KR20130095614A - Hybrid cooler - Google Patents

Abstract

PURPOSE: A hybrid cooler is provided to implement uniformity of heat distribution, by locating a main heat radiation line and a sub heat radiation line at vicinity of the edge and the center of a cooling pin. CONSTITUTION: A number of cooling pins (51) are stacked in a constant interval. The cooling pin radiates heat generated in an electronic component. A main heat pipe (61) locates a main heat radiation line at the vicinity of the edge of the cooling pin. A sub heat pipe (63) locates a sub heat radiation line at the center of the cooling pin. The main and the sub heat radiation line have different length.

Description

Hybrid cooler {HYBRID COOLER}

The present invention relates to a hybrid cooler that effectively enables heat dissipation from an electric and electronic device, thereby preventing malfunction of the device and inducing an effective design and stable operation of a system equipped with the device of the present invention.

As the performance and functions of integrated circuits (ICs) improve, the tendency for high thermal energy to be released in similar cooling spaces continues. Typical heat sinks for air cooling cannot achieve sufficient cooling performance due to heat control limitations such as shape constraints, high thermal density and noise. High-performance cooling technology needs research to meet the needs of these thermal performance increases.

The easiest way to improve heat dissipation is to use a larger cooler. However, these methods have problems in terms of weight and size. Larger coolers present limited space inside the system and interfere with peripherals. In addition, when a heavy weight cooler is mounted on a circuit board, the possibility that a board which does not have sufficient strength may be damaged by an external small impact or cooler weight may not be excluded.

As shown in FIG. 1, in the cooler 10, one side of the cooler base 1 is fixed in contact with the heat source 9, and the other side of the cooler base 1 is fixed in contact with the bent portion of the heat pipe 11. . The other part of the heat pipe 11 is connected to the plurality of cooling fins 13. The cooler 10 absorbs heat from the heat source 9 through the cooler base 1 at the bent portion of the heat pipe 11, and the heat is transferred to both ends of the heat pipe 11. The cooler 10 emits heat through a plurality of cooling fins 13 in contact with the heat pipe 11. In addition, the cooler 10 may release heat generated in the cooling fins 13 by forced convection blowing air from the cooling fan 3 toward the cooling fins 13. Therefore, the condensation efficiency of the heat pipe 11 rises.

As shown in FIG. 2, the heat pipe 11 includes the working fluid WF in the vacuumed inner space HW, and a wick WK that causes a capillary phenomenon is formed on the inner side of the inner space. WK is formed on the inner wall of the container in the inner space. As shown enlarged in the drawing, the wick WK may have a groove shape and may have other shapes. When heat from the heat source is absorbed in one portion of the heat pipe 11, the working fluid WF is vaporized by the absorbed heat, and the vaporized gas is in contact with a plurality of cooling fins 13. Move quickly to another part of Then, the gas is condensed by the heat dissipation action of the cooling fins 13 and a phase change occurs to the liquid again. The liquid moves along the wick WK to the heat absorbing portion (one part that absorbs heat) of the heat pipe 11 again by the capillary force of the wick WK. This process is repeated as heat from the heat source is dissipated through the heat pipe.

As shown in Fig. 2 (a) and 2 (b), the heat pipe 11 is generally formed in a cylindrical shape, and may also be configured as a flat plate having a rectangular cross section. In the case of a flat plate type, one or more flow paths are included, and each flow path includes a working fluid WF in the vacuum internal space HW. Although the cylindrical heat pipe 11 has a simple structure and is easy to manufacture, many heat pipes having a cooling fin 13 applied to the cooler 10 as shown in FIG. 2 (a) have a heat transfer area AH. And a thermoelectric overlapping region OL in which a heat transfer region overlaps a space between neighboring heat pipes 11. The thermoelectric overlap region OL of the cylindrical heat pipe may reduce the heat dissipation performance of the cooler. In addition, the heat pipe 11 is a column (column) is connected to cross through a plurality of cooling fins 13, these intersection points are arranged in a line. In a typical cooler, as shown in FIG. 2A, this linear arrangement (hereinafter, a thermal emission line (TEL)) is located along an edge (edge) of the cooling fin 13. In this case, the central portion of the cooling fin 13 cannot play an important role in heat dissipation as compared to the corner portion. This is because the heat transferred to the column of the heat pipe 11 is concentrated on the outer edge of the cooling fin 13, the corner portion. As such, the state in which the heat of the cooling fins 13 is not uniformly distributed is one of the main causes of reducing the cooling performance of the cooler.

The flat heat pipe 11 is Korean Patent Publication No. 061050 (Platform Heat Pipe: Applicant ETRI), Published Patent Publication No. 2004-0019150 (Platform Heat Pipe and Heat Sink: Applicant Daehong Co., Ltd. And Korean Utility Model Publication No. 0411135 (flat plate heat pipe, Century Hitech Co., Ltd.). These patents are to form the above-described wick (WK) in various forms in the interior of the above-described internal space, that is, the hollow (HW) in order to structurally overcome the heat radiation limit. Therefore, the flat plate heat pipes 11 of this patent can provide a somewhat improved heat dissipation performance than the conventional flat plate heat pipes 11 due to the improved wick WK, but the improvement of the wick WK is possible. If only the heat dissipation performance is poor, as described above, when applied to the heat dissipation cooler of the high heat-generating component (heat source), which greatly increases the amount of heat dissipation due to integration, the desired heat dissipation performance cannot be expected.

Recently, technologies that have improved the heat dissipation cooler 10 as a whole have been developed. For these techniques, Korean Patent Publication No. 0766109 (heat radiator, LG Electronics Co., Ltd.), No. 0790790 (heat sink and cooler for integrated circuits, (Note) Celsia Technologies Korea No. 0981155 (Heat-Sink, Hiro Co., Ltd.) and No. 871457 (Heat sink of heat generating element, ITWELL Co., Ltd.).

Here, in the case of the aforementioned LG Electronics patent, the aforementioned heat pipe 11 is connected along the edge of the cooling fin 13 described above, and the aforementioned cooling fan 3 formed in the form of a sirocco fan at the center of the cooling fin 13. ) Is mounted in a penetrating state. In the case of the above-mentioned Cell Asia Technology patent, as shown in FIG. 2 (b), the above-mentioned cooling fins 13 are vertically coupled to the flat heat pipe 11. In the case of the above-described Hiroshio patent, the above-described cooling fin 13 is bent (not shown) in a zigzag fashion, and the aforementioned circular heat pipe 11, 13 in the form of approximately 'V'. In the case of the above-mentioned Haitwell patent, the above-described circular heat pipe 11 is bent substantially in the shape of 'c' so that the aforementioned cooling fin 13 is vertically installed in the heat pipe 11 . These patents can provide better heat dissipation efficiency than the technologies of the Korea Electronics and Telecommunications Research Institute, Daehong Enterprise, and Century Hitech patents when applied to the above-mentioned high heat generating parts, but are circular heat formed on the cooling fins 13. Since the above-described heat radiation overlapping portions OL between the pipes 11 are generated, it is virtually impossible to expect a heat dissipation amount superior to those of the aforementioned patents. That is, in the technology of the above-described patents, as the heat of both sides is transferred to the thermoelectric overlapping part OL, the cooling function is deteriorated in the thermoelectric overlapping part OL, and thus an excellent heat dissipation amount cannot be expected.

