JP5076476B2 - Cooling system - Google Patents

Cooling system Download PDF

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JP5076476B2
JP5076476B2 JP2006331271A JP2006331271A JP5076476B2 JP 5076476 B2 JP5076476 B2 JP 5076476B2 JP 2006331271 A JP2006331271 A JP 2006331271A JP 2006331271 A JP2006331271 A JP 2006331271A JP 5076476 B2 JP5076476 B2 JP 5076476B2
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heat
cooling
heat pipe
radiator
coupled
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JP2008147319A (en
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敏治 持田
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

この発明は、半導体素子のような発熱する電子素子を有する電子装置を効果的に冷却するための冷却装置に関する。 The present invention relates to a cooling device for effectively cooling an electronic device having an electronic element that generates heat, such as a semiconductor element.

電子装置を構成する半導体素子は、年々その容量が増大し、発熱量も多くなっている。
そのため、このような電子装置を冷却するための冷却装置も大形にして冷却容量を増大する必要がある。 The capacity of semiconductor elements constituting electronic devices is increasing year by year, and the amount of heat generated is also increasing.
Therefore, it is necessary to increase the cooling capacity by increasing the size of the cooling device for cooling such an electronic device.

ところで、このような冷却装置としては、図６に示すように平板状の冷却基板７１の一面に櫛歯状に放熱フィン７２を多数結合して構成した櫛歯形冷却体７０を電子装置などの発熱体８０に取り付け、この冷却体７０の放熱フィン７２を自然冷却または強制冷却することにより発熱体８０の冷却を行うようにしたものが、最も一般的である。   By the way, as such a cooling device, as shown in FIG. 6, a comb-shaped cooling body 70 formed by connecting a large number of radiating fins 72 in a comb-like shape on one surface of a flat cooling substrate 71 is heated by an electronic device or the like. It is most common to cool the heating element 80 by attaching it to the body 80 and naturally cooling or forcibly cooling the radiating fins 72 of the cooling body 70.

このような櫛歯形冷却体を用いた従来の冷却装置は、冷却容量を大きくするために、冷却基板７１および放熱フィン７２の形状を変えずにただ単にこれらの寸法を大きくしても、寸法が大きくなるにしたがって冷却基板７１および放熱フィン７２の放熱効率が低下するため、例えば、冷却体の体積を２倍に増大したとしても、冷却容量を２倍にすることはできず、せいぜい１．５倍程度にしか増加させることができない。このため、櫛歯形冷却体だけを用いた冷却装置は、冷却容量の増大に限界があり、冷却可能な電子装置等の発熱体の容量も限定される。   In the conventional cooling device using such a comb-shaped cooling body, in order to increase the cooling capacity, even if these dimensions are simply increased without changing the shapes of the cooling substrate 71 and the radiating fins 72, the dimensions can be reduced. Since the heat radiation efficiency of the cooling substrate 71 and the heat radiation fins 72 decreases as the size increases, for example, even if the volume of the cooling body is doubled, the cooling capacity cannot be doubled. It can only be increased by a factor of two. For this reason, the cooling device using only the comb-shaped cooling body has a limit in increasing the cooling capacity, and the capacity of the heating element such as an electronic device that can be cooled is also limited.

特許文献１および２に示されるような放熱フィンとヒートパイプを組み合わせた冷却装置とすれば、より容量の大きい電子装置の冷却が可能となる。このような放熱フィンとヒートパイプを組み合わせた従来の冷却装置を図７に示す。   If the cooling device is a combination of heat radiation fins and heat pipes as shown in Patent Documents 1 and 2, it is possible to cool an electronic device having a larger capacity. FIG. 7 shows a conventional cooling device in which such a radiation fin and a heat pipe are combined.

この図７の従来の冷却装置は、クリップ７４により電子装置などの発熱体８０に結合された冷却基板７１にＵ字形のヒートパイプ７３の受熱端部となる中間部を熱的に結合し、このヒートパイプ７３の放熱端となる先端部に複数の放熱フィン７２を直接結合して構成している。   The conventional cooling device of FIG. 7 thermally couples an intermediate portion serving as a heat receiving end portion of a U-shaped heat pipe 73 to a cooling substrate 71 coupled to a heating element 80 such as an electronic device by a clip 74. A plurality of heat radiating fins 72 are directly coupled to a tip portion that becomes a heat radiating end of the heat pipe 73.

