there is a need for such a technique.

  In the above-mentioned Patent Document 3, a jet upstream method that enables cooling by using a sheet metal having a plurality of desired through holes as fins of a heat sink and allowing a cooling airflow (heat removal fluid) to pass through the through holes. A heat sink device using is described. However, in the heat sink device, the fins of the heat sink are preferably arranged in a fence shape surrounding a blower device (fan) that generates cooling air, and restrictions are imposed when cooling air flows in one direction from the outside. Therefore, when it is difficult to provide the blower device on the upper part of the heating element, it is also difficult to provide the heat sink on the upper part of the heating element.

  A typical cooling mechanism body, a component temperature, and a case top temperature will be described with reference to FIGS. 9 (a), 9 (b), and 9 (c). As shown in FIGS. 9A and 9B, the cooling mechanism body of the conventional example includes a component 201 having a large heat generation amount and a component 202 having a small heat generation amount inside the same module 203, and the housing of the module 203. The plate-like heat sink 210 is provided on the top plate 203a. Examples of the components 201 and 202 include electric / electronic components and optical components. The plate heat sink 210 includes a plurality of plate fins 211 arranged adjacent to each other at a predetermined pitch. The module 203 is mounted on the printed board 204. A printed circuit board 204 on which the module 203 is mounted is covered with a case 205. Grilles 206 and 207 are attached to the case 205 on the inflow side and the exhaust side of the heat removal fluid, respectively. In addition, the component 201 with a large calorific value is disposed upstream of the component 202 with a small calorific value in the flow direction of the heat removal fluid.

  The heat removal fluid 101 flowing from the outside flows into the case 205 through one grill 206. The heat removal fluid 131, 132, 133 in the case 205 flows along the plate fins 211 of the plate heat sink 210. The heat removal fluid 134 that has flowed to the outside of the plate fins 211 flows to the other grill 207. Then, the heat removal fluid 102 that has flowed to the outside of the other grill 207 is discharged to the outside. Thus, cooling is performed by the heat removal fluid.

  In the cooling mechanism having the above-described configuration, the flow rate of the heat removal fluid flowing from the outside is set to 1.5 m / sec, and the heat generation amounts of the component 201 and the component 202 are set to 50 W and 10 W, respectively. As shown in FIG. 9C, the temperature characteristic graph shows a downward-sloping characteristic, the component 201 having a large heat generation amount is not efficiently cooled, and the temperature of the housing top plate 203a of the module 203 is also low. It turned out to be close to 100 ° C. and was not suitable for actual use. It is considered that this is mainly due to the cooling being hindered by the velocity boundary layer that appears in the vicinity of the surface of the plate fins 211 constituting the plate heat sink 210.

  In view of the above, the present invention has been made to solve the above-described problems, and is small and thin, and at least two heating elements each having different calorific values are combined in the same module. An object of the present invention is to provide a cooling mechanism body that can be effectively cooled by a heat removal fluid despite being mounted.

  A cooling mechanism body according to the present invention that solves the above-described problems is a cooling mechanism body that cools a module including at least two heating elements, each having a different amount of heat generation, with a heat removal fluid. A columnar heat sink thermally connected to one of the heating elements having a large heating value; and a plate-shaped heat sink thermally connected to the other heating element having a small heating value of the two heating elements; The columnar heat sink and the plate heat sink are respectively disposed relatively upstream and downstream in the flow direction of the heat removal fluid, and the speed at which the heat removal fluid is inclined with respect to the height direction of the column heat sink. A first duct that guides the heat removal fluid to the columnar heat sink with the vector applied thereto, and cools the columnar heat sink by collision jet flow, and the removal A second duct that guides the heat removal fluid to the plate heat sink in a state in which a velocity vector parallel to the longitudinal direction of the plate heat sink is applied to the fluid to cool the plate heat sink in a laminar or turbulent flow And connecting the first duct and the second duct to convert the heat removal fluid discharged from the first duct into the heat removal fluid that cools the laminar or turbulent flow. It is characterized by having been drawn together.

