JP2007221153A - Heat sink cooling device - Google Patents

Heat sink cooling device Download PDF

Info

Publication number
JP2007221153A
JP2007221153A JP2007080683A JP2007080683A JP2007221153A JP 2007221153 A JP2007221153 A JP 2007221153A JP 2007080683 A JP2007080683 A JP 2007080683A JP 2007080683 A JP2007080683 A JP 2007080683A JP 2007221153 A JP2007221153 A JP 2007221153A
Authority
JP
Japan
Prior art keywords
heat sink
cooling device
heat
fins
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007080683A
Other languages
Japanese (ja)
Other versions
JP4135960B2 (en
Inventor
Yoshifumi Nakahama
敬文 中濱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2007080683A priority Critical patent/JP4135960B2/en
Publication of JP2007221153A publication Critical patent/JP2007221153A/en
Application granted granted Critical
Publication of JP4135960B2 publication Critical patent/JP4135960B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sink cooling device having improved cooling performance. <P>SOLUTION: In the heat sink cooling device 5 in which heat-generating objects 3 are arranged on a heat sink 2 provided with a plurality of pin fins 11, other straight fins (louver) 6 are arranged toward the heat-generating objects 3 roughly perpendicular to a height direction of the pin fins 11 in an upstream of one end 11b of the pin fins 11. By this configuration, air from an air inlet 5a flows to between the louvers 6, and flows into the pin fins 11 obliquely toward the heat-generating objects 3, while generating vortex on the downstream side of the pin fins 11, and collides with a fin base portion 11c near the heat-generating objects 3. Thereby, a boundary layer becomes thin, and a heat transfer coefficient increases. Consequently, the cooling performance can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、複数の直線フィンを備えたヒートシンクに発熱体を配したヒートシンク冷却装置に関するものである。   The present invention relates to a heat sink cooling apparatus in which a heating element is arranged on a heat sink having a plurality of straight fins.

図４、及び図５は、それぞれ従来のヒートシンク冷却装置の構成例を示す断面図で、それぞれの図の（ａ）は冷却媒体の流れ方向に沿って切断した縦断面を、また（ｂ）は同図（ａ）における矢視Ａの断面を示す。   4 and 5 are cross-sectional views showing examples of the configuration of the conventional heat sink cooling device, where (a) in each figure shows a longitudinal section cut along the flow direction of the cooling medium, and (b) shows The cross section of the arrow A in the figure (a) is shown.

図４、及び図５において、１は直線フィン、２は複数の直線フィン１を配したヒートシンク、３は素子などの発熱体、４は軸流タイプのファン、５はこれらからなるヒートシンク冷却装置である。   4 and 5, 1 is a linear fin, 2 is a heat sink having a plurality of linear fins 1, 3 is a heating element such as an element, 4 is an axial flow type fan, and 5 is a heat sink cooling device comprising these. is there.

図４に示すヒートシンク冷却装置５では、複数の直線フィン１を備えたヒートシンク２に発熱体３を配し、直線フィン１の長手方向の冷却媒体上流側に、軸流タイプのファン４を配しており、ファン４からの旋回成分を伴った流れが直線フィン１に流入する。発熱体３から熱は伝導により直線フィン１に伝わり、フィン１間を流れる空気に熱伝達する。   In the heat sink cooling device 5 shown in FIG. 4, the heating element 3 is disposed on the heat sink 2 having a plurality of linear fins 1, and the axial flow type fan 4 is disposed on the upstream side of the cooling medium in the longitudinal direction of the linear fins 1. The flow accompanied by the swirling component from the fan 4 flows into the straight fin 1. Heat is transmitted from the heating element 3 to the straight fins 1 by conduction and is transferred to the air flowing between the fins 1.

また、図５に示すヒートシンク冷却装置５では、複数の直線フィン１を備えたヒートシンク２に発熱体３を配し、直線フィン１の長手方向の冷却媒体下流側に、軸流タイプのファン４を配しており、ファン４の作用により冷却空気が直線フィン１に流入する。発熱体３から熱は伝導により直線フィン１に伝わり、フィン１間を流れる空気に熱伝達する。   Further, in the heat sink cooling device 5 shown in FIG. 5, the heating element 3 is arranged on the heat sink 2 provided with a plurality of linear fins 1, and the axial flow type fan 4 is disposed downstream of the cooling medium in the longitudinal direction of the linear fins 1. The cooling air flows into the straight fin 1 by the action of the fan 4. Heat is transmitted from the heating element 3 to the straight fins 1 by conduction and is transferred to the air flowing between the fins 1.

