JP2014045134A - Flow passage member, heat exchanger using the same, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flow passage member with improved heat exchange efficiency, a heat exchanger using the same, and a semiconductor device.SOLUTION: A flow passage member 1, 11-13 according to the present invention having a flow passage 6 inside which fluid 8 flows comprises: a substrate 2 having a recess 2c on a principal plane 2a on the flow passage 6 side; a housing 15; and a fin member 5 provided with plural fins 4 on a base part 3 jointed to the recess 2c of the substrate 2. The fin member 5 is jointed to the recess 2c, so that a portion 3a' of a flow passage side surface 3a of the base part 3 positioned nearest a flow passage side and an end 2c' on the flow passage side of the recess 2c are at different positions. Therefore, the fluid 8 easily generates an eddy current 8d by a step 9, so as to improve heat exchange efficiency. A heat exchanger 21 and a semiconductor device 31 using the flow passage member 1, 11-13 according to the present invention can have improved heat exchange efficiency.

Description

  The present invention relates to a flow path member, a heat exchanger using the same, and a semiconductor device.

  It is known to use a member in which a plurality of fins are erected in an air-cooled or water-cooled flow path member.

  For example, Patent Document 1 discloses a flow channel member in which a fin member is brazed and fixed in a recess provided in a jacket body.

JP 2006-324647 A

  However, the flow path member described in Patent Document 1 has not been able to sufficiently meet this requirement at present when a material with further improved heat exchange efficiency is required.

  The present invention has been devised to solve the above-described problems, and an object of the present invention is to provide a flow path member with high heat exchange efficiency, a heat exchanger using the same, and a semiconductor device.

  The flow path member of the present invention is a flow path member having a flow path through which a fluid flows, and a base having a recess on a main surface on the flow path side, a housing, and a base joined to the recess of the base A fin member in which a plurality of fins are provided in the portion, and the fin member has a position where a portion located closest to the flow channel on the flow channel side surface of the base portion differs from the end of the recess on the flow channel side. As such, it is joined to the recess.

  Moreover, the heat exchanger of the present invention is characterized in that a metal layer is provided on the main surface of the flow path member having the above-described configuration on the opposite side to the flow path side of the base.

  The semiconductor device of the present invention is characterized in that a semiconductor element is mounted above the heat exchanger having the above-described configuration.

  According to the flow path member of the present invention, the flow path member has a flow path through which a fluid flows. The base has a recess on the main surface on the flow path side, the housing, and the base joined to the recess of the base A fin member in which a plurality of fins are provided in the portion, and the fin member is positioned so that the portion located on the most flow path side on the flow path side surface of the base portion is different from the end on the flow path side of the recess. Since it is joined to the recess, the fluid generates a vortex due to this step, and the heat exchange efficiency can be improved.

  Further, the heat exchanger of the present invention is provided with a metal layer on the main surface opposite to the flow path side of the base in the flow path member having the above-described configuration, so that heat exchange between the base and the metal layer is efficient. Therefore, a heat exchanger with high heat exchange efficiency can be obtained.

  In addition, since the semiconductor device of the present invention has a semiconductor element mounted above the heat exchanger having the above structure, the semiconductor device can be a semiconductor device that suppresses a temperature rise due to heat generation of the semiconductor element with a simple structure.

An example of the flow path member of this embodiment is shown, (a) and (b) are cross-sectional views along the direction in which the fluid flows, and (c) is an enlarged view of the stepped portion surrounded by the dotted line A in (a). (D) is an enlarged cross-sectional view of a step portion surrounded by a dotted line A in (b), and (e) is a deformation of a fin member surrounded by a broken line B in (a) and (b). It is sectional drawing of an example. Another example of the flow path member of the present embodiment is shown, (a) is an enlarged cross-sectional view of a stepped portion surrounded by a dotted line A in FIG. 1 (a), (b) is a modification of the stepped portion. It is expanded sectional drawing, (c) is sectional drawing to which the level | step-difference part enclosed with the dotted line A of FIG.1 (b) was expanded. The other example of the flow-path member of this embodiment is shown, (a) is sectional drawing of the direction in alignment with the flow direction of a fluid, (b) is sectional drawing of the direction orthogonal to the flow direction of a fluid. It is sectional drawing of the direction which shows another example of the flow-path member of this embodiment, and follows the direction through which a fluid flows. (A)-(c) which shows the cross-sectional shape of an example of the fin of this embodiment is a square shape, (d) and (e) are circular. It is a perspective view of the heat exchanger which showed an example of the heat exchanger of this embodiment, and provided the metal layer on the main surface on the opposite side of the base | substrate in a flow-path member. It is a perspective view of the semiconductor device which showed an example of the semiconductor device of this embodiment, and in which the semiconductor element was mounted in the heat exchanger.