  Further, the cooling mechanism body according to the present invention for solving the above-described problems is the above-described cooling mechanism body, wherein the module is disposed on a surface of a printed board larger than its own footprint, and the printed board is supplied from the outside. The heat removal fluid inflow port and the discharge port are disposed inside the case at both ends, respectively, and the heat removal fluid inflow port side of the case has the first duct and the second duct. Each heat removal fluid inflow port is disposed, and the heat removal fluid discharge port of the first duct is connected to the middle of the second duct.

  Further, the cooling mechanism body according to the present invention for solving the above-described problems is the above-described cooling mechanism body, wherein the inlet ports of the heat removal fluids of the first duct and the second duct are on the printed circuit board. Are arranged adjacent to each other.

  Further, the cooling mechanism body according to the present invention for solving the above-described problem is the above-described cooling mechanism body, wherein the heat removal fluid flow of the second duct is disposed above the heat removal fluid inlet port of the first duct. An inlet is arranged.

  According to the cooling mechanism body according to the present invention, in each module in which electrical / electronic components and optical components that are at least two heating elements each having different heating values are disposed, In addition, it is possible to provide a cooling mechanism that performs heat transport using a heat removal fluid by different methods. Thereby, although it is small and thin, and at least two heating elements having different calorific values are mounted on the same module, cooling with the heat removal fluid can be performed effectively.

It is a figure for demonstrating the cooling mechanism body which concerns on the 1st, 2nd Example of this invention, Comprising: The plane of the module is shown to Fig.1 (a), The schematic side surface is shown to FIG.1 (b). . It is a figure for demonstrating the collision jet cooling duct which the cooling mechanism body which concerns on 1st Example of this invention comprises, Comprising: The plane except a case is shown to Fig.2 (a), FIG.2 (b) The schematic side is shown. FIG. 3 is a view for explaining a laminar flow / turbulent duct provided in the cooling mechanism body according to the first embodiment of the present invention, and FIG. ) Shows the schematic side view. It is the perspective view seen from the upper part of the cooling mechanism body which concerns on 1st Example of this invention. It is the perspective view seen from the downward direction of the cooling mechanism body which concerns on 1st Example of this invention. It is a figure for demonstrating the cooling mechanism body which concerns on 1st Example of this invention, Comprising: The schematic side surface is shown to Fig.6 (a), and the temperature distribution is shown to FIG.6 (b). It is a figure for demonstrating the collision jet cooling duct which the cooling mechanism body which concerns on 2nd Example of this invention comprises, Comprising: The plane except a case is shown to Fig.7 (a), FIG.7 (b) The schematic side is shown. FIG. 8A is a diagram for explaining a laminar flow / turbulent duct provided in a cooling mechanism body according to a second embodiment of the present invention, and FIG. ) Shows the schematic side view. It is a figure for demonstrating the cooling mechanism body by a prior art example, Comprising: FIG. 9 (a) shows the plane except a case, FIG.9 (b) shows the schematic side surface, FIG.9 (c) shows the temperature. Show the distribution.

  The form for implementing the cooling mechanism body which concerns on this invention is demonstrated concretely in each Example.

  The cooling mechanism according to the first embodiment of the present invention will be specifically described with reference to FIGS. In this embodiment, for example, the case where the area of the printed circuit board of the line card is relatively large and the thickness of the line card is thin is assumed.

  As shown in FIGS. 1 to 4, the cooling mechanism according to the present embodiment includes two parts each having a different calorific value, that is, a part 201 having a large calorific value and a part 202 having a small calorific value. This is applied to the provided module 203. An aluminum columnar heat sink 1 and an aluminum plate heat sink 3 are bonded or integrally formed at locations facing the component 201 and the component 202 of the housing top plate 203a of the module 203, respectively. That is, the component 201 having a large calorific value is thermally connected to the columnar heat sink 1 via the housing top plate 203 a of the module 203. The component 202 having a small calorific value is thermally connected to the plate heat sink 3 via the housing top plate 203 a of the module 203. The columnar heat sink 1 is composed of a plurality of quadrangular column fins 2 arranged at a predetermined pitch. The plate heat sink 3 is composed of a plurality of flat plate fins 4 arranged at a predetermined pitch in the width direction of the module 203. The component 201 is disposed on the upstream side of the component 202 in the flow direction of the heat removal fluid described later.