On the other hand, the Republic of Korea Patent Publication No. 2011-0033596 (electronic device cooling device, Zalman Tech Co., Ltd.) to improve this is made of one in the center of the cooling fin 13, as shown in a schematic front view in Figure 3 (a) Heat dissipation cooler 10 in which a cylindrical columnar heat pipe 11 is installed in a penetrating state, and a plurality of circular heat pipes 11 are formed at the edges of the cooling fins 13 to be thinner than the columnar heat pipes 11. ) Is proposed. However, in the case of this Zalman Tech patent, due to the diameter of the columnar heat pipe 11 in the center, as shown in a plan view schematically in FIG. 3 (b), the vortex is generated while the backside of the columnar heat pipe 11 flows. Since resistance occurs, the air (arrow) of the cooling fan 3 does not come into contact with the rear surface of the columnar heat pipe 11, thereby creating an invalid space (indicated by broken lines) where the heat radiation efficiency is substantially expected. Can't.

On the other hand, a technique that can improve the heat dissipation performance by removing the air stagnation region 5 of FIG. 3 (b), which is a problem with the above-described Zalman Tech, US Patent No. 7,619,888 (flat heat column and Heat dissipation dispersion device, Applicant: Delta Electronics. However, such a Delta Electronics patent has a problem that a flat heat pipe 11 is installed perpendicularly to the cooling fin 13 as shown in Figs. 4 (a) and 4 (b) The contact area of the upper end of the flat plate heat pipe 11 and the cooling fin 13 is formed only in a straight line at the center of the cooling fin 13, The desired heat radiation efficiency can not be expected because the contact area of the heat pipe 11 with respect to the cooling fin 13 is very limited.

KR 10-0631050 KR 10-2004-0019150 KR 10-0411135 KR 10-0766109 KR 10-0790790 KR 10-0981155 KR 10-871457 KR 10-2011-0033596 US 7,619,888 B2

In order to solve the problems described above, the present invention provides a hybrid cooler as a heat dissipation solution for a heat source such as an IC chip. The hybrid cooler has a compact arrangement with a combination of heterogeneous heat pipes such as cylindrical heat pipes and flat heat pipes.

In the present invention, cylindrical and / or flat heat pipes are connected near the center and the edges of the cooling fins, respectively. Intersections through which heat pipes and cooling fins intersect are arranged in a row on the cooling fins.The main heat dissipation line (main-TEL) when this intersection is located near the edge of the cooling fins and sub heat dissipation when located at the center This is called a sub-TEL.

The presence of heat radiation lines on the cooling fins can result in a uniform distribution of heat on the cooling fins by simultaneously transferring heat from the heat pipe to the center and corners of the cooling fins. The forced convection air caused by the cooling fan by the preferred arrangement of the heat dissipation lines allows the air to flow smoothly with almost no air stagnation zone. Furthermore, the main and sub heat dissipation lines have different lengths to further form a heat dissipation effective area in front of or behind the center or corner heat dissipation lines so that the flow air by the cooling fan can effectively act on cooling.

In the present invention, the heat pipes constituting the main and sub heat dissipation lines have different sizes, that is, a diameter of the cylindrical tube and a thickness of the flat heat pipe. Preferably, the heat dissipation performance is excellent when the size of the heart pipe constituting the main heat dissipation line is larger than the size of the heat pipe constituting the sub heat dissipation line. The reason is that the heat transmitted through the main heat dissipation line can be dissipated more effectively because the vicinity of the edge of the cooling fins in contact with the outside air of the cooler can be more effectively dissipated than the central portion of the cooling fins which is relatively blocked from the outside air of the cooler. This is because it is effective to allow more than the amount of heat through the line.

The present invention may include a cooler base that directly contacts a heat source to transfer heat. The cooler base is made of a thermally conductive material, and one side of the cooler base is formed to maximize the contact surface with the heat source, and the other side is formed such that the contact with the heat pipe is preferably made and firmly fixed. One side of the cooler base may have a pedestal shape to match the shape of the heat source, and the other side may have a corrugated shape that matches the appearance of multiple cylindrical heat pipes or a flat shape that matches the shape of a flat heat pipe. Can be formed.

SUMMARY OF THE INVENTION The present invention provides a hybrid cooler that transmits heat to a plurality of plate-shaped cooling fins laminated at regular intervals via heat pipes from a heat source such as an electronic device, to be laminated at regular intervals. The main heat pipe, consisting of a cylindrical or flat heat pipe, forms one or more main thermal emission line TELs along the edges of the cooling fins, which absorb the heat absorbed by the main heat pipe. Transfer from one part to the other to the main heat dissipation line. Consisting of cylindrical or flat heat pipes, sub heat pipes of a different size from the main heat pipe form one or more sub heat dissipation lines in the center of the cooling fins, which sub-heat pipes absorb the heat absorbed by a portion of the sub heat pipe. From to the sub heat dissipation line via the other part. The sub heat dissipation line has a length different from that of the main heat dissipation line, thereby forming a heat dissipation effective area on the cooling fins. Also, the cooling fins and the cooling fins vertically disposed on the sides of the plurality of cooling fins can be forced to blow in the direction of the cooling fins, thereby enabling effective cooling in the space between the cooling fins. The cooler base, which is made of a thermally conductive material, is formed so that one side is in direct contact with the heat source, and one side may form a pedestal. In addition, the cooler base has a shape that conforms to the outer shape of the plurality of heat pipes so that one side of the cooler base is transferred to the other side through the inside of the cooler base, and the heat is effectively transferred to the heat pipe. Is formed.

By the arrangement and structural combination of the above components in the hybrid cooler of the present invention, the performance of the cooler can be improved for the following reasons.

First, the heat distribution on the cooling fins is uniform. The combination of main and sub heat dissipation lines located near and at the corners of the cooling fins, respectively, can lead to this heat distribution uniformity.

Second, the introduction of the main and sub heat dissipation lines can achieve an effective heat transfer mechanism. Since the main heat pipe is different in size from the sub heat pipe, the heat transferred from the heat source preferably flows through the cooling fin (not shown) because the diameter of the main heat pipe is preferably larger than that of the sub heat pipe By the main heat pipe at the periphery of the cooling fin and by the sub heat pipe at the center portion of the cooling fin. Since the main heat dissipation line is composed of a main heat pipe which directly or indirectly comes into contact with the cooler base to transfer heat from the heat source, it can absorb more heat than the sub heat dissipation line. This is because the sub-heat-radiating lines consist of sub-heat pipes, which receive heat through the main heat pipe in contact with the cooler base.

Third, since the main heat dissipation line and the sub heat dissipation line have different lengths, an additional heat dissipation effective area (area) may be formed on the cooling fin in front of or behind the main or sub heat dissipation line. Preferably, the shorter heat dissipation line than the main heat dissipation line is excellent in heat dissipation effect in the effective heat dissipation area. The effective heat dissipation area is formed at the front or the rear of the sub heat dissipation line, so that the blown air can effectively dissipate heat in the area of the cooling fin.

Fourth, the hybrid cooler is compact in size and slim in construction. In order for the heat transfer function of the heat pipe to be optimal, it must be bent uniformly so that the internal wick structure is not deformed when the main and sub heat pipes are bent. In a preferred hybrid cooler configuration, the diameter of the cylindrical heat pipe (or thickness in the case of a flat heat pipe) that is a sub heat pipe is smaller than the main heat pipe. This means that the sub heat pipe can be bent at a smaller curvature, i.e. a sharper internal angle. When the bends are uniformly bent in the limited space inside the cooler to have a U-shape, the straight portion between the two bends becomes short, that is, the two bands are formed close to each other. The sub heat pipes are uniformly bent to maintain optimal heat transfer performance of the heat pipes, and these sub heat pipes can form sub heat dissipation lines on the cooling fins, thereby contributing optimally to heat dissipation performance. The main heat pipe is also U-shaped and uniformly bent and deformed to maintain optimal heat transfer performance while maintaining the shortest length between the two bends but maintaining the optimum straight portion. Therefore, the hybrid cooler can be formed in a compact and slim size while exhibiting high heat dissipation performance.

