KR20140042736A - Cooling device - Google Patents

Abstract

A cooling device to which a heating element is attachable includes a base, a plurality of heat radiation fins of first groups and a plurality of heat radiation fins of second groups. The first groups and the second groups are alternately arranged in a flowing direction in which a cooling medium flows in the path of the base. A second outermost heat radiation fin of each second group is more distant from the side of the base than the first outermost heat radiation fin of each first group. A width between the side of the base and the side of the second outermost heat radiation fin of the second group is equal to or wider than a width between the side of each heat radiation fin of the first group which is adjacent to the first outermost heat radiation fin of the first group and the side of the second outermost heat radiation fin.

Description

Cooling unit {COOLING DEVICE}

The present invention relates to a cooling apparatus for cooling a heating element bonded to a gas by a cooling medium flowing in a flow path of a base.

Japanese Unexamined Patent Application Publication No. 2012-29539 discloses a cooling apparatus provided with a gas in which a heating element such as an electronic component is mounted from the outside and a flow path through which a cooling medium flows to cool the heating element is formed therein.

In the cooling device disclosed in the above-mentioned document, a plurality of heat dissipation fins are provided in a zigzag arrangement in the gas flow path to increase the contact area between the inner surface of the flow path and the cooling medium. By transferring heat radiated from the heating element to the gas, the heat dissipation fins improve heat radiation from the inner surface of the flow path to the cooling medium to effectively cool the heating element.

The cooling device disclosed in this document has a flow path control unit between the inner side of the flow path and the heat dissipation fins extending in the flow path along the flow direction of the cooling medium. The flow path control unit guides the cooling medium flowing through the flow path away from the inner side of the flow path, so that the cooling medium flows toward the area of the gas on which the heat radiation fins are formed. Thus, the cooling medium is prevented from flowing the gap between the inner side of the flow path and the heat dissipation fins without flowing the region of the gas, and as a result, the heating element is cooled more effectively.

In the above-described cooling apparatus in which the flow path control unit is disposed in the flow path of the gas, it is necessary to ensure a space for the flow path control unit in the flow path, which makes the gas larger.

In the cooling device, providing a flow path control unit reduces the flow path cross-sectional area of the gas to reduce the gap between the flow path control unit and the heat dissipation fins, thereby increasing the pressure loss that occurs when the cooling medium flows through the flow path, which is a cooling medium. This makes it difficult for the flow path to flow smoothly.

The present invention is directed to providing a cooling device which allows for a smooth flow of the cooling medium and which is reduced in size.

According to one aspect of the present invention, there is provided a cooling device to which a heating element can be bonded. The cooling apparatus includes a gas, a plurality of first group of heat dissipation fins, and a plurality of second group of heat dissipation fins. The gas has a flow path through which the cooling medium flows. The heat radiation fins of the first group are located in the flow path and adjacent to the heating element. The heat dissipation fins of each first group are arranged in the width direction perpendicular to the flow direction in which the cooling medium flows through the flow path. One of each of the first group of heat dissipation fins located closest to the side of the first group of gases is the first outermost heat dissipation fin. The second group of heat dissipation fins is located in the flow path and adjacent to the heating element. The heat radiation fins of each second group are arranged in the width direction perpendicular to the flow direction in which the cooling medium flows through the flow path. One of each of the second group of heat dissipation fins located closest to the side of the second group of gases is the second outermost heat dissipation fin. The second group and the first group are alternately arranged in the flow direction. The heat dissipation fins of the second group and the first group are provided in a zigzag arrangement. The second outermost heat dissipation fin of each second group is further distanced from the side of the body than the first outermost heat dissipation fin of each first group. The width between the side of the second outermost heat dissipation fin of each second group and the side of the body is equal to the side of the heat dissipation fin of the first group adjacent to the first outermost heat dissipation fin of the first group and the second outermost. It is equal to or greater than the width between the sides of the heat dissipation fins.

Other aspects and advantages of the invention will be apparent from the following description with reference to the accompanying drawings which illustrate, by way of example, the principles of the invention.

Together with the objects and advantages of the present application, this application will be better understood with reference to the following description of the preferred embodiments of the present application in conjunction with the accompanying drawings.

1 is an exploded perspective view showing a cooling device according to an embodiment of the present invention;
FIG. 2 is a horizontal sectional view showing the cooling device of FIG. 1;
3 is an enlarged partial view illustrating the cooling device of FIG. 2;
4 is a schematic view showing a cooling device of a comparative example;
5 is a schematic view showing the cooling device of FIG. 1, FIG.
6 is an enlarged partial schematic view showing the cooling device of FIG. 1, FIG.
7A is a partial sectional view showing a cooling device according to a modification of the present invention, and
7B is a partial sectional view showing a cooling device according to another modification of the present invention.

A cooling device according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 6. Referring to FIG. 1, the cooling device is indicated at 10 and has a gas 20. The base 20 includes a first gas forming member 21 and a second gas forming member 22 joined to each other. These members 21 and 22 are both made of aluminum and have substantially the same shape. Each of the members 21, 22 has a rectangular outer plate 23, two side walls 25A extending from each of the two short sides of the outer plate 23, and two extending from each of the two long sides of the outer plate 23. Side walls 25B, and plate-like joints 26 extending outward in the horizontal direction from the ends of the side walls 25A and 25B.

The gas 20 has an internal space S therein that serves as a flow path through which the cooling medium flows. The semiconductor device 28 acting as a heating element has an outer plate of the first gas forming member 21 by a rectangular insulating substrate 27 on the outer surface of the outer plate 23 whose inner surface faces the inner space S. As shown in FIG. It is joined to (23). More specifically, the insulating substrate 27 is bonded to the first gas forming member 21 by a metal plate (not shown) serving as a bonding layer at its lower surface. It is understood that the long side direction of the insulating substrate 27 corresponds to the long side of the first gas forming member 21. The semiconductor device 28 is mounted on the upper surface of the insulating substrate 27 by a metal plate (not shown) serving as a wiring layer.

A rectangular support plate 32 is interposed between the first gas forming member 21 and the second gas forming member 22, and the rectangular supporting plate has a plurality of heat dissipation fins () in the internal space S of the base 20. 31) Support. The support plate 32 has a shape and size substantially the same as the outer profile of the junctions 26 of the first gas forming member 21 and the second gas forming member 22 in plan view. The support plate 32 is held between the junctions 26 of the gas forming members 21, 22 so that the opposing surfaces of the support plate 32 are the outer plates 23 of the gas forming members 21, 22. Respectively). The joining portion 26 of the first gas forming member 21, the joining portion 26 of the second gas forming member 22, and the support plate 32 are hermetically joined together by brazing. Thus, the support plate 32 disposed in the cooling device separates the internal space S into the first flow path S1 (see FIG. 2) and the second flow path S2 (see FIG. 1).

The junction 26 and the side wall 25A of the first gas forming member 21 have recesses 33A, 34A (see FIG. 2). The junction 26 and the side wall 25A of the second gas forming member 22 have recesses 33B, 34B. Recesses of the first gas forming member 21 by joining the joining portions 26 of the first gas forming member 21 and the second gas forming member 22 to the support plates 32 of the opposing surfaces thereof in place. The fields 33A and 34A communicate the first flow path S1 with the outside of the base 20. Similarly, the recesses 33B, 34B of the second gas forming member 22 communicate the second flow path S2 with the outside of the base 20.

A cylindrical inlet tube 41 is connected to the gas forming members 21, 22 in the recesses 33A, 33B of the gas forming members, so that the cooling medium is respectively through the openings formed in the recesses 33A, 33B. It flows into the 1st flow path S1 and the 2nd flow path S2. In addition, a cylindrical outlet tube 42 is connected to the gas forming members 21 and 22 in the recesses 34A and 34B of the gas forming members so that the cooling medium forms openings formed in the recesses 34A and 34B. It flows outside the 1st flow path S1 and the 2nd flow path S2, respectively. Thus, the cooling medium flows from the inlet tube 41 toward the outlet tube 42 in the direction along the long side of the gas forming members 21, 22.

Referring to FIG. 2, the heat dissipation fins 31 are formed in a zigzag arrangement on both the upper surface and the lower surface of the support plate 32 in plan view, forming the heat dissipation fin unit 50. The zigzag arrangement of the heat dissipation fins 31 of the upper surface and the lower surface of the support plate 32 is the same. In particular, in the illustrated embodiment the heat dissipation fins 31 (heat sink fins on one surface are shown in the figure) of each of the opposing surfaces of the support plate 32 comprise seven rows of heat dissipation fins 31, Are spaced at substantially equal intervals in the direction along the long side of the support plate 32 (or in the flow direction in which the cooling medium flows through the internal space S). In more detail, the seven rows include three first rows of heat dissipation fins each including three first heat dissipation fins 31B arranged at predetermined intervals in a direction along the short side of the support plate 32, and Four second heat dissipation fins each including four second heat dissipation fins 31A arranged at the same spacing interval in the same direction as the first heat dissipation fins 31B. In addition, the first row of first heat dissipation fins 31B and the second row of second heat dissipation fins 31A are alternately arranged in the flow direction, and the first heat dissipation fin 31B in any two adjacent first rows and second rows. ) And the second heat dissipation fin 31A are arranged in a zigzag arrangement as clearly shown in FIG.

As shown in FIGS. 1 and 2, all the heat dissipation fins 31 are cylindrical in shape with the same length and diameter and also extend from the respective surfaces of the support plate 32. All the heat dissipation fins 31 extending upward from the upper surface of the support plate 32 are joined to the outer plate 23 of the first gas forming member 21 at its upper end. All the heat dissipation fins 31 extending downward from the bottom surface of the support plate 32 are joined to the outer plate 23 of the second gas forming member 22 at its lower end.

On each of the inner side surfaces of the sidewalls 25B of the gas forming members 21, 22 extending along the flow direction of the cooling medium, heat dissipation fins 31 in the flow direction, as shown in FIGS. 2 and 3. Three protrusions 60 are formed which are spaced at the same interval as and which protrude inwardly from the inner side. As shown in FIG. 2, each of the protrusions 60 has the shape of a segment of a circle (a segment of the circle is smaller than a semicircle) that is the same as the circle of the cylindrical heat dissipation fin 31 in the horizontal section of the base 20. The protrusion 60 is formed such that the vertical section of the protrusion gradually decreases toward the end. The projections 60 are formed such that any normal direction with respect to the outer circumferential surface of the projections 60 is directed toward the inside of the internal space S of the gas forming members 21, 22 away from the side wall 25B.

The support plate 32 is held between the joints 26 of the gas forming members 21, 22, so that the protrusion 60 and the first heat dissipation fins 31B are in the direction along the short side of the support plate 32. Arranged along three parallel imaginary lines (or in a width direction perpendicular to the flow direction). In the present embodiment, the first heat dissipation fins 31B and the protrusion 60 arranged along three parallel imaginary lines extending in the width direction form the first group of heat dissipation fins. In this case, the protrusions 60 forming part of the sidewalls 25B of the gas forming members 21, 22 are regarded as first outermost heat dissipation fins of the first group of heat dissipation fins.

In the embodiment of the present application, four rows of the second heat dissipation fins 31A arranged along the width direction across the flow direction form the second group of heat dissipation fins. The second heat dissipation fins 31A located closest to the opposing sidewalls 25B of the gas forming members 21, 22 in each of the second group of heat dissipation fins are regarded as the second outermost heat dissipation fins 31A1. . The second outermost heat dissipation fins 31A1 are separated from the side walls 25B of the gas forming members 21, 22, unlike the first outermost heat dissipation fins. In this regard, the projection 60 is closer to the side of the side walls 25B extending along the flow direction of the cooling medium in the internal space S than the second outermost heat dissipation fins 31A1. That is, the second outermost heat dissipation fins 31A1 are further distanced from the side of the side walls 25B than the protrusion 60.

The distance L1 or the shortest distance between the outer circumferential surface (side) of the second outermost heat dissipation fin 31A1 and the inner side of the adjacent side wall 25B of each of the gas forming members 21, 22 is the first group of heat dissipation. Distance L2 between the outer circumferential surface (side) of the first heat dissipation fin 31B positioned closest to the protrusion 60 in the fins and the outer circumferential surface (side) of the second outermost heat dissipation fin 31A1 adjacent to the first heat dissipation fin. Or greater than the shortest distance. Accordingly, the width W1 between the outer circumferential surface of the second outermost heat dissipation fin 31A1 and the inner side of the adjacent sidewall 25B of each of the gas forming members 21, 22 is a projection of the first group of heat dissipation fins. It is larger than the width W2 between the outer circumferential surface of the first heat dissipation fin 31B positioned closest to 60 and the outer circumferential surface (side surface) of the second outermost heat dissipation fin 31A1 adjacent to the first heat dissipation fin.

The distance L3 or the shortest distance between the outer circumferential surface of the projection 60 and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the projection is substantially the same as the distance L2. Accordingly, the width W3 between the outer circumferential surface of the protrusion 60 and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the protrusion is substantially the same as the width W2.

The operation of the above-described cooling device 10 will be described below. Referring to FIG. 4 showing the manner in which the cooling medium flows in the cooling apparatus of the comparative example indicated by reference numeral 110, the cooling medium shows the region P1 of the internal space S in which the heat dissipation fins 131 are formed. In addition to flowing as indicated by the solid arrows in FIG. 4, a portion of the cooling medium also shows a region P2 of the inner space S between the outermost heat of the heat dissipation fins 131 and the inner side of the gas 120. It flows as indicated by the dashed-dotted arrow. The cooling medium flowing in the region P2 contributes very little to heat radiation from the gas 120 through the heat dissipation fins 131, and thus cannot achieve effective cooling of the semiconductor device 28 bonded to the gas 120. .

Referring to FIG. 5, which shows the manner in which the cooling medium flows in the cooling device 10 of the present embodiment, on the other hand, in the cooling device 10 of the present embodiment, the second outermost heat dissipation fin 31A1 is provided. The width W1 between the outer circumferential surface and the inner side of the side wall 25B adjacent to the second outermost heat dissipation fin is adjacent to the side wall 125B and the side wall 125B in the cooling device 110 of the comparative example shown in FIG. 4. It is smaller than the width W11 between the heat dissipation fins 131. Thus, the cooling medium reliably flows the region P1 of the internal space S as shown by the solid arrows in FIG. 5. Therefore, the cooling medium contributes greatly to heat radiation from the base 20 through the heat dissipation fins 31 effectively, thereby effectively cooling the semiconductor device 28 bonded to the base 20.

In the present embodiment, the width W4 of the internal space S of the gas 20 of the cooling device 10 may be smaller than the width W14 of the internal space S of the gas 120 of the cooling device 110. have. Thus, the dimension of the gas 20 in the width direction perpendicular to the flow direction of the cooling medium is reduced, so that the gas 20 is made smaller.

In the present embodiment in which the internal space S of the base 20 has a width W4, the flow path of the cooling medium flowing through the internal space S of the base 20 decreases in width compared with the width W2. Don't have Thus, an increase in pressure loss that occurs when the cooling medium flows through the internal space S of the gas 20 is prevented.

Referring to FIG. 6, the cooling medium flowing along the side wall 25B of the gas 20 is guided inward away from the side wall 25B by the projection 60 as shown by the arrow. Thus, the cooling medium is guided to flow toward the region P1 of the internal space S.

The width W3 is substantially the same as the width W2. In the present embodiment in which the protrusions 60 are formed on the side wall 25B of the base 20, the flow path of the cooling medium flowing through the internal space S of the base 20 has a reduced width compared to the width W2. Don't have Thus, an increase in pressure loss that occurs when the cooling medium flows through the internal space S of the gas 20 is prevented.

The above-described embodiment has the following advantageous effects.

(1) The width W1 between the outer circumferential surface of the second outermost heat dissipation fin 31A1 and the inner side of the side wall 25B adjacent to the second outermost heat dissipation fin of each of the gas forming members 21, 22 is the first. According to the invention the width W2 between the outer circumferential surface of the first heat dissipation fin 31B adjacent to the projection 60 in the group of heat dissipation fins and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the first heat dissipation fin In the present embodiment, the sidewalls 25B of the gas forming members 21 and 22 are located close to the heat dissipation fins 31, while the second outermost heat dissipating fin 31A1 and the gas forming members 21, Sufficient space or distance for the width W1 between the side walls 25B adjacent to the second outermost heat dissipation fin of 22 is ensured. Thus, the cooling medium can reliably flow in the region P1 of the internal space S, and the pressure loss occurring when the cooling medium flows in the internal space S of the gas 20 is prevented from increasing. . Accordingly, the cooling medium helps to cool the semiconductor device 28 effectively by smoothly flowing the region P1 of the internal space S. As shown in FIG. Further, in this embodiment in which the inner side of the base 20 is located close to the heat dissipation fins 31, the width dimension of the inner space S is reduced, so that the size of the base 20 having the inner space S is reduced. And hence the size of the cooling device 10.

(2) The width W3 between the outer circumferential surface of the protrusion 60 and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the protrusion is the first heat dissipation fin (adjacent to the protrusion 60 of the first group of heat dissipation fins). It is substantially equal to the width W2 between the outer circumferential surface of 31B) and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the first heat dissipation fin. Further, the width W1 between the outer circumferential surface of the second outermost heat dissipation fin 31A1 and the inner side of the side wall 25B adjacent to the second outermost heat dissipation fin of each of the gas forming members 21, 22 is defined by the protrusion ( It is larger than the width W3 between the outer circumferential surface of 60) and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the protrusion. Thus, the width W1 is larger than the width W2. Since sufficient space or distance is ensured for the width W1, the pressure loss occurring when the cooling medium flows through the internal space S of the gas 20 is prevented from increasing.

(3) In the present embodiment, the protrusions 60 protruding from the side wall 25B extending along the flow direction of the cooling medium in the internal space S into the internal space S form the cooling medium in the internal space. Guided to the area P1 of (S), the cooling medium allows the area P1 of the internal space S to flow more reliably.

(4) In the present embodiment, in which the protrusions 60 are formed such that their vertical sections are gradually reduced toward their ends, even if the distance L3 is set relatively small, the second outermost face adjacent to the protrusions and the outer peripheral surface of the protrusions 60 are provided. Sufficient space or distance is ensured with respect to the width between the outer circumferential surfaces of the outer heat dissipation fins 31A1. Thus, the pressure loss occurring when the cooling medium flows through the space between the protrusion 60 and the second outermost heat dissipation fin 31A1 adjacent to the protrusion is further reduced.

(5) The base 20 is reinforced by heat dissipation fins 31 to increase the rigidity of this base. Thus, the reinforced gas 20 limits the distortion of the gas 20 that occurs due to the difference in the linear thermal expansion coefficient between the insulating substrate 27 and the gas 20.

This embodiment can be implemented by the following example.

Referring to FIG. 7A, the protrusion 60 may be formed in a semi-cylindrical shape having a semicircle of the same circle as the cylindrical heat dissipation fin 31 in the horizontal section of the base 20.

Referring to FIG. 7B, the protrusion 60 may be formed in a partial cylindrical shape having a partial circle of the same circle as the cylindrical heat dissipation fin 31 and larger in a horizontal section than the semi-cylinder in FIG. 7A.

In the above embodiment, the width W1 between the outer circumferential surface of the second outermost heat dissipation fin 31A1 and the inner side of the side wall 25B adjacent to the second outermost heat dissipation fin of each of the gas forming members 21, 22. ) Is equal to the width W2 between the outer circumferential surface of the first heat dissipation fin 31B adjacent to the protrusion 60 of the heat dissipation fins of the first group and the outer circumferential surface of the second outermost heat dissipation fin 31A1 adjacent to the first heat dissipation fin. It can be configured to.

In the above-described embodiment, the protrusions similar in shape to the protrusions 60 shown in Figs. 6, 7A and 7B may be formed to extend from opposing surfaces of the support plate 32.

In the above-described embodiment, the protrusions such as the protrusions 60 shown in Figs. 6, 7A, and 7B may have a partial cylindrical shape having a partial circle of circles having a diameter different from the cylindrical heat dissipation fin 31. .

In the above-described embodiment, the protrusions 60 of Figs. 6, 7A, and 7B do not need to be formed in a partial cylindrical shape. The protrusion 60 can be formed to have a spherical outer surface. In this structure, the flow direction of the cooling medium flowing through the space between the protrusion 60 and the heat dissipation fin 31 adjacent to the protrusion is changed in a direction normal to the spherical outer surface of the protrusion 60. Thus, the cooling medium flowing through the internal space S of the base 20 is effectively guided toward the region of the internal space S in which the heat dissipation fins 31 are formed.

In the above-described embodiment, the heat dissipation fin 31 can be replaced with a polygonal column-shaped fin such as a triangular prism or a rectangular prism.

In the above-described embodiment, the heat dissipation fins 31 may be arranged in a grid pattern in plan view.

In the above embodiment, the number of heat dissipation fins 31 supported by the supporting plate 32 can be changed if desired.

In the above-described embodiment, the support plate 32 can be modified to include the heat dissipation fins 31 only on one side of the support plate without separating the inner space S into the upper space and the lower space.

Claims (5)

A cooling device capable of joining a heating element, wherein the cooling device,
Gas with flow path through which the cooling medium flows,
A plurality of first groups of heat dissipation fins located within the flow path and adjacent to the heating element, each of the first groups of heat dissipation fins being arranged in a width direction perpendicular to the flow direction in which the cooling medium flows through the flow path, One of each of the first group of heat dissipation fins located closest to the side of the gas in the first group is a first outermost heat dissipation fin, the plurality of first group of heat dissipation fins, and
A plurality of second groups of heat dissipation fins located within the flow path and adjacent to the heating element, each second group of heat dissipation fins arranged in a width direction perpendicular to a flow direction in which the cooling medium flows through the flow path, One of each of the second group of heat dissipation fins located closest to the side of the gas in the second group includes the plurality of second group of heat dissipation fins, the second outermost heat dissipation fin,
The second groups and the first groups are alternately arranged in the flow direction, wherein the heat dissipation fins of the second groups and the heat dissipation fins of the first groups are provided in a zigzag arrangement, and the first of each of the second groups 2 outermost heat dissipation fins are further distanced from the side of the body than the first outermost heat dissipation fin of each first group, the side of the second outermost heat dissipation fin of each second group and the side of the gas The width between is equal to or greater than the width between the side of each of the first group of heat dissipation fins adjacent to the first outermost heat dissipation fin of the first group and the side of the second outermost heat dissipation fin, Cooling system. The method according to claim 1,
The width between the side of the first outermost heat dissipation fin and the side of the second outermost heat dissipation fin is equal to the side of each heat dissipation fin of the first group adjacent to the first outermost heat dissipation fin of the first group. And a width equal to the width between the sides of the second outermost heat dissipation fin. The method according to claim 1,
And the first outermost heat dissipation fin is a protrusion formed from a side of the base. The method of claim 3, wherein
The protrusion is formed so that the cross section of the protrusion is gradually reduced toward the end of the protrusion. The method according to claim 1,
And the heating element is a semiconductor device bonded to the substrate through an insulated substrate.

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