  The module 203 is mounted on the surface of the printed circuit board 204 that is sufficiently larger than its own footprint. The printed circuit board 204 is covered with a case 205. The case 205 includes two side wall plates (not shown) arranged on the outer side in the width direction of the module 203. To the case 205, grill plates 206 and 207 having functions of an inlet and an outlet for the heat removal fluid are attached. By these, after ensuring the mechanical strength of the printed circuit board 204 itself, the bottom surface is the printed circuit board 204, the top surface is the case 205, the two grill plates 206 and 207, and the two side wall plates, A closed space including the module 203 is formed inside. The heat removal fluid 101 supplied from the outside of the closed space flows into the inside through the inflow port formed by one grill plate 206 and is discharged through the discharge port formed by the other grill plate 207. The heat removal fluid 102 discharged from the inside is discharged to the outside.

  Furthermore, the cooling mechanism according to the present embodiment is configured such that the first duct (impact jet cooling duct) 10 that guides the heat removal fluid 101 near the grill 206 to the columnar heat sink 1 and the heat removal fluid 101 near the grill 206 are plate-shaped. And a second duct (laminar flow / turbulent flow duct) 20 guided to the heat sink 3. As the 1st duct 10 and the 2nd duct 20, the thing made from resin, respectively is mentioned, for example.

  As shown in FIGS. 2 (a), 2 (b), 4 and 5, the first duct 10 has a cylindrical shape and includes an inlet 10a and an outlet 10b for the heat removal fluid at both ends. The first duct 10 includes a ceiling plate 11, side plates 12 and 13 connected to the side portions of the ceiling plate 11, and a bottom plate 14 connected to the lower ends of the side plates 12 and 13. The ceiling board 11 includes a flat part 11a and an inclined part 11b connected to the rear end part of the flat part 11a. A connecting portion between the flat portion 11a and the inclined portion 11b forms a bent portion 11c. The bottom plate 14 includes a first inclined portion 14a and a second inclined portion 14b connected to the rear end portion of the first inclined portion 14a. A connecting portion between the first inclined portion 14a and the second inclined portion 14b forms a bent portion 14c. The first duct 10 is attached at a predetermined position, that is, the rear end portion of the second inclined portion 14b of the bottom plate 14 is near the front end portion 203b of the housing top plate 203a of the module 203, and the flat portion 11a of the ceiling plate 11 is attached. Are arranged substantially horizontally, the inclined portion 11b is inclined with respect to the extending direction of the flat surface portion 11a and extends toward the housing top plate 203a of the module 203. The first inclined portion 14 a is inclined with respect to the length direction of the first duct 10 and extends toward the flat portion 11 a side of the ceiling plate 11, and the second inclined portion 11 b is the length of the first duct 10. It inclines with respect to the direction and extends to the housing top plate 203a side of the module 203. Further, the inclined portion 11 b of the ceiling plate 11 covers the upper side of the quadrangular column fin 2 of the columnar heat sink 1.

  A region between the bent portion 11c of the ceiling plate 11 and the bent portion 14c of the bottom plate 14 has a diameter smaller than that of the region, for example, the inlet 10a and the outlet 10b, and forms a waist portion 15.

  As described above, the first duct 10 includes the waist portion 15, and the inclined portion 11 b is provided on the ceiling plate 11 on the discharge port 10 b side of the first duct 10. A velocity vector that circulates in a direction inclined with respect to the longitudinal direction is given. That is, the velocity vector of the heat removal fluid is changed by the first duct 10. Therefore, the heat removal fluid that cools the quadrangular fin 2 has velocity vectors 104 and 105 that have an angle with respect to the longitudinal direction of the quadrangular fin 2, and the heat removal fluid that has circulated in the first duct 10. The fluid 103 collides with an inclination angle with respect to the longitudinal direction of the quadrangular prism fin 2. The inclination angle may be, for example, 10 degrees or more. As a result, the heat removal fluid 103 that has flowed into the first duct 10 collides and jets against the respective quadrangular column fins 2. This is because if the inclination angle is smaller than 10 degrees, the heat removal fluid 103 flowing into the first duct 10 may not collide with the respective quadrangular fins 2. Therefore, the provision of the first duct 10 realizes collision jet cooling and realizes highly efficient cooling.

  As shown in FIGS. 3A, 3 </ b> B, 4, and 5, the second duct 20 is cylindrical and has two inlets 20 a into which the heat removal fluid 101 near the grill 206 flows. , 20b, an inlet (opening) 20c into which the heat removal fluid 106 discharged from the first duct 10 flows, and a discharge port 20d through which the heat removal fluid flowing through the inside is discharged. The second duct 20 includes a first passage 21, a second passage 26, a first duct 10, a connection portion 31 connected to the rear end portions of the first and second passages 21, 26, and a connection And a third passage 40 connected to the rear end portion of the portion 31. The first passage 21 and the second passage 26 are respectively disposed adjacent to the side of the first duct 10. The first passage 21 and the second passage 26 extend substantially linearly in the length direction of the second duct 20.

  The first passage 21 includes a ceiling plate 22, side plates 23 and 24 connected to the side portions of the ceiling plate 22, and a bottom plate 25 connected to the lower ends of the side plates 23 and 24. The ceiling board 22 includes a flat portion 22a and an inclined portion 22b connected to the rear end portion of the flat portion 22a. The bottom plate 25 includes a flat portion 25a and an inclined portion 25b connected to the rear end portion of the flat portion 25a. The second passage 26 has the same shape as the first passage 21, and includes a ceiling plate 27, side plates 28 and 29 connected to the side portions of the ceiling plate 27, and a bottom plate 30 connected to the lower end portions of the side plates 28 and 29. Prepare. The ceiling board 27 includes a flat portion 27a and an inclined portion 27b connected to the rear end portion of the flat portion 27a. The bottom plate 30 includes a flat portion 30a and an inclined portion 30b connected to the rear end portion of the flat portion 30a.

  The connecting portion 31 is connected to the ceiling plate 32, side plates 34 and 35 connected to the side portions of the ceiling plate 32, bottom plates 37 and 38 connected to the lower ends of the side plates 34 and 35, and connected to the front end portion of the ceiling plate 32. A vertical plate 33 is provided. The ceiling plate 32 is connected to the rear end portion of the ceiling plate 22 of the first passage 21 and the rear end portion of the ceiling plate 27 of the second passage 26. The ceiling board 22 of the 1st channel | path 21 is provided with the inclined part 22b connected to the plane part 22a and the rear-end part of the plane part 22a. The ceiling plate 27 of the second passage 26 also includes a flat portion 27a and an inclined portion 27b connected to the rear end portion of the flat portion 27a. The side plate 34 and the side plate 35 are connected to the side plate 23 of the first passage 21 and the side plate 28 of the second passage 26, respectively. The side plate 34 has an inclined portion 34 a extending toward the center in the width direction of the second duct 20, and a flat portion 34 b connected to the rear end portion of the inclined portion 34 a and extending in the width direction of the second duct 20. With. The side plate 35 also has an inclined portion 35a extending toward the center in the width direction of the second duct 20, and a flat portion 35b connected to the rear end portion of the inclined portion 35a and extending in the width direction of the second duct 20. With. The front vertical plate 33 is connected to the rear end portion of the ceiling plate 11 of the first duct 10, the side plate 24 of the first passage 21, and the side plate 29 of the second passage 26. In the connecting portion 31, a portion that is connected to the first duct 10, the first passage 21, and the second passage 26 and is connected to a third passage 40 described later forms a fluid acceleration inlet 39. As a result, the heat removal fluid 106 after cooling the columnar heat sink 1 in the first duct 10 joins downstream of the second duct 20 and is accelerated.

  The third passage 40 is connected to the ceiling plate 41 connected to the rear end portion of the ceiling plate 32 of the connecting portion 31, and to the rear end portions of the side plates 34 and 35 of the connecting portion 31 and connected to the side portion of the ceiling plate 41. Side plates 42 and 43 are provided. That is, the upper side and the side of the plate-shaped heat sink 3 are covered by the third passage 40. As a result, the heat removal fluid 121, 122, 123 that has flowed into the third passage 40 is transferred to the plate heat sink 3 in a state in which the longitudinal direction of the flat fin 4 of the plate heat sink 3 is parallel to the velocity vector. The plate heat sink 3 is guided to the heat sink 3 and laminar or turbulently cooled by the heat removal fluid.

  As described above, the second duct 20 includes the heat removal fluid inlets 20a and 20b and the outlet 20d at both ends thereof, and further includes a waist structure in the longitudinal direction of the main body, and at the same time, the fluid acceleration inlet. 39, and the fluid acceleration inlet 39 is physically connected to the outlet 10b of the first duct 10, so that the heat removal fluid 106 discharged from the outlet 10b of the first duct 10 is the second. The heat removal fluid 121 that cools the plate fins 4 after accelerating the drawing of the heat removal fluid 108 passing through the first and second passages 21 and 26 of the duct 20 and accelerating the flow rate of the heat removal fluid. , 122, 123 are formed. That is, the heat removal fluid is drawn and joined. Thus, the increase in the flow velocity of the heat removal fluid 121, 122, 123 reduces the velocity boundary layer that appears in the vicinity of the surface of the plate fin 4, and cools the component 202 with a small amount of heat generation with high efficiency.

  In the first embodiment, the inlets 20 a and 20 b of the second duct 20 are arranged on the same surface of the surface of the printed circuit board 204 as the inlet 10 a of the first duct 10.

  Here, the result of measuring the component temperature and the case top temperature using the cooling mechanism having the above-described configuration will be described with reference to FIGS. The flow rate of the heat removal fluid flowing from the outside is 1.5 m per second, the heat generation amount of the component 201 having a large heat generation amount and the heat generation amount of the small component 202 are 50 W and 10 W, respectively, and the parameters shown in FIG. The same conditions were used. As shown in FIG. 6B, the temperature of the housing top plate 203a of the module 203 shows a characteristic of rising to the right, but it has become clear that the component 201 having a large calorific value falls within about 80 ° C. This is an indication that the velocity boundary layer is not formed in principle on the surface of the quadrangular column fin 2 by the collision jet of the heat removal fluid by the first duct 10 and the heat removal fluid is efficiently cooled. Further, the component 202 having a small calorific value is also well cooled, which is an indication that the heat removal fluid flowing between the flat plate fins 4 is accelerated by the present cooling mechanism.

  Therefore, according to the cooling mechanism body according to the present embodiment, the exhaust resistance of the heat removal fluid used for the impinging jet flow is reduced by the drawing and confluence of the heat removal fluid, and the flow velocity of the heat removal fluid used for laminar flow or turbulent cooling is used. Thus, the speed boundary layer of the heat removal fluid appearing on the surface of the plate heat sink 3 can be made thin, and the cooling efficiency of both the columnar heat sink 1 and the plate heat sink 3 can be improved. Therefore, it is possible to provide an optimum heat removal fluid (cooling air) intake for each type of line card in the rack. Thereby, although it is small and thin, and at least two heating elements having different calorific values are mounted on the same module, cooling with the heat removal fluid can be performed effectively.

  A cooling mechanism according to a second embodiment of the present invention will be described with reference to FIGS. 1, 7, and 8. In this embodiment, for example, a case where the printed board has a relatively small area and the line card is thick is assumed. In the present embodiment, similar to the cooling mechanism according to the first embodiment described above, two components each having a different calorific value, that is, a component having a large calorific value and a component having a small calorific value are provided inside. Applies to modules. The module top plate is provided with a columnar heat sink that is thermally connected to a component that generates a large amount of heat, and a plate-shaped heat sink that is thermally connected to a component that generates a small amount of heat. In this embodiment, the same parts as those of the cooling mechanism according to the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 1, 7, and 8, the cooling mechanism according to the present embodiment guides the heat removal fluid 101 in the vicinity of the grill 206 to a columnar heat sink composed of a plurality of square column fins 2. A duct (impact jet cooling duct) 50 and a second duct (laminar / turbulent duct) 60 for guiding the heat removal fluid 101 in the vicinity of the grill 206 to a plate-shaped heat sink composed of a plurality of flat fins 4 are provided. . When the first duct 50 and the second duct 60 are arranged at predetermined positions in the case 205, the heat removal fluid inlet 50 a of the first duct 50 and the heat removal fluid of the second duct 60 are arranged. The inflow port 60a is adjacent in the vertical direction.