このような冷却装置によれば、電子装置などの発熱体８０の熱は冷却基板７１からヒートパイプ７３により放熱端側の放熱フィン７２に運ばれてこの放熱フィン７２から自然冷却または強制冷却によって放熱されることにより、発熱体８０の冷却が行われる。このように、ヒートパイプ７３を用いると、ヒートパイプの特性により、その受熱端と放熱端の間で低温度差で熱輸送が可能になるため、ヒートパイプの放熱端となる先端部でも十分な冷却性能が得られる。そのため、先端部の放熱フィンを大きくしたり、その枚数を多くしたりすると、それに比例して冷却容量が増大し、大容量の電子装置などの発熱体の冷却が可能となる。   According to such a cooling device, the heat of the heating element 80 such as an electronic device is transferred from the cooling substrate 71 to the heat radiation fin 72 on the heat radiation end side by the heat pipe 73 and radiated from the heat radiation fin 72 by natural cooling or forced cooling. As a result, the heating element 80 is cooled. As described above, when the heat pipe 73 is used, heat transfer is possible with a low temperature difference between the heat receiving end and the heat radiating end due to the characteristics of the heat pipe. Cooling performance can be obtained. Therefore, if the heat dissipating fins at the tip end portion are increased or the number of the fins is increased, the cooling capacity increases in proportion thereto, and the heating element such as a large-capacity electronic device can be cooled.

しかして、前記のようなヒートパイプを用いた従来の冷却装置においては、図７（ｂ）に示すように、平板の薄板からなる放熱フィン７２の平板面にヒートパイプを挿通するため貫通孔７２ａを設け、この貫通孔７２ａにヒートパイプ７３の放熱端となる先端部を挿入してろう付けしたり、圧入したりすることにより放熱フィン７２とヒートパイプ７３との機械的および熱的な結合を行うようにしている。   Therefore, in the conventional cooling device using the heat pipe as described above, as shown in FIG. 7B, the through hole 72a is inserted through the heat pipe through the flat surface of the radiating fin 72 made of a thin plate. By inserting a brazing tip and inserting a tip portion serving as a heat radiating end of the heat pipe 73 into the through hole 72a, or by press-fitting, the mechanical and thermal coupling between the heat radiating fin 72 and the heat pipe 73 is achieved. Like to do.

このため、このような冷却装置おいても、冷却容量が増大すると、大形の放熱フィンを多数ヒートパイプに直接結合する必要があるため、高い加工精度が必要になるとともに、ろう付け等による結合作業の困難度が高まり、ヒートパイプと放熱フィンの結合作業に多大の労力とコストが必要となる問題がある。   For this reason, even in such a cooling device, when the cooling capacity increases, it is necessary to directly connect a large number of large radiating fins to the heat pipe. There is a problem that the degree of difficulty of work increases, and a great deal of labor and cost is required for the work of joining the heat pipe and the radiating fin.

図８に、特許文献３に示された従来の冷却装置を示す。この図８に示す冷却装置は、電子装置などの発熱体８０の取り付けられた冷却基板７１に受熱端部を結合されたヒートパイプ７３の放熱端となる先端部を、冷却体９０を構成する放熱フィン９２の上に載置し、カバー９３により固定するようにしている。そして、冷却ファン９５により、放熱フィン９２に冷却空気を強制送風して冷却を行う。   FIG. 8 shows a conventional cooling device disclosed in Patent Document 3. In the cooling device shown in FIG. 8, the end portion serving as the heat radiating end of the heat pipe 73 having the heat receiving end portion coupled to the cooling substrate 71 to which the heat generating body 80 such as an electronic device is attached is radiated from the cooling body 90. It is placed on the fin 92 and fixed by the cover 93. The cooling fan 95 cools the cooling fins 92 by forcibly blowing cooling air.

この図８の従来装置によれば、ヒートパイプ７３の放熱端となる先端部が放熱フィンの上面に載置して、固定されているので、前記の図７に示す従来装置のうようにヒートパイプを放熱フィンに貫通して取り付けるものに比して、ヒートパイプと放熱フィンとの結合作業が容易となり、前記の問題は解決できる。   According to the conventional device of FIG. 8, the tip portion which becomes the heat radiating end of the heat pipe 73 is placed and fixed on the upper surface of the heat radiating fin, so that the heat pipe 73 is heated like the conventional device shown in FIG. Compared with the case where the pipe is inserted through the heat radiating fins, the heat pipe and the heat radiating fins can be easily combined, and the above-described problem can be solved.

しかし、この図８の従来装置においては、ヒートパイプが放熱フィンの上に載置されてこれと接触するだけであるので、特にヒートパイプが円形断面の金属管で構成されている場合は、カバー９３により固定されているといえども、ヒートパイプと放熱フィンとの接触面積が小さくなるため、ヒートパイプから放熱フィンへの熱伝達効率が低くなり、冷却効果を高めることができないという不都合がある。
特開平１１−１２１６６７号公報 特開２００４−０８７５５３号公報 特開平１１−０９７８７３号公報 However, in the conventional apparatus shown in FIG. 8, the heat pipe is only placed on the heat dissipating fin and comes into contact therewith, so that the cover is particularly suitable when the heat pipe is formed of a metal tube having a circular cross section. Even if it is fixed by 93, since the contact area between the heat pipe and the heat radiating fin is reduced, there is a disadvantage that the heat transfer efficiency from the heat pipe to the heat radiating fin is lowered and the cooling effect cannot be enhanced.
Japanese Patent Laid-Open No. 11-121667 JP 2004-087553 A JP-A-11-097873

この発明は、前記のような従来装置における不都合を解消するため、ヒートパイプから放熱体への熱伝達効率を高くして、冷却効果が高く、かつ大容量化の容易な冷却装置を提供することを課題とするものである。   In order to eliminate the disadvantages of the conventional apparatus as described above, the present invention provides a cooling apparatus that increases the heat transfer efficiency from the heat pipe to the heat radiating body, has a high cooling effect, and can easily increase the capacity. Is an issue.

前記の課題を解決するため、この発明は、発熱体の取り付けられた冷却基板と、放熱基板に複数の放熱フィンを結合して形成した放熱体とを設け、前記放熱体のこの冷却基板と放熱体とをヒートパイプにより熱的に結合したものにおいて、中心部に取付け穴を有する補助放熱体を設け、前記取付け穴に前記ヒートパイプの放熱端となる側の端部を挿入して前記ヒートパイプを補助放熱体に結合し、この補助放熱体の対向する両面に前記放熱体の放熱基板を結合することを特徴とするものである。
In order to solve the above-mentioned problems, the present invention provides a cooling substrate to which a heating element is attached, and a radiator that is formed by coupling a plurality of radiation fins to the radiator board. The heat pipe is provided with an auxiliary heat radiating body having a mounting hole at the center , and an end portion on the side serving as a heat radiating end of the heat pipe is inserted into the mounting hole. Is connected to the auxiliary heat radiator, and the heat radiating substrate of the heat radiator is connected to both opposing surfaces of the auxiliary heat radiator .

このようにこの発明によれば、電子装置などの発熱体の取り付けられた冷却基板と、放熱基板に複数の放熱フィンを結合して形成した放熱体とを設け、この冷却基板と放熱体とをヒートパイプにより熱的に結合して冷却装置を構成しているので、ヒートパイプは放熱フィンに直接結合することなく放熱フィンの結合された放熱体の放熱基板に結合することにより、ヒートパイプの全外周を冷却体の放熱基板と接触させて結合するので放熱体との接触面積が大きくなり、ヒートパイプから放熱体への熱伝達効率を高めることができるとともに、その結合精度を高くする必要がないため、ヒートパイプへの放熱フィンの結合作業が容易となり、簡単に冷却容量を高めることができる。   As described above, according to the present invention, a cooling board on which a heating element such as an electronic device is attached, and a radiator that is formed by coupling a plurality of radiation fins to the radiator board are provided. Since the cooling device is configured by thermally coupling with the heat pipe, the heat pipe is not directly coupled to the heat radiating fin, but is coupled to the heat radiating board of the heat radiating body to which the heat radiating fin is coupled. Since the outer periphery contacts with the heat dissipation substrate of the cooling body and is combined, the contact area with the heat dissipation body is increased, the heat transfer efficiency from the heat pipe to the heat dissipation body can be increased, and there is no need to increase the coupling accuracy. For this reason, it is easy to connect the radiating fins to the heat pipe, and the cooling capacity can be easily increased.

この発明の実施の形態を、図に示す実施例に基づいて説明する。   Embodiments of the present invention will be described based on examples shown in the drawings.

図１はこの発明の第１の実施例を示すもので、（ａ）はその正面断面図、（ｂ）はその平面図、（ｃ）は（ａ）におけるｃ−ｃ線の断面図である。   FIG. 1 shows a first embodiment of the present invention, in which (a) is a front sectional view thereof, (b) is a plan view thereof, and (c) is a sectional view taken along line cc in (a). .

この図１において、１は冷却基板であり、電子装置等の発熱体２が上下両面に結合されている。この基板１の中心部に設けられた結合穴１１にヒートパープ３の受熱端となる側の端部を挿入して、冷却基板１にヒートパイプ３を熱的に結合する。   In FIG. 1, reference numeral 1 denotes a cooling substrate, and a heating element 2 such as an electronic device is coupled to both upper and lower surfaces. The end portion on the side that becomes the heat receiving end of the heat pulp 3 is inserted into the coupling hole 11 provided in the central portion of the substrate 1 to thermally couple the heat pipe 3 to the cooling substrate 1.

４は、放熱基板４１の対向する両面に、ろう付け、またはカシメ加工等により多数の放熱フィン４２を結合して構成した放熱体である。この放熱体４の放熱基板４１の中心部に取付穴４３を設け、この取付穴４３にヒートパイプ３の放熱端となる側の端部を挿入して熱的に結合する。   Reference numeral 4 denotes a heat dissipating member formed by connecting a large number of heat dissipating fins 42 to both opposing surfaces of the heat dissipating substrate 41 by brazing or caulking. An attachment hole 43 is provided at the center of the heat dissipation board 41 of the heat dissipating body 4, and an end of the heat pipe 3 on the side serving as the heat dissipating end is inserted into the attachment hole 43 and thermally coupled.

このヒートパイプ３と放熱体４の放熱基板４１との結合は、取付穴４３に挿入されたヒートパイプと基板４１とをろう付けしたり、ヒートパイプの外径を多少基板４１の取付穴４３の内径より大きくして挿入時に圧入することにより締り嵌めにしたりすることにより熱的に良好な結合となるようにする。冷却基板１とヒートパイプ３の結合も同様である。   The heat pipe 3 and the heat radiating board 41 are joined to the heat radiating board 41 by brazing the heat pipe inserted into the mounting hole 43 and the board 41, or by slightly adjusting the outer diameter of the heat pipe to the mounting hole 43 of the board 41. By making it larger than the inner diameter and making an interference fit by press-fitting at the time of insertion, a good thermal connection is obtained. The same applies to the coupling of the cooling substrate 1 and the heat pipe 3.

この実施例によれば、図１（ｃ）から明らかなように、ヒートパイプ３の放熱端側の端部が放熱体４の放熱基板４１の取付穴４３に挿入されてこの基板４１と結合されるため、ヒートパイプ３の全外周が基板４１と接触するため、両者の接触面積が大きくなる。これによりヒートパイプ３から放熱体４への熱伝達効率が高くなるため、発熱体２で発生された熱を冷却基板１からこのヒートパイプ３を介して放熱体４へ良好に伝達でき、放熱フィン４２から外気へ効果的に放熱することができ、高い冷却効果を得ることできる。 According to this embodiment, as is apparent from FIG. 1 (c), the end of the heat pipe 3 on the heat radiating end side is inserted into the mounting hole 43 of the heat radiating board 41 of the heat radiating body 4 and coupled to the board 41. Therefore, since the entire outer periphery of the heat pipe 3 is in contact with the substrate 41, the contact area between the two becomes large. As a result, the heat transfer efficiency from the heat pipe 3 to the heat radiating body 4 is increased, so that the heat generated in the heat generating body 2 can be transferred from the cooling substrate 1 to the heat radiating body 4 through the heat pipe 3 and the heat radiating fins. The heat can be effectