KR101372728B1 - Hybrid cooler - Google Patents

Abstract

A hybrid cooler according to the present invention includes a plurality of cooling fins which are made of a thermally conductive material and stacked at regular intervals and serve to dissipate heat generated from a heat source of an electronic component to discharge heat; Wherein one side absorbs heat from the heat source, the absorbed heat is transmitted to the other side, the other side penetrates the cooling fin, and the intersection points are arranged in a line on the cooling fin, A main heat pipe for distributing and dissipating heat by acting as a heat source on the cooling fin and allowing the main heat dissipating line to be positioned in the vicinity of the edge of the cooling fin; And one side absorbs heat from the heat source or the main heat pipe on one side and transmits the absorbed heat to the other side and the other side penetrates the cooling fin and the intersection points are arranged in a line on the cooling fin, And a sub heat pipe which forms a sub heat dissipation line and dissipates heat by dissipating heat by serving as another heat source on the cooling fin and the sub heat dissipation line is located at the center of the cooling fin, The sub-heat-dissipating lines are located in the vicinity of the corners of the cooling fins and at the center of the cooling fins, respectively, so that the heat of the heat sources can be uniformly distributed throughout the entirety of the cooling fins.

Description

Hybrid cooler {HYBRID COOLER}

The present invention relates to a hybrid cooler capable of effectively dissipating heat from an electric / electronic device, thereby preventing a malfunction of the device, and can lead to effective design and stable operation of a system equipped with the device of the present invention.

As the performance and functionality of integrated circuits (ICs) have improved, there has been a trend to release high thermal energy in similar cooling spaces. Typical air cooling heat sinks can not exhibit sufficient cooling performance due to shape constraints, high thermal densities, and thermal control limits such as noise. High-performance cooling technology requires research to meet these demands for increased thermal performance.

The easiest way to improve the heat radiation performance is to use a cooler having a large size. However, these methods cause problems in terms of weight and size. Larger-sized coolers have limited space inside the system and interference with peripheral devices. In addition, when a heavy-weight cooler is mounted on a circuit board, it is not possible to exclude a possibility that a substrate which does not have sufficient strength may be damaged by a small external impact or the weight of the cooler.

1, one side of the cooler base 1 is held in contact with the heat source 9 and the other side of the cooler base 1 is fixed in contact with the bent portion of the heat pipe 11 . The other part of the heat pipe 11 is connected to the plurality of cooling fins 13. [ The cooler 10 absorbs the heat of the heat source 9 through the cooler base 1 at the curved portion of the heat pipe 11 and the heat is transferred to both ends of the heat pipe 11. The cooler 10 discharges heat through the plurality of cooling fins 13 that are in contact with the heat pipe 11. Further, the cooler 10 can release heat generated from the cooling fin 13 by forced convection blowing air from the cooling fan 3 toward the cooling fin 13. The condensing efficiency of the heat pipe 11 is increased.

As shown in FIG. 2, the heat pipe 11 includes a working fluid WF in a vacuumed inner space HW, and a wick WK is formed on an inner side surface of the inner space to cause a capillary phenomenon. The wick (WK) is formed on the inner wall of the container having the inner space. As shown in the drawing, the wick WK may have a groove shape or may have a different shape. When the heat from the heat source is absorbed in one part of the heat pipe 11, the working fluid WF is vaporized by the absorbed heat, and the vaporized gas passes through the heat pipe 11). ≪ / RTI > Then, the base body is condensed by the heat radiation action of the cooling fin 13, and a phase change occurs again to the liquid. This liquid moves along the wick WK again by the capillary force of the wick WK to the heat absorbing portion of the heat pipe 11 (one side absorbing the heat). This process repeats itself as heat from the heat source is dissipated through the heat pipe.

As shown in FIGS. 2 (a) and 2 (b), the heat pipe 11 is generally formed in a cylindrical shape and may be formed in a flat plate shape having a rectangular cross section. In the case of the flat plate type, one or more flow paths are included, and each flow path includes the working fluid WF in the vacuum inner space HW. Although the cylindrical heat pipe 11 has a simple structure and is easy to manufacture, a plurality of heat pipes having the cooling fin 13 applied to the cooler 10 as in Fig. 2 (a) have a heat transfer area AH And a heat transfer overlap region OL in which a heat transfer region overlaps the space between neighboring heat pipes 11 exists. The heat overlap region OL of such a cylindrical heat pipe may lower the heat radiation performance of the cooler. In addition, the heat pipe 11 is connected in such a manner that a column passes through a plurality of cooling fins 13, and these crossing points are arranged in a line. In the general cooler, such a linear arrangement (hereinafter, a thermal emission line, TEL) is located along the edge of the cooling fin 13 as shown in Fig. 2A. In this case, the central portion of the cooling fin 13 can not play an important role in heat dissipation as compared with the edge portion. This is because the heat transferred to the column of the heat pipe 11 is concentrated at the outer or corner portion of the cooling fin 13. As described above, a state in which the heat of the cooling fin 13 can not be uniformly distributed is one of the main causes for reducing the cooling performance of the cooler.

The flat plate type heat pipe 11 is a plate type heat pipe and a heat sink which are disclosed in Korean Patent Publication No. 061050 (flat plate type heat pipe: ETRI of applicant's electronic parts research institute), Laid-Open Patent Publication No. 2004-0019150 Ltd.) and Registered Utility Model No.0411135 (Flat-Plate Heat Pipe, Century High Tech Co., Ltd.). In order to overcome the heat dissipation limit, these patents form the above-mentioned wick (WK) in various forms in the above-mentioned inner space, that is, inside the hollow (HW). Thus, the flat heat pipes 11 of this patent can provide somewhat improved heat dissipation performance than the conventional conventional flat heat pipes 11 due to the improved wick (WK), but the improvement of the wick WK The heat dissipation performance can not be expected when the heat dissipation performance of the heat dissipation unit is applied to a heat dissipation cooler of a high heat dissipation component (heat source) whose heat dissipation amount increases drastically due to integration as described above.

Recently, technologies for improving the heat dissipation cooler 10 have been developed. For example, Korean Patent Registration No. 0766109 (Heat dissipation device, LG Electronics Co., Ltd.) and 0790790 (Heat sink and cooler for integrated circuits (Celia Technologies, Korea) No. 0981155 (Heisei Co., Ltd., Hiroko) and No. 871457 (Heat dissipation device of a heating element, Hait Well Co., Ltd.).

In the above-mentioned LG Electronics patent, the above-mentioned heat pipe 11 is connected along the edge of the cooling fin 13, and the above-mentioned cooling fan 3 (in the form of a sirocco fan) Is mounted in a penetrating state. In the case of the above-mentioned Cell Asia Technology patent, as shown in FIG. 2 (b), the above-mentioned cooling fins 13 are vertically coupled to the flat heat pipe 11. In the case of the above-described Hiroshio patent, the above-described cooling fin 13 is bent (not shown) in a zigzag fashion, and the aforementioned circular heat pipe 11, 13 in the form of approximately 'V'. In the case of the above-mentioned Haitwell patent, the above-described circular heat pipe 11 is bent substantially in the shape of 'c' so that the aforementioned cooling fin 13 is vertically installed in the heat pipe 11 . These patents, when applied to the above-mentioned high-temperature parts, can provide a better heat radiation efficiency than the above-described technologies of the Korea Electronics and Telecommunications Research Institute, Daehong Enterprise and Century High Tech, but the circular heat The heat dissipating overlap portions OL between the pipes 11 are generated, so that it is practically impossible to expect a heat dissipation superior to that of the above-described patent techniques. That is, since the cooling function is degraded in the thermoelectric superposition portion OL as the heat of both sides is transferred to the thermoelectric superposition portion OL, the heat dissipation amount can not be expected.

To improve this, Korean Patent Laid-Open Publication No. 2011-0033596 (cooling device for electronic parts, Zalman Tech Co., Ltd.) has a cooling pin 13 formed at the center of the cooling pin 13 as shown in a schematic front view in FIG. A heat radiating cooler 10 provided with a plurality of circular heat pipes 11 having a cylindrical columnar heat pipe 11 in a penetrating state and formed at the edge of the cooling fin 13 to be thinner than the columnar heat pipe 11 ). However, in the case of the Zalman Tech patent, as shown by a schematic plan view in FIG. 3 (b) due to the diameter of the center columnar heat pipe 11, a vortex is generated on the back surface of the columnar heat pipe 11, A resistance is generated and an ineffective space (indicated by a dashed line) in which the air (arrow) of the cooling fan 3 is not in contact with the back surface of the columnar heat pipe 11 is stagnant is generated, I can not.

On the other hand, a technique capable of improving the heat radiation performance by removing the air congestion region 5 of Fig. 3 (b), which is a problem in the above-described Zalman Tech, is disclosed in U.S. Patent No. 7,619,888 Heat dissipating device, applicant: Delta Electronics). However, such a Delta Electronics patent has a problem that a flat heat pipe 11 is installed perpendicularly to the cooling fin 13 as shown in Figs. 4 (a) and 4 (b) The contact area of the upper end of the flat plate heat pipe 11 and the cooling fin 13 is formed only in a straight line at the center of the cooling fin 13, The desired heat radiation efficiency can not be expected because the contact area of the heat pipe 11 with respect to the cooling fin 13 is very limited.

KR 10-0631050 KR 10-2004-0019150 KR 10-0411135 KR 10-0766109 KR 10-0790790 KR 10-0981155 KR 10-871457 KR 10-2011-0033596 US 7,619,888 B2

In order to solve the above-described problems, the present invention provides a hybrid cooler as a heat dissipation solution for a heat source such as an IC chip. These hybrid coolers are compact in arrangement with a combination of different heatpipes, such as cylindrical heatpipes and flat plate heatfits.

In the present invention, the cylindrical and / or flat heat pipes are connected in the vicinity of the center and the edge of the cooling fin, respectively. The intersection points where the heat pipes and the cooling fins cross each other are arranged in a row on the cooling fins. When the intersection arrays are located near the corners of the cooling fins, they are arranged in the main heat- Line (sub-TEL).

The presence of the heat dissipation line on the cooling fin can simultaneously result in the heat being uniformly distributed to the cooling fin by simultaneously transferring the heat from the heat pipe to the center portion and the edge of the cooling fin. By the preferable arrangement of the heat dissipating lines, the forced convection air by the cooling fan smoothly flows with almost no air congestion area. Furthermore, the main and sub-heat-radiating lines may be formed at different lengths to further form a heat-radiating effective area in front of or behind the center or edge heat-radiating line so that the flowing air by the cooling fan can effectively work for cooling.

In the present invention, the heat pipes constituting the main and subdissipation lines are formed to have different sizes, that is, diameters in the case of cylindrical tubes and thicknesses in the case of flat-plate heat pipes. Preferably, when the size of the heart pipe constituting the main heat-radiating line is larger than the size of the heat pipe constituting the sub-heat-radiating line, the heat radiation performance is excellent. The reason for this is that since the vicinity of the edge of the cooling fins in contact with the outside air of the cooler can dissipate more effectively than the center portion of the cooling fins that are relatively blocked from the outside air of the cooler, It is more effective to allow more than the amount of heat through the line to be delivered.

The present invention may include a cooler base that directly contacts the heat source to transfer heat. The cooler base is made of a thermally conductive material. One surface of the cooler base is formed to maximize the contact surface with the heat source, and the other surface is preferably formed to be in contact with the heat pipe and securely fixed. One surface of the cooler base may have a pedestal shape to match the shape of the heat source and the other surface may have a wave shape corresponding to the external shape of a plurality of cylindrical heat pipes or a flat shape matching the external shape of the plate heat pipe .

The present invention provides a hybrid cooler that transfers heat from a heat source such as an electronic device through a heat pipe to a plurality of plate-like cooling fins in which a plate material of a thermally conductive material is stacked at a predetermined interval to radiate heat. A main heat pipe composed of a cylindrical or flat heat pipe forms one or more thermal emission lines TEL along the edge of the cooling fin and the main heat pipe absorbs the absorbed heat to the main heat pipe It passes from one part to the other through the main heat dissipation line. A sub heat pipe made of a cylindrical or flat heat pipe having a size different from that of the main heat pipe forms one or more sub heat dissipation lines at the center of the cooling fin, To the sub-heat-dissipating line through the other part. The sub-heat-dissipating line is formed to have a different length from the main heat-dissipating line, thereby forming a heat-dissipating effective area on the cooling fin. Also, the cooling fins and the cooling fins vertically disposed on the sides of the plurality of cooling fins can be forced to blow in the direction of the cooling fins, thereby enabling effective cooling in the space between the cooling fins. The cooler base, which is made of a thermally conductive material, is formed so that one side is in direct contact with the heat source, and one side thereof can form a pedestal. In addition, the cooler base has a shape conforming to the outer shape of a plurality of heat pipes so that the heat transmitted from one side to the heat source is transferred to the other side through the interior of the cooler base, .

In the hybrid cooler of the present invention, the performance of the cooler can be improved for the following reason by arrangement and structural combination of the above components.

First, the heat distribution on the cooling fins is uniform. The combination of the main and subdissipation lines, located near and at the corners of the cooling fin, respectively, can induce this thermal distribution uniformity.

Second, the introduction of the main and subdissipation lines can provide an effective heat transfer mechanism. Since the main heat pipe is different in size from the sub heat pipe, the heat transferred from the heat source preferably flows through the cooling fin (not shown) because the diameter of the main heat pipe is preferably larger than that of the sub heat pipe By the main heat pipe at the periphery of the cooling fin and by the sub heat pipe at the center portion of the cooling fin. The main heat-radiating line is able to absorb more heat than the sub-heat-radiating line because it is constituted by the main heat pipe directly or indirectly contacting the cooler base and transmitting heat from the heat source. This is because the sub-heat-radiating lines consist of sub-heat pipes, which receive heat through the main heat pipe in contact with the cooler base.

Third, since the main heat-radiating lines and the sub-heat-radiating lines have different lengths, additional heat-radiating effective areas (areas) can be formed on the cooling fin in front of or behind the main or sub-heat-radiating lines. Preferably, the sub heat dissipation line is shorter than the main heat dissipation line, and the heat dissipation effect at the effective heat dissipation area is excellent. The effective heat dissipation area is formed in front of or behind the sub-heat dissipation line, so that the blowing air can effectively dissipate heat in the area on the cooling fin.

Fourth, the hybrid cooler is compact and slim in size. In order for the heat transfer function of the heat pipe to be optimized, the main and sub heat pipes must be uniformly bent so that the inner wick structure is not deformed when the main and sub heat pipes are bent. In the configuration of the preferred hybrid cooler, the diameter of the cylindrical heat pipe serving as the sub heat pipe (or thickness in the case of a flat plate heat pipe) is smaller than that of the main heat pipe. This means that the sub heat pipe can be bent with a smaller curvature, i.e., a sharper interior angle. When the bent portion is uniformly bent so as to have the U shape in the limited space inside the cooler, the straight line portion between the two bent portions is shortened, that is, the two bandings are formed close to each other. These sub heat pipes are uniformly bent so that the heat transfer performance of the heat pipes is maintained optimally. These sub heat pipes can form a sub heat dissipation line on the cooling fin, thereby contributing to optimal heat dissipation performance. The main heat pipe is also U-shaped and uniformly bent and deformed to maintain optimal heat transfer performance while keeping the shortest length between the two bent portions, but maintaining the optimal straight portion. Therefore, the hybrid cooler can be formed in a compact and slim size while exhibiting high heat radiation performance.

Fifth, the present invention can include a cooler base. Such a cooler base is formed of a thermally conductive material and may include a pedestal on the side in contact with the heat source. A cooler base having a shape adapted to the shape of one or more main or sub heat pipes can effectively transfer heat from the heat source to the main or sub heat pipes.

For a better understanding of the present invention, reference should be made to the accompanying drawings. It should be understood, however, that the drawings are only illustrative and do not limit the present invention.
1 is a schematic front view illustrating a general type cooler,
2 is a schematic perspective view illustrating a general type cooler,
3 is a schematic front view and a plan view illustrating a general type cooler,
4 is a schematic front view and plan view illustrating another general type cooler,
5 is a perspective view illustrating a cooler according to a first embodiment of the present invention,
6 is a front view illustrating a cooler according to a second embodiment of the present invention,
7 is a front view illustrating a cooler according to a third embodiment of the present invention,
8 is a front view illustrating a hybrid cooler according to a fourth embodiment of the present invention,
Fig. 9 is a plan view of Fig. 8,
10 is an exploded perspective view of a hybrid cooler according to a fifth embodiment of the present invention,
11 is a perspective view for explaining a state in which the hybrid cooler of FIG. 5 is assembled,
Fig. 12 is a front view of Fig. 11,
Fig. 13 is a plan view of Fig. 11,
14 is a schematic front view illustrating the fifth embodiment of Fig. 10, Fig.
15 is a schematic plan view illustrating a hybrid cooler according to the sixth and sixth embodiments of the present invention,
16 is a schematic plan view illustrating a hybrid cooler according to a seventh embodiment of the present invention,
17 is a schematic front view illustrating a hybrid cooler according to an eighth embodiment of the present invention,
18 (a) is a perspective view of a heat source having a height lower than that of the central portion; (b) is a perspective view illustrating a hybrid cooler according to a ninth embodiment of the present invention including a cooler base in which a single pedestal is formed in a shape in which one side of a cooler base is protruded; (c) is a perspective view illustrating a hybrid cooler according to a ninth embodiment of the present invention in which the shape of a cooler base and a main heat pipe are deformed to match the shape of a heat source to form a pedestal, that is, a structural pedestal is formed,
19 is a schematic front view illustrating a hybrid cooler according to a tenth embodiment of the present invention,
20 is a schematic front view illustrating a hybrid cooler according to an eleventh embodiment of the present invention,
FIG. 21 is a schematic front view illustrating a hybrid cooler according to a twelfth embodiment of the present invention; FIG.
22 is a schematic front view illustrating a hybrid cooler according to a thirteenth embodiment of the present invention;
23 is a graph showing the thermal resistance (R _th ) at various calorific values in the hybrid cooler according to the fifth and ninth embodiments of the present invention.

Preferred embodiments of the present invention will be described below with reference to the drawings.

As shown in FIG. 5, the cooler of the first embodiment of the present invention includes a plurality of cooling fins 51, a main heat pipe 61, and a sub heat pipe 63. The cooling fin (51) serves to distribute heat to and from the main heat pipe (61) and the sub heat pipe (63). The cooling fin 51 is preferably made of a heat conductive material such as copper, aluminum and alloys thereof, and may be formed as a heat sink having a plurality of protrusions (in the form of cooling fins). A plurality of cooling fins 51 are stacked at intervals, and the main heat pipe 61 and the sub heat pipe 63 penetrate through and are fixed.

The main heat pipe 61 is composed of a plurality of cylindrical heat pipes constituting a finger type finger structure. The main heat pipe 61 may be formed by bending into a U-shape or L-shape having a linear heat absorbing portion 61a which is in contact with the cooler base 50. Preferably, the main heat pipe 61 is transferred to one portion of the heat source 9, that is, to the heat absorbing portion 61a, and this heat is transferred to the other portion 61c. This portion 61c is formed so as to intersect with the cooling fin 51 in a line in the corner portion of the cooling fin 51. [ The main heat pipe 61 may be deformed according to design conditions. The heat is transferred vertically to the upper cooling fin among the plurality of cooling fins along the main and sub heat pipes 61 and 63 to be transferred. The heat pipes may be configured to include the hot spot described later of the cooler base 50 so that the heat across the cooler base 50 can be quickly transferred to the upper cooling pin 51, , As well as the cooling efficiency of the cooling fin 51 can be increased.

The main heat pipe 61 determines the quantity and size (the diameter in the case of a cylindrical shape and the thickness in the case of a flat plate type) depending on the size of the heat source 9 and the heat absorbing portion 61a and the pair And a pair of condensing portions (or heat radiating portions) 61c. The pair of condensing portions 61c are coupled to each other in a direction perpendicular to the cooling fins 51 in a crossing manner. Here, the heat absorbing portion 61a serves as a vaporizing portion for absorbing heat from the heat source 9 to vaporize the working fluid. The heat dissipating portion 61c serves as a condensing portion where the working fluid vaporized inside the heat pipe reaches and is condensed into liquid again by releasing heat by the cooling fin 51. [ This configuration is preferable for the main heat pipe 61 to absorb the heat transferred to one portion of the heat absorbing portion 61a and to transmit the heat to the cooling fin through the heat radiating portion 61c. Therefore, the heat of the heat source is dissipated.

The bent portion 61b should be bent to have a critical curvature _Rcr for uniform banding. This is to prevent damage to the wick structure and contraction of the working fluid (liquid and gas) at the time of bending, and that the cross section of the radius r of the inner tube of the heat pipe has a bending deformation it means. When a cylindrical heat pipe is bending in a conventional manner, the bending radius R should generally be greater than or equal to the threshold R _cr of uniform banding. Moreover, the curvature R _cr of uniform bending is more a radius "r" is the reduction of the cylindrical tube that is, decreases the more thin cylindrical, R _cr shall be greater than the radius of the pipe r to the uniformity banding, R ≥ R _cr and R _cr> > r. If the radius of the banding curvature radius and the radius of the tube are R <&gt; r, that is, if they are bent too sharply, the heat pipe will not be an optimal capillary force and flow condition of the working fluid, Is preferably larger than the radius r of the cylindrical container. In FIGS. 5 and 6, R and r1 denote R _cr And r. As a result, the cylindrical heat pipe to be bent can maintain the heat transfer performance in the optimum state when the bending flexural curvature R is larger than the radius r of the heat pipe.

The main heat pipe 61 is formed such that the bent portion 61b is uniformly bent under the condition of R >> r. 5, the length of the heat absorbing portion 61a is determined according to the size of the heat source 9, and the heat radiating portion 61c formed vertically starting from the bent portion 61b is positioned near the edge of the cooling fin 51 Crossed. The width of the heat dissipating portion 61c is MW1, which is similar to the width of the cooling fin 51. The heat dissipating portion 61c is provided with a clearance of the contact surface by interference fit or soldering or brazing at the time of penetration with the cooling fin 51, Lt; RTI ID = 0.0 &gt; minimization &lt; / RTI &gt; The main heat pipe 61 is composed of a plurality of cylindrical heat pipes and intersects with the cooling fin 51 so that the intersections thereof are arranged in a line while maintaining a constant interval in the vicinity of the edge of the cooling fin 51 . The arrangement of these intersections forms the main heat-releasing line L1 in the vicinity of the edge of the cooling fin 51. As the main heat pipe 61 is uniformly bent in a U shape, both ends of the heat radiating portion 61c form two main heat radiating lines L1, one at each of opposite sides of opposite sides of the cooling fin.

The main heat pipe 61 is engaged with the cooler base 50. The cooler base is a thermally conductive material and is in the form of a block or a plate and the heat absorbing portion 61a and the heat source 9 are in contact with both surfaces of the cooler base 50 to receive the heat of the heat source 9, It is a role to deliver. The cooler base 50 in contact with the heat source 9 may be formed in the form of a pedestal according to the shape of the heat source 9 (not shown). In addition, the main heat pipe 61 can be directly contacted with the heat source 9 in the absence of the cooler base 50 to receive heat from the heat source.

The sub heat pipe 63 has a size of the same radius r1 as that of the main heat pipe 61. [ And is formed in a shape similar to that of the main heat pipe 61. The plurality of sub heat pipes 63 are seated inside the U-bend main heat pipe 61 with the width of SW1. This is an arrangement in which the sub heat pipe 63 distributes heat to the central portion of the cooling fin 51 to distribute the uniform heat across the cooling fin 51. 5, the sub heat pipes 63 intersect with the cooling fins 51 at the central portions of the plurality of cooling fins 51, and the sub heat-radiating lines L2 ). It is preferable that the sub-heat-dissipating line L2 is in parallel with the main heat-dissipating line L1 because the air forcedly blown by the cooling fan 57 flows in the same direction to increase the cooling efficiency .

The cooling fins 51 can be stacked horizontally from the lower bottom portion of the main and sub heat pipes 61 and 63 to be stacked on top. However, the cooling fins 51 can not be laminated down to the bottom of the bottom of the main 61 and sub 63 heat pipes, i.e., to the area close to the cooler base 50. This is because there is a curved portion bent at the curvature R in the heat pipe. Therefore, in the cooler of this embodiment, there is a region where a finless zone (h1: a cooling fin 51) can not be installed in the lower portion. Due to the presence of the finless region h1, The cooling efficiency is lowered.

In this embodiment, the length of the main radiating line L1 is the same as that of the sub-radiating line L2, and the sub-radiating line L2 is disposed at the center of the cooling fin 51. [ This is for the central portion of the cooling fin 51 to effectively contribute to heat radiation. However, since the lengths L1-a and L2-a of the main and subdissipation lines L1 and L2 are the same, a "heat radiation effective area " Since the radius r1 of the main and sub heat pipes 61 and 63 is the same as the radius of the heat absorbing portion 61a of the main heat pipe 61, The contact of the heat absorbing portion 63a of the heat exchanger 63 becomes very limited. This is because the curvature R of the curved portion 63b is very large for uniformly bending the sub heat pipe 63 as shown in the figure and the straight heat absorbing portion 63a between the curved portions 63b is very short to be. Therefore, although the performance of the cooler according to this embodiment can be improved as compared with the general cooler due to the introduction of the sub heat pipe 63, it is difficult to expect a high cooling performance at present.

6 shows a second embodiment of the present invention. The cooler of this embodiment is generally similar in structure to the cooler of the first embodiment of Fig. 5, except that the length of the heat absorbing portion 63a of the sub heat pipe 63 is longer than that of the first embodiment. This is intended to increase the thermal contact between the sub heat pipe 63a and the heat absorbing portion 61a of the main heat pipe 61. [ That is, the second embodiment improves the disadvantage of the basic first embodiment.

However, as shown in Fig. 6, the main heat pipe 61 has increased in width as the width MW2 of the heat absorbing portion 61a is increased. This is because the length of the heat absorbing portion 63a of the sub heat pipe 63 positioned inside the cooler is increased. The widths MW2 and SW2 of the inner space (the inner side of the U-shape) of the main and sub heat pipes 61 and 63 have increased, so that the size of the cooler according to the second embodiment is generally increased as compared with the first embodiment . This increase in size can be a limitation for electronic devices with limited internal space requirements.

In the second embodiment, the expansion of the heat absorbing portion 63a of the sub heat pipe 63 causes the enlargement of the width SW2 forming the internal space and the expansion of the heat dissipating portion 63c forming the sub heat dissipating line L2 Resulting in the position shifted in the direction of the edge (edge) from the central portion of the cooling fin 51. The state in which the sub heat dissipation line is close to the edge of the cooling fin 51 is difficult to uniformly distribute the heat on the cooling fin 51 and heat is concentrated on the outer periphery of the cooling fin 51. [ Therefore, the cooling performance of the cooler of the second embodiment of the present invention is less improved than that of the first embodiment of the present invention.

7 illustrates a cooler according to a third embodiment of the present invention. Basically, this cooler has been proposed to improve the uneven heat distribution in the cooling fins 51 generated in the cooler of the second embodiment. As shown in Fig. 7, the arrangement of the components is almost the same as that of the second embodiment. However, in the sub heat pipe 63, a secondary bending portion 63d exists between the bent portion 63b and the heat dissipating portion 63c. The secondary bending portion 63d starts from the bent portion 63b and is bent in the direction toward the upper straight portion of the sub heat pipe 63 and toward the inside of the cooler. The curved shape allows the width SW3 of the heat dissipating portion 63c to be smaller than that of the second embodiment, so that the heat dissipating portion 63c is positioned at the center of the cooling fin 51. [ In the second bend portion 63d, if the bend radius is the optimum uniform change radius R, it is the same as the curvature of the first bend portion 63b. As a result, the sub heat pipe 63 is formed into a jar shape in which the two portions are bent in different directions.

The heat transferred from the main heat pipe 61 is transferred to the heat absorbing portion 63a of the sub heat pipe 63 and the heat dissipating portion 63c of the sub heat pipe and the heat absorbing portion 63b of the main heat pipe The heat radiating portions 61c are respectively positioned and fixed near the center of the cooling fin 51 and the edge. Accordingly, the heat of the heat source 9 is transmitted to the central portion and the corner portion of the cooling fin 51, and heat can be uniformly distributed to the entire cooling fin 51. Therefore, the third embodiment of the present invention is similar to the second embodiment The cooling performance can be further improved.

However, in the third embodiment, the width MW2 of the main heat pipe 61 must be maintained in an enlarged state as in the second embodiment. Therefore, there is a disadvantage that it is still large. In addition, the cooler of the third embodiment has the pin-less area h2 which is wider than the pin-less area h1 of the first and second embodiments. This is because the cooling fins 51 can not be installed at the lower portion due to the bending curvature R due to the secondary bending of the sub heat pipe 63. [ As the number of the cooling fins 51 that can be installed as described above is reduced, the heat radiation efficiency is reduced as a result. The cooler of the third embodiment of the present invention is consequently reduced in heat dissipation performance of the cooler compared to the coolers of the first and second embodiments due to the increase of the pinless area h2 and the decrease of the number of the installation cooling fins 51 have.

As shown in Fig. 8, the fourth embodiment of the present invention improves the problems of the first to third embodiments. This cooler has the same structure as that of the first embodiment except that the radius r2 of the sub heat pipe 63 tube is smaller than the radius r1 of the tube of the main heat pipe 61. [ The difference in the heat pipe size can be configured to have an appropriate size in the region of the heat absorbing portion 63a of the sub heat pipe 63. [ Further, the sub heat pipe 63 can be deformed by bending uniformly with the bending curvature of R2. Here, the curvature radius R2 is smaller than the uniform banding curvature R of the main heat pipe 61. [ This means that the length of the heat absorbing portion 63a of the sub heat pipe 63 can be kept the same as that of the third embodiment in which the thermal contact is maximized. In addition, in the sub heat pipe 63 of the fourth embodiment, The width SW4 of the space can be made equal to the SW3 of the second embodiment of the present invention. In some cases, SW4 can be formed smaller than SW3. In this structure and arrangement, the vertical heat absorbing portion 63c of the sub heat pipe 63 can maintain a certain distance from the heat absorbing portion 61c of the main heat pipe 61, Since the cooling fins 63c can be positioned at the center of the cooling fins 51, it is possible to induce uniform thermal distribution on the cooling fins 51.

In addition, the cooler of the fourth embodiment does not require secondary bending as in the second embodiment, and the bending-deformed sub heat pipe 63 has a smaller radius of curvature (R2) because the radius r2 of the tube is smaller As shown in Fig. This condition means that the pin-less area h3 of the sub heat pipe 63 can be formed small independently of the pin-less area h1 of the main heat pipe 61 applied to the first to third embodiments do. Therefore, since the cooling fin 51 can be additionally provided below the starting point of the finless region h3 of the sub heat pipe 63, the cooler of the fourth embodiment has improved heat dissipation more than the coolers of the first to third embodiments. Performance can be expected.

The cooler according to the fourth embodiment has a structure in which the main heat pipe 61 and the sub heat pipe 63 located on the outer and inner sides of the cooling fin 51 have different tube radii, can do. Preferably, the tube radius of the sub heat pipe (63) is smaller than the tube radius of the main heat pipe (61). 9, it is preferable that the thickness LW2 of the sub-heat-radiating lines L2 arranged in a line is thinner than the thickness LW1 of the main heat-radiating line L1 composed of the main heat pipes 61. [ Generally, the greater the size of the heat pipe, the greater the amount of working fluid contained in the heat pipe. Therefore, the heat transfer capacity of the main heat pipe 61 located near the edge of the cooling fin 51 is located at the center of the cooling fin 51 Is larger than that of the sub heat pipe (63). 9, since the length L2-a of the sub-heat dissipation line is shorter than the length L1-a of the main heat dissipation line, the cooling fin 51 has an effective heat dissipation area (an area required for heat dissipation) Lt; / RTI &gt; This effective heat dissipation area means an area where the forced air can be effectively cooled. Therefore, the thinner and shorter the sub-heat-radiating line (L2) composed of the sub heat pipe (63) minimizes the air congestion area around the heat pipe to induce smooth cooling air flow on the plurality of cooling fins (51) can do. As a result, the hybrid cooler according to the fourth embodiment of the present invention can achieve significantly higher heat radiation performance than the coolers of the first to third embodiments.

10 to 14 illustrate a hybrid cooler according to a fifth embodiment of the present invention. This embodiment is structurally similar to the hybrid cooler of the fourth embodiment. However, the sub heat pipe 63 is composed of one flat heat pipe instead of a plurality of cylindrical heat pipes. 10, the sub heat pipe 63 is formed of a heat absorbing portion 63a, a pair of bent portions 63b, and a pair of vertically disposed heat dissipating portions 63c. The bending radius R3 of the bending portion 63b in the case of a plurality of plate heat pipes may be different from that of the main heat pipe 61 and stacked . The laminated structure of the sub heat pipe 63 is generally implemented by a person skilled in the art and will be omitted from the description.

As mentioned above, even if the hybrid cooler according to the fourth embodiment has good cooling performance, it is inevitable that the above-described thermoelectric superposing area OL shown in FIG. 2 occurs between the cylindrical heat pipes on the cooling fin Do. Areas that are inefficient for this cooling can be removed by using a planar heat pipe. Therefore, the hybrid cooler of the fifth embodiment can further improve the heat radiation performance. In this embodiment, the working fluid flow rate in the planar heat pipe 63 in Fig. 10 can be formed to be at least equal to or larger than the total amount of the working fluid in the cylindrical sub heat pipe of the fourth embodiment in Fig. This is because even if the thickness of the plate type sub heat pipe 63 of FIG. 10 is smaller than the radius of the cylindrical sub heat pipe 63 of FIG. 9, that is, LW2, by regulating the number and size of the channels in the plate type sub heat pipe It is possible. In addition, in the fifth embodiment, the eddy current (or air stagnation region) caused by the forced air blowing in the vicinity of the plate-type sub heat pipe 63 is hardly generated as compared with the cylindrical sub heat pipe. Therefore, the hybrid cooler of the fifth embodiment can exhibit a very excellent heat radiation performance.

The sub heat pipes 63 installed in the linear section (inside) formed by the plurality of main heat pipes 61 can reduce the space for installation and can efficiently transfer heat from the main heat pipe 61 to the main heat pipe 61 in a usual manner And is in contact with and joined to the heat pipe 61. The main heat pipe 61 is coupled to a cooler base 50 of a thermally conductive material and the cooler base 50 is composed of a core conducting base 53 and a frame 55. One surface of the thermoelectric plate 53 is coupled to the heat absorbing portion 61a of the main heat pipe, and the other surface is brought into contact with the heat source. The periphery of the thermoelectric plate 53 may be formed with a fastening block 53b protruding from the upper portion of the thermoelectric plate 53 and / or the fixed blade 53a. The fastening block 53b is a structure for fastening to the frame 55 with screws SC or bolts. In addition, the thermoelectric plate 53 can form a pedestal on the other side for effective and direct contact with the heat source (not shown in Fig. 10). The thermoelectric plate 53 and the frame 55 are not limited to the method of coupling by the fixed blade 53a and the fastening block 53b described above.

The frame 55 is preferably fixed on the circuit board on which the heat source is mounted. The frame 55 is a structure in which the heat source is transferred to the thermoelectric plate 53, the main heat pipe 61 and the sub heat pipe 63 on the circuit board or other devices mounted on the circuit board to cause the circuit board or the device to malfunction They are separated from the circuit board or the elements so as to prevent them. The frame 55 dissipates the heat of the heat source transferred through the thermoelectric plate 53. This frame 55 not only firmly fixes the main heat pipe 61 and the sub heat pipe 63 together with the heat radiating member 51 to the electronic product but also easily removes it. 10, the frame 55 is formed with a hole 55c as shown to permit the contact of the heat source and the heat transfer plate 53. As shown in Fig. The frame 55 may be provided with a seating step 55b on the inner circumferential surface of the hole 55c as shown in the figure so that the heat transfer plate 53 is seated and stably engaged. 11 and 13, the cooling fan may be installed on one side of the frame 55 perpendicularly to the corners of the plurality of cooler pins 51. The cooling fan 57 may be a sirocco type fan, To prevent diffusion to the outside and to concentrate into the interior of the cooler.

The thermoelectric plate 53 can be fitted to the hole 55c of the frame 55 by a method of shrinking. In this method of joining the heat, when the frame 55 is heated and the central hole 55c is inserted in the expanded state and the thermoelectric plate 53 is cooled in the fitted state, the frame 55 is contracted, It is a way to be firmly coupled. In addition, the cooler base 50 can be formed such that the thermoelectric plate 53 and the frame 55 are integrally formed by casting or the like.

As shown in Fig. 14A, the sub heat pipe 63 is formed of a flat plate heat pipe and can be formed to be thinner than the diameter LW2 of the cylindrical sub heat pipe 63 of the fourth embodiment shown in Fig. 9 have. In the fifth embodiment, the sub heat pipe 63 has a bent portion 63b bent at a bending radius R3, and this curvature R3 is a radius of curvature of the sub heat pipe 63 of the fourth embodiment shown in Fig. 8 (R2). In other words, the bent portion 63b of the sub heat pipe 63 can be uniformly and sharply bent without contraction of the container as compared with the fourth embodiment. The width SW5 of the inner space of the sub heat pipe 63 can be further reduced than in the case of the fourth embodiment. Since the fifth embodiment has a structure capable of reducing the bending width MW1 of the main heat pipe 61, it is possible to improve the heat radiation performance of the cooler and at the same time reduce the overall size.

However, the spacing of the vertical heat radiating portions 63a of the sub heat pipes 63 may be formed so as to be too close to each other in the inner space, that is, to be offset toward the center of the cooling fin 51. [ Such a structure is likely to cause uneven distribution of heat on the cooling fins 51. On the other hand, the outer space width MW1 of the main heat pipe 61 depends on the size of the heat source 9. Therefore, the cooling performance is inefficient when the sub heat pipe 63 is formed to be smaller than the thickness (width: LW2) of the sub heat pipe 63 of the fourth embodiment. Preferably, the thickness LW2 of the sub heat pipe 63 should be at least equal to or greater than that of the fourth embodiment. In the fifth embodiment, the bending curvature R3 of the flat plate-type sub heat pipe 63 is different from the bending curvature R1 of the main heat pipe 61, The lease area h4 and the pin-less area h1 formed by the main heat pipe 61 can be formed differently. The fineless region h4 of the present embodiment can be formed smaller than the finless region h3 of the fourth embodiment, which means that the number of stackable cooling fins 51 can be increased.

The hybrid cooler according to the sixth embodiment of the present invention is shown in Fig. The main heat pipe (61) and the sub heat pipe (63) are each composed of a single flat heat pipe and a plurality of cylindrical heat pipes. In the sixth embodiment, the plate main heat pipe 61 is not formed with the above-described thermoelectric overlap region OL at the intersection point that intersects with the cooling fin 51. Furthermore, the main heat pipe 61 can form a sufficient fluid channel therein, and thus can transfer more heat efficiently through the inside of the container than a plurality of cylindrical heat pipes. That is, the main heat-radiating line L1 formed in the vicinity of the edge of the cooling fin 51 does not form the thermoelectric overlap region OL of heat transmitted from the heat source 9 through the heat pipe on the cooling fin, The pipe 61 is capable of making a planar contact favorable to heat transfer with the cooler bases 50 and 53. [ The sub heat dissipation line L2 formed on the cooling fin 51 by the plurality of sub heatpipes 63 diffuses heat transferred from the heat source 9 via the main heatpipe 61 onto the cooling fin 51 . Such a heat pipe or the like can be expected to have a better heat transfer performance than the cooler of the fifth embodiment. The cooler according to the sixth embodiment is configured such that the main heat pipe 61 and the sub heat pipe 63 are formed in different shapes and the thicknesses LW1 and LW2 of the main heat radiating line L1 and the sub heat radiating line L2, It is a hybrid cooler from the viewpoint that LW2 is different.

Another hybrid cooler according to a seventh embodiment of the present invention will be described with reference to FIG. The main heat pipe (61) and the sub heat pipe (63) are all made of a flat plate heat pipe. The thickness LW1 of the main heat pipe 61 is thicker than the thickness LW2 of the sub heat pipe 63 so that more heat can be transferred to the vicinity of the edge of the cooling fin 51 to dissipate heat. In the seventh embodiment, since the main and sub heat pipes 61 and 63 do not form the heat transfer overlap region OL around the heat pipe, the heat radiation efficiency on the cooling fin 51 is excellent. In addition, since all of the heat pipes in the heat transfer side are of the plate type, the contact between the main heat pipe 61 and the heat source 9 or the cooler bases 50 and 53 and the contact between the sub heat pipe 63 and the main heat pipe 61 are excellent in surface contact. Therefore, the heat dissipation performance of the hybrid cooler of the present embodiment is superior to the other embodiments.

The hybrid cooler of the eighth embodiment will be described with reference to Fig. The main heat pipe 61 is constituted by a plurality of cylindrical heat pipes, and the sub heat pipe 63 is constituted by a straight plate type or cylindrical heat pipe without bending. In the eighth embodiment, the sub heat pipe 63 is vertically stacked on the thermoelectric plate 53 of the cooler base 50 located above the main heat pipe 61. [ Here, the sub heat pipe 63 may be composed of one or a plurality of cylindrical heat pipes or flat plate heat pipes. In this embodiment, since the heat transferred from the main heat pipe 61 to the sub heat pipe 63 via the cooler base 50 (53) is transmitted from the end (lower end) of the straight heat pipe, (Lower contact area). Therefore, the cooling efficiency of the cooler may be somewhat lowered. However, since the heat of the heat source 9 is dividedly transmitted to the central portion and the edge of the cooling fin 51 due to the presence of the main and sub heat pipes 61 and 63, uniform heat distribution on the cooling fin 51 can be induced Therefore, heat dissipation performance is superior to general cooler.

A hybrid cooler according to a ninth embodiment of the present invention will be described with reference to Fig. 18 (a). The hybrid cooler of the present embodiment includes a cooler base having a pedestal fitted to the external shape of the heat source 9. Here, the heat source 9 is composed of a central hot spot 91 and a peripheral portion 92 composed of various electronic components, and the central high temperature point 91 is formed to be lower in height than the peripheral portion 92 . In this embodiment, when the hybrid cooler of the fifth embodiment is contacted and fixed to the heat source 9, one side of the cooler bases 50 and 53 is configured to have a shape for effective thermal contact with the heat source 9, And the other side may be formed in a shape including a heat absorbing portion of the main heat pipe 61.

18 (b), the cooler base 50 is formed with a pedestal 53c having a shape protruding so as to directly contact with the high-temperature point 91 of the heat source 9. [ The pedestal 53c is integrally formed as a part of the cooler base 50 or the thermoelectric plate 53. As shown in the drawing, the heat of the high temperature point 91 is transferred to the plurality of main heat pipes 61 via the pedestal 53c. Accordingly, the hybrid cooler including the pedestal type cooler base 50 can expect a higher cooling efficiency than the hybrid cooler having the pedestalless cooler base 50 as in the other embodiments.

Another pedestal configuration can be configured to improve thermal contact between the heat source and the cooler. 18 (b) is not formed on one side of the cooler base 50 in contact with the heat source, the cooler base 50 is configured in a shape matching the shape and size of the high temperature point 91 . This method can be achieved by adjusting the shape of the heat absorbing portion 61a and the above-described finless region h1 to match the shape and depth of the high temperature point 91 of the heat source as shown in Fig. 18C. In this way, the structural cooler can be said to be a "structural pedestal 53d" because it is installed in accordance with the high temperature point 91 of the heat source 9 by structural modification and combination of the components of the hybrid cooler. As in the case of the cooler bases 50 and 53 having the integral pedestal 53c of FIG. 18 (b), the structural plates 50 and 53 and the plurality of main heat pipes 61, The pedestal 53d effectively causes heat transfer from the heat source 9 to the main heat pipe 61 as shown in Fig. 18 (c).

As shown in FIG. 19, the cooler base 5 may be formed of a thicker thermoelectric block 54 than the thermoelectric plate 53. One side of the thermoelectric block 54 is in direct contact with the heat source 9 and the other side of the thermoelectric block 54 is in contact with the main heat pipe 61 so that the heat of the heat source 9 is uniformly discharged and transmitted to the main heat pipe 61 It plays a role.

As shown in Fig. 20, the thermoelectric block 54 described above may be formed with a seating sheet 54a for receiving and seating a part of the circular heat pipe. It is preferable that the seating sheet 54a is formed in a semicircular shape corresponding to the shape of the circular heat pipe as shown in the figure. This seating seat 54a accommodates a part of the circular heat pipe and extends the contact area by surface contact, so that the heat of the heat source 9 can be smoothly transmitted to the circular heat pipe. Therefore, the thermoelectric block 54 can improve the heat dissipation performance of the main heat pipe 61 and the sub heat pipe 63.

Referring to Fig. 21, the thermoelectric block 54 described above may be provided with a seating sheet 54a on a surface facing the heat source 9. [ In this case, the main heat pipe 61 must be machined in a semicircular cross section as shown for surface contact with the heat source 9. Since the thermoelectric block 54 is housed in the seating seat 54a with a portion of the main heat pipe 61, the heat of the main heat pipe 61 is effectively transmitted. Further, the main heat pipe 61 and the sub heat pipe 63 may be stacked in an orthogonal state as shown by the heat-generating block 54. [

Referring to FIG. 22, the main heat pipe 61 and the sub heat pipe 63 may be connected through the cooler base 50 as shown in FIG. The cooler base 50 can be formed in the shape of a block or a plate as shown in the figure. This cooler base 50 is able to distribute the heat of the main heat pipe 61 to the sub heat pipe 63 by distributing the heat of the main heat pipe 61 by mediating the heat of the main heat pipe 61 to the sub heat pipe 63 have. In addition, the cooler base 50 can transfer heat more smoothly as the seating seat 54a described above is formed and the sub heat pipe 63 is accommodated in the seating seat 54a.

In order to facilitate understanding of the present invention, a test was performed to measure the heat radiation performance of the cooler as follows. The general commercial cooler and the cooler of the present invention evaluated the performance by applying various heat loads as thermal design power (TDP) and measuring the thermal resistance at that time. The "thermal resistance (R _th)" is meant the value of the temperature difference shown by the degree to prevent the heat flow (typically per unit amount of heat) from any contact with the connection used here and, R _th = (T _a - T _j) / Q. Here, T _a is the ambient temperature (° C), T _j is the junction temperature (° C), and Q (Watt) is the input heat amount (or power) of the heat source that can be considered as TDP.

Since the higher the degree of heat transfer at the interface is, the lower the value of the thermal resistance is, the value is a value that can quantify the cooling performance of the cooler. In general, the thermal resistance R _th decreases as the thermal load increases, and since it has the minimum value by increasing again at a certain heat load, the thermal load at the minimum value of the thermal resistance can be regarded as the TDP of the cooler. In other words, the maximum value at which the cooler can dissipate the heat (heat load) of the heat source, that is, the cooling capacity of the cooler. Generally, the thermal design power (TDP) and size of a cooler are determined by the amount of heat dissipated by the heat source and the size of the allowable space inside the electronic device.

The characteristics of the cooling performance of the hybrid cooler of the fifth embodiment and the ninth embodiment are as follows. Commercial 1 and commercial 2 are general commercial coolers and are constructed of cylindrical heat pipes of the same radius and have a structure and arrangement very similar to the cooler of the first embodiment of the present invention. Commercial 1 exhibits a TDP performance of 130 Watt and commercial 2 has a TDP of 140 Watt. The hybrid 5 and the hybrid 9 refer to the hybrid cooler manufactured according to the fifth embodiment and the ninth embodiment, respectively. Such a hybrid cooler comprises a plurality of cylindrical heat pipes as main heat pipes and a flat heat pipe as sub heat pipes. Hybrids 5 and 9 were made to be similar or smaller than commercial products in order to compare the cooling performance of commercial 1 and commercial 2, respectively.

Item Commercial 1 Hybrid 5 Commercial 2 Hybrid 9 Cooler size (mm) 91.5 x 91.5 x 66 70 x 70 x 64.5 91 x 91 x 110 90 x 90 x 110 Cooling fan diameter 60 mm 60 mm 92 mm 85 mm Thermal design power TDP (thermal load) 130 Watts 130 Watts 140 Watts 140 Watts Thermal resistance, R _th 0.169 ^o C / W 0.156 ^o C / W 0.19 ^o C / W 0.13 ^o C / W

As shown in [Table 1], when a thermal load was applied to a commercial 1-cooler, the minimum value of the thermal resistance was 0.169 ° C / W as several test average values. As for the hybrid 5 cooler, the thermal load is applied from 130 watts to 200 watts as shown in FIG. 23, and the thermal resistance of the hybrid 5 at 130 watts corresponding to the commercial 1 TDP is 0.156 ° C / W. 1, which is lower than that of commercial 1, which means that Hybrid 5 is superior to Commercial 1. More specifically, since the commercial 1 is larger than the hybrid 5, the hybrid 5 cooler is more excellent in cooling performance even though the total area of the commercial 1 cooling fins is much larger than that of the hybrid 5 it means. These results demonstrate the superiority of the hybrid cooler according to the present invention, and the factors of the hybrid cooler such as the uniform heat distribution on the cooling fin rather than the total area of the cooling fin and the smooth air- .

As summarized in Table 1, Commercial 2 is somewhat larger than Commercial 1 and has a thermal design power of 0.19 ° C / W at a TDP of 140 W and a thermal resistance of 0.19 ° C / W. As shown in FIG. 23, in the hybrid 9 cooler, the thermal load was applied from 100 watts to 225 watts, and the thermal resistance of the hybrid 9 was found to be 0.129 ° C / W at 140 watts, which is the thermal design power of commercial 2. In addition, it can be seen that the thermal resistance continues to decrease from 225 watts to 0.124 ° C / W as the minimum through three or more tests. When reduced, the hybrid 5 can be expected to have a lower heat resistance of 225 watt or more under heat load, which means that the heat dissipation performance can be exerted even when the heating value of the heat source is 225 watt or more. Therefore, from the results of the measurement of the heat radiation performance, it is proved that even though the diameter of the cooling fan installed in the hybrid 5 cooler is 7 mm smaller than that of the commercial 2 cooler, the cooling performance can be remarkably higher than that of the commercial 2 cooler.

From the above measurement results, it can be inferred that the excellent heat radiation performance of the hybrid 9 cooler is due to the presence of the structural pedestal that is capable of effectively absorbing the heat generated from the heat source as well as the hybrid of the hybrid 5 cooler. The hybrid 9 cooler forms a structural pedestal adapted to the external shape of the heat source. The pedestal is matched to the shape and size of the hot spots of the heat source, and a plurality of main heat pipes are bent and deformed at an obtuse angle as shown in FIG. And is appropriately inserted into the position of the heat source. In addition, to ensure the reliability of the measurement, three or more Hybrid 5 and Hybrid 9 coolers were produced, respectively. As can be seen in FIG. 23, it can be seen that there is little difference in the thermal resistance values at a given thermal load in both the coolers of hybrids 5 and 9, which means that the reproducibility is excellent, This can be another advantage for the mass production condition.

In addition, the performance of the hybrid cooler was measured by mounting it on a commercial electronic device instead of a dedicated measuring device. Here, the heat source is a type of heat source including a CPU and various electronic parts mounted on a circuit board. The high temperature point of the heat source is not the same level (height) as the peripheral portion of the heat source, It is in a low position. In addition, the conventional commercial cooler to be compared uses a heat source, especially a product certified by a CPU manufacturer. This commercial three-cooler has a form similar to the cooler of the first embodiment of the present invention, which is composed of a plurality of U-shaped bent cylindrical heat pipes. In the measurement for confirming the cooling performance of the cooler, the temperature T _j of the connection portion and the thermal resistance R _th between the high temperature point of the heat source and the cooler were measured. As summarized in [Table 2], when the thermal design power, TDP, of 150 watt of thermal load was applied, the thermal resistance R _th was measured to be 0.153 ° C / W, although Hybrid 9 was almost the same size as Commercial 3 , Which is more than 30% lower than commercial 3-coolers. Furthermore, the junction temperature T _j of the hybrid 9 was measured to be about 10 degrees lower than that of a commercial 3-cooler. As a result, the hybrid 9 has significantly better heat dissipation performance than a commercial three-cooler, and it also means providing a condition that allows the electronic device to operate more stably.

Item Thermal design power, TDP Thermal resistance, R _th Junction temperature, T _j Temperature difference, Δ T Commercial 3 150 Watts 0.22 68 ^o C Reference Hybrid 9 150 Watts 0.153 58.1 ^o C 9.9 ^o C Measuring conditions T _a | ^max = 35 [ ^deg.] C; R _th and T _j are the results obtained for a sufficient number of measurements, and a 3 sigma average value is calculated

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to be illustrative of the present invention and are not intended to limit the scope of the present invention. Change, partial omission, or supplement). In addition, the above-described embodiments may combine some or many of the features with each other. Therefore, the structure and configuration of each component shown in the embodiments of the present invention can be implemented by modifications or combinations, and it goes without saying that modifications and combinations of these structures and configurations fall within the scope of the appended claims of the present invention.

51: cooling pin 61: main heat pipe
63: Sub heat pipe 50: Cooler base
53: thermoelectric plate 54: thermoelectric block
55: frame

Claims (16)

delete delete delete delete delete delete delete delete A plurality of cooling fins which are made of a thermally conductive material and stacked at regular intervals and serve to dissipate heat generated from a heat source of the electronic component to discharge heat;
Wherein one side absorbs heat from the heat source, the absorbed heat is transmitted to the other side, the other side penetrates the cooling fin, and the intersection points are arranged in a line on the cooling fin, A main heat pipe for distributing and dissipating heat by acting as a heat source on the cooling fin and allowing the main heat dissipating line to be positioned in the vicinity of the edge of the cooling fin; And
Absorbing heat from one side to the heat source or from the main heat pipe and transferring the absorbed heat to the other side, the other side of which penetrates the cooling fin, and the intersection point is arranged in line on the cooling fin, And a sub heat pipe which forms a heat dissipation line and dissipates heat by serving as another heat source on the cooling fin and the sub heat dissipation line is located at the center of the cooling fin,
The main and sub heat dissipation lines are respectively located near and at the corners of the cooling fins and have different lengths so that the heat of the heat source can be uniformly distributed throughout the cooling fins.
Hybrid cooler is installed on the corner of the cooling fins to enable a cooling fan in a direction perpendicular to the cooling fins. delete delete A plurality of cooling fins which are made of a thermally conductive material and stacked at regular intervals and serve to dissipate heat generated from a heat source of the electronic component to discharge heat;
Wherein one side absorbs heat from the heat source, the absorbed heat is transmitted to the other side, the other side penetrates the cooling fin, and the intersection points are arranged in a line on the cooling fin, A main heat pipe for distributing and dissipating heat by acting as a heat source on the cooling fin and allowing the main heat dissipating line to be positioned in the vicinity of the edge of the cooling fin; And
Absorbing heat from one side to the heat source or from the main heat pipe and transferring the absorbed heat to the other side, the other side of which penetrates the cooling fin, and the intersection point is arranged in line on the cooling fin, And a sub heat pipe which forms a heat dissipation line and dissipates heat by serving as another heat source on the cooling fin and the sub heat dissipation line is located at the center of the cooling fin,
The main and sub heat dissipation lines are respectively located near and at the corners of the cooling fins and have different lengths so that the heat of the heat source can be uniformly distributed throughout the cooling fins.
The cooler base is composed of a thermally conductive material, one side is in contact with the heat source, the other side is in direct thermal contact with at least one of the main heat pipe or the sub heat pipe; The method according to claim 12,
The cooler base is provided on one side with a pedestal corresponding to the appearance of the heat source to enable thermal contact,
And the pedestal is designed to be in direct contact with the hot spot of the heat source and is part of the cooler base. The method according to claim 12,
The cooler base is a hybrid cooler consisting of a thermoelectric plate of a thermally conductive material or a thermoelectric block of a thermally conductive material having a thickness greater than the thickness of the thermoelectric plate. A plurality of cooling fins which are made of a thermally conductive material and stacked at regular intervals and serve to dissipate heat generated from a heat source of the electronic component to discharge heat;
Wherein one side absorbs heat from the heat source, the absorbed heat is transmitted to the other side, the other side penetrates the cooling fin, and the intersection points are arranged in a line on the cooling fin, A main heat pipe for distributing and dissipating heat by acting as a heat source on the cooling fin and allowing the main heat dissipating line to be positioned in the vicinity of the edge of the cooling fin;
One side absorbs heat from the heat source or the main heat pipe and transfers the absorbed heat to the other side, the other side passes through the cooling fins, the crossing points are arranged in a row on the cooling fins, and this arrangement is sub A sub heat pipe constituting a heat dissipation line, wherein the sub heat dissipation line serves as another heat source on the cooling fins to dissipate and dissipate heat, and the sub heat dissipation line is positioned at the center of the cooling fins; And
And a pedestal made of a structure capable of thermal contact with a hot point of a heat source.
The main and sub heat dissipation lines are respectively located near and at the corners of the cooling fins and have different lengths so that the heat of the heat source can be uniformly distributed throughout the cooling fins.
The pedestal made of the structure is made of a cooler base considering the size of the hot spot,
And the main heat pipe and the sub heat pipe are bent to correspond to the external shape of the heat source. delete

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