  Embodiments of the present invention will be described below.

  An example of the embodiment of the flow path member of the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 shows an example of a flow path member of the present embodiment. (A) and (b) are cross-sectional views in the direction along the fluid flow direction, and (c) is surrounded by a dotted line A in (a). It is sectional drawing which expanded the level | step-difference part, (d) is sectional drawing which expanded the level | step-difference part enclosed with the dotted line A of (b), (e) was enclosed with the broken line B of (a) and (b). It is sectional drawing of the modification of a fin member. FIG. 2 shows another example of the flow path member of the present embodiment. (A) is an enlarged cross-sectional view of a step portion surrounded by a dotted line A in FIG. 1 (a). It is sectional drawing to which the modification of the level | step-difference part was expanded, (c) is sectional drawing to which the level | step-difference part enclosed with the dotted line A of FIG.1 (b) was expanded.

  The flow path members 1 and 11 of the present embodiment shown in FIG. 1 are flow path members 1 and 11 having a flow path 6 through which a fluid 8 flows, and a base body 2 having a recess 2c on a main surface 2a on the flow path side. And a casing 15 and a fin member 5 in which a plurality of fins 4 are provided on the base portion 3 joined to the concave portion 2c of the base body 2. The fin member 5 is provided on the flow path side surface 3a of the base portion 3. It is important that the portion 3a ′ located closest to the flow path in FIG. 2 and the end 2c ′ on the flow path side of the concave portion 2c are joined to the concave portion 2c so as to be different from each other. In the present embodiment, the position 3a ′ located closest to the flow path and the end 2c ′ of the recess 2c on the flow path side are different from each other when viewed in the vertical direction. Means that

Here, the position (hereinafter also referred to as a step 9) where the portion 3a ′ located closest to the flow path in the flow path side surface 3a of the base 3 and the flow path side end 2c ′ of the recess 2c are different (hereinafter also referred to as a step 9). As shown in FIGS. 1A and 1C, a portion 3a ′ located on the most flow path side on the flow path side surface 3a of the base portion 3 is positioned above the end 2c ′ on the flow path side of the recess 2c. And in other words, as shown in FIGS. 1B and 1D, the flow path side surface 3a of the base portion 3 is closest to the flow path side with respect to the flow path side end 2c ′ of the recess 2c. This means both of the cases where the part 3a ′ located at the bottom is located below (in other words, protrudes toward the flow path 6).

  As described above, the flow path members 1 and 11 of the present embodiment include the portion 3c ′ located closest to the flow path on the flow path side surface 3a of the base portion 3 of the fin member 5 and the end of the recess 2c of the base 2 on the flow path side. Steps 9 are provided so as to be different from 2c ′. Thereby, in the case of the flow path member 1, the fluid 8 flowing through the flow path 6 hits the fin 4, and a part of the fluid that has hit the fin 4 flows toward the root portion 4 b of the fin 4, The fluid generates a vortex 8d in the space between the flow path side end 2c ′ and the root portion 4b, and the heat exchange efficiency between the fluid 8 and the flow path member 1 can be increased. In the case of the flow path member 11, the fluid 8 flowing in the flow path 6 hits the step 9 between the main surface 2a on the flow path side and the base 3, and the vortex flows in the direction opposite to the main surface 2a on the flow path side. 8d is generated, and the heat exchange efficiency between the fluid 8 and the flow path member 11 can be increased.

  Further, the distance for heat transfer between the main surface 2b on the opposite side of the base body 2 serving as the heat receiving portion and the fins 4 is smaller in the recess 2c than when the main surface 2a on the flow path side of the base body 2 is a flat surface. The substrate 2 can be shortened by reducing the thickness. As a result, heat on the opposite main surface 2b of the base 2 is efficiently transferred to the fins 4, and the fluid 8 tends to generate a vortex 8d at the root portion 4b of the fins 4. As a result, the fluid 8 and The heat exchange efficiency with the fin member 5 can be increased. Furthermore, the portion of the flow path members 1 and 11 excluding the recess 2c of the base body 2 is thick, so that the rigidity of the base body 2 can be secured.

  Further, the fins 4 of the flow path members 1 and 11 shown in FIG. 1 are not particularly limited in addition to the plate shape, when viewed from either the direction in which the fluid 8 flows or the direction perpendicular to the flow. In order to flow the fluid 8 efficiently, it is preferable that the fluid 8 is divided into a plurality of parts. In the following, description will be made using an example divided into a plurality unless otherwise specified. In other words, the fins 4 may be formed from a plurality of members. In that case, a known structure such as a plate shape or a rod shape can be appropriately employed.

  Moreover, in the flow path members 1 and 11 of FIGS. 1A to 1D, the fins 4 of the fin member 5 are inserted and fixed in the holes 3b of the base portion 3, but FIG. As shown in the modified example, the fin member 5 may be one in which the fin 4 and the base portion 3 are integrated.

  Further, it may be a case where a recess is provided in the base portion 3 and the fin 4 is joined, or a case where the fin 4 is joined directly to the surface 3a of the base portion 3, and the fin 4 is plate-shaped. In some cases, the fin member 5 is formed by using a plate-like body having a short vertical length and a plate-like body having a long length, and alternately laminating the plate-like bodies by aligning one end on the side that becomes the recess 2c. By joining, it can also be set as the fin member 5 which has the base part 3 and the fin 4. FIG. In this case, of each plate-like body, a portion corresponding to the plate-like body having a short length corresponds to the base portion 3, and among plate-like bodies having a long length, it corresponds to a plate-like body having a short length. The lower part corresponds to the fins 4.

  Further, the supply port 16 and the discharge port 17 for the fluid 8 are preferably provided at positions close to the main surface 2 a on the flow path side of the housing 15. As a result, the fluid 8 easily flows into the vicinity of the step 9, and the vortex 8d is easily generated. Therefore, heat exchange at the root portion 4b of the fin 4 becomes active, and heat exchange efficiency can be improved.

  Note that the supply port 16 and the discharge port 17 for the fluid 8 are not limited to being provided at positions close to the main surface 2a on the flow path side of the casing 15, and from the viewpoint of maintenance, etc. It may be provided on the bottom 15 a of the body 15.

  Further, in order to efficiently flow the fluid 8 through the flow path 6, it is preferable to arrange the tip portions 4 a of the fins 4 with a gap between them and the housing 15. In order to increase the pressure loss of the flow path 6 and increase the heat exchange efficiency, the gap between the tip 4a and the casing 15 is narrowed to prevent the pressure loss from increasing due to the strength problem of the flow path member. In order to do this, the gap between the tip 4a and the housing 15 may be widened.

  FIG. 2 shows another example of the flow path member of the present embodiment. FIG. 2A shows a portion 3a of the base portion 3 that is located closest to the flow path with respect to the flow path side end 2c ′ of the recess 2c. The position of 'is recessed, and the end 2c' on the flow path side of the recess 2c is inclined. Further, (b) shows that the position of the portion 3a ′ positioned closest to the flow path of the base portion 3 is recessed with respect to the flow path side end 2c ′ of the recess 2c, and is positioned closest to the flow path of the base portion 3. The part 3a ′ to be formed has a slope shape. Further, (c) shows that the position of the portion 3a ′ located on the most flow path side of the base portion 3 protrudes from the main surface 2a on the flow path side with respect to the flow path side end 2c ′ of the recess 2c, and is square. It is what has become.