Fifth, the present invention may include a cooler base. The cooler base is formed of a thermally conductive material, and may include a pedestal on the surface in contact with the heat source. A cooler base having a shape adapted to the shape of one or more main or sub heat pipes can effectively transfer heat from the heat source to the main or sub heat pipes.

Reference may be made to the accompanying drawings to aid in understanding the invention. However, these drawings are only for illustration and do not limit the present invention.
1 is a schematic front view illustrating a general type cooler,
2 is a schematic perspective view illustrating a general type cooler,
3 is a schematic front and plan view illustrating a general type cooler;
4 is a schematic front view and plan view illustrating another general type cooler,
5 is a perspective view illustrating a cooler according to a first embodiment of the present invention,
6 is a front view illustrating a cooler according to a second embodiment of the present invention,
7 is a front view illustrating a cooler according to a third embodiment of the present invention,
8 is a front view illustrating a hybrid cooler according to a fourth embodiment of the present invention,
Fig. 9 is a plan view of Fig. 8,
10 is an exploded perspective view of a hybrid cooler according to a fifth embodiment of the present invention,
11 is a perspective view illustrating a state in which the hybrid cooler of FIG. 5 is assembled;
12 is a front view of FIG. 11,
FIG. 13 is a plan view of FIG. 11;
14 is a schematic front view illustrating the fifth embodiment of Fig. 10, Fig.
15 is a schematic plan view illustrating a hybrid cooler according to the sixth and sixth embodiments of the present invention,
16 is a schematic plan view illustrating a hybrid cooler according to a seventh embodiment of the present invention,
17 is a schematic front view illustrating a hybrid cooler according to an eighth embodiment of the present invention,
18A is a perspective view of a heat source having a shape in which the height of the central portion is lower than that of the surroundings; (b) is a perspective view illustrating a hybrid cooler according to a ninth embodiment of the present invention including a cooler base having an integral pedestal formed in a form in which one surface of the cooler base protrudes; (c) is a perspective view illustrating a hybrid cooler according to a ninth embodiment of the present invention in which the shape of the cooler base and the main heat pipe are modified to match the shape of the heat source to form a pedestal, that is, a structural pedestal is formed;
19 is a schematic front view illustrating a hybrid cooler according to a tenth embodiment of the present invention;
20 is a schematic front view illustrating a hybrid cooler according to an eleventh embodiment of the present invention;
21 is a schematic front view illustrating a hybrid cooler according to a twelfth embodiment of the present invention;
22 is a schematic front view illustrating a hybrid cooler according to a thirteenth embodiment of the present invention;
Fig. 23 is a graph of the thermal resistance R _th at various calories in the hybrid coolers according to the fifth and ninth embodiments of the present invention.

Preferred embodiments of the present invention are described below in conjunction with the drawings.

As shown in FIG. 5, the cooler of the first embodiment of the present invention includes a plurality of cooling fins 51, a main heat pipe 61, and a sub heat pipe 63. The cooling fin (51) serves to distribute heat to and from the main heat pipe (61) and the sub heat pipe (63). The cooling fin 51 is preferably a thermally conductive material such as copper, aluminum, and alloys thereof, and may be formed as a heat sink having a plurality of protrusions (in the form of cooling fins). A plurality of cooling fins 51 are stacked at intervals, and the main heat pipe 61 and the sub heat pipe 63 penetrate through and are fixed.

The main heat pipe 61 is composed of a plurality of cylindrical heat pipes forming a finger-like finger structure. The main heat pipe 61 may be bent in a U or L shape having a linear heat absorbing portion 61a in contact with the cooler base 50. Preferably, the main heat pipe 61 transfers heat from the heat source 9 to one portion, that is, the heat absorbing portion 61a, and the heat is transferred to the other portion 61c. This portion 61c is formed so as to intersect with the cooling fins 51 in a line at the corner of the cooling fins 51. The main heat pipe 61 may be modified according to design conditions. The heat is transferred vertically upward along the main and sub heat pipes 61 and 63 to the upper cooling fin of the plurality of cooling fins. The heat pipes are configured to include hot spots, which will be described later, of the cooler base 50 so that the heat across the cooler base 50 can be quickly transferred to the cooling fins 51 located on the upper side of the cooler base 50. In addition to the heat diffusion, the cooling efficiency of the cooling fins 51 can be increased.

The main heat pipe 61 has a quantity or size (diameter in the case of a cylindrical shape, thickness in the case of a flat plate shape) according to the size of the heat source 9, and a heat absorbing portion 61a and a pair horizontally with the cooler base 50. Is formed of a bent portion 61b and a pair of condensation portions (or heat radiating portions) 61c. The pair of condensing portions 61c are coupled to each other in a direction perpendicular to the cooling fins 51 in a crossing manner. Here, the heat absorbing portion 61a serves as a vaporizing portion for absorbing heat from the heat source 9 to vaporize the working fluid. The heat dissipation part 61c serves as a condensation part that reaches a working fluid vaporized inside the heat pipe and is discharged by the cooling fin 51 to condense back into liquid. This configuration is preferable for the main heat pipe 61 to absorb the heat transferred to a portion of the heat absorbing portion 61a and transfer the heat to the cooling fins through the heat radiating portion 61c. Therefore, the heat of the heat source is dissipated.

The bend 61b should be bent at the critical curvature R _cr for uniform bending. This is to prevent wick structure damage and passage shrinkage of the working fluid (liquid and gas) during bending, and the bending cross-section of the radius (r) of the inner pipe of the heat pipe is almost unchanged after bending. it means. If a cylindrical heat pipe is to be banded in the usual processing method, the bending radius R should generally be greater than or equal to the threshold value R _cr of the uniform banding. Moreover, the curvature R _cr of the uniform banding decreases as the radius "r" of the cylindrical tube decreases, i.e. the thinner the cylindrical, and for uniform banding, R _cr must be greater than the radius r of the tube and R ≥ R _cr and R _cr >> r must be satisfied. If the bending radius of curvature and the radius of the tube are R << r, i.e. too sharply bent, the heat pipe will not be at optimum capillary force and working fluid flow conditions, so the bending curvature R at bending is It is preferred that it is larger than the radius r of the cylindrical container. 5 and 6, R and r1 are each R _cr described above. And r. As a result, the cylindrical heat pipe to be bent can maintain optimal heat transfer performance when the bending bending curvature R is larger than the radius r of the heat pipe tube.

The main heat pipe 61 is formed with the bend 61b uniformly bent under the condition of R >> r. 5, the length of the heat absorbing portion 61a is determined according to the size of the heat source 9, and the heat radiating portion 61c formed vertically starting from the bent portion 61b is positioned near the edge of the cooling fin 51 Crossed. Here, the width is formed of MW1 similar to the width of the cooling fins 51, and the heat dissipation portion 61c is a gap (gap) of the contact surface by forcible fitting, soldering or brazing at the time of the through coupling with the cooling fins 51. It is fixed in the usual way to minimize the The main heat pipe 61 is composed of a plurality of cylindrical heat pipes and intersects with the cooling fin 51 so that the intersections thereof are arranged in a line while maintaining a constant interval in the vicinity of the edge of the cooling fin 51 . This arrangement of intersections forms the main heat dissipation line L1 near the edges (edges) of the cooling fins 51. As the main heat pipe 61 is uniformly bent in a U shape, both ends of the heat radiating portion 61c form two main heat radiating lines L1, one at each of opposite sides of opposite sides of the cooling fin.