  As shown in FIG. 7, the first duct 50 has a cylindrical shape, and includes an inlet 50a and an outlet 50b for the heat removal fluid at both ends. The first duct 50 includes a ceiling plate 51, side plates 52 and 53 connected to the side of the ceiling plate 51, and a bottom plate 54 connected to the lower ends of the side plates 52 and 53. The ceiling plate 51 includes a first inclined portion 51a and a second inclined portion 51b connected to the rear end portion of the first inclined portion 51a. A connecting portion between the first inclined portion 51a and the second inclined portion 51b forms a bent portion 51c. The bottom plate 54 includes a first inclined portion 54a and a second inclined portion 54b connected to the rear end portion of the first inclined portion 54a. A connecting portion between the first inclined portion 54a and the second inclined portion 54b forms a bent portion 54c. When the first duct 50 is in a predetermined position and the rear end portion of the second inclined portion 54b of the bottom plate 54 is attached in the vicinity of the front end portion 203b of the housing top plate 203a of the module 203, the first inclined portion 51a is The second duct 51b is inclined with respect to the length direction of the first duct 50 and extends toward the case 205. The second inclined portion 51b is inclined with respect to the length direction of the first duct 50 and is on the housing top plate 203a side of the module 203. Extend to. The first inclined portion 54 a is inclined with respect to the length direction of the first duct 50 and extends toward the second inclined portion 51 b side of the ceiling plate 51, and the second inclined portion 54 b is the first duct 50. The module 203 inclines with respect to the length direction of the module 203 and extends toward the housing top plate 203a. Further, the second inclined portion 51 b of the ceiling plate 51 covers the upper side of the quadrangular column fin 2 of the columnar heat sink 1.

  A region between the bent portion 51c of the ceiling plate 51 and the bent portion 54c of the bottom plate 54 has a diameter smaller than that of the region, for example, the inlet 50a and the outlet 50b, and forms a waist portion 55.

  As described above, the first duct 50 includes the waist portion 55, and the second inclined portion 51 b is provided on the ceiling plate 51 on the discharge port 50 b side of the first duct 50. A velocity vector flowing in a direction inclined with respect to the longitudinal direction of the fin 2 is given. That is, the velocity vector of the heat removal fluid is changed by the first duct 50. Therefore, the heat removal fluid that cools the quadrangular fin 2 has the velocity vector 112 having an angle with respect to the longitudinal direction of the quadrangular fin 2, and the heat removal fluid 111 that has circulated in the first duct 50 is Colliding with an inclination angle with respect to the longitudinal direction of the quadrangular prism fin 2. The inclination angle may be, for example, 10 degrees or more. As a result, the heat removal fluid 111 flowing into the first duct 50 collides and jets against the respective quadrangular column fins 2. This is because if the inclination angle is smaller than 10 degrees, the heat removal fluid 111 flowing into the first duct 50 may not collide with the respective quadrangular fins 2. Therefore, by providing the first duct 50, collision jet cooling is realized, and highly efficient cooling is realized.

  As shown in FIG. 8, the second duct 60 has a cylindrical shape, one inlet 60 a into which the heat removal fluid 101 near the grill 206 flows, and the heat removal fluid discharged from the first duct 50. An inflow port (opening) 60b into which 113 flows in and an exhaust port 60c through which the heat removal fluid that has circulated inside is provided. The second duct 60 includes a first passage 61, a first duct 50, a connecting portion 70 connected to the rear end portion of the first passage, and a second passage connected to the rear end portion of the connecting portion 70. 75. The first passage 61 is disposed on the upper side of the first duct 50. The first passage 61 extends substantially linearly in the length direction of the second duct 60.

  The first passage 61 includes a ceiling plate 62, side plates 63 and 64 connected to the side portions of the ceiling plate 62, and a bottom plate 65 connected to the lower ends of the side plates 63 and 64. The bottom plate 65 includes a first inclined portion 65a and a second inclined portion 65b connected to the rear end portion of the first inclined portion 65a. The connection part of the 1st inclination part 65a and the 2nd inclination part 65b has comprised the bending part 65c. When the second duct 60 is disposed at a predetermined position, the first inclined portion 65a is inclined with respect to the length direction of the second duct 60 and extends toward the ceiling plate 62 side of the second duct 60. The second inclined portion 65 b is inclined with respect to the length direction of the second duct 60 and extends toward the housing ceiling plate 203 a of the module 203. The rear end portion of the second inclined portion 65 b is connected to the rear end portion of the ceiling plate 51 b of the first duct 50. The side plates 63 and 64 of the first passage 61 are connected to the side plates 52 and 53 of the first duct 50.

  The connecting portion 70 includes a ceiling plate 71 connected to the rear end portion of the ceiling plate 62 of the first passage 61, and side plates 72 and 73 connected to the side portions of the ceiling plate 71. The ceiling plate 71 is inclined with respect to the length direction of the second duct 60 and extends to the housing top plate 203 a side of the module 203. The rear end portion of the ceiling plate 71 is connected to the front end portion of the ceiling plate 76 of the second passage 75 described later. As a result, the heat removal fluid 113 after cooling the columnar heat sink 1 in the first duct 50 joins downstream of the second duct 60 and is accelerated.

  The second passage 75 is connected to the ceiling plate 76 connected to the rear end portion of the ceiling plate 71 of the connecting portion 70, and to the side plates 72 and 73 of the connecting portion 70, and to the side plate 77 connected to the side portion of the ceiling plate 76. , 78. That is, the upper side and the side of the plate heat sink 3 are covered by the second passage 75. As a result, the heat removal fluid 124, 125 flowing into the second passage 75 is supplied with the heat removal fluid in the state in which the velocity vector parallel to the longitudinal direction of the plate fins 4 of the plate heat sink 3 is applied. Thus, the plate heat sink 3 is laminar or turbulently cooled by the heat removal fluid.

  As described above, the second duct 60 includes the inlet port 60a and the outlet port 60c of the heat removal fluid at both ends thereof, and further includes a waist structure in the middle of the longitudinal direction of the main body and at the same time forms a fluid acceleration inlet port. Since the opening 60b is provided and the opening 60b is physically connected to the outlet 50b of the first duct 50, the heat removal fluid 113 discharged from the outlet 50b of the first duct 50 is the second. The heat removal fluids 114, 115, 116 passing through the duct 60 are accelerated to accelerate the flow rate of the heat removal fluid, and then the heat removal fluids 124, 125, 126 that cool the plate fins 4 are formed. . That is, the heat removal fluid is drawn and joined. As the flow speeds of the heat removal fluids 124, 125, and 126 are increased in this way, the velocity boundary layer that appears in the vicinity of the surface of the flat fin 4 is reduced, and the component 202 that generates a small amount of heat is cooled with high efficiency.

  In the second embodiment, the inlet 60a of the second duct is disposed above the inlet 50a of the first duct 50 and the surface of the printed board 204.

  Therefore, according to the cooling mechanism body according to the present embodiment, as with the cooling mechanism body according to the first embodiment, the exhaust resistance of the heat removal fluid used for the collision jet is lowered by the drawing and confluence of the heat removal fluid, The flow velocity of the heat removal fluid used for laminar flow or turbulent cooling can be increased, and the velocity boundary layer of the heat removal fluid appearing on the surface of the plate heat sink 3 can be thinned. It is possible to improve the cooling efficiency. Therefore, it is possible to provide an optimum heat removal fluid (cooling air) intake for each type of line card in the rack. Thereby, although it is small and thin, and at least two heating elements having different calorific values are mounted on the same module, cooling with the heat removal fluid can be performed effectively.

  In the above embodiment, the cooling mechanism body in which the heat sinks 1 and 3 are aluminum heat sinks and the ducts 10, 20, 50, and 60 are resin ducts has been described. However, the respective materials are not limited to this, and the copper heat sink and the copper plate are used. It is also possible to provide a cooling mechanism body applied by a combination of a gold duct, an aluminum heat sink and a SUS sheet metal duct. Even such a cooling mechanism has the same effect as the above-described embodiment.

  Further, in the above description, the cooling mechanism body in which the columnar heat sink 1 is a square column and the plate heat sink 3 is a flat plate has been described. It is also possible. Even such a cooling mechanism has the same effect as the above-described embodiment.

  In the above description, the cooling mechanism body in which the number of heating elements provided in the module to be cooled is two has been described. However, even when three or more heating elements are used, high heat generation and low heat generation are achieved. Divided into groups, a columnar heat sink is thermally connected to the high heat generation group, and a first duct (impact jet cooling duct) is provided, while a plate heat sink is thermally applied to the low heat generation group. It is also possible to provide a cooling mechanism body provided with a second duct (laminar flow / turbulent flow duct) as well as being connected to the. Even such a cooling mechanism has the same effect as the above-described embodiment.

  The cooling device according to the present invention is small and thin, and can effectively perform cooling with a heat removal fluid, even though at least two components having different calorific values are mounted on the same module. Therefore, it can be used extremely beneficially in various industries for manufacturing electronic devices.

DESCRIPTION OF SYMBOLS 1 Columnar heat sink 2 Square column fin 3 Plate-shaped heat sink 4 Flat plate fin 10 First duct (impact jet cooling duct)
10a Inflow port 10b Discharge port 11 Ceiling plate 12, 13 Side plate 14 Bottom plate 15 Waist part 20 Second duct (laminar flow / turbulent flow duct)
21 First passage 26 Second passage 31 Connecting portion 40 Third passage 39 Fluid acceleration inlet 50 First duct (impact jet cooling duct)
55 Waist 60 Second Duct (Laminar / Turbulent Duct)
60b opening (fluid acceleration inlet)
101, 102 Heat removal fluid 103-108 Heat removal fluid 111-116 Heat removal fluid 121-126 Heat removal fluid 201 Parts with large heat generation 202 Parts with small heat generation 203 Module 203a Housing top plate 204 Printed circuit board 205 Case 206, 207 Grill plate

Claims (4)

A cooling mechanism for cooling a module including at least two heating elements each having a different heating value by a heat removal fluid;
A columnar heat sink thermally connected to one of the heating elements having a large calorific value in the two heating elements;
A plate-like heat sink thermally connected to the other heating element having a small calorific value in the two heating elements;
The columnar heat sink and the plate heat sink are relatively disposed on the upstream side and the downstream side in the flow direction of the heat removal fluid, respectively.
A first duct that guides the heat removal fluid to the column heat sink in a state in which a velocity vector that is inclined with respect to the height direction of the column heat sink is applied to the heat removal fluid, and cools the column heat sink by collision jet flow;
The heat removal fluid is guided to the plate heat sink in a state in which the velocity vector parallel to the longitudinal direction of the plate heat sink is applied to the heat removal fluid, and the plate heat sink is cooled laminarly or turbulently. And a second duct,
The first duct and the second duct are connected, and the heat removal fluid discharged from the first duct is drawn into and merged with the heat removal fluid that is laminar or turbulently cooled. A cooling mechanism characterized by. The cooling mechanism according to claim 1,
The module is placed on the surface of the printed circuit board larger than its footprint,
The printed circuit board is disposed inside a case having an inlet and an outlet of the heat removal fluid supplied from the outside at both ends,
On the inlet side of the heat removal fluid of the case, an inlet of the heat removal fluid of each of the first duct and the second duct is disposed,
The cooling mechanism body, wherein a discharge port for the heat removal fluid of the first duct is connected in the middle of the second duct. The cooling mechanism body according to claim 2,
The cooling mechanism body, wherein the inlet ports of the heat removal fluids of the first duct and the second duct are arranged adjacent to each other on the printed circuit board. The cooling mechanism body according to claim 2,
The cooling mechanism body, wherein the heat removal fluid inlet of the second duct is disposed above the heat removal fluid inlet of the first duct.

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