As described above, even when the shape of the end 2c ′ on the flow path side of the recess 2c or the shape of the portion 3a ′ located on the most flow path side of the surface 3a on the flow path side of the base portion 3 is an inclined surface including a curved surface The step 9 generates a vortex 8d, and the heat exchange efficiency between the fluid 8 and the flow path members 1 and 11 can be increased.

  The recess 2c of the main surface 2a on the flow path side of the substrate 2 is not limited to a planar shape, and may be a square including a square or a rectangle or a circle including an ellipse. Furthermore, it is sufficient that the step 9 is present at least at a part of the periphery of the recess 2c. However, in order to generate the vortex 8d at the step 9 and perform heat exchange efficiently, the upstream side of the flow of the fluid 8 is used. It is preferable to provide in. Further, the base body 2 and the fin member 5 may be made of copper, aluminum, an alloy containing them as a main component, alumina, zirconia, mullite, silicon carbide, silicon nitride, aluminum nitride, or a composite material thereof having high thermal conductivity. However, if highly insulating alumina, zirconia, mullite, silicon nitride, or the like is used, a wiring conductor can be formed directly on the main surface 2b on the opposite side of the substrate 2, and a simple structure can be obtained by mounting a semiconductor element thereon. And it can be set as a semiconductor device provided with the flow path members 1 and 11 with high heat exchange efficiency.

  The base 2 and the fin member 5 are joined, for example, when the base 2 is made of a ceramic material, the base 2 is formed by powder press molding, extrusion molding, or green sheet molding, and the fin member 5 is also a green sheet. The molded body is laminated and fired by combining them, or the molded body is fabricated by injection molding, and the base body 2 and the fin member 5 are combined and fired. An integrated substrate 2 can be obtained.

  Further, when using other materials or a combination of a plurality of materials, for example, the base 2 and the fin member 5 can be joined by a bonding agent such as a brazing material or solder, or screwing. A material having high heat conductivity and heat resistance can be selected, and a material having high heat conductivity can be selected as the fin member 5.

  In the fin member 5 shown in FIGS. 2B and 2C, the entire base portion 3 to which the fin 4 is joined or the surface layer (not shown) on the flow path 6 side is made of an adhesive containing brazing material or solder. It may be coated. Even in this case, the generation of the vortex 8d at the step 9 is not affected.

Further, when the fins 4 are provided in the base portion 3 in a state of being divided into a plurality of parts, they may be arranged in a lattice shape (not shown) when viewed from the main surface 2a side on the flow path side of the base 2. However, it is preferable to provide the fins 4 in a staggered arrangement. With such a configuration, the fluid 8 collides with the fin 4 and then travels while being dispersed to the left and right of the fin 4, and then collides with the next fin 4 and further dispersed. Thereby, since the frequency with which the fluid 8 repeats dispersion and mixing increases, it is possible to suppress an increase in temperature variation in the direction perpendicular to the direction in which the fluid 8 flows in the flow path members 1 and 11.

  Further, in the case where the fins 4 are provided in the base portion 3 in a state where the fins 4 are divided into a plurality, the density of the fins 4 is set so that the inlet side of the fluid is increased along the direction of fluid flow or in the vicinity where the heat exchange object is provided. The temperature variation of the entire main surface 2b on the opposite side, which becomes the heat receiving portion of the base body 2, can be reduced by appropriately selecting and providing the heat exchange target object according to the arrangement method of the heat exchange object.