なお、このような、複数の直線フィンを備えたヒートシンクに発熱体を配し、直線フィンの長手方向の冷却媒体上流側に、ファンを配したヒートシンク冷却装置は、例えば特許文献１にも記載されている。
特開平９−２３７９９２号公報（第３頁、図１） Note that a heat sink cooling device in which a heating element is arranged on a heat sink having a plurality of straight fins and a fan is arranged on the upstream side of the cooling medium in the longitudinal direction of the straight fins is also described in Patent Document 1, for example. ing.
Japanese Patent Laid-Open No. 9-237992 (page 3, FIG. 1)

上述のようなヒートシンク冷却装置において、ＩＢＧＴなどの素子発熱体の発熱密度は年々上昇しており、従来の構造では素子の温度が許容温度を上回ってしまう可能性が生じてきた。よって複数の直線フィンを備えたヒートシンクに発熱体を配した冷却装置において、その冷却能力を向上させ、素子の温度を許容温度以下に抑える必要がある。   In the heat sink cooling device as described above, the heat generation density of element heating elements such as IBGT is increasing year by year, and there is a possibility that the element temperature may exceed the allowable temperature in the conventional structure. Therefore, in a cooling device in which a heating element is arranged on a heat sink having a plurality of straight fins, it is necessary to improve the cooling capacity and to keep the temperature of the element below an allowable temperature.

そこで、本発明は、冷却能力を向上させたヒートシンク冷却装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a heat sink cooling device with improved cooling capacity.

本発明は、複数のピンフィンを備えたヒートシンクに発熱体を配したヒートシンク冷却装置において、ピンフィンの流入側の上流に、ピンフィンの高さ方向に対し略垂直に、別のフィンを発熱体に向けて配したことを特徴とする。   The present invention relates to a heat sink cooling device in which a heating element is arranged on a heat sink provided with a plurality of pin fins, and the other fin is directed to the heating element upstream of the inflow side of the pin fins and substantially perpendicular to the height direction of the pin fins. It is characterized by having arranged.

このように、ピンフィンの流入側の上流に、ピンフィンの高さ方向に対し略垂直に、別のフィンを発熱体に向けて配することにより、別のフィンから流出する流体は、発熱体を配したヒートシンクのピンフィン間を斜めに流入し、ピンフィン下流側で渦を生じながら、ピンフィン根元部に斜めに衝突する。このためピンフィン根元部の境界層厚さが薄くなり熱伝達率が増加する。従って、冷却能力を向上させることができる。   In this way, by arranging another fin toward the heating element upstream of the inflow side of the pin fin, substantially perpendicular to the height direction of the pin fin, the fluid flowing out from the other fin can arrange the heating element. It flows diagonally between the pin fins of the heat sink, and collides with the pin fin base portion diagonally while generating a vortex on the downstream side of the pin fin. For this reason, the boundary layer thickness of the pin fin base portion is reduced, and the heat transfer coefficient is increased. Therefore, the cooling capacity can be improved.

本発明によれば、発熱体及びヒートシンクを有するヒートシンク冷却装置においてフィン表面の熱伝達が増加し、冷却能力を強化することができ、またヒートシンク冷却装置をコンパクトにすることができる。   ADVANTAGE OF THE INVENTION According to this invention, in the heat sink cooling device which has a heat generating body and a heat sink, the heat transfer of a fin surface increases, a cooling capability can be strengthened, and a heat sink cooling device can be made compact.

以下、図面を参照して本発明の実施形態について詳細に説明する。なお、以下の図において、同符号は同一部分または対応部分を示す。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following drawings, the same symbols indicate the same or corresponding parts.

（第１の実施形態）
図１は本発明の第１の実施形態に係るヒートシンク冷却装置の構成を示す断面図で、同図（ａ）は冷却媒体の流れ方向に沿って切断した縦断面を、同図（ｂ）は同図（ａ）における矢視Ａの断面を示す。 (First embodiment)
FIG. 1 is a cross-sectional view showing the configuration of the heat sink cooling device according to the first embodiment of the present invention. FIG. 1 (a) is a longitudinal cross section cut along the flow direction of the cooling medium, and FIG. The cross section of the arrow A in the figure (a) is shown.

図１に示すように、この実施形態は、パワー半導体素子を搭載したパワーエレクトロニクス機器などのヒートシンク冷却装置５に、複数のピンフィン１１を備えたヒートシンク２に発熱体３を配する。複数のピンフィン１１の一端１１ａの側に、１つもしくは複数の軸流タイプもしくは斜流タイプのファン４が配されている。複数のピンフィン１１の反対側の一端１１ｂの側に、ピンフィン１１の高さ方向に対し略垂直に、平行に配列された複数の別の直線フィン（以下、ルーバと称する）６を発熱体３の方に向けて配する。   As shown in FIG. 1, in this embodiment, a heating element 3 is arranged on a heat sink 2 having a plurality of pin fins 11 in a heat sink cooling device 5 such as a power electronics device equipped with a power semiconductor element. One or a plurality of axial flow type or diagonal flow type fans 4 are arranged on one end 11 a side of the plurality of pin fins 11. A plurality of other linear fins (hereinafter referred to as louvers) 6 arranged in parallel and substantially perpendicular to the height direction of the pin fins 11 are provided on the opposite end 11 b side of the plurality of pin fins 11. Distribute towards the direction.

この構造において、ヒートシンク冷却装置５の空気流入口５ａからの空気はルーバ６の間に沿って流れ、発熱体３の方に向いてピンフィン１１に斜めに流入する。流れはピンフィン１１の下流側で渦を生じながら、発熱体３の近傍のフィン根元部１１ｃに衝突する。これにより境界層が薄くなり、熱伝達率がアップする。これらより、ヒートシンク２の冷却性能が向上し、発熱体３をより低い温度に冷却できるようになる。   In this structure, the air from the air inlet 5 a of the heat sink cooling device 5 flows along the louver 6, and flows obliquely into the pin fin 11 toward the heating element 3. The flow collides with the fin base portion 11 c in the vicinity of the heating element 3 while generating a vortex on the downstream side of the pin fin 11. This makes the boundary layer thinner and increases the heat transfer coefficient. As a result, the cooling performance of the heat sink 2 is improved, and the heating element 3 can be cooled to a lower temperature.

（第２の実施形態）
図２は本発明の第２の実施形態に係るヒートシンク冷却装置の構成を示す断面図で、同図（ａ）は冷却媒体の流れ方向に沿って切断した縦断面を、同図（ｂ）は同図（ａ）における矢視Ａの断面を示す。 (Second Embodiment)
FIG. 2 is a cross-sectional view showing the configuration of the heat sink cooling device according to the second embodiment of the present invention. FIG. 2 (a) is a longitudinal cross section cut along the flow direction of the cooling medium, and FIG. The cross section of the arrow A in the figure (a) is shown.

図２に示すように、この第２の実施形態は、上述の第１の実施形態において、ピンフィン１１とルーバ６の間にルーバのピッチと略同等の隙間７を設けたものである。これにより、冷却空気はルーバ６から流入する他に、該隙間７から流入するため、第１の実施形態より流量が増え、ピンフィン１１を通過する流速が大きくなり、ピンフィンの表面、ピンフィン根元部の熱伝達率が増加する。   As shown in FIG. 2, in the second embodiment, a gap 7 substantially equal to the pitch of the louver is provided between the pin fin 11 and the louver 6 in the first embodiment described above. As a result, the cooling air flows from the louver 6 and from the gap 7, so that the flow rate is increased compared to the first embodiment, the flow velocity passing through the pin fins 11 is increased, and the surface of the pin fins and the pin fin root portions are increased. Heat transfer rate increases.

（第３の実施形態）
図３は本発明の第３の実施形態に係るヒートシンク冷却装置の構成を示す断面図で、同図（ａ）は冷却媒体の流れ方向に沿って切断した縦断面を、同図（ｂ）は同図（ａ）における矢視Ａの断面を示す。 (Third embodiment)
FIG. 3 is a cross-sectional view showing a configuration of a heat sink cooling device according to a third embodiment of the present invention. FIG. 3 (a) is a longitudinal cross section cut along the flow direction of the cooling medium, and FIG. The cross section of the arrow A in the figure (a) is shown.

図３に示すように、この第３の実施形態は、上述の第１の実施形態において、ルーバ６を発熱体に取り付けた面に対し略４５°以下の角度γで発熱体に向けて配する（このように発熱体取り付け面に対し略４５°以下の角度γで発熱体３に向けて配したルーバを図３において、６ｃで示す）。これにより、通風抵抗が小さくなり流体流量が増え、ピンフィン１１の表面、ピンフィン根元部の熱伝達率が増加する。   As shown in FIG. 3, in the third embodiment, in the first embodiment described above, the louver 6 is arranged toward the heating element at an angle γ of approximately 45 ° or less with respect to the surface attached to the heating element. (The louver thus arranged toward the heating element 3 at an angle γ of about 45 ° or less with respect to the heating element mounting surface is indicated by 6c in FIG. 3). Thereby, ventilation resistance becomes small and a fluid flow rate increases, and the heat transfer rate of the surface of the pin fin 11 and a pin fin base part increases.

（第４の実施形態）
次に本発明の第４の実施形態について説明する。この第４の実施形態は、上述の第１の実施形態から第３の実施形態までのいずれかのヒートシンク冷却装置を備えたパワーエレクトロニクス装置である。 (Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. The fourth embodiment is a power electronics device including any one of the heat sink cooling devices from the first embodiment to the third embodiment described above.

パワーエレクトロニクス装置において、上述のような構成のヒートシンク冷却装置を備えることにより、冷却能力を向上させることができるので、パワーエレクトロニクス装置を小形化することができる。   In the power electronics device, since the cooling capacity can be improved by providing the heat sink cooling device having the above-described configuration, the power electronics device can be miniaturized.

（第５の実施形態）
この第５の実施形態は、第１の実施形態から第３の実施形態までのいずれかのヒートシンク冷却装置において、ルーバ６、６ｃのいずれかをパワーエレクトロニクス装置の筐体の流入口のルーバとし、ルーバが斜め上を向くように、ヒートシンク２のピンフィン１１の根元部が上側、ヒートシンク２のピンフィン１１の先端部が下側になるように配することにより、防滴構造となり、筐体内に水滴が流入しにくくなる。 (Fifth embodiment)
In the fifth embodiment, in any one of the heat sink cooling devices from the first embodiment to the third embodiment, any one of the louvers 6 and 6c is used as a louver at the inlet of the casing of the power electronics device. By arranging the pin fin 11 of the heat sink 2 so that the base portion is on the upper side and the tip end portion of the pin fin 11 of the heat sink 2 is on the lower side so that the louver faces diagonally upward, a drip-proof structure is formed, and water droplets are formed in the housing. It becomes difficult to flow in.

本発明の第１の実施形態に係るヒートシンク冷却装置の構成を示す断面図。Sectional drawing which shows the structure of the heat sink cooling device which concerns on the 1st Embodiment of this invention. 本発明の第２の実施形態に係るヒートシンク冷却装置の構成を示す断面図。Sectional drawing which shows the structure of the heat sink cooling device which concerns on the 2nd Embodiment of this invention. 本発明の第３の実施形態に係るヒートシンク冷却装置の構成を示す断面図。Sectional drawing which shows the structure of the heat sink cooling device which concerns on the 3rd Embodiment of this invention. 従来のヒートシンク冷却装置の構成例を示す断面図。Sectional drawing which shows the structural example of the conventional heat sink cooling device. 従来のヒートシンク冷却装置の他の構成例を示す断面図。Sectional drawing which shows the other structural example of the conventional heat sink cooling device.

符号の説明Explanation of symbols

１…直線フィン
２…ヒートシンク
３…発熱体
４…ファン
５…ヒートシンク冷却装置
６、６ｃ…別の直線フィン（ルーバ）
１１…ピンフィン DESCRIPTION OF SYMBOLS 1 ... Linear fin 2 ... Heat sink 3 ... Heat generating body 4 ... Fan 5 ... Heat sink cooling device 6, 6c ... Another linear fin (louver)
11 ... pin fin

Claims (3)

複数のピンフィンを備えたヒートシンクに発熱体を配したヒートシンク冷却装置において、前記ピンフィンの流入側の上流に、前記ピンフィンの高さ方向に対し略垂直に、別のフィンを発熱体に向けて配したことを特徴とするヒートシンク冷却装置。   In a heat sink cooling device in which a heating element is arranged on a heat sink having a plurality of pin fins, another fin is arranged on the upstream side of the inflow side of the pin fins, substantially perpendicular to the height direction of the pin fins, and facing the heating element. A heat sink cooling device characterized by that. 請求項１に記載のヒートシンク冷却装置において、前記ピンフィンと前記別のフィンとの間に、前記別のフィンのピッチと略同等の隙間を設けることを特徴とするヒートシンク冷却装置。   2. The heat sink cooling device according to claim 1, wherein a gap substantially equal to a pitch of the another fin is provided between the pin fin and the another fin. 3. 請求項１に記載のヒートシンク冷却装置において、前記別のフィンを発熱体取り付け面に対し略４５°以下の角度で発熱体に向けて配することを特徴とするヒートシンク冷却装置。   2. The heat sink cooling device according to claim 1, wherein the another fin is disposed toward the heating element at an angle of approximately 45 ° or less with respect to the heating element mounting surface.
JP2007080683A 2007-03-27 2007-03-27 Heat sink cooling device Expired - Fee Related JP4135960B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007080683A JP4135960B2 (en) 2007-03-27 2007-03-27 Heat sink cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007080683A JP4135960B2 (en) 2007-03-27 2007-03-27 Heat sink cooling device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003067484A Division JP4135904B2 (en) 2003-03-13 2003-03-13 Heat sink cooling device and power electronics device having the same

Publications (2)

Publication Number Publication Date
JP2007221153A true JP2007221153A (en) 2007-08-30
JP4135960B2 JP4135960B2 (en) 2008-08-20

Family

ID=38498015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007080683A Expired - Fee Related JP4135960B2 (en) 2007-03-27 2007-03-27 Heat sink cooling device

Country Status (1)

Country Link
JP (1) JP4135960B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014165378A (en) * 2013-02-26 2014-09-08 Mitsubishi Electric Corp Cooling device and electronic apparatus
DE102016102832A1 (en) * 2016-02-18 2017-08-24 Rehm Gmbh & Co. Kg Device comprising a power part comprising a power electronics and a housing surrounding this, in particular welding device, and housing for a welding device
US11018076B2 (en) 2018-04-02 2021-05-25 Fuji Electric Co., Ltd. Cooling apparatus, semiconductor module, and vehicle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4853282B2 (en) 2006-12-28 2012-01-11 トヨタ自動車株式会社 Braking device for vehicle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014165378A (en) * 2013-02-26 2014-09-08 Mitsubishi Electric Corp Cooling device and electronic apparatus
DE102016102832A1 (en) * 2016-02-18 2017-08-24 Rehm Gmbh & Co. Kg Device comprising a power part comprising a power electronics and a housing surrounding this, in particular welding device, and housing for a welding device
US11018076B2 (en) 2018-04-02 2021-05-25 Fuji Electric Co., Ltd. Cooling apparatus, semiconductor module, and vehicle
US11538736B2 (en) 2018-04-02 2022-12-27 Fuji Electric Co., Ltd. Cooling apparatus, semiconductor module, and vehicle

Also Published As

Publication number Publication date
JP4135960B2 (en) 2008-08-20

Similar Documents

Publication Publication Date Title
JP4532422B2 (en) Heat sink with centrifugal fan
JP2008140802A (en) Heat sink
JP5078872B2 (en) Heat sink with centrifugal fan
JP2011091301A (en) Liquid cooling type cooling device
JP7081203B2 (en) Radiation fin structure and cooling structure of electronic board using this
JP5567076B2 (en) Radiator
JP4135960B2 (en) Heat sink cooling device
JP2008288330A (en) Semiconductor device
JP2016207928A (en) Heat sink for cooling multiple heating components
JP2013165298A (en) Liquid cooling device
JP2009277699A (en) Heat sink, heat sink assembly, semiconductor module, and semiconductor device with cooling device
JP6904389B2 (en) Heat dissipation parts and mounting board
JP2010118497A (en) Heat exchanger equipped with fin with louvers
JP4135904B2 (en) Heat sink cooling device and power electronics device having the same
JP2011054778A (en) Heat exchanger using comb-type radiation unit
JP5715352B2 (en) heatsink
JP2014045134A (en) Flow passage member, heat exchanger using the same, and semiconductor device
JP2010093034A (en) Cooling device for electronic component
TWI588437B (en) Heat dissipator and heat dissipating device
JP2006237366A (en) Heat sink
JP2017069522A (en) Cold plate
JP2007005397A (en) Dissipator unit for electronic part
JP4875454B2 (en) Heat sink with centrifugal fan for heat dissipation
JP2016086018A (en) heat sink
JP2004273876A (en) Heating body cooling device and power electronics device equipped therewith

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Effective date: 20080310

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080424

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Effective date: 20080528

Free format text: JAPANESE INTERMEDIATE CODE: A01

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080602

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 3

Free format text: PAYMENT UNTIL: 20110613

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120613

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120613

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130613

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees