JP2014072395A - Cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooler which can fluidize a cooling medium smoothly while down-sizing.SOLUTION: A first heat dissipation fin group and a second heat dissipation fin group are arranged in parallel with each other in the width direction orthogonal to the flow direction of the cooling medium in an interior region S. Both the heat dissipation fin groups are arranged alternately in the flow direction of the cooling medium in the interior region S. Protrusions 60 located on a sidewall 25b side of a substrate 20 in the parallel direction of the first heat dissipation fin group are closer to the sidewall 25b of the substrate 20 than second external heat dissipation fins 31A located on the sidewall 25b side of the substrate 20 in the parallel direction of the second heat dissipation fin group. The width between the second external heat dissipation fins 31A and the sidewall 25b of the substrate 20 is larger than the width between a heat dissipation fin 31b adjoining the protrusion 60 in the parallel direction of the first heat dissipation fin group and the second external heat dissipation fins 31A.

Description

  The present invention relates to a cooling device that cools a heating element joined to a substrate by a cooling medium that flows through a channel of the substrate.

  2. Description of the Related Art Conventionally, as a cooling device for cooling a heating element such as an electronic component, a configuration in which a heating element has a base body mounted from the outside and a flow path for flowing a cooling medium is formed inside the base body is widely known. (For example, refer to Patent Document 1).

  In the cooling device described in Patent Document 1, a large number of pin-shaped radiating fins are arranged in a staggered manner in the flow path to increase the contact area with the cooling medium on the inner surface of the flow path of the substrate. When the heat generated by the heating element is transmitted from the heating element to the base, heat dissipation from the inner surface of the flow path of the base to the cooling medium is promoted by the radiation fins, thereby improving the cooling efficiency for the heating element. ing.

  Further, in the cooling device described in Patent Document 1, a flow path control unit is provided between the inner surface along the flow direction of the cooling medium in the flow path of the base body and the heat radiation fin. The flow path control unit guides the flow direction of the cooling medium flowing in the flow path in a direction away from the inner surface of the flow path of the substrate. As a result, the cooling medium is guided to the portion where the radiation fins are formed in the base. Therefore, the cooling medium is further prevented from bypassing the gap between the inner surface of the flow path and the heat radiating fin without passing through the portion where the heat radiating fin is formed on the base, thereby further improving the cooling efficiency for the heating element. Improvements are being made.

JP 2012-29539 A

  By the way, in the above cooling device, since the flow path control unit is provided in the flow path of the base body, it is necessary to secure an installation space for installing the flow path control part in the flow path of the base body. As a result, there has been a problem that the base becomes large.

  In the above cooling device, the channel cross-sectional area of the channel of the base is narrowed by the channel control unit, and the gap between the channel control unit and the radiation fin is narrowed. For this reason, there is a problem that the pressure loss when the cooling medium flows through the flow path of the substrate increases, and the cooling medium cannot smoothly flow through the flow path of the substrate.

  This invention is made | formed in view of such a situation, The objective is to provide the cooling device which can flow a cooling medium smoothly, aiming at size reduction.

  In order to solve the above problem, the invention according to claim 1 is such that a heating element can be joined to the outside of the base, and a plurality of heat radiation fins are arranged in a staggered manner on the side of the heating element inside the base to form a flow path. And a cooling device for causing the cooling medium to flow in the flow path, wherein the heat dissipating fins are arranged in parallel in a width direction orthogonal to the flow direction of the cooling medium in the flow path. And a second radiating fin group arranged in parallel with the parallel direction of the first radiating fin group, the first radiating fin group and the second radiating fin group being the cooling in the flow path. The first external radiating fins, which are alternately arranged so as to be adjacent to each other in the flow direction of the medium and located on the side surface side of the base in the parallel direction of the first radiating fin group, are arranged in the parallel direction of the second radiating fin group. It is arranged closer to the side surface of the base body than the second external heat radiating fin located on the side surface side of the base body, and the width of the side surface of the second external heat radiating fin and the side surface of the base body is The gist is that it is equal to or larger than the width between the side surface of the heat radiating fin adjacent to the first external heat radiating fin and the side surface of the second external radiating fin in the parallel direction of the first heat radiating fin group.

  According to this, the width of the passage of the cooling medium formed between the side surface of the second external radiating fin and the side surface of the base is sufficiently ensured, and the side surface of the base is in relation to the second external radiating fin. Placed close together. As a result, while suppressing an increase in pressure loss when the cooling medium flows through the flow path, the cooling medium can surely pass through the site where the radiation fins are formed in the flow path. Therefore, the cooling efficiency of the heating element can be improved by allowing the cooling medium to smoothly flow through the portion where the heat dissipating fins are formed in the flow path. Moreover, the width dimension of a flow path can be made small by arrange | positioning the side surface of a base | substrate close to a radiation fin. Therefore, the base on which the flow path is formed can be reduced in size. Therefore, it is possible to improve the cooling efficiency for the heating element while reducing the size.

  According to a second aspect of the present invention, in the cooling device according to the first aspect, the width between the side surface of the first external radiation fin and the side surface of the second external radiation fin is the first heat radiation. The gist is that it is equal to the width between the side surface of the heat radiating fin adjacent to the first external heat radiating fin and the side surface of the second external heat radiating fin in the parallel direction of the fin group.

  According to this, the size of the width of the passage of the cooling medium formed between the side surface of the second external radiation fin and the side surface of the base is such that the side surface of the first external radiation fin and the side surface of the second external radiation fin are The width of the passage of the cooling medium formed between the side surface of the second external radiating fin and the side surface of the base body is larger than the width of the first radiating fin group in the parallel direction. It becomes larger than the magnitude | size of the width | variety between the side surface of the radiation fin adjacent to 1 external radiation fin, and the side surface of the 2nd external radiation fin. For this reason, the width of the passage of the cooling medium formed between the side surface of the second external radiating fin and the side surface of the base body is sufficiently secured, so that the pressure loss when the cooling medium flows through the flow path is increased. Can be further suppressed.

The invention described in claim 3 is summarized in that, in the cooling device according to claim 1 or 2, the first external heat dissipating fin is a protrusion protruding from a side surface of the base.
According to this, the projection guides the flow direction of the cooling medium to the portion where the heat radiation fin is formed in the flow path. Therefore, the cooling medium can flow more reliably in the part where the radiation fins are formed in the flow path.

  According to a fourth aspect of the present invention, in the cooling device according to the third aspect, the protrusion is such that the tip side portion has a smaller cross-sectional shape in a direction perpendicular to the protrusion direction of the protrusion. To do.

  According to this, even when the distance between the tip side portion of the protrusion and the second external heat dissipating fin is set short, the cooling formed between the tip side portion of the protrusion and the second external heat dissipating fin. The cross-sectional area of the medium passage is sufficiently secured. Therefore, it is possible to reduce the pressure loss when the cooling medium flows through the passage formed between the tip side portion of the protrusion and the second external heat radiation fin.

  According to a fifth aspect of the present invention, in the cooling device according to any one of the first to fourth aspects, a semiconductor element as the heating element is bonded to the base via an insulating substrate. This is the gist.

  According to this, the rigidity of the base is reinforced by the heat radiating fins. Therefore, even if the base is warped due to the difference in the coefficient of linear thermal expansion between the insulating substrate and the base, such warpage of the base can be suitably suppressed.

  According to the present invention, it is possible to smoothly flow the cooling medium while reducing the size.

The disassembled perspective view which shows the cooling device in embodiment. Sectional drawing which shows the cooling device in embodiment. The principal part enlarged view of FIG. The schematic diagram which shows the effect | action of the cooling device of a comparative example. The schematic diagram which shows the effect | action of the cooling device in embodiment. The schematic diagram which shows the effect | action of the cooling device in embodiment. (A), (b) is sectional drawing which shows the cooling device of another example.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS.
As shown in FIG. 1, the base 20 of the cooling device 10 in this embodiment is formed by joining a first base forming member 21 made of aluminum and a second base forming member 22 made of aluminum. The first substrate forming member 21 and the second substrate forming member 22 have the same shape. Of the four sides of the bottom plate 23 having a rectangular shape in plan view, the first base member forming member 21 and the second base member forming member 22 include a side wall 25a erected from the short side and a side wall 25b erected from the long side, It is comprised from the plate-shaped junction part 26 extended substantially horizontal toward the outward from the front-end | tip of side wall 25a, 25b.

  Inside the base body 20, an internal region S is formed as a flow path through which the cooling medium flows. A semiconductor element 28 as a heating element is bonded to the outer surface of the bottom plate 23 of the first base member 21 on the back surface side of the inner surface facing the inner region S via a rectangular plate-shaped insulating substrate 27. Specifically, the lower surface of the insulating substrate 27 is bonded to the first substrate forming member 21 via a metal plate (not shown) that functions as a bonding layer. The longitudinal direction of the insulating substrate 27 coincides with the longitudinal direction of the first base body forming member 21. The upper surface of the insulating substrate 27 is a surface on which the semiconductor element 28 is mounted, and the semiconductor element 28 is mounted via a metal plate (not shown) that functions as a wiring layer.

  Between the first substrate forming member 21 and the second substrate forming member 22, a support plate 32 that supports the pin-shaped heat radiation fins 31 accommodated in the internal region S of the substrate 20 is disposed. The support plate 32 has a rectangular flat plate shape, and the size thereof is the same as that of the outer periphery of the joint portion 26. The support plate 32 is sandwiched between the joint portions 26 so as to face the bottom plate 23 of the first base member forming member 21 and the bottom plate 23 of the second base member forming member 22. Since the joint portion 26 of the first base body forming member 21, the joint portion 26 of the second base body forming member 22, and the support plate 32 are joined with a brazing material, the joint interface between the joint portion 26 and the support plate 32 is airtight. It is sealed. The internal region S is partitioned by the support plate 32 into a first flow path S1 (see FIG. 2) and a second flow path S2.

  Further, concave portions 33a, 33b, 34a, 34b (see FIG. 2 for the concave portions 34a) are formed on both sides in the longitudinal direction of the joint portion 26 of both the base member forming members 21, 22. Then, when the joint portions 26 of both the base body forming members 21 and 22 are overlapped via the support plate 32, the concave portions 33a and 34a of the first base body forming member 21 communicate the first flow path S1 to the outside of the base body 20. It is configured as a communication part. Further, the concave portions 33b and 34b of the second base body forming member 22 are configured as a communication portion that allows the second flow path S2 to communicate with the outside of the base body.

  Further, the side edges of the recesses 33a and 33b in both the base body forming members 21 and 22 are joint portions to which the cylindrical inflow pipe 41 can be joined. The inflow pipe 41 allows the cooling medium to flow into the first flow path S1 through the recess 33a and allows the cooling medium to flow into the second flow path S2 through the recess 33b. Further, the side edges of the recesses 34a and 34b in both the base body forming members 21 and 22 are joint portions to which the cylindrical outflow pipe 42 can be joined. The outflow pipe 42 causes the cooling medium to flow out from the first flow path S1 through the recess 34a, and causes the cooling medium to flow out from the second flow path S2 through the recess 34b. Then, the cooling medium flows from the recesses 33a and 33b toward the recesses 34a and 34b along the longitudinal direction of both the base body forming members 21 and 22.

  As shown in FIG. 2, the radiating fin portions 50 are configured by arranging a plurality of pin-shaped radiating fins 31 in a staggered manner in a plan view on both upper and lower surfaces of the support plate 32. In this case, the arrangement mode of the radiation fins 31 supported on the upper surface of the support plate 32 and the arrangement mode of the radiation fins 31 supported on the lower surface of the support plate 32 are the same. Specifically, the heat radiation fin portion 50 includes four heat radiation fins 31 a arranged at equal intervals in the short direction of the support plate 32 and three heat radiations arranged at equal intervals in the short direction of the support plate 32. The fins 31 b are arranged so as to be alternately arranged in seven rows in the longitudinal direction of the support plate 32. And the radiation fin 31b is located in the intermediate position of the radiation fin 31a adjacent in the transversal direction of the support plate 32. FIG.

  All the radiating fins 31 protrude from the support plate 32 with a constant thickness, and the cross-sectional shape in the direction orthogonal to the protruding direction is the same in the entire region in the protruding direction of the radiating fins 31. And as for the radiation fin 31, the planar view shape seen from the protrusion direction is circular. Moreover, all the radiation fins 31 are configured to have the same amount of protrusion from the support plate 32. And the front-end | tip part of all the radiation fins 31 which protrudes upwards from the upper surface of the support plate 32 is joined to the baseplate 23 of the 1st base | substrate formation member 21. As shown in FIG. Further, the tip portions of all the radiation fins 31 projecting downward from the lower surface of the support plate 32 are joined to the bottom plate 23 of the second base body forming member 22.

  As shown in FIGS. 2 and 3, a protrusion 60 is formed on the inner side surface of the side wall 25 b along the flow direction of the cooling medium in both the base member forming members 21 and 22. The protrusion 60 has a shape obtained by cutting a cylindrical body having the same shape as the heat radiating fin 31 in the height direction of the cylindrical body so as to be smaller than the semicylindrical body. Therefore, the protrusion 60 has a smaller cross-sectional shape in the direction perpendicular to the protruding direction of the protrusion 60 in the distal end portion than in the proximal end portion connected to the side wall 25b. In addition, the normal direction of the outer peripheral surface of the protrusion 60 is directed to the inside of both base member forming members 21 and 22 so as to be away from the side wall 25b in the width direction orthogonal to the flow direction of the cooling medium. Further, the protrusions 60 are arranged at equal intervals at three positions in the flow direction of the cooling medium.

  When the support plate 32 is sandwiched between the joint portions 26 of both the base body forming members 21 and 22, the protrusions 60 and the radiation fins 31b are arranged in parallel on the same straight line. Therefore, in this embodiment, the 1st radiation fin group is comprised by the radiation fin 31b and the processus | protrusion 60 which are arrange | positioned in parallel in the width direction orthogonal to the flow direction of the cooling medium in the internal region S. In this case, the protrusion 60 constitutes a first external radiation fin located on the side wall 25b side of both the base member forming members 21 and 22 with respect to the radiation fin 31b constituting the first radiation fin group in the parallel direction of the first radiation fin group. doing.

  Moreover, in this embodiment, the 2nd radiation fin group is comprised by the radiation fin 31a arrange | positioned in parallel with the parallel direction of the radiation fin 31b and the protrusion 60 in parallel. Of the radiating fins 31a constituting the second radiating fin group, the radiating fins 31a located on the side walls 25b of the base member forming members 21 and 22 in the parallel direction of the second radiating fin group replace the second external radiating fins 31A. It is composed. In this case, the second external radiating fin 31 </ b> A is disposed away from the side walls 25 b of both the base body forming members 21 and 22. In this regard, in the present embodiment, it can be said that the protrusion 60 is disposed closer to the side wall 25b along the flow direction of the cooling medium in the internal region S than the second external radiation fin 31A.

  The distance L1 between the outer peripheral surface (side surface) of the second external radiating fin 31A and the inner surface of the side wall 25b of both the base member forming members 21, 22 is adjacent to the protrusion 60 in the parallel direction of the first radiating fin group. It is larger than the distance L2 between the outer peripheral surface (side surface) of the radiation fin 31b and the outer peripheral surface (side surface) of the second external radiation fin 31A. Therefore, the size of the width W1 of the passage of the cooling medium formed between the second external radiating fin 31A and the side walls 25b of both the base member forming members 21 and 22 is the same as the protrusion 60 in the parallel direction of the first radiating fin group. It becomes larger than the width W2 of the passage of the cooling medium formed between the adjacent radiation fins 31b and the second external radiation fins 31A.

  The distance L3 between the outer peripheral surface of the protrusion 60 and the outer peripheral surface of the second external heat dissipating fin 31A is equal to the outer peripheral surface of the heat dissipating fin 31b adjacent to the protrusion 60 in the parallel direction of the first heat dissipating fin group. It is equal to the distance L2 between the outer peripheral surfaces of the fins 31A. Therefore, the size of the width W3 of the passage of the cooling medium formed between the protrusion 60 and the second external radiation fin 31A is the outer peripheral surface of the radiation fin 31b adjacent to the protrusion 60 in the parallel direction of the first radiation fin group. And the width W2 of the passage of the cooling medium formed between the outer peripheral surface of the second external radiation fin 31A.

Next, the operation of the cooling device 10 configured as described above will be described.
In the cooling device 110 of the comparative example shown in FIG. 4, the cooling medium not only passes through the part P1 where the heat radiation fin 131 is formed in the internal region S as shown by the solid line arrow in FIG. As indicated by an alternate long and short dash line arrow, it is possible that the portion P2 where the heat dissipating fins 131 are not formed in the inner region S is bypassed. In this case, since the bypassed cooling medium does not promote heat dissipation from the base 120 through the heat dissipation fins 131, the semiconductor element 28 joined to the base 120 may not be efficiently cooled.

  On the other hand, as shown in FIG. 5, in the cooling device 10 of the present embodiment, the size of the width W1 of the passage of the cooling medium formed between the second external radiation fin 31A and the side wall 25b is compared. In the cooling device 110 of the example, the cooling medium passage width W11 is smaller than the size of the cooling medium passage formed between the radiation fin 131 closest to the side wall 125b and the side wall 125b. As a result, the cooling medium surely flows through the portion P1 where the heat dissipating fins 31 are formed in the internal region S as indicated by arrows in FIG. Therefore, the cooling medium efficiently promotes heat dissipation from the base 20 through the heat dissipation fins 31, thereby improving the cooling efficiency for the semiconductor element 28 bonded to the base 20.

  In this case, the flow path width W4 of the inner region S of the base body 20 in the cooling device 10 of the present embodiment is narrower than the flow path width W14 of the inner region S of the base body 120 in the cooling device 110 of the comparative example. Therefore, it is possible to reduce the size of the base body 20 by reducing the dimension in the width direction orthogonal to the flow direction of the cooling medium in the base body 20.

  Further, in this case, even if the flow path width W4 of the inner region S of the base body 20 is narrowed, the projection 60 and the projection 60 in the parallel direction of the first radiating fin group are formed on the flow path of the cooling medium in the inner region S of the base body 20. A portion narrower than the width W2 of the passage of the cooling medium formed between the outer peripheral surface of the adjacent radiating fins 31b and the outer peripheral surface of the second external radiating fin 31A is not formed. Therefore, an increase in pressure loss when the cooling medium passes through the internal region S of the base body 20 is suppressed.

  In particular, in the present embodiment, as indicated by an arrow in FIG. 6, when the cooling medium is flowing along the side wall 25 b of the base body 20, the flow direction of the cooling medium is away from the side wall 25 b by the protrusion 60. Be guided. As a result, the flow direction of the cooling medium is guided so as to approach the portion P1 where the heat radiation fins 31 are formed in the internal region S.

  In this case, the width W3 of the passage of the cooling medium formed between the second external radiating fin 31A and the protrusion 60 is equal to the outer peripheral surface of the radiating fin 31b adjacent to the protrusion 60 in the parallel direction of the first radiating fin group. 2 Equal to the width W2 of the passage of the cooling medium formed between the outer peripheral surfaces of the external radiation fins 31A. Therefore, even if the protrusion 60 is provided on the side wall 25b of the base body 20, the heat radiation fin 31b adjacent to the protrusion 60 in the parallel direction of the first heat radiation fin group on the flow path of the cooling medium in the inner region S of the base body 20 is provided. A portion narrower than the width W2 of the passage of the cooling medium formed between the outer peripheral surface and the outer peripheral surface of the second external radiation fin 31A is not formed. Therefore, an increase in pressure loss when the cooling medium passes through the internal region S of the base body 20 is suppressed.

Therefore, according to the above embodiment, the following effects can be obtained.
(1) The size of the width W1 of the passage of the cooling medium formed between the second external radiating fin 31A and the side walls 25b of both the base member forming members 21 and 22 is the protrusion 60 in the parallel direction of the first radiating fin group. And the width W2 of the passage of the cooling medium formed between the outer peripheral surface of the adjacent heat radiating fin 31b and the outer peripheral surface of the second external heat radiating fin 31A. Therefore, the width W1 of the passage of the cooling medium formed between the second external heat dissipating fin 31A and the side walls 25b of both the base member forming members 21 and 22 is sufficiently secured, and the side walls 25b of both the base member forming members 21 and 22 are secured. Is disposed in proximity to the radiation fin 31. As a result, while suppressing an increase in pressure loss when the cooling medium flows through the flow path, the cooling medium can surely pass through the portion P1 where the radiation fins 31 are formed in the internal region S. Therefore, the cooling efficiency of the semiconductor element 28 can be improved by allowing the cooling medium to smoothly flow through the portion P1 where the heat radiation fins 31 are formed in the internal region S. Further, by arranging the inner side surface of the inner region S close to the heat radiation fins 31, the width dimension of the inner region S can be reduced. Therefore, the base body 20 in which the internal region S is formed can be reduced in size. Therefore, it is possible to improve the cooling efficiency for the semiconductor element 28 while reducing the size.

  (2) The width W3 of the passage of the cooling medium formed between the protrusion 60 and the second external radiation fin 31A is the same as that of the radiation fin 31a adjacent to the protrusion 60 in the parallel direction of the first radiation fin group. 2 It is equal to the width W2 of the passage of the cooling medium formed between the external heat radiation fins 31A. The width W1 of the cooling medium passage formed between the second external radiating fin 31A and the side walls 25b of the base member forming members 21 and 22 is set between the protrusion 60 and the second external radiating fin 31A. It is larger than the size of the width W3 of the passage of the coolant formed in As a result, the size of the width W1 of the passage of the cooling medium formed between the second external radiating fin 31A and the side walls 25b of both the base member forming members 21 and 22 is the protrusion 60 in the parallel direction of the first radiating fin group. Is larger than the width W2 of the passage of the cooling medium formed between the adjacent heat dissipating fins 31a and the second external heat dissipating fins 31A. Therefore, the size of the width W1 of the passage of the cooling medium formed between the second external radiating fin 31A and both the base member forming members 21 and 22 is sufficiently ensured. An increase in pressure loss can be suppressed.

  (3) The protrusion 60 protrudes from the side wall 25b along the flow direction of the cooling medium in the internal region S. Therefore, the protrusion 60 guides the flow direction of the cooling medium to the portion P1 where the heat radiation fin 31 is formed in the inner region S. Therefore, the cooling medium can flow more reliably through the portion P1 where the heat radiation fins 31 are formed in the internal region S.

  (4) The protrusion 60 has a smaller cross-sectional shape in the direction perpendicular to the protruding direction of the protrusion 60 at the tip side portion. Therefore, even if the distance L3 between the outer peripheral surface of the tip end portion of the protrusion 60 and the outer peripheral surface of the second external heat dissipating fin 31A is set short, the tip end portion of the protrusion 60 and the second external heat dissipating fin 31A. The cross-sectional area of the cooling medium passage formed between the two is sufficiently secured. Therefore, it is possible to further reduce the pressure loss when the cooling medium flows between the tip side portion of the protrusion 60 and the second external radiation fin 31A.

  (5) The rigidity of the base body 20 is reinforced by the radiation fins 31. Therefore, even if the base 20 is warped due to the difference in the linear thermal expansion coefficient between the insulating substrate 27 and the base 20, such warpage of the base 20 can be suitably suppressed.

In addition, you may change embodiment as follows.
As shown in FIG. 7A, the protrusion 60 may have a shape obtained by cutting a cylindrical body having the same shape as the heat radiation fin 31 in the height direction of the cylindrical body so as to be a semi-cylindrical body.

As shown in FIG. 7B, the protrusion 60 may have a shape obtained by cutting a cylindrical body having the same shape as the heat radiation fin 31 in the height direction of the cylindrical body so as to be larger than the semi-cylindrical body.
In the embodiment, the size of the width W1 of the passage of the cooling medium formed between the second external radiating fin 31A and the side walls 25b of both the base member forming members 21 and 22 is in the parallel direction of the first radiating fin group. It is good also as a structure equal to the magnitude | size of the width W2 of the channel | path of the cooling medium formed between the outer peripheral surface of the radiation fin 31b adjacent to the processus | protrusion 60, and the outer peripheral surface of the 2nd external radiation fin 31A.

  In the embodiment, the protrusions 60 having a shape obtained by cutting a part of the cylindrical body having the same shape as the heat radiation fin 31 in the height direction of the cylindrical body may be extended from both the upper and lower surfaces of the support plate 32.

In the embodiment, the protrusion 60 may have a shape obtained by cutting a part of a cylindrical body having a central diameter different from that of the radiating fin 31 in the height direction of the cylindrical body.
In the embodiment, the protrusion 60 is not necessarily configured to have a columnar shape. For example, the outer surface of the protrusion 60 may be formed in a spherical shape. In this configuration, when the cooling medium flows through the passage of the cooling medium formed between the protrusion 60 and the radiation fin 31, the flow direction of the cooling medium is directed toward the normal direction of the outer surface of the protrusion 60 having a spherical shape. Converted. As a result, the flow direction of the cooling medium can be efficiently guided to the site where the heat radiation fins 31 are formed in the internal region S.

In the embodiment, the shape of the radiating fin 31 may be a pin shape, and may be a polygonal column shape such as a triangular column shape or a quadrangular column shape.
In the embodiment, the radiating fins 31 may be arranged in a lattice shape in plan view.

In the embodiment, the number of radiating fins 31 supported by the support plate 32 may be increased or decreased.
In the embodiment, the support plate in which the heat radiation fins 31 are provided on only one side of the upper and lower surfaces may be accommodated in the inner region S without partitioning the inner region S up and down by the support plate 32.

  S: Internal region as flow path, 10 ... Cooling device, 20 ... Base, 27 ... Insulating substrate, 28 ... Semiconductor element as heating element, 31, 31a, 31b ... Radiation fin, 31A ... Second external radiation fin, 50 ... Radiation fin part, 60 ... Projection constituting the first external radiation fin.

Claims (5)

A cooling device capable of joining a heating element to the outside of a base, forming a flow path by staggering a plurality of radiating fins on the side of the heat generation element inside the base, and causing a cooling medium to flow in the flow path. And
The radiating fin is
A first radiating fin group arranged in parallel in the width direction orthogonal to the flow direction of the cooling medium in the flow path and a second radiating fin arranged in parallel with the parallel direction of the first radiating fin group. Composed of groups,
The first radiating fin group and the second radiating fin group are alternately arranged so as to be adjacent to each other in the flow direction of the cooling medium in the flow path,
The first external radiation fin located on the side surface side of the base in the parallel direction of the first radiation fin group is more than the second external radiation fin located on the side surface side of the base in the parallel direction of the second radiation fin group. , Arranged close to the side surface of the base body,
The width of the side surface of the second external radiating fin and the side surface of the base body is such that the side surface of the radiating fin adjacent to the first external radiating fin in the parallel direction of the first radiating fin group and the second external radiating fin. A cooling device having a width greater than or equal to a width between the side surfaces of the heat dissipating fins. The width between the side surface of the first external heat radiating fin and the side surface of the second external heat radiating fin is equal to the width of the heat radiating fin adjacent to the first external heat radiating fin in the parallel direction of the first heat radiating fin group. The cooling device according to claim 1, wherein the cooling device is equal to a width between a side surface and a side surface of the second external heat dissipating fin. The cooling device according to claim 1, wherein the first external heat radiation fin is a protrusion protruding from a side surface of the base body. The cooling device according to claim 3, wherein the protrusion has a smaller cross-sectional shape in a direction perpendicular to a protruding direction of the protrusion at a tip side portion. The cooling device according to any one of claims 1 to 4, wherein a semiconductor element as the heating element is bonded to the base via an insulating substrate.