  As described above, the flow path member 1 of the present embodiment is such that the portion 3a ′ located closest to the flow path in the flow path side surface 3a of the base portion 3 of the fin member 5 is more than the end 2c ′ of the recess 2c on the flow path side. If it is indented (as shown in FIGS. 1A and 1C and FIGS. 2A and 2B), it has entered the flow path 6 from the supply port 16 of the flow path member 1. A part of the fluid 8 becomes a vortex 8d at the root 4b of the fin 4 having a recess in the step 9, and heat exchange between the fluid 8 and the fin member 5 is actively performed. Since the thickness is thinner than the portion, it is possible to increase the efficiency of heat exchange with the opposite main surface 2b serving as the heat receiving portion. Further, since the thickness of the portion of the base body 2 where the concave portion is not provided (for example, the portion serving as a frame) is thicker than the thickness of the base portion 2 of the concave portion 2c, the rigidity can be ensured, and the occurrence of warping of the base body 2 can also be suppressed. It can suppress that the flow-path member 1 destroys.

  Further, as described above, the flow path member 11 of the present embodiment is located at the flow path side end 3c ′ of the recess 2c on the flow path side surface 3a of the base portion 3 of the fin member 5 at the most flow path side portion 3a ′. 1 (b), (d), and FIG. 2 (c), the fluid 8 that has entered the flow path 6 from the supply port 16 of the flow path member 11 , A part of which becomes a vortex 8d at the root 4b of the fin 4 protruding from the step 9, thereby actively exchanging heat between the fluid 8 and the fin member 5, and the base 2 has a recess 2c to be thicker than the other parts. Therefore, the heat exchange efficiency with the main surface 2b on the opposite side serving as the heat receiving portion can be increased. In addition, since the thickness of the portion of the base body 2 where the concave portion is not provided (for example, the portion serving as a frame) is thicker than the thickness of the base portion 2 of the concave portion 2c, rigidity can be ensured and occurrence of warpage of the base body 2 can be suppressed. Breakage of the flow path member 11 can be suppressed.

  In addition, with respect to the end 2c ′ on the flow path side of the recess 2c, the portion 3a ′ located closest to the flow path side on the flow path side surface 3a of the base portion is both recessed and protruding. It may be on the periphery of the fin member 5. In addition, it is not restricted to the periphery of the fin member 5.

  Next, another example of the flow path member of the present embodiment will be described with reference to FIGS. 3 and 4.

  3A and 3B show another example of the flow path member of the present embodiment, in which FIG. 3A is a cross-sectional view in the direction along the fluid flow direction, and FIG. 3B is a cross-sectional view in the direction orthogonal to the fluid flow direction. FIG. 4 shows another example of the flow path member of the present embodiment, and is a cross-sectional view in the direction along the fluid flow direction.

As shown in FIG. 3A, the flow path member 12 of the present embodiment shown in FIG. 3 is provided with three recesses 2c in the direction along which the fluid 8 flows, and the fin member 5 is disposed in each recess 2c. As shown in (b), two recesses 2c are provided in a direction orthogonal to the direction in which the fluid 8 flows, and the fin member 5 is disposed in each recess 2c. That is, six fin members 5 are joined to one base body 2. Each fin member 5 is provided with a step 9 in which a portion 3a ′ located closest to the flow path of the base 3 is recessed with respect to the flow path side end 2c ′ of the recess 2c.

  Further, the flow path member 13 of the present embodiment shown in FIG. 4 is provided with three recesses 2c in the direction along which the fluid 8 flows, and the fin member 5 is disposed in each recess 2c. In each fin member 5, a portion 3 a ′ located on the most flow path side of the base portion 3 protrudes toward the flow path 6 with respect to the end 2 c ′ on the flow path side of the recess 2 c. In addition, since sectional drawing of the direction orthogonal to the fluid 8 in FIG. 4 is the same as arrangement | positioning of FIG.3 (b), description is abbreviate | omitted.

In the flow path members 12 and 13 of this embodiment, the base 2 has a plurality of recesses 2c, and the fin members 5 are joined to the respective recesses 2c. The difference between the portion 3a ′ located closest to the flow channel in the flow channel side surface 3a of the base portion 3 in the concave portion 2c of 2d and the end 2c ′ on the flow channel side of the concave portion 2c is the concave portion of the portion 2e other than the central portion of the base 2 It is more preferable that the difference between the portion 3a ′ located closest to the flow path on the flow path side surface 3a of the base portion 3 in 2c and the flow path side end 2c ′ of the recess 2c is larger. Thus, when the heat exchange object is arranged in the center, the flow path members 12 and 13 with improved heat exchange efficiency can be obtained.

Here, the flow path members 12 and 13 are formed with three recesses 2c in the direction in which the fluid 8 flows and two recesses 2c in the direction perpendicular to the direction in which the fluid 8 flows. The number and arrangement of the fins 5 to be inserted into and joined to the recess 2c and the recess 2c may be changed.

  In addition, with respect to the end 2c ′ of the recess 2c on the flow path side, the portion 3a ′ located closest to the flow path on the flow path side surface 3a of the base portion is both recessed and protruding. It may be mixed in the flow path member 12 or 13.

  Further, the central portion 2d of the base body 2 refers to the direction from the center of each dimension toward the end in the length direction and the width direction of the main surface 2a on the flow path side excluding the joint portion between the base body 2 and the casing 15. The range may be up to 25%.

  As described above, the flow path member 12 of the present embodiment is such that the portion 3a ′ located closest to the flow path side on the flow path side surface 3a of the base portion 3 of the fin member 5 is more than the end 2c ′ of the recess 2c on the flow path side. The difference (step 9) between the portion 3a ′ located closest to the flow path in the flow path side surface 3a of the base portion 3 in the concave portion 2c of the central portion 2d of the base 2 and the flow path side end 2c ′ of the recess 2c. ) Is the difference (step 9) between the portion 3a 'located on the most flow path side in the flow path side surface 3a of the base portion 3 and the end 2c' on the flow path side of the recess 2c. ), The eddy current 8d generated in the central portion 2d tends to be the largest among the vortex 8d of the fluid 8 caused by the respective steps 9. Therefore, the heat exchange efficiency in the central portion 2d of the main surface 2b on the opposite side of the base body 2 that is the heat receiving portion is enhanced, and the heat exchange object is disposed in the vicinity of the central portion 2d of the main surface 2b on the opposite side of the base body 2. The temperature variation between the central portion 2d of the base 2 and the portion 2e other than the central portion can be further reduced.

Further, as described above, the portion 3a ′ of the channel member 13 of the present embodiment, which is located on the most channel side in the channel side surface 3a of the base portion 3 of the fin member 5, protrudes toward the channel 6 side. Further, the difference (step 9) between the portion 3a ′ located on the most flow path side in the flow path side surface 3a of the base portion 3 in the concave portion 2c of the central portion 2d of the base 2 and the end 2c ′ of the concave portion 2c on the flow path side is 2 is greater than the difference (step 9) between the portion 3a 'located on the most flow path side of the flow path side surface 3a of the base portion 3 and the end 2c' of the recess 2c on the flow path side. In some cases, the eddy current 8d of the fluid 8 caused by each step 9 is most likely to be the eddy current 8d generated at the central portion 2d. Therefore, the heat exchange efficiency in the central portion 2d of the main surface 2b on the opposite side of the base body 2 that is the heat receiving portion is enhanced, and the heat exchange object is disposed in the vicinity of the central portion 2d of the main surface 2b on the opposite side of the base body 2. The temperature variation between the central portion 2d of the base 2 and the portion 2e other than the central portion can be further reduced.

  FIG. 5 shows the cross-sectional shape of an example of the fin used for the flow path member of the present embodiment, (a) to (c) are rectangular, and (d) and (e) are circular. Here, it is assumed that the fin 4 is divided, and only one of them is shown.

  Here, in FIG. 5, (a) is a rectangle that is long in the flow direction of the fluid 8, (b) is a square, (c) is a rhombus in which one of the corners corresponds to the flow of the fluid 8, and (d ) Is an ellipse that is long in the flow direction of the fluid 8, and (e) is circular.

  In this way, the cross-sectional shape of the divided fins 4 is a rectangle such as a rectangle or a square, and at least one of the sides of the rectangle is configured to be orthogonal to the flow of the fluid 8 (a) and (b). In the case of the square shape shown in FIG. 4, the fluid 8 becomes a vortex or creeping flow at the location of the fin 4 where the fluid 8 collides, and the mixing with the surrounding fluid 8 is promoted, but the resistance to the fluid 8 is increased. Since the pressure loss becomes higher and the pressure loss becomes lower on the back side of the fin 4 where the fluid 8 collides, locally, the temperature distribution of heat exchange between the fin 4 and the fluid 8 is likely to vary. However, as a whole, the heat exchange efficiency is increased.

  On the other hand, when the cross-sectional shape of the fin 4 is a substantially circular shape such as an ellipse or a circle (d) and (e), most of the fluid 8 is circular at the location of the fin 4 where the fluid 8 collides. Accordingly, the temperature distribution of the heat exchange between the fins 4 and the fluid 8 is suppressed, and the pressure loss is also suppressed low.

  In addition, when the cross-sectional shape of the fin 4 is a rhombus in which one of the corners corresponds to the flow of the fluid 8, the shape of the fin 4 is a square shape of (a) and (b) , (D) and (e), an intermediate effect is obtained.

  Thus, the cross-sectional shape of the fin 4 may be selected depending on whether the pressure loss is high or the temperature distribution variation due to heat exchange is important.

  For example, as shown in FIG. 4, the fin 4 shape of the fin member 5 in the vicinity of the central portion 2d of the base 2 on which the heat exchange object is mounted is a square shape, and the fin 4 shape of the fin member 5 in the 2e other than the central portion is formed. May be circular.

  Moreover, it is preferable that the base member 2 and the fin member 5 are made of an inflexible member, and the flow path members 1 and 11 to 13 of the present embodiment are rigid if the base member 2 is made of an inflexible member. Even if the heat exchange object is mounted on the main surface 2b on the opposite side of the base 2, the occurrence of warpage due to the difference in load and thermal expansion coefficient can be further suppressed, and the flow path members 1, 11 to 13 can be destroyed. Can be suppressed.

  Further, when the fin member 5 is made of an inflexible member, when the fluid 8 is pumped to the flow path 6 of the flow path members 1, 11 to 13, the fluid 8 and the solid matter contained in the fluid 8 are finned. Even if it hits 4, it can suppress that the fin 4 deform | transforms and wears. Therefore, the flow path 6 between the fins 4 can be prevented from being blocked, and a decrease in heat exchange efficiency can be suppressed.

Further, in the manufacturing process of the flow path members 1, 11 to 13, for example, deposits may adhere to the flow path 6 during molding or firing of the flow path members 1, 11 to 13. Even if the inside of the flow path 6 is washed by flowing a fluid mixed with the media through the flow path 6 of the flow path members 1, 11 to 13, the fin 4 is made of an inflexible material, so that deformation and wear are suppressed. However, the flow path 6 can be cleaned.

  The inflexible member is more preferably ceramic.

  When the base member 2 and the fin member 5 of the flow path members 1, 11 to 13 are made of ceramics, for example, a metal layer such as a wiring conductor can be formed directly on the main surface 2 b on the opposite side of the base member 2. A semiconductor element can be directly mounted on this metal layer, the number of parts can be reduced, and the number of joints between parts can be reduced, so that the thermal resistance at the joints can be reduced and the heat exchange efficiency can be increased.

  In addition, silicon is often used as a material for semiconductor elements, but in recent years silicon carbide is also being used. These semiconductor element materials and ceramics have similar thermal expansion coefficients compared to metals and resins. Therefore, even when the temperature of the flow path members 1, 11 to 13 and the semiconductor element is increased, it is possible to suppress the occurrence of shear stress due to thermal stress between these members. Thereby, generation | occurrence | production of peeling of the junction part with the semiconductor element etc. which are the heat exchange objects provided above the fin member 5 and the base | substrate 2 of the flow-path members 1 and 11-13 can be suppressed.

  Here, the ceramic material may be alumina, zirconia, mullite, silicon carbide, silicon nitride and aluminum nitride, or a composite material thereof. However, if insulation and price are important, alumina is preferable, and thermal conductivity is important. From a viewpoint, any of silicon carbide, aluminum nitride, and silicon nitride may be selected.

  FIG. 6 shows an example of the heat exchanger of this embodiment, and is a perspective view of a heat exchanger in which a metal layer is provided on the main surface of the flow path member on the opposite side of the base.

  In the heat exchanger 21 of this embodiment shown in FIG. 6, a metal layer 22 is provided above the main surface 2b on the opposite side of the base 2 of the flow path members 1, 11 to 13 of this embodiment. Thereby, heat exchange between the base 2 and the metal layer 22 can be performed efficiently, and the heat exchanger 21 with high heat exchange efficiency can be obtained.

  Here, as long as the metal layer 22 provided in the heat exchanger 21 is a wiring conductor, it may be a thick film or thin film printing, a plating method, a metal plate bonding, or the like. Further, a flow path member through which another fluid flows may be joined on the metal layer 22, and in this case, effective heat exchange with the other fluid can be performed.

  FIG. 7 is a perspective view of a semiconductor device in which a semiconductor element is mounted on a heat exchanger, showing an example of the semiconductor device of the present embodiment.

  The semiconductor device 31 of the present embodiment shown in FIG. 7 has a simple structure with a small number of parts and a heating element because the semiconductor element 32 is mounted above the metal layer 22 provided in the heat exchanger 21. A certain semiconductor element 32 can be mounted.

  Accordingly, since the number of parts that become thermal resistance is minimized between the fluid flowing through the flow path of the semiconductor element 32 and the flow path members 1 and 11 to 13, the heat exchange efficiency is high and the cost can be suppressed. Further, since the fin member can suppress the deformation and wear due to the fluid and the solid matter contained in the fluid, the semiconductor device 31 can be configured to suppress the temperature rise due to the heat generation of the semiconductor element 32.

DESCRIPTION OF SYMBOLS 1, 11-13: Channel member 2: Base | substrate 2a: Main surface on the flow path side, 2b: Main surface on the opposite side, 2c: Recessed part, 2c ': End on the flow path side, 2d: Central part, 2e: Other than central part 3: Base part 3a: Surface on the flow path side, 3a ': Site located closest to the flow path side 4: Fin 4a: Tip part, 4b: Root part 5: Fin member 6: Flow path 8: Fluid, 8a: Downflow, 8b : Surface flow, 8c: Creeping flow, 8d: Swirl 9: Step (step)
15: Housing
16: Supply port
17: Discharge port
21: Heat exchanger
22: Metal layer
31: Semiconductor devices
32: Semiconductor element

Claims (7)

  A flow path member having a flow path through which a fluid flows, wherein a base having a recess on a main surface on the flow path side, a housing, and a plurality of fins are provided on a base portion joined to the recess of the base The fin member is joined to the recess so that the most channel-side portion of the base portion on the channel-side surface is different from the channel-side end of the recess. A flow path member characterized by being made.   2. The fin member according to claim 1, wherein a portion of the base portion, which is located closest to the flow path side on the flow path side surface, is recessed from the flow path side than the end of the recess on the flow path side. Channel member.   2. The fin member according to claim 1, wherein a portion of the fin portion located closest to the flow path side on the flow path side surface of the base portion protrudes toward the flow path side from the end of the recess on the flow path side. Channel member.   The base has a plurality of the recesses, and the fin member is joined to each of the recesses. In the plurality of fin members, the base portion of the base portion in the recess at the center of the base is the most The difference between the portion located on the flow channel side and the end of the recess on the flow channel side is such that the portion located on the flow channel side of the base portion in the concave portion of the base portion other than the central portion of the base and the concave portion The flow path member according to claim 2, wherein the flow path member is larger than a difference from the end on the flow path side.   The flow path member according to claim 1, wherein the base body and the fin are made of an inflexible member.   6. A heat exchanger, wherein a metal layer is provided on a main surface of the flow path member according to claim 1 opposite to the flow path side of the base body.   A semiconductor device, wherein a semiconductor element is mounted above the metal layer of the heat exchanger according to claim 6.

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