The main heat pipe 61 is coupled to the cooler base 50. The cooler base is a thermally conductive material, and the heat absorbing portion 61a and the heat source 9 are in the form of a block or plate and are in contact with both sides of the cooler base 50 to receive heat from the heat source 9 to the heat absorbing portion 61a. It serves to convey. The cooler base 50 in contact with the heat source 9 may be formed in the form of a pedestal as described below according to the shape of the heat source 9 (not shown in the figure). In addition, the main heat pipe 61 may be in direct contact with the heat source 9 without the cooler base 50 to receive heat from the heat source.

The sub heat pipe 63 has the same radius r1 as the main heat pipe 61. And it is formed in a shape similar to the main heat pipe 61. The plurality of sub heat pipes 63 may be seated in the inside of the main heat pipe 61 which is U-shaped with a width of SW1. This is an arrangement for distributing uniform heat throughout the cooling fins 51 by transferring heat to the central portion of the cooling fins 51. As shown in FIG. 5, the sub heat pipe 63 intersects with the cooling fins 51 at the centers of the plurality of cooling fins 51, and the sub heat dissipation line L2 having the length of L2-a where the crossing points are arranged in a row. ). The sub heat dissipation line L2 is preferably in parallel with the main heat dissipation line L1, since the air forced by the cooling fan 57 flows in the same direction, thereby increasing the cooling efficiency. .

The cooling fins 51 can be stacked horizontally from the lower bottom portion of the main and sub heat pipes 61 and 63 to be stacked on top. However, the cooling fins 51 may not be stacked below the bottoms of the main 61 and sub-63 heat pipes, that is, to areas close to the cooler base 50. This is because the bent portion bent in curvature R exists in the heat pipe. Therefore, the cooler of the present embodiment has a finless zone (h1), that is, a region where the cooling fins 51 cannot be installed, at the lower portion of the cooler, and due to the presence of the finless region h1, The cooling efficiency is lowered.

In this embodiment, the length of the main heat dissipation line (L1) is the same as the sub heat dissipation line (L2), the sub heat dissipation line (L2) is disposed in the central portion on the cooling fin (51). This is to make the central portion of the cooling fins 51 also effectively contribute to heat dissipation. However, since the lengths L1-a and L2-a of the main and sub heat dissipation lines L1 and L2 are the same, the effective heat dissipation area (? �� Not only does not have the required area of the heat radiation fin), but also the heat absorbing portion 61a and the sub heat pipe of the main heat pipe 61 because the radii r1 of the tubes of the main and sub heat pipes 61 and 63 are the same. The contact of the heat absorbing portion 63a of 63 is in a very limited state. This is because the curvature R of the curved portion 63b is very large for uniformly bending the sub heat pipe 63 as shown in the figure and the straight heat absorbing portion 63a between the curved portions 63b is very short to be. Therefore, although the performance of the cooler according to this embodiment can be improved as compared with the general cooler due to the introduction of the sub heat pipe 63, it is difficult to expect a high cooling performance at present.

6 shows a second embodiment of the present invention. The cooler of this embodiment is structurally similar to the cooler of the first embodiment of FIG. 5, except that the heat absorbing portion 63a of the sub heat pipe 63 is longer than that of the first embodiment. This is to increase the thermal contact between the sub heat pipe 63a and the heat absorbing portion 61a of the main heat pipe 61. That is, the second embodiment improves the disadvantage of the basic first embodiment.

However, as shown in FIG. 6, the main heat pipe 61 increased as the width MW2 enlarged the length of the heat absorbing portion 61a. This is because the length of the heat absorbing portion 63a of the sub heat pipe 63 located inside the cooler is increased. The widths MW2 and SW2 of the inner space (the inner side of the U-shape) of the main and sub heat pipes 61 and 63 have increased, so that the size of the cooler according to the second embodiment is generally increased as compared with the first embodiment . This increase in size may be a limitation for electronic devices with limited internal installation space.

In the second embodiment, the expansion of the heat absorbing portion 63a of the sub heat pipe 63 causes the enlargement of the width SW2 forming the internal space and the expansion of the heat dissipating portion 63c forming the sub heat dissipating line L2 Resulting in the position shifted in the direction of the edge (edge) from the central portion of the cooling fin 51. In a state in which the sub heat dissipation line is close to the edge of the cooling fin 51, it is difficult to uniformly distribute the heat on the cooling fin 51 and heat is concentrated on the outer portion of the cooling fin 51. Therefore, the cooler of the second embodiment of the present invention is more difficult to improve the cooling performance than the first embodiment of the present invention.

7 illustrates a cooler according to a third embodiment of the present invention. Basically, this cooler was proposed to improve the uneven heat distribution in the cooling fins 51 generated in the cooler of the second embodiment. As in Fig. 7, the arrangement of the components is almost the same as in the second embodiment. However, in the sub heat pipe 63, there is a secondary bending portion 63d between the bent portion 63b and the heat dissipation portion 63c. The secondary bending portion 63d starts from the bend portion 63b and is bent in the direction of the upper straight portion of the sub heat pipe 63 and inward of the cooler. Since the curved shape can make the width SW3 forming the end side gap of the heat dissipating portion 63c smaller than in the case of the second embodiment, the heat dissipating portion 63c is positioned at the center of the cooling fin 51. In this secondary bend 63d, if the curvature of curvature is R, which is the optimal uniform change radius, this is the same as the curvature of the primary bend 63b. As a result, the sub heat pipe 63 has a jar shape in which two portions are bent in different directions.

In the third embodiment of the present invention, the heat transferred from the main heat pipe 61 is transferred to the heat absorbing portion 63a of the sub heat pipe 63, and the heat dissipation portion 63c of the sub heat pipe and the main heat pipe The heat dissipation part 61c is positioned and fixed near the center and corners of the cooling fins 51, respectively. Therefore, the heat of the heat source 9 is transmitted to the center portion and the corner portion of the cooling fin 51 can be evenly distributed heat transfer throughout the cooling fin 51, the third embodiment of the present invention is the second embodiment Better cooling performance can be achieved.

However, in the third embodiment as well as the second embodiment, the width MW2 of the main heat pipe 61 should be maintained in an enlarged state. Therefore, there is still a disadvantage in that the size is large. In addition, the cooler of the third embodiment has a finless region h2 which is enlarged more than the finless region h1 in the first and second embodiments. This is because the cooling fins 51 cannot be installed in the lower portion due to the bending curvature R due to the secondary bending of the sub heat pipe 63. As the number of cooling fins 51 that can be installed in this manner is reduced, the heat dissipation efficiency is reduced as a result. As a result of the cooler of the third embodiment of the present invention, the heat dissipation performance of the cooler can be lowered compared to the coolers of the first and second embodiments by the increase of the finless region h2 and the decrease of the number of the installation cooling fins 51. have.

As in FIG. 8, the fourth embodiment of the present invention has improved the problems of the first to third embodiments. This cooler has the same configuration as the first embodiment, except that the radius r2 of the sub heat pipe 63 tube is smaller than the radius r1 of the tube of the main heat pipe 61. The difference in the size of the heat pipes may be configured to have an appropriate size of the heat absorbing portion 63a region of the sub heat pipe 63. In addition, the sub heat pipe 63 may be uniformly bent and deformed at a bending curvature of R2. The bending curvature R2 is smaller than the uniform bending curvature R of the main heat pipe 61. This means that the length of the heat absorbing portion 63a of the sub heat pipe 63 can be kept the same as in the case of the third embodiment configured to maximize the thermal contact, and also the inside of the sub heat pipe 63 of the fourth embodiment. It means that the width SW4 of the space can be made equivalent to SW3 of the second embodiment of the present invention. In some cases, SW4 may be made smaller than SW3. In such a structure and arrangement, the vertical heat absorbing portion 63c of the sub heat pipe 63 can maintain a constant distance from the heat absorbing portion 61c of the main heat pipe 61, and also the heat absorbing portion of the sub heat pipe 63. The 63c may be positioned at the center of the cooling fins 51, thereby inducing a uniform heat distribution on the cooling fins 51.

Additionally, the cooler of the fourth embodiment does not require secondary banding as in the second embodiment, and the bending deformed sub-heat pipe 63 has a smaller bending radius R2 because the tube radius r2 is smaller. May be bent and deformed. This condition means that the finless region h3 of the sub heat pipe 63 can be made small independently of the finless region h1 of the main heat pipe 61 applied to the first to third embodiments. do. Therefore, since the cooling fins 51 can be further installed below the start point of the finless region h3 of the sub-heat pipe 63, the cooler of the fourth embodiment has improved heat dissipation than the coolers of the first to third embodiments. You can expect performance.

The cooler according to the fourth embodiment is a hybrid cooler in the sense that the main heat pipes 61 and the sub heat pipes 63 respectively positioned on the outer and inner sides of the cooling fin 51 have different tube radii. can do. Preferably, the tube radius of the sub heat pipe 63 is smaller than the tube radius of the main heat pipe 61 for heat dissipation. 9, it is preferable that the thickness LW2 of the sub-heat-radiating lines L2 arranged in a line is thinner than the thickness LW1 of the main heat-radiating line L1 composed of the main heat pipes 61. [ In general, as the size of the heat pipe increases, the amount of working fluid included in the heat pipe increases, so that the heat transfer capacity of the main heat pipe 61 located near the edge of the cooling fin 51 is located at the center of the cooling fin 51. It is larger than the case of the sub heat pipe 63. In addition, as shown in FIG. 9, since the length L2-a of the sub heat dissipation line is shorter than the length L1-a of the main heat dissipation line, the cooling fin 51 has an effective heat dissipation area (area required for heat dissipation). This exists. This effective heat dissipation area means an area in which forced air can be cooled effectively. Therefore, the thinner and shorter the sub heat dissipation line (L2) composed of the sub heat pipes 63 minimizes the air congestion area around the heat pipes, thereby inducing a smooth flow of cooling air on the plurality of cooling fins 51 to effectively dissipate heat. can do. As a result, the hybrid cooler according to the fourth embodiment of the present invention can achieve significantly higher heat radiation performance than the coolers of the first to third embodiments.

10 to 14 illustrate a hybrid cooler according to a fifth embodiment of the present invention. This embodiment is structurally similar to the hybrid cooler of the fourth embodiment. However, the sub heat pipe 63 was composed of one flat heat pipe instead of a plurality of cylindrical heat pipes. As shown in FIG. 10, the sub heat pipe 63 is formed of a heat absorbing portion 63a, a pair of bent portions 63b, and a pair of vertical heat dissipating portions 63c. The bending radius R3 of the bending portion 63b in the case of a plurality of plate heat pipes may be different from that of the main heat pipe 61 and stacked . Since the laminated structure of the sub heat pipe 63 may be commonly implemented by those skilled in the art, the description thereof will be omitted.

As mentioned above, even if the hybrid cooler according to the fourth embodiment has good cooling performance, it is inevitable that the above-described thermoelectric superposing area OL shown in FIG. 2 occurs between the cylindrical heat pipes on the cooling fin Do. Areas that are inefficient for cooling can be removed by using a flat plate heat pipe. Therefore, the hybrid cooler of the fifth embodiment can further improve heat dissipation performance. In this embodiment, the working fluid flow rate in the flat heat pipe 63 of FIG. 10 may be formed to have a structure at least equal to or greater than the total working fluid amount in the cylindrical sub heat pipe of the fourth embodiment of FIG. 9. This is achieved by adjusting the number and size of channels in the flat sub heat pipe even if the thickness of the flat sub heat pipe 63 of FIG. 10 is smaller than the radius of the cylindrical sub heat pipe 63 of FIG. 9, that is, LW2. It means possible. In addition, in the fifth embodiment, the eddy current (or air stagnation region) caused by the forced air blowing in the vicinity of the plate-type sub heat pipe 63 is hardly generated as compared with the cylindrical sub heat pipe. Therefore, the hybrid cooler of the fifth embodiment can exhibit very excellent heat dissipation performance.

The sub heat pipe 63 installed in the linear section (inner side) formed by the plurality of main heat pipes 61 has a main structure in a conventional manner in order to efficiently receive heat from the main heat pipe 61 while reducing the installation space. In contact with the heat pipe 61 is coupled. The main heat pipe 61 is coupled to the cooler base 50 made of a thermally conductive material, and the cooler base 50 is composed of a core conducting base 53 and a frame 55. One side of the thermoelectric plate 53 is coupled with the heat absorbing portion 61a of the main heat pipe, and the other side is in contact with the heat source. The fixing blade 53a and / or the fastening block 53b that is a protrusion may be formed on the upper portion of the thermoelectric plate 53. The fastening block 53b is a structure for fixing to the frame 55 with screws SC or bolts BT. In addition, the thermoelectric plate 53 may form a pedestal on the other side for effective and direct contact coupling with the heat source (not shown in FIG. 10). The thermoelectric plate 53 and the frame 55 are not limited to the coupling method by the above-described fixing blade 53a and the fastening block 53b, and any method may be applied as long as it is a conventional method that can be coupled to each other.

The frame 55 is preferably fixed on a circuit board on which a heat source is mounted. In the frame 55, the heat source of the heat source is transferred to the thermoelectric board 53, the main heat pipe 61, and the sub heat pipe 63 to another element mounted on the circuit board or the circuit board, thereby causing the circuit board or the device to malfunction. Keep them away from circuit boards or devices so as to prevent them. The frame 55 dissipates heat of the heat source transferred through the thermoelectric plate 53. The frame 55 not only firmly fixes the main heat pipe 61 and the sub heat pipe 63 together with the heat sink 51 to the electronic product, but also easily removes them. 10, the frame 55 is formed with a hole 55c as shown to permit the contact of the heat source and the heat transfer plate 53. As shown in Fig. The frame 55 may be provided with a seating step 55b on the inner circumferential surface of the hole 55c as shown in the figure so that the heat transfer plate 53 is seated and stably engaged. 11 and 13, the cooling fan may be installed on one side of the frame 55 perpendicularly to the corners of the plurality of cooler pins 51. The cooling fan 57 may be a sirocco type fan, To prevent diffusion to the outside and to concentrate into the interior of the cooler.

