JP7113914B2 - Heatsinks, heatsink assemblies, electronics, and methods of making heatsinks - Google Patents

Description

The present disclosure relates to heat sinks, heat sink assemblies, electronic devices, and methods of manufacturing heat sinks.

2. Description of the Related Art Heat sinks are known which are assembled from a plurality of heat dissipating members manufactured by die casting or extrusion.

Japanese Patent Application Laid-Open No. 59-229844 discloses a heat sink assembled by fitting the connectors of heat radiating members so that they form an angle of 90 degrees or 180 degrees.

JP-A-59-229844

However, in a heat sink assembled by fitting a plurality of connectors, there is a possibility that gaps are formed between the connectors and the heat radiation performance is impaired.

A primary object of the present disclosure is to provide a heat sink, a heat sink assembly, and an electronic device with improved heat dissipation compared to conventional heat sinks assembled by mating connectors.

A heat sink according to an embodiment of the present disclosure is a first heat dissipation member including at least one corner extending along a first direction and a plurality of side portions connected via the at least one corner. and a plurality of second heat radiating members connected to each of the plurality of side portions. At least one corner is provided with at least one recess. At least one corner portion is a bent portion formed by bending the at least one concave portion as a bending axis. The plurality of second heat radiating members are arranged inside the first heat radiating member.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide a heat sink with higher heat dissipation than a conventional heat sink assembled by fitting connectors together, and an electronic device including the heat sink.

1 is a side view showing a heat sink and a heat sink assembly according to Embodiment 1; FIG. 2 is a perspective view of the heat sink and heat sink assembly shown in FIG. 1; FIG. 2 is a side view of an electronic device assembled from the heat sink assembly shown in FIG. 1; FIG. 4 is a perspective view of the electronic device shown in FIG. 3; FIG. FIG. 8 is a side view showing a heat sink and a heat sink assembly according to Embodiment 2; 6 is a perspective view of the heat sink and heat sink assembly shown in FIG. 5; FIG. Figure 6 is a side view of an electronic device assembled from the heat sink assembly shown in Figure 5; 8 is a perspective view of the electronic device shown in FIG. 7; FIG. FIG. 11 is a side view showing a heat sink and a heat sink assembly according to Embodiment 3; Figure 10 is a side view of an electronic device assembled from the heat sink assembly shown in Figure 9; FIG. 11 is a side view showing a heat sink and a heat sink assembly according to Embodiment 4; 12 is a side view of an electronic device assembled from the heat sink assembly shown in FIG. 11; FIG. FIG. 12 is a side view of the electronic device according to Embodiment 5 as viewed from the first direction; FIG. 14 is a cross-sectional view seen from a line segment XIV-XIV in FIG. 13; FIG. 14 is a side view of the heat sink and the heat sink assembly according to Embodiment 5 as viewed from the first direction; FIG. 11 is a side view of a modification of the heat sink according to Embodiment 2 as viewed from the first direction; FIG. 11 is a side view of another modification of the heat sink according to the second embodiment, viewed from the first direction; FIG. 11 is a side view of a further modification of the heat sink according to Embodiment 2 as viewed from the first direction;

Embodiments of the present disclosure will be described below with reference to the drawings. In the drawings below, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

Embodiment 1.
A heat sink assembly 101 according to the first embodiment shown in FIGS. 1 and 2 includes a heat sink 100, and a plurality of semiconductor elements 10 and a plurality of substrates 11 mounted on the heat sink 100 as heat-dissipating members. The heat sink assembly 101 is assembled into the electronic device 1 according to the first embodiment shown in FIGS. 3 and 4. FIG.

<Construction of heat sink>
As shown in FIGS. 1 and 2, the heat sink 100 includes a plate-like member 20 as a first heat dissipating member and a plurality of fins 3 as a second heat dissipating member.

The plate-like member 20 is configured as one piece. In other words, the plate member 20 is configured as a continuous body and has no interface inside. The material forming the plate-shaped member 20 may be any material having relatively high thermal conductivity, and includes, for example, metal materials such as copper (Cu), aluminum (Al), and magnesium (Mg), or alloy materials. . The plate-like member 20 may be molded by any molding method, for example, extrusion molding or die-cast molding.

The plate member 20 has a first surface 2A and a second surface 2B opposite to the first surface 2A. The first surface 2A is a surface on which a plurality of semiconductor elements 10 and a plurality of substrates 11 are mounted. The second surface 2B is a surface to which the plurality of fins 3 are connected. The first surface 2A extends along a first direction A and a second direction B intersecting the first direction A. As shown in FIG. The second surface 2B is, for example, a surface parallel to the first surface 2A.

The first surface 2A is a surface on which a plurality of semiconductor elements 10 and a plurality of substrates 11, which will be described later, are mounted. The second surface 2B is a surface to which the plurality of fins 3 are connected.

The plate-like member 20 has a plurality of first regions 21 overlapping the plurality of fins 3 and a plurality of second regions 22 not overlapping the plurality of fins 3 when viewed from a third direction perpendicular to the first surface 2A. is doing. Two first regions 21 adjacent in the second direction B are connected via one second region 22 . In other words, one second region 22 is arranged between two adjacent first regions 21 and connects the two first regions 21 . The plate member 20 has, for example, four first regions 21 and three second regions 22 . The number of first regions 21 is one more than the number of second regions 22 .

A plurality of fins 3 are connected to the second surface 2B. A plurality of fins 3 are connected to each first region 21 . A plurality of fins 3 are not connected to each second region 22 . A plurality of fins 3 extend along the third direction. The plurality of fins 3 are spaced apart from each other in the first direction A and the second direction B, for example.

Preferably, the plurality of fins 3 are connected to the plate member 20 via a heat receiving layer (not shown). The heat receiving layer is formed on the second surface 2B of the plate-like member 20, for example. The heat-receiving layer is made of any material with high thermal conductivity, such as heat-conducting grease.

Each second region 22 of the plate member 20 is provided with one recessed portion 23 that is recessed with respect to the second surface 2B. Each recess 23 extends along the first direction A. As shown in FIG. Each recess 23 is provided, for example, between one end and the other end of the plate member 20 in the first direction A. As shown in FIG. The recesses 23 are spaced apart from each other in the second direction B, for example. placed in parallel. A first region 21 , a plurality of fins 3 connected to the first region 21 , a semiconductor element 10 and a substrate 11 are arranged between each recess 23 .

The cross-sectional shape of each recess 23 perpendicular to the first direction A is not particularly limited, but is, for example, a U shape. The cross-sectional shape of each recess 23 may be V-shaped. Each second region 22 is provided so as to be plastically deformed when bent at the concave portion 23 to form the bent portion 4 shown in FIGS. 3 and 4 .

A thickness T2 between the bottom of the recess 23 and the first surface 2A in each second region 22 is thinner than a thickness T1 between the first surface 2A and the second surface 2B in each first region 21 . The thickness T2 is, for example, 1/3 or more and 2/3 or less of the thickness T1. The thickness T2 is preferably 1/2 or more and 2/3 or less of the thickness T1.

The width of each recess 23 in the second direction B exceeds the width of each fin 3 in the second direction B, for example.
The plate member 20 has a first end 2C as one end in the second direction B and a second end 2E as the other end. The first end 2C and the second end 2E are provided so as to fit together. The first end 2C has a plurality of portions spaced apart from each other in the first direction A, for example. The second end 2E has a portion sandwiched between the plurality of portions of the first end 2C in the first direction A, for example.

First through holes 2D extending along the first direction A are provided in the plurality of portions of the first end portion 2C. A second through hole 2F extending along the first direction A is provided in the sandwiched portion of the second end portion 2E. The first through-hole 2D and the second through-hole 2F are arranged so as to be continuous in the first direction A and through which the fixing member 5 is inserted when the first end 2C and the second end 2E are fitted to each other. is provided.

<Configuration of heat sink assembly>
As shown in FIGS. 1 and 2, the heat sink assembly 101 includes a heat sink 100, a plurality of semiconductor elements 10 and a plurality of substrates 11 as heat-radiating members.

A plurality of semiconductor elements 10 and a plurality of substrates 11 are mounted on the first surface 2</b>A of the first region 21 . For example, a plurality of semiconductor elements 10 are mounted on each substrate 11 . Each semiconductor element 10 is sandwiched between the first surface 2A of the plate member 20 and the substrate 11, for example. Each semiconductor element 10 is in contact with the first surface 2A of the plate member 20, for example. The substrates 11 are arranged side by side with a space therebetween in the second direction B. As shown in FIG.

<Configuration of electronic device>
As shown in FIGS. 3 and 4, electronic device 1 is assembled by deforming heat sink assembly 101 . An electronic device 1 includes a tubular member 2 as a first heat dissipating member, a plurality of fins 3 as a plurality of second heat dissipating members, a fixing member 5, and a semiconductor element 10 and a substrate 11 as heat dissipating members.

The tubular member 2 is obtained by bending the plate member 20 of the heat sink assembly 101 at the second region 22 and plastically deforming it. The tubular member 2 has a polygonal tubular shape. The tubular member 2 has, for example, a rectangular tubular shape. The tubular member 2 has an inner peripheral surface consisting of a first surface 2A and an outer peripheral surface consisting of a second surface 2B. The first surface 2A and the second surface 2B of the tubular member 2 are parallel to each other. The first end 2C and the second end 2E form both ends of the cylindrical member 2 in the circumferential direction. The first end 2C and the second end 2E are arranged, for example, to form one vertex of a polygonal tube shape.

The tubular member 2 has four sides and four corners. Each of the four side portions of the tubular member 2 is configured by each first region 21 of the plate-shaped member 20 . The four corners of the tubular member 2 are composed of three bent portions 4 and one connecting portion. From a different point of view, each of the three corners among the four corners of the tubular member 2 is configured as the bent portion 4 of the plate member 20 . Only one of the four corners of tubular member 2 is fixed by fixing member 5 .

Each bent portion 4 is formed by bending and plastically deforming each second region 22 of the plate member 20 . A concave portion 23 is provided on the outer peripheral side of each bent portion 4 . The concave portion 23 is formed by plastically deforming the concave portion 23 of the plate-like member 20 and opens toward the outer peripheral side of the cylindrical member 2 . The opening width of the concave portion 23 in the circumferential direction of the tubular member 2 is wider than the opening width of the concave portion 23 in the second direction B of the plate-like member 20 . At each bent portion 4, the thickness between the bottom of recess 23 and first surface 2A is thinner than the thickness between first surface 2A and second surface 2B at each side.

The fixing member 5 is inserted through the first through hole 2D and the second through hole 2F of the plate member 20 to connect the first end 2C and the second end 2E. The fixing member 5 includes, for example, an insertion portion that is inserted through the first through hole 2D and the second through hole 2F, and a first expansion member that is connected to one end of the insertion portion and has a larger diameter than the insertion portion. It has a diameter portion and a second enlarged diameter portion connected to the other end of the insertion portion and having a larger diameter than the insertion portion. The first enlarged diameter portion and the second enlarged diameter portion are arranged outside the first through hole 2D and the second through hole 2F.

The plurality of fins 3 are arranged outside the tubular member 2 . In other words, in the electronic device 1 , the flow paths for gas supplied to the plurality of fins 3 are provided outside the tubular member 2 . In addition, the flow direction of the gas supplied to the plurality of fins 3 is along the first direction A. As shown in FIG.

<Method for manufacturing electronic equipment>
First, the heat sink assembly 101 shown in FIGS. 1 and 2 is prepared. The heat sink assembly 101 is prepared by mounting the semiconductor element 10 and the substrate 11 on the plate member 20 of the heat sink 100, for example. As described above, the plate member 20 provided with the plurality of recesses 23 may be formed by any method, such as extrusion molding or die casting. The semiconductor element 10 and the substrate 11 may be fixed to the plate-like member 20 by any method, such as screws or an adhesive.

Next, each second region 22 of the plate member 20 of the heat sink assembly 101 is bent and plastically deformed. Each second region 22 is bent so that each concave portion 23 opens outward. Each second region 22 is bent such that the two first regions 21 connected via the second region 22 form an obtuse angle with respect to the concave portion 23 side. Each second region 22 is bent such that the two first regions 21 connected via the second region 22 form a right angle with respect to the recess 23 . As a result, three bent portions 4 are formed, and the first end portion 2C and the second end portion 2E are arranged so as to be continuous in the first direction A. As shown in FIG.

Next, the first end 2C and the second end 2E are fixed by the fixing member 5. As shown in FIG. For example, after the insertion portion joined to the first enlarged diameter portion is inserted through the first through hole 2D and the second through hole 2F, the other end of the insertion portion is joined to the second enlarged diameter portion. Thus, the electronic device 1 is assembled from the heat sink assembly 101 .

<Effect>
The heat sink 100 includes a plate member 20 having a first surface 2A and a second surface 2B located on the opposite side of the first surface 2A, and a plurality of fins 3 connected to the second surface 2B. A plurality of recesses 23 that are recessed with respect to the second surface 2B are provided on the plate-like member 20 in a region that does not overlap the plurality of fins 3 when viewed from the direction perpendicular to the first surface 2A.

In the heat sink 100 , the plurality of concave portions 23 are provided in the plate-like member 20 , so that the plate-like member 20 can be bent at each concave portion 23 . By bending the plate-like member 20 at each concave portion 23 , the plate-like member 20 is deformed into the cylindrical member 2 having a polygonal tube shape, and the electronic device 1 of the electronic device 1 is assembled from the heat sink 100 . Therefore, no gap is formed in the bent portion 4 in the electronic device 1 . As a result, in the electronic device 1, compared to a conventional heat sink in which a gap is formed between the fitted connectors, the heat transfer property inside the cylindrical member 2 via the bent portion 4 is high, and the heat dissipation property is high. .

Furthermore, according to the heat sink 100, since it is assembled to the electronic device 1 by one fixing member 5, the number of parts is reduced compared to the conventional heat sink in which each corner is formed by fitting a plurality of connectors. has been reduced. As a result, the electronic device 1 can be made lighter than the electronic device having the conventional heat sink.

In the heat sink 100, each recess 23 extends along the first direction A between one end and the other end of the plate member 20 in the first direction A along the first surface 2A.

Such a plate-like member 20 does not have a concave portion 23 extending along the first direction A between one end and the other end of the plate-like member 20 in the first direction A. , the second region 22 including the recess 23 is easily bent. Therefore, the electronic device 1 can be assembled more easily than the electronic device provided with the conventional heat sink, which is assembled by fitting the connectors together.

The electronic device 1 can be assembled more easily than a heat sink assembled by welding. In a heat sink assembled by welding, it is necessary to assemble the heat dissipating member before mounting the heat dissipating member on the heat dissipating member. This is because it is difficult to weld the heat-dissipating member after attaching it to the heat-dissipating member, and the heat-dissipating member may be damaged by heat. Therefore, for example, when the heat radiating member has a polygonal cylinder shape, there is a problem that it is difficult to mount the heat radiating member on the heat radiating member. On the other hand, in the electronic device 1 , the semiconductor element 10 and the like can be mounted on the plate-like member 20 and then assembled with the cylindrical member 2 , so that the semiconductor element 10 and the like can be easily mounted on the plate-like member 20 .

In the heat sink 100, each recess 23 is recessed with respect to the second surface 2B. In this case, in the electronic device 1 , the plurality of fins 3 are arranged on the outer peripheral side of the cylindrical member 2 . Each group of fins 3 connected to each first region 21 is arranged in a space different from each other. A group of fins 3 connected to one first region 21 does not overlap a group of fins 3 connected to another first region 21 in the first direction A and the second direction B. FIG. As a result, the electronic device 1 can exchange heat with a large amount of air compared to an electronic device 1A described later in which a plurality of fins 3 are arranged on the inner peripheral side of the cylindrical member 2, so that high heat dissipation is realized. can be

In the heat sink 100, the plate-like member 20 is integrally constructed. In the electronic device 1 assembled with such a heat sink 100, heat transfer and heat dissipation in the cylindrical member 2 are high compared to the case where the plate member 20 is not integrally formed.

The heat sink 100 has multiple recesses 23 . Each of the plurality of recesses 23 extends along the first direction A along the first surface 2A. The plurality of recesses 23 are spaced apart from each other in a second direction B that extends along the first surface 2A and intersects with the first direction A. As shown in FIG.

Such a heat sink 100 can be assembled into the polygonal tube-shaped electronic device 1 by bending the plate member 20 at each recess 23 . When the electronic device 1 has a polygonal tube shape, compared to the case where the electronic device 1 does not have a polygonal tube shape, the area of the region in which the heat-dissipating member can be mounted and the degree of freedom in the arrangement of the region are increased. , with high cooling efficiency. Further, when the electronic device 1 has a polygonal tube shape, the space in which the member to be heated is arranged and the space in which the plurality of fins 3 are arranged are partitioned by the tubular member 2 . The cooling efficiency of such an electronic device 1 is higher than that of a heat sink in which the space in which the member to be heated is arranged and the space in which the plurality of fins 3 are arranged are not separated by the cylindrical member 2.

The heat sink assembly 101 further includes a heat sink 100, and a semiconductor element 10 and a substrate 11 connected to the first surface 2A.

In the above-described conventional heat sink, when the couplers on which the heat-dissipated members are mounted are fitted together, bending stress is applied to the heat-dissipated members, and the heat-dissipated members may be damaged. On the other hand, in the heat sink assembly 101 in which the semiconductor element 10 and the substrate 11 are mounted on the plate-like member 20, even if the plate-like member 20 is bent, the bending stress is applied to the second region 22 including the concave portion 23 and Since the second region 22 undergoes plastic deformation, bending stress is less likely to be applied to the semiconductor element 10 and the substrate 11 . As a result, in the electronic device 1 assembled from the heat sink assembly 101, deterioration of reliability due to the damage is suppressed compared to the electronic device having the conventional heat sink described above.

The electronic device 1 includes the heat sink 100 and a fixing member 5 provided to fix the first end 2C and the second end 2E of the plate member 20 in the second direction B. As shown in FIG. In the electronic device 1 of the electronic device 1, the plate-like member 20 is bent around the plurality of concave portions 23 as bending axes, and the cylindrical member 2 has a polygonal outer shape. The first end 2C and the second end 2E fixed by the fixing member 5 form one vertex of a polygonal shape.

From a different point of view, the electronic device 1 has a polygonal tubular shape, and a cylindrical member 2 having a first end 2C and a second end 2E arranged to form one vertex of the polygonal tubular shape. , the semiconductor element 10 and the substrate 11 connected to the inner peripheral surface of the tubular member 2, the plurality of fins 3 connected to the outer peripheral surface of the tubular member 2, the first end 2C and the second end and a fixing member 5 fixing the portion 2E. A bent portion 4 of the cylindrical member 2 forming a vertex other than the one vertex of the polygonal cylinder shape is provided with a concave portion 23 that is recessed with respect to the outer peripheral surface.

The outer shape of the cylindrical member 2 of the electronic device 1 is maintained by plastic deformation at the three bent portions 4 and by fixing the first end portion 2C and the second end portion 2E by one fixing member 5. . Therefore, in the electronic device 1, compared to an electronic device having a conventional heat sink in which each corner is formed by fitting two connectors, heat dissipation is high, and the number of parts can be reduced. can be

In the electronic device 1, the first end portion 2C is provided with a first through hole 2D, and the second end portion 2E is provided with a second through hole 2F. The fixing member 5 is inserted into the first through hole 2D and the second through hole 2F at the same time.

As described above, in the electronic device 1, the first end portion 2C and the second end portion 2E are fixed by the fixing member 5, so that the first end portion 2C and the second end portion 2E form a plurality of connectors. Bending stress is less likely to be applied to semiconductor element 10 and substrate 11 than in the case where they are coupled through each other. Therefore, in the electronic device 1, deterioration of reliability due to the damage is suppressed as compared with the electronic device having the above-described conventional heat sink.

Embodiment 2.
As shown in FIGS. 7 and 8, the heat sink 100A according to the second embodiment has basically the same configuration as the heat sink 100 according to the first embodiment, but the concave portion 23 is It differs in that it is recessed. A heat sink assembly 101A according to the second embodiment has basically the same configuration as the heat sink assembly 101 according to the first embodiment, but differs in that a heat sink 100A is provided instead of the heat sink 100. FIG.

Each second region 22 of the plate member 20 is provided with one recessed portion 23 that is recessed with respect to the first surface 2A. Each second region 22 is provided so as to be plastically deformed when bent at the recess 23 to form the bent portion 4 shown in FIGS. 9 and 10 .

In each second region 22, the thickness between the bottom of recess 23 and second surface 2B is thinner than the thickness T1 between first surface 2A and second surface 2B in each first region 21. As shown in FIG. The thickness between the bottom of the recess 23 and the second surface 2B is, for example, 1/3 or more and 2/3 or less of the thickness T1. The thickness T2 is preferably 1/2 or more and 2/3 or less of the thickness T1.

As shown in FIGS. 9 and 10, the electronic device 1A includes an electronic device 1A formed by deforming a heat sink assembly 101A. The electronic device 1</b>A has basically the same configuration as the electronic device 1 , but differs in that the plurality of fins 3 are arranged inside the cylindrical member 2 . In the electronic device 1</b>A, flow paths for gas supplied to the plurality of fins 3 are provided inside the tubular member 2 .

The tubular member 2 is obtained by bending the plate member 20 of the heat sink assembly 101A at the second region 22 and plastically deforming it. The tubular member 2 has an outer peripheral surface consisting of a first surface 2A and an inner peripheral surface consisting of a second surface 2B.

Each bent portion 4 is formed by bending and plastically deforming each second region 22 of the plate member 20 . A concave portion 23 is provided on the outer peripheral side of each bent portion 4 . The recessed portion 23 is open toward the outer peripheral side of the tubular member 2 . At each bent portion 4, the thickness between the bottom of recess 23 and second surface 2B is thinner than the thickness between first surface 2A and second surface 2B at each side.

The plurality of fins 3 are provided so as not to interfere with each other in the electronic device 1A. For example, one group of fins 3 (first group of fins 3) connected to one of the first regions 21 connected to the bending portion 4 and the other group of fins 3 connected to the other first region 21 connected to the bending portion 4 The group of fins 3 (the second group of fins 3) are alternately arranged in the first direction A. As shown in FIG. The intervals in the first direction A between the fins 3 of the first group are, for example, equal to each other. The intervals in the first direction A between the fins 3 of the second group are, for example, equal to each other. The spacing in the first direction A between each of the fins 3 of the first group is, for example, equal to the spacing in the first direction A between each of the fins 3 of the second group. In the first direction A, the first group of fins 3 and the second group of fins 3 are arranged with a half period shift from each other.

For example, the group of fins 3 connected to one first region 21 connected to the bent portion 4 and the group of fins 3 connected to the other first region 21 connected to the bent portion 4 are , are shifted from each other by half a cycle, and arranged so as not to interfere with each other when bent.

For example, the group of fins 3 connected to one of the two first regions 21 facing each other and the group of fins 3 connected to the other first region 21 are the same. They are arranged in a straight line. The length of the plurality of fins 3 in the extending direction is less than half the distance between the second surfaces 2B of the two first regions 21 facing each other in the tubular member 2 .

In the heat sink 100A, the multiple recesses 23 are recessed with respect to the first surface 2A. In this case, in the electronic device 1</b>A, the plurality of fins 3 are arranged on the inner peripheral side of the cylindrical member 2 . Each group of fins 3 connected to each first region 21 is arranged in a common space. A group of fins 3 connected to one first region 21 is arranged to overlap a group of fins 3 connected to another first region 21 in the first direction A and the second direction B. . As a result, the electronic device 1</b>A has a higher cooling efficiency than the electronic device 1 in which the plurality of fins 3 are arranged on the outer peripheral side of the cylindrical member 2 .

Embodiment 3.
As shown in FIGS. 9 and 10, the electronic device 1B according to the third embodiment has basically the same configuration as the electronic device 1A according to the second embodiment, but the cylindrical member 2 has the second surface The difference is that 2B is provided so as to form a circumferential surface. Further, the electronic device 1B differs from the electronic device 1A in that the contact surfaces 2G and 2H where the adjacent first regions 21 of the cylindrical member 2 are in contact with each other are provided on the bent portion 4 .

The heat sink 100B according to Embodiment 3 has basically the same configuration as the heat sink 100A, but the plate-like member 20 is located on the side opposite to the first surface 2A and the inner peripheral surface of the cylindrical member 2 of the electronic device 1B. , a plurality of sets of first concave surfaces 24a and 24b forming the contact surface 2G in the tubular member 2 of the electronic device 1B, and a set of second concave surfaces 25a and 25b forming the contact surface 2G. It differs in that it has A heat sink assembly 101B according to Embodiment 3 differs from the heat sink assembly 101A in that it includes a heat sink 100B.

The plate member 20 of the heat sink 100B is provided with a recess 24 recessed with respect to the second surface 2B in addition to the recess 23 recessed with respect to the first surface 2A.

A plurality of fins 3 are connected to the second surface 2B. The second surface 2B is provided on each first region 21 of the plate member 20 . The second surface 2B has a plurality of circumferential surface portions divided in the second direction B and arranged. The plurality of circumferential surface portions have mutually equivalent configurations. Each circumferential surface portion is provided in the first region 21 . The plurality of circumferential surface portions are configured as part of the circumferential surface divided in the circumferential direction. One end and the other end of each circumferential surface portion in the second direction B are connected to one end and the other end of the first concave surfaces 24a, 24b and the second concave surfaces 25a, 25b. One end and the other end of each circumferential surface portion in the second direction B are located farther from the first surface 2A in the third direction than the central portion of each circumferential surface portion in the second direction B.

The plurality of fins 3 are provided parallel to each other, for example, like the plurality of fins 3 in the electronic device 1A.

The plurality of sets of first concave surfaces 24a and 24b have the same configuration. A pair of first concave surfaces 24 a and 24 b are provided in one second region 22 . As shown in FIG. 9, the pair of first concave surfaces 24a and 24b are provided in the plate-like member 20 so as to form one concave portion 24 extending along the first direction A. As shown in FIG. Each recess 24 is provided so as to overlap with one recess 23 in the third direction. The depth of the recess 23 is greater than the depth of the recess 24 in the third direction.

The thickness between the bottom of the recess 23 and the bottom of the recess 24 in the third direction is thinner than the thickness between the first surface 2A and the second surface 2B in each first region 21 . The thickness between the bottom of the recess 23 and the bottom of the recess 24 in the heat sink 100B is equal to that of the heat sink 100A, for example. The depth of the concave portion 23 with respect to the first surface 2A of the heat sink 100B is set deeper than that of the heat sink 100A, for example.

As shown in FIG. 9, the pair of first concave surfaces 24a and 24b have a V-shape in the plate-like member 20 and are provided in the tubular member 2 so as to contact each other. As shown in FIG. 10, the first concave surfaces 24a and 24b of each pair are in contact with each other in the tubular member 2 to form a contact surface 2G.

As shown in FIG. 9, the pair of second concave surfaces 25a and 25b are spaced apart from each other in the second direction B on the plate member 20. As shown in FIG. One second concave surface 25a is provided so as to continue to the first end 2C. The other second concave surface 25b is provided so as to continue to the second end 2E. A pair of second concave surfaces 25a and 25b are provided in the cylindrical member 2 so as to contact each other. As shown in FIG. 10, the pair of second concave surfaces 25a and 25b are in contact with each other in the tubular member 2 to form a contact surface 2H.

As shown in FIG. 10, in the electronic device 1B, the second surface 2B of the cylindrical member 2 forms a circumferential surface. In the electronic device 1B, flow paths for gas supplied to the plurality of fins 3 are provided within the space surrounded by the circumferential surface. In the electronic device 1B, the concave portion 23 has, for example, two side surfaces that are arranged with the bottom portion therebetween and form an angle of 90 degrees. As a result, the pressure loss of the air passage surrounded by the inner peripheral surface of the tubular member 2 of the electronic device 1B is reduced compared to the pressure loss of the air passage surrounded by the inner peripheral surface of the tubular member of the electronic device 1A. It is As a result, the cooling efficiency of the electronic device 1B is higher than the cooling efficiency of the electronic device 1A.

In addition, the second surface 2B of the electronic device 1B may be provided so as to form an elliptical peripheral surface. Even in this way, the pressure loss of the air passage surrounded by the inner peripheral surface of the cylindrical member 2 of the electronic device 1B is reduced compared to that of the electronic device 1A, so the cooling efficiency of the electronic device 1B is lower than that of the electronic device 1A. higher than the cooling efficiency of

Embodiment 4.
As shown in FIGS. 11 and 12, the heat sink 100C according to the fourth embodiment has basically the same configuration as the heat sink 100A according to the second embodiment, but at least one heat sink incorporated in the plate member 20. It differs in that two heat pipes 6 are further provided. A heat sink assembly 101C according to the fourth embodiment differs from the heat sink assembly 101A in that it includes a heat sink 100C. An electronic device 1C according to Embodiment 4 is obtained by assembling a heat sink assembly 101C.

The heat pipe 6 is provided so that a heat medium flows. Preferably, the heat medium flowing through the heat pipe 6 is a solvent with relatively high thermal conductivity, such as water.

The heat sink 100C includes a plurality of heat pipes 6, for example. A plurality of heat pipes 6 are arranged between the first surface 2A and the second surface 2B. The arrangement pattern of the plurality of heat pipes 6 can be set arbitrarily. Each heat pipe 6 is arranged, for example, along the first surface 2A. Each heat pipe 6 is arranged parallel to the recess 23, for example.

Each heat pipe 6 may be incorporated into the plate-like member 20 by any method, but is press-fitted into the plate-like member 20, for example.

The electronic device 1</b>C can dissipate the heat generated in the semiconductor element 10 and the substrate 11 to the heat medium flowing around the plurality of fins 3 and the heat medium flowing inside the heat pipe 6 . Therefore, the electronic device 1C can efficiently cool the semiconductor element 10 and the substrate 11 even when the heat density of the semiconductor element 10 and the substrate 11 is relatively high, and when the amount of heat generated by the semiconductor element 10 and the substrate 11 is relatively large.

Embodiment 5.
As shown in FIGS. 13 and 14, an electronic device 1D according to the fifth embodiment has basically the same configuration as the electronic device 1A according to the second embodiment, but a tubular member as a first heat radiation member 2 in place of the frame member 2, and when viewed from the first direction A, a first heat exchange area in which a plurality of fins 3 are densely arranged, and a plurality of fins 3 compared to the first heat exchange area. is formed inside the frame-shaped member 2, which is different from the electronic device 1A. 13 is a diagram of the electronic device 1D viewed from the first direction A. FIG.

The frame-shaped member 2 is obtained by bending and plastically deforming the plate-shaped member 20 of the heat sink assembly 101D shown in FIG. 15 at the second region 22 . That is, the heat sink 100D according to Embodiment 5 has basically the same configuration as the heat sink 100B, but differs from the heat sink 100B in that the plate-like member 20 is provided so as to deform into the frame-like member 2. different.

The frame-shaped member 2 has an outer peripheral surface consisting of a first surface 2A and an inner peripheral surface consisting of a second surface 2B. Each of the outer peripheral surface and the inner peripheral surface of the frame-shaped member 2 is not configured as a series of surfaces in their circumferential direction.

The frame member 2 has three sides and four corners. The three sides of the frame-shaped member 2 are: a first side located between two bent portions 4; a second side connected to the first side via one bent portion 4; It has a first side and a third side connected via another bent portion 4 . Each of the three side portions of the tubular member 2 is configured by each first region 21 of the plate-shaped member 20 . A plurality of fins 3 are connected to each side. Two corners of the tubular member 2 are formed by the two bent portions 4, and the other two corners are formed by the first end 2C and the second end 2E of the plate member 20. . Each bent portion 4 is formed by bending and plastically deforming each second region 22 of the plate member 20 . A concave portion 23 is provided on the outer peripheral side of each bent portion 4 . The recessed portion 23 is open toward the outer peripheral side of the tubular member 2 .

The longitudinal direction of the group of fins 3a (first group of fins) connected to the first side is the same as the group of fins 3b (second group of fins) connected to each of the second and third sides. fins).

As shown in FIGS. 13 and 14, when viewed from the first direction A, a first heat exchange region in which the first group of fins 3a and the second group of fins 3b are arranged so as to overlap in a grid pattern; A second heat exchange area in which only the second group of fins 3b are arranged is formed inside the frame member 2 . The first heat exchange area is continuous with the second heat exchange area. The first heat exchange area faces the first side, the second side and the third side. The second heat exchange area faces the second side and the third side. In the frame-shaped member 2, more heat-dissipating members are mounted in the area facing the first heat exchange area than in the area facing the second heat exchange area.

In the first heat exchange area where the fins 3a of the first group and the fins 3b of the second group are arranged so as to overlap in a grid pattern, a plurality of spaces extending in the first direction A are formed by the fins 3a of the first group. and the second group of fins 3b are spaced apart longitudinally. In the second heat exchange area where only the second group of fins 3b are arranged, a plurality of spaces extending in the first direction A are arranged in a direction intersecting the longitudinal direction of the second group of fins 3b (that is, the first group of fins 3b). are spaced apart in the longitudinal direction of the fins 3a).

A group of fins 3a (first group of fins) connected to the first side, and a group of fins 3b (second group of fins) connected to each of the second and third sides are provided so as not to interfere with each other.

As shown in FIG. 14, the first group of fins 3a and the second group of fins 3b are arranged alternately in the first direction A. As shown in FIG. The intervals in the first direction A between the fins 3 of the first group are, for example, equal to each other. The intervals in the first direction A between the fins 3 of the second group are, for example, equal to each other. The spacing in the first direction A between each of the fins 3 of the first group is, for example, equal to the spacing in the first direction A between each of the fins 3 of the second group. In the first direction A, the first group of fins 3 and the second group of fins 3 are arranged with a half period shift from each other.

As shown in FIG. 13, the length in the extending direction (longitudinal direction) of the first group of fins 3 is shorter than the length of each of the second and third side portions in that direction. The longitudinal length of the fins 3 of the first group is, for example, equal to the longitudinal length of the fins 3 of the second group.

As shown in FIG. 15, in the heat sink 100D, the first end portion 2C and the second end portion 2E of the plate-like member 20 are not provided so as to be fitted to each other. Each of the first end portion 2C and the second end portion 2E of the plate-like member 20 is provided to form a corner portion of the frame-like member 2 in the electronic device 1D. Plate member 20 includes three first regions 21 and two second regions 22 . The lengths of the three first regions 21 in the second direction B are, for example, equal to each other. The first side portion of the frame-shaped member 2 is configured by the first region 21 located in the center in the second direction B among the three first regions 21 and located between the two second regions 22. . The second side portion of the frame-shaped member 2 is configured by the first region 21 located on one side in the second direction B among the three first regions 21 . The third side portion of the frame-shaped member 2 is configured by the first region 21 located on the other side in the second direction B among the three first regions 21 . The longitudinal lengths of the plurality of fins 3 connected to each first region 21 are, for example, equal to each other.

In the electronic device 1D, as in the electronic device 1A, the semiconductor element 10 and the substrate 11 are mounted on the outer peripheral surface of each side of the frame-shaped member 2, and the frame-shaped member 2 and the plurality of fins 3 are mounted inside the frame-shaped member 2. heat exchange with the flowing gas. As a result, the electronic device 1D can achieve the same effects as the electronic device 1B.

Further, in the electronic device 1</b>D, the first heat exchange area and the second heat exchange area are formed inside the frame member 2 when viewed from the first direction A. When the air volume and air velocity of the gas flowing through both areas are the same, the heat exchange efficiency in the first heat exchange area is higher than the heat exchange pore size in the second heat exchange area. Therefore, in the electronic device 1D, the amount of heat generated by the member to be radiated mounted in the area facing the first heat exchange area in the frame-shaped member 2 is reduced by the amount of heat generated in the area facing the second heat exchange area. This is suitable when the amount of heat generated is large compared to the amount of heat generated by the member to be radiated.

Although only the second group of fins 3b are arranged in the second heat exchange area of the electronic device 1D shown in FIGS. 13 and 14, the present invention is not limited to this. In the electronic device 1D, the tips of some of the fins 3a of the first group may be arranged to reach the second heat exchange area. For example, in the first heat exchange region, all of the first group of fins 3a and part of the second group of first heat transfer tubes 3b are arranged in a grid pattern, and in the second heat exchange region, the first group of A portion of the fins 3 and another portion of the second group of fins 3b may be arranged in a grid pattern. From a different point of view, the longitudinal length of some of the fins 3a of the first group may be longer than the longitudinal length of the rest of the fins 3a of the first group. The part of the fins 3a of the first group and the remaining part of the fins 3a of the first group are alternately arranged in the second direction B, for example.

<Modification>
Each of the first heat dissipation members of the heat sinks 100, 100A, 100B, 100C, and 100D according to Embodiments 1 to 5 is a plate as long as the plurality of semiconductor elements 10 and the plurality of substrates 11 serving as heat-dissipated members are not mounted. It may be the tubular member 2 or the frame-shaped member 2 in which the plate-shaped member 20 is bent with each concave portion 23 as a bending axis. In other words, the heat sinks 100, 100A, 100B, 100C, and 100D may be configured as coolers having the tubular member 2 or the frame-shaped member 2 as the first heat radiating member.

The electronic devices 1, 1A, 1B, 1C, and 1D according to the first to fifth embodiments are configured by plastically deforming the plate member 20, which is the first heat radiation member of each of the heat sink assemblies 101, 101A, 101B, 101C, and 101D. The heat sinks 100, 100A, 100B, 100C, and 100D may be assembled by mounting the heat-radiated member on the cylindrical member 2 or the frame-shaped member 2, which is the first heat radiating member plastically deformed. It may have been

In the heat sinks 100, 100A, 100B, 100C, and 100D according to Embodiments 1 to 5, the first heat dissipation member may be integrated with the second heat dissipation member. For example, the plate member 20 and the plurality of fins 3 may be integrally provided. In this case, the heat-receiving layer described above is not required. Similarly, the tubular member 2 or the member having only one corner as described above may be provided integrally with the plurality of fins 3 . The first heat radiation member may be provided as the same member as the second heat radiation member, for example. The second heat dissipating member may be joined to the first heat dissipating member by a joining member, for example, and may be provided integrally with the first heat dissipating member, or may be fitted to the first heat dissipating member and provided integrally therewith.

The longitudinal direction of each of the second heat dissipation members of the heat sinks 100, 100A, 100B, 100C, and 100D according to Embodiments 1 to 5 is along the third direction perpendicular to the second surface 2B, but is limited to this. is not. The inclination angle formed by the longitudinal direction of each second heat radiating member with respect to the second surface 2B may be more than 0 degrees and less than 90 degrees.

In the heat sinks 100, 100A, 100B, 100C and the electronic devices 1, 1A, 1B, 1C according to Embodiments 1 to 4, the tubular member 2 may have a polygonal tubular shape other than the rectangular tubular shape. . In the heat sink 100D and the electronic device 1D according to Embodiments 1 to 5, the frame member 2 may have a polygonal cylindrical shape other than the rectangular shape. For example, the tubular member 2 may have a triangular tubular shape, a pentagonal tubular shape, a hexagonal tubular shape, or an octagonal tubular shape.

16 to 18 are side views of each modification of the heat sink 100A viewed from the first direction A. FIG. 16 to 18, the semiconductor element 10 and the substrate 11 to be mounted on the heat sink 100A are illustrated by dotted lines.

As shown in FIG. 16, the shape of the tubular member 2 viewed from the first direction A may be a regular triangular tubular shape. Also in this case, the plurality of fins 3 are provided so as not to interfere with each other. For example, a group of fins 3c connected to the first side of the tubular member 2, a group of fins 3d connected to the second side of the tubular member 2 and the third A group of fins 3e connected to the side portions of are alternately arranged in the first direction A. As shown in FIG.

A group of fins 3c connected to the first side extends, for example, in a direction perpendicular to the inner peripheral surface of the first side. Each tip of the group of fins 3c connected to the first side has an end surface parallel to the inner peripheral surfaces of the second side and the third side, for example. When viewed from the first direction A, the longitudinal length of the fins 3c connected to the center of the first side is equal to the longitudinal length of the fins 3c connected to the region away from the center of the first side. Longer than length.

The inclination angle formed by the longitudinal direction of the group of fins 3d connected to the second side with respect to the inner peripheral surface of the second side is, for example, the interior angle of the first side and the second side. equal. The inclination angle formed by the longitudinal direction of the group of fins 3e connected to the third side with respect to the inner peripheral surface of the third side is, for example, the interior angle of the first side and the third side. equal. The inclination angle formed by the longitudinal direction of the group of fins 3d connected to the second side with respect to the inner peripheral surface of the second side is, for example, the angle of inclination of the group of fins 3e connected to the third side. is equal to the inclination angle formed by the longitudinal direction of the third side with respect to the inner peripheral surface of the third side. The longitudinal directions of the group of fins 3d and the group of fins 3e are the same. Each tip of the group of fins 3d connected to the second side is provided, for example, so as to contact each tip of the group of fins 3e connected to the third side. The contact portions between the tips of the group of fins 3d and the tips of the group of fins 3e are alternately arranged in the first direction A with the fins 3d connected to the first side, for example. ing.

In the heat sink 100A, the group of fins 3d connected to the second side and the group of fins 3e connected to the third side are the same as the group of fins connected to the first side. It may have the same configuration as 3c. In this case, the group of fins 3c, the group of fins 3d, and the group of fins 3e may be alternately arranged in the first direction A.

As shown in FIG. 17, the shape of the tubular member 2 as viewed from the first direction A may be a regular pentagonal tubular shape. Also in this case, the plurality of fins 3 are provided so as not to interfere with each other. For example, the fins 3 connected to each side of the tubular member 2 are arranged alternately in the first direction A. As shown in FIG. The length of each fin 3 in the longitudinal direction is shorter than the shortest distance between the center of the cylindrical member 2 and each side when viewed from the first direction A, for example. In this case, when viewed from the first direction A, a space in which the fins 3 are not arranged is formed inside the tubular member 2 . The length of each fin 3 in the longitudinal direction may be longer than the shortest distance between the center of the cylindrical member 2 and each side when viewed from the first direction A, for example.

As shown in FIG. 18, the shape of the tubular member 2 viewed from the first direction A may be a regular hexagonal tubular shape. Also in this case, the plurality of fins 3 are provided so as not to interfere with each other. For example, the fins 3 connected to each side of the tubular member 2 are arranged alternately in the first direction A. As shown in FIG. The length of each fin 3 in the longitudinal direction is shorter than the shortest distance between the center of the cylindrical member 2 and each side when viewed from the first direction A, for example. In this case, when viewed from the first direction A, a space in which the fins 3 are not arranged is formed inside the tubular member 2 . The length of each fin 3 in the longitudinal direction may be longer than the shortest distance between the center of the cylindrical member 2 and each side when viewed from the first direction A, for example. Also, each tip of the fin 3 connected to one side may be in contact with each tip of the fin 3 connected to another side opposite to the side.

In electronic devices 1, 1A, 1B, and 1C according to Embodiments 1 to 4, all corners of cylindrical member 2 are formed by bent portions 4, and first end 2C and second end 2E are polygonal cylinders. It may be arranged on one side of the shape. In this case, a concave portion 23 is provided on the outer peripheral surface of the entire bent portion 4 .

In heat sinks 100, 100A, 100C, and 100D according to Embodiments 1, 2, 4, and 5, recesses 24 may be provided in plate-like member 20 as in heat sink 100B according to Embodiment 3. The recess 24 is provided so as to overlap with one recess 23 in the third direction. The depth of the recess 24 is shallower than the depth of the recess 23 . The inner peripheral surfaces facing each other across the bottom of the concave portion 24 are provided so as to come into contact with each other in the cylindrical member 2 or the frame-like member 2, like the first concave surfaces 24a and 24b. The plate member 20 of the heat sinks 100A, 100C, and 100D may further be provided with a concave portion 24 that is concave with respect to the second surface 2B. The plate member 20 of the heat sink 100 may be further provided with a concave portion 24 that is concave with respect to the first surface 2A.

Although the embodiment of the present disclosure has been described as above, it is also possible to modify the above-described embodiment in various ways. Also, the scope of the present disclosure is not limited to the above-described embodiments. The scope of the present disclosure is indicated by the claims, and is intended to include all changes within the meaning and range of equivalents to the claims.

1, 1A, 1B, 1C Electronic device, 2 Cylindrical member, 2A First surface, 2B Second surface, 2C First end, 2D First through hole, 2E Second end, 2F Second through hole, 2G , 2H contact surface 3 fin 4 bent portion 5 fixing member 6 heat pipe 10 semiconductor element 11 substrate 20 plate member 21 first region 22 second region 23, 24 concave portion 24a, 24b first concave surface 25a, 25b second concave surface 100, 100A, 100B, 100C heat sink 101, 101A, 101B, 101C heat sink assembly.

Claims (20)

a first heat dissipation member including at least one corner extending along a first direction and a plurality of side portions connected via the at least one corner;
A plurality of second heat dissipation members connected to each of the plurality of side portions,
At least one recess is provided in the at least one corner,
the at least one corner portion is a bent portion formed by bending the at least one concave portion as a bending axis;
The plurality of second heat radiating members are arranged inside the first heat radiating member ,
The plurality of second heat dissipating members include a first group of second heat dissipating members connected to one of the plurality of side portions and a second heat dissipating member connected to another side portion of the plurality of side portions. a connected second group of second heat dissipating members,
When viewed from the first direction, a region is formed inside the first heat dissipating member so that at least the second heat dissipating member of the first group and the second heat dissipating member of the second group overlap each other. A heat sink. The heat sink according to claim 1, wherein the at least one recess extends along the first direction from one end of the first heat dissipation member to the other end in the first direction. 3. The heat sink according to claim 1, wherein said at least one concave portion is provided on the outer peripheral surface of said first heat radiating member. the at least one recess has a plurality of recesses;
4. The heat sink according to claim 3, wherein a part of said plurality of recesses is provided on the inner peripheral surface of said first heat radiation member. The heat sink according to any one of claims 1 to 4, wherein the first group of second heat dissipating members are provided so as not to interfere with the second group of second heat dissipating members. When viewed from the first direction, a region in which the first group of second heat radiating members and the second group of second heat radiating members are arranged to overlap in a grid pattern, and the second group of second heat radiating members. 6. The heat sink according to any one of claims 1 to 5, wherein the area where the chisel is arranged is formed inside the first heat dissipation member. The heat sink according to any one of claims 1 to 6, further comprising a heat pipe arranged inside said first heat dissipation member. The heat sink according to any one of claims 1 to 7, wherein the first heat dissipation member is integrally constructed. The at least one corner has a plurality of corners arranged to sandwich one of the plurality of sides,
The heat sink according to any one of claims 1 to 8, wherein each of said plurality of corners is provided with said at least one recess. a heat sink according to any one of claims 1 to 9;
An electronic device, further comprising a heat-dissipated member connected to at least one of the plurality of side portions and arranged outside the first heat-dissipating member. a first heat radiating member having a polygonal tubular shape when viewed from a first direction and having a first end and a second end in the circumferential direction of the polygonal tubular shape;
a heat-dissipated member connected to either one of the inner peripheral surface and the outer peripheral surface of the first heat radiating member;
a plurality of second heat radiating members connected to the other of the inner peripheral surface and the outer peripheral surface of the first heat radiating member;
The first heat radiation member has a bent portion forming a vertex of the polygonal tube shape and a plurality of side portions connected via the bent portion ,
A concave portion is provided on the outer peripheral surface of the bent portion ,
The plurality of second heat dissipating members include a first group of second heat dissipating members connected to one of the plurality of side portions and a second heat dissipating member connected to another side portion of the plurality of side portions. a connected second group of second heat dissipating members,
When viewed from the first direction, an area in which at least the second heat radiation member of the first group and the second heat radiation member of the second group are arranged to overlap is formed inside the first heat radiation member. electronic equipment . 12. The electronic device according to claim 11, wherein said inner peripheral surface is curved. The first end is provided with a first through hole,
A second through hole is provided in the second end,
13. The electronic device according to claim 11, further comprising a fixing member inserted into said first through-hole and said second through-hole at the same time to fix said first end and said second end. a first heat radiating member having a first surface and a second surface located opposite to the first surface, wherein at least one recess is provided in at least one of the first surface and the second surface; and a plurality of second heat dissipating members connected to the second surface; and
a step of plastically deforming the first heat radiating member by bending the first heat radiating member with the at least one concave portion as a bending axis ;
each of the first surface and the second surface extends along a first direction and a second direction that intersects the first direction;
When viewed from the first direction, the first heat dissipation member includes a plurality of side portions arranged to sandwich the at least one recessed portion,
The plurality of second heat dissipating members include a first group of second heat dissipating members connected to one of the plurality of side portions and a second heat dissipating member connected to another side portion of the plurality of side portions. a connected second group of second heat dissipating members,
In the step of plastically deforming, at least the second heat dissipating member of the first group and the second heat dissipating member of the second group overlap inside the first heat dissipating member when viewed from the first direction. A method of manufacturing a heat sink in which a positioned region is formed . having a first surface extending along a first direction and a second direction intersecting the first direction and a second surface located opposite to the first surface, and arranged side by side in the second direction a first heat dissipating member including a plurality of first regions, and at least one second region connecting between two first regions adjacent in the second direction among the plurality of first regions;
a plurality of second heat dissipation members connected to the second surface of each of the plurality of first regions;
At least one recess is provided in the at least one second region,
The at least one second region is bent when the first heat radiation member is bent around the at least one concave portion as a bending axis such that the first surface faces outward and the second surface faces inward. It is provided so as to constitute a part ,
The plurality of second heat dissipating members include a first group of second heat dissipating members connected to one of the plurality of first regions and one of the plurality of first regions. a second group of second heat dissipation members connected to the first region;
When the first heat dissipating member is bent around the at least one concave portion as a bending axis so that the first surface faces outward and the second surface faces inward, the first heat dissipating member is bent as viewed from the first direction. A heat sink, wherein a region is formed inside the heat dissipating member so that at least the second heat dissipating member of the first group and the second heat dissipating member of the second group overlap each other . 16. The heat sink according to claim 15, wherein the at least one recess extends along the first direction from one end of the first heat dissipation member to the other end in the first direction. 17. A heat sink according to claim 15 or 16, wherein said at least one recess is provided in said first surface. the at least one recess has a plurality of recesses;
18. The heat sink according to claim 17, wherein a portion of said plurality of recesses are provided on said second surface. When the first heat dissipating member of the first group is bent around the at least one concave portion as a bending axis such that the first surface faces outward and the second surface faces inward. 19. The heat sink according to any one of claims 15 to 18, wherein the heat sink is provided so as not to interfere with the second heat dissipating member of the second group. When viewed from the first direction, the first heat dissipating member bent around the at least one concave portion as a bending axis so that the first surface faces outward and the second surface faces inward. A region in which the group of second heat radiating members and the second group of second heat radiating members are arranged so as to overlap in a grid pattern, and a region in which only the second group of second heat radiating members are arranged 20. The heat sink according to claim 19, provided so as to be formed inside the 1 heat radiating member.

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