The thermoelectric plate 53 may be fitted into the hole 55c of the frame 55 by a shrink fit method. In this shrink fit method, when the frame 55 is heated to be inserted in the expanded state of the central hole 55c and cooled while the thermoelectric plate 53 is inserted, the frame 55 contracts to form a very large area with the thermoelectric plate 53. It's a tightly coupled way. In addition, the cooler base 50 may be formed such that the thermoelectric plate 53 and the frame 55 are integral with each other by casting or the like.

As shown in FIG. 14A, the sub heat pipe 63 is formed of a flat heat pipe, and may be formed thinner than the diameter LW2 of the cylindrical sub heat pipe 63 of the fourth embodiment shown in FIG. 9. have. In the fifth embodiment, the sub heat pipe 63 has a bend 63b bent with a bend curvature R3, and this curvature R3 is the radius of curvature of the sub heat pipe 63 of the fourth embodiment shown in FIG. Smaller than (R2) In other words, the bent portion 63b of the sub heat pipe 63 may be uniformly and sharply bent without contraction of the container than in the fourth embodiment. The width SW5 of the internal space of the sub heat pipe 63 may be further reduced than in the case of the fourth embodiment. Since the fifth embodiment has a structure capable of reducing the bending width MW1 of the main heat pipe 61, the overall size can be reduced while improving the heat dissipation performance of the cooler.

However, the spacing of the vertical heat dissipation portion 63a of the sub heat pipe 63 may be formed to be too close to each other in the inner space, that is, to be biased in the center portion of the cooling fin 51. This structure is likely to result in uneven heat distribution on the cooling fins 51. On the other hand, the outer space width MW1 of the main heat pipe 61 depends on the size of the heat source 9. Therefore, cooling performance is inefficient when the sub heat pipe 63 is formed smaller than the thickness (width: LW2) of the sub heat pipe 63 of 4th Embodiment. Preferably, the thickness LW2 of the sub heat pipe 63 should be at least equal to or larger than that of the fourth embodiment. In the fifth embodiment, the bending curvature R3 of the planar sub heat pipe 63 is different from the bending curvature R1 of the main heat pipe 61, which is formed by the fin subheat pipe 63. The lease region h4 and the finless region h1 formed by the main heat pipe 61 may be formed differently. The finless region h4 of this embodiment can be formed smaller than the finless region h3 of the fourth embodiment, which means that the number of cooling fins 51 that can be stacked can be increased.

A hybrid cooler according to a sixth embodiment of the present invention is shown in FIG. The main heat pipe 61 and the sub heat pipe 63 each consist of one flat heat pipe and a plurality of cylindrical heat pipes. In the sixth embodiment, the above-mentioned thermoelectric overlap region OL is not formed in the flat main heat pipe 61 at the intersection crossing through the cooling fins 51. Moreover, the main heat pipe 61 can form a sufficient fluid channel therein, and thus can effectively transfer more heat through the interior of the container than a plurality of cylindrical heat pipes. That is, the main heat dissipation line L1 formed near the edge of the cooling fin 51 does not form a thermoelectric overlap region OL of heat transferred from the heat source 9 through the heat pipe on the cooling fin, and is a flat main heat. Pipe 61 is capable of planar contact with the cooler bases 50, 53, which is advantageous for heat transfer. The sub heat dissipation line L2 formed on the cooling fins 51 by the plurality of sub heat pipes 63 diffuses the heat transferred from the heat source 9 through the main heat pipe 61 onto the cooling fins 51. Let's do it. Such a heat pipe or the like can be expected to have a better heat transfer performance than the cooler of the fifth embodiment. In the cooler according to the sixth embodiment, the main heat pipe 61 and the sub heat pipe 63 are formed in different shapes, and the thicknesses LW1 of the main heat dissipation line L1 and the sub heat dissipation line L2 and It's a hybrid cooler in terms of different LW2.

Another hybrid cooler according to a seventh embodiment of the present invention will be described with reference to FIG. 16. Both the main heat pipe 61 and the sub heat pipe 63 are constituted by flat heat pipes. The thickness LW1 of the main heat pipe 61 is thicker than the thickness LW2 of the sub heat pipe 63, and thus, heat can be radiated by transferring more heat near the edge of the cooling fin 51. In the seventh embodiment, since the main and sub heat pipes 61 and 63 do not form the thermoelectric overlap region OL around the heat pipe, the heat dissipation efficiency is excellent on the cooling fin 51. In addition, since all heat pipes are flat in terms of heat transfer, the contact between the main heat pipe 61 and the heat source 9 or the cooler bases 50 and 53, and the sub heat pipe 63 and the main heat pipe ( The contact of 61) is very good as the surface contact. Therefore, the heat dissipation performance of the hybrid cooler of this embodiment is superior to the other embodiments described above.

The hybrid cooler of the eighth embodiment will be described with reference to FIG. The main heat pipe 61 is composed of a plurality of cylindrical heat pipes, and the sub heat pipe 63 is composed of a straight flat plate or cylindrical heat pipe that is not bent. In the eighth embodiment, the sub heat pipes 63 are stacked vertically on the thermoelectric plates 53 of the cooler base 50 located above the main heat pipes 61. Here, the sub heat pipe 63 may be composed of one or a plurality of cylindrical heat pipes or flat heat pipes. In this embodiment, the heat transmitted from the main heat pipe 61 through the cooler base 50 (53) to the sub heat pipe 63 is transferred from the end (bottom) of the straight heat pipe, so that the area is very narrow. It is delivered along (bottom contact area). Therefore, the cooling efficiency of the cooler may be somewhat lowered. However, the heat of the heat source 9 is transferred to the center and the corner of the cooling fins 51 due to the presence of the main and sub heat pipes 61 and 63 to induce a uniform heat distribution on the cooling fins 51. Therefore, the heat dissipation performance is superior to that of the general cooler.

A hybrid cooler according to a ninth embodiment of the present invention will be described with reference to FIG. 18A. The hybrid cooler of the present embodiment includes a pedestal cooler base adapted to the appearance of the heat source 9. Here, the heat source 9 is composed of a peripheral portion 92 composed of a hot spot 91 in the center and various electronic components, and the central hot spot 91 is formed to have a lower height than the peripheral portion 92. Can be. In this embodiment, when the hybrid cooler of the fifth embodiment is fixed in contact with the heat source 9, one side of the cooler bases 50 and 53 forms a shape for effective thermal contact with the heat source 9. The other side can be configured in a shape including the heat absorbing portion of the main heat pipe (61).

In FIG. 18B, the cooler base 50 is formed with a pedestal 53c protruding to directly contact the hot point 91 of the heat source 9. The pedestal 53c is integrally formed as part of the cooler base 50 or the thermoelectric plate 53. As shown in the figure, heat of the hot spot 91 is transferred to the plurality of main heat pipes 61 via the pedestal 53c. Accordingly, the hybrid cooler including the pedestal type cooler base 50 can expect a higher cooling efficiency than the hybrid cooler having the pedestalless cooler base 50 as in the other embodiments.

Another pedestal shape can be constructed to improve thermal contact between the heat source and the cooler. When the integrated pedestal as shown in FIG. 18B is not formed on one side of the cooler base 50 in contact with the heat source, the cooler base 50 may be configured in a shape that matches the shape and size of the hot spot 91. Can be. Such a method is possible by adjusting the shape of the heat absorbing portion 61a and the finless region h1 described above to match the shape and depth of the hot point 91 of the heat source, as shown in FIG. In this way, the structural deformations and combinations of the components of the hybrid cooler may be referred to as the "structural pedestal 53d" because they are installed at a high temperature point 91 of the heat source 9. As in the case of the cooler bases 50, 53 having the integral pedestal 53c of Fig. 18B, this structural structure consists of the thermoelectric plates 50, 53 of the plate and a part of the plurality of main heat pipes 61. The pedestal 53d is configured to effectively conduct heat transfer from the heat source 9 to the main heat pipe 61 as shown in FIG. 18C.

As shown in FIG. 19, the cooler base 5 may be formed of a thermoelectric block 54 thicker than the thermoelectric plate 53. One side of the thermoelectric block 54 is in direct contact with the heat source 9, the other side is in contact with the main heat pipe 61, thereby uniformly dissipating heat from the heat source 9 and simultaneously transferring the heat to the main heat pipe 61. Play a role.

As shown in Figure 20, the above-mentioned thermoelectric block 54 may be formed a seating sheet 54a for receiving and seating a portion of the circular heat pipe. It is preferable that the seating sheet 54a is formed in a semicircular shape corresponding to the shape of the circular heat pipe as shown in the figure. Since the seating sheet 54a receives a portion of the circular heat pipe and expands the contact area by surface contact, heat of the heat source 9 can be more smoothly transferred to the circular heat pipe. Therefore, the thermoelectric block 54 can improve the heat dissipation performance of the main heat pipe 61 and the sub heat pipe 63.

Referring to FIG. 21, in the aforementioned thermoelectric block 54, a seating sheet 54a may be formed on a surface of the thermoelectric block 54 that faces the heat source 9. In this case, the main heat pipe 61 should be machined in a semicircular cross section as shown for surface contact with the heat source 9. Since the thermoelectric block 54 is a part of the main heat pipe 61 is accommodated in the seating sheet 54a, the heat of the main heat pipe 61 is effectively transferred. In addition, the main heat pipe 61 and the sub heat pipe 63 may be stacked in an orthogonal state as shown by the heat transfer block 54.

Referring to FIG. 22, the main heat pipe 61 and the sub heat pipe 63 may be connected through the cooler base 50 as shown. Cooler base 50 may be configured in the form of a block or plate as shown. The cooler base 50 mediates the heat of the main heat pipe 61 to the sub heat pipe 63, and evenly distributes the heat of the main heat pipe 61 to the sub heat pipe 63. have. In addition, the cooler base 50 may further smoothly transfer heat as the above-described seating sheet 54a is formed and the sub-heat pipe 63 is accommodated in the seating sheet 54a.

In order to help the understanding of the present invention, a test for measuring the heat dissipation performance of the cooler was performed as follows. The general commercial cooler and the cooler of the present invention evaluated the performance by applying various heat loads as thermal design power (TDP) and measuring the thermal resistance at that time. The "thermal resistance (R _th)" is meant the value of the temperature difference shown by the degree to prevent the heat flow (typically per unit amount of heat) from any contact with the connection used here and, R _th = (T _a - T _j) / Q. Here, T _a is the ambient temperature (° C.), T _j is the connection temperature (° C.) and Q (Watt) means the input heat amount (or power) of the heat source that can be regarded as TDP.

Since the heat resistance has a lower value as the degree of heat transfer at the interface increases, the value is a value that can quantify the cooling performance of the cooler. In general, the thermal resistance R _th decreases as the heat load increases and has a minimum value by increasing again at a specific heat load, so the heat load at the minimum heat resistance can be regarded as the TDP of the cooler. In other words, it can be said that the said cooler is the maximum value which can radiate the heat (heat load) of a heat source, ie, the cooling capacity of a cooler. In general, the thermal design power (TDP) and size of a cooler are determined by the heat dissipation of the heat source and the size of the allowable space inside the electronic device.

The characteristics of the cooling performance of the hybrid cooler of the fifth embodiment and the ninth embodiment are as follows. Commercial use 1 and commercial use 2 are general commercial coolers, and are composed of cylindrical heat pipes of the same radius and have a structure and arrangement form very similar to those of the cooler of the first embodiment of the present invention. Commercial 1 exhibits a TDP performance of 130 Watts and Commercial 2 140 watts. The hybrid 5 and the hybrid 9 refer to the hybrid cooler manufactured according to the fifth embodiment and the ninth embodiment, respectively. The hybrid cooler consists of a main heat pipe of a plurality of cylindrical heat pipes and a sub heat pipe of a flat heat pipe. In order to compare the cooling performance of the commercial 1 and the commercial 2 of the hybrids 5 and 9, the hybrid coolers were made similar or smaller than the commercial products.

Item Commercial 1 Hybrid 5 Commercial 2 Hybrid 9 Cooler size (mm) 91.5 x 91.5 x 66 70 x 70 x 64.5 91 x 91 x 110 90 x 90 x 110 Cooling fan diameter 60 mm 60 mm 92 mm 85 mm Thermal Design Power TDP (Thermal Load) 130 Watts 130 Watts 140 Watts 140 Watts Thermal resistance, R _th 0.169 ^o C / W 0.156 ^o C / W 0.19 ^o C / W 0.13 ^o C / W

As shown in Table 1, when a heat load was applied to the commercial 1 cooler, the minimum value of the thermal resistance was 0.169 ° C / W as the test average value of several times. For the hybrid 5 cooler, as shown in Fig. 23, the heat load was applied in the range of 130 watts to 200 watts, and the thermal resistance of the hybrid 5 at 130 watts corresponding to the commercial 1 TDP is 0.156 ° C / W. Although it is smaller than 1, it shows lower thermal resistance than commercial 1, which means that hybrid 5 is superior to commercial 1. More specifically, since commercial 1 has a larger overall size than hybrid 5, the hybrid 5 cooler has better cooling performance in spite of the total size of commercial 1 cooling fins being much larger than hybrid 5's cooling fin area. it means. These results demonstrate the superiority of the hybrid cooler according to the present invention, and the factors of the hybrid cooler such as uniform heat distribution on the cooling fins and smooth blowing conditions between the cooling fins are more important than the total area of the cooling fins. To confirm that.

As summarized in Table 1, Commercial 2 is somewhat larger than Commercial 1, thermal design power, TDP 140 watts thermal resistance is 0.19 ℃ / W. As shown in FIG. 23, the heat load of the hybrid 9 cooler was applied in the range of 100 watts to 225 watts, and the thermal resistance of the hybrid 9 at 140 watts, which is the thermal design power of the commercial 2, was found to be 0.129 ° C / W. In addition, the thermal resistance was found to continue to decrease from 225 watts to 0.124 ° C / W as the minimum value through three or more tests. In other words, the hybrid 5 can be expected to lower the heat resistance of more than 225 watts of heat load, which means that the heat dissipation performance can be exhibited even at 225 watts or more. Therefore, from the heat dissipation performance measurement results, even though the diameter of the cooling fan installed in the hybrid 5 cooler is about 7 mm smaller than the commercial 2 cooler, it can prove that the cooling performance is much higher than that of the commercial 2 cooler.

From the above measurement results, it can be inferred that the excellent heat dissipation performance of the hybrid 9 cooler is due to the presence of a structural pedestal configured to effectively absorb the heat generated from the heat source as well as the advantages of the hybrid 5 cooler. The Hybrid 9 cooler forms a structural pedestal adapted to the shape of the heat source, and the pedestal is adapted to the shape and size of the hot spot of the heat source, and at the same time, a plurality of main heat pipes are bent and deformed at an obtuse angle as shown in FIG. It is because it was comprised so that it may insert suitably in the position of a heat source. In addition, three or more hybrid 5 and hybrid 9 coolers each were manufactured to ensure the reliability of the measurement. As shown in FIG. 23, it can be seen that the thermal resistance values at a given heat load in the coolers of hybrids 5 and 9 have little difference, which means that the measurement is excellent in reproducibility, which is a technical condition for manufacturing. Not beneficial can be another advantage of the production conditions.

In addition, the performance of the hybrid cooler was measured by mounting it on commercial electronic equipment instead of a dedicated measuring device. Here, the heat source is a state of being mounted on a circuit board, and is a heat source in which a CPU and various electronic components are included, and the hot point of the heat source is not the same level (height) as the peripheral part of the heat source, as shown in FIG. 18 (a). It is located low. In addition, the existing commercial cooler to be compared uses a heat source, especially a product certified by a CPU manufacturer. This commercial three-cooler has a form similar to the cooler of the first embodiment of the present invention, which is composed of a plurality of U-shaped bent cylindrical heat pipes. In the measurement for confirming the cooling performance of the cooler, the temperature T _j and the thermal resistance R _th between the hot point of the heat source and the cooler were measured, respectively. As summarized in [Table 2], when 150 watts of heat load was applied as the thermal design power and TDP, the hybrid 9 was about the same size as the commercial 3, but the thermal resistance R _th was measured at 0.153 ° C./W. This value is more than 30% lower than commercial 3 coolers. Moreover, the connection temperature T _j of the Hybrid 9 was measured about 10 degrees lower than that of the commercial 3 cooler. As a result, the Hybrid 9 has considerably better heat dissipation performance than commercial 3 coolers, and it also provides conditions for more stable operation of the electronics.

Item Thermal design power, TDP Thermal resistance, R _th Junction temperature, T _j Temperature difference, Δ T Commercial 3 150 Watts 0.22 68 ^o C Reference Hybrid 9 150 Watts 0.153 58.1 ^o C 9.9 ^o C Measuring conditions T _a | ^max = 35 ^o C; R _th and T _j calculate the average value of three sigma

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to be illustrative of the present invention and are not intended to limit the scope of the present invention. Change, partial omission, or supplement). In addition, the above-described embodiments may combine some or many of the features with each other. Therefore, the structure and configuration of each component shown in the embodiments of the present invention can be implemented by modifications or combinations, and it goes without saying that modifications and combinations of these structures and configurations fall within the scope of the appended claims of the present invention.

51: cooling fin 61: main heat pipe
63: sub heat pipe 50: cooler base
53: thermoelectric plate 54: thermoelectric block
55: frame

Claims (16)

A plurality of cooling fins, which are thermally conductive materials and are stacked at regular intervals and serve to dissipate heat generated from a heat source of the electronic component to release heat;
One side absorbs heat from the heat source, transfers the absorbed heat to the other side, the other side crosses through the cooling fins, the crossing points are arranged in a row on the cooling fins, this arrangement constitutes the main heat dissipation line, The main heat dissipation line serves as a heat source on the cooling fins to dissipate heat and to dissipate heat, and the main heat pipe to position the main heat dissipation line near the edge of the cooling fins; And
Absorbing heat from one side to the heat source or from the main heat pipe and transferring the absorbed heat to the other side, the other side of which penetrates the cooling fin, and the intersection point is arranged in line on the cooling fin, And a sub heat pipe which forms a heat dissipation line and dissipates heat by serving as another heat source on the cooling fin and the sub heat dissipation line is located at the center of the cooling fin,
The main and sub heat dissipation line is a hybrid cooler, characterized in that the heat source is located in the vicinity and the center of the cooling fins, respectively, so that the heat of the heat source is uniformly distributed throughout the cooling fins. The method of claim 1, wherein the sub heat radiation line,
Hybrid cooler characterized in that the length is shorter than the main heat radiation line. According to claim 1,
Wherein the main heat pipe comprises a plurality of cylindrical heat pipes, the cooling fins vertically passing through the cooling fins stacked at regular intervals and intersecting with each other to form a main heat dissipating line,
The sub heat pipe is composed of a flat heat pipe, and intersects with the cooling fins, and the intersection points constitute the sub heat radiation line. According to claim 1,
Wherein the main heat pipe comprises a plate-shaped heat pipe, the cooling fins vertically passing through the cooling fins stacked at regular intervals, the intersection point constituting the main heat radiation line,
Wherein the sub-heat-radiating line is composed of a plurality of cylindrical heat pipes, and the sub-heat-radiating lines are formed by intersecting vertically through the cooling fins and by arranging intersecting points in a row. The method of claim 1, wherein the main and sub heat pipes are composed of flat heat pipes, and vertically cross the cooling fins stacked at regular intervals, and the intersection points on the cooling fins constitute the main and sub heat dissipation lines, respectively. Hybrid cooler. According to claim 1,
The main and sub heat pipes are composed of a cylindrical heat pipe. The cooling fins vertically penetrate the cooling fins stacked at regular intervals. The intersection points on the cooling fins are arranged in a row, A hybrid cooler. The method according to any one of claims 1 to 6,
And the main heat pipe and the sub heat pipe have different sizes (mean diameter for cylindrical heat pipes and thickness for flat heat pipes). The method of claim 7 wherein
And the sub heat pipe is smaller in size than the main heat pipe. The method according to any one of claims 1 to 6,
Hybrid cooler is installed on the corner of the cooling fins to enable a cooling fan in a direction perpendicular to the cooling fins. The method of claim 9,
A hybrid cooler having a cover installed on the cooling fan to prevent diffusion of cooling air blown from the cooling fan and to be concentrated in the direction of the cooling fin and the heat radiation line. The method according to any one of claims 1 to 6,
The main heat pipe and the sub heat pipe,
An endothermic portion in thermal contact with the heat source or cooler base to absorb heat transferred from the heat source or through the cooler base;
Bending portions bent at both ends of the heat absorbing portion in a direction different from that of the heat absorbing portion; And
And a heat dissipation part formed in a straight line starting from the curved part and intersecting with the cooling fins in a line. The method according to any one of claims 1 to 6,
It is made of a thermally conductive material, one side is in contact with the heat source, the other side is in direct thermal contact with the main heat pipe and / or the sub heat pipe to transfer the heat of the heat source to the main heat pipe and / or the sub heat pipe. Hybrid cooler further comprising a cooler base; The method according to claim 12,
The cooler base is formed with one side provided with a pedestal corresponding to the external shape of the heat source to enable thermal contact and the other side receiving the heat absorbing portion of the main heat pipe and / or the sub heat pipe,
And the pedestal is designed to be in direct contact with the hot spot of the heat source and is part of the cooler base. The method according to claim 12,
The cooler base is a hybrid cooler consisting of a thermoelectric plate of a thermally conductive material or a thermoelectric block of a thermally conductive material having a thickness greater than the thickness of the thermoelectric plate. The method according to any one of claims 1 to 6,
And a pedestal made of a structure capable of thermal contact with a hot point of a heat source.
The pedestal made of the structure is made of a cooler base considering the size of the hot spot,
The heat pipe is a hybrid cooler characterized in that the bending to correspond to the appearance of the heat source. The method according to any one of claims 1 to 6,
The main heat pipe and the sub heat pipe being fixed to the electronic device together with the cooling fin and having one side to which the main heat pipe and the sub heat pipe are respectively connected and which has another side fixed to the electronic device, ; And a hybrid cooler further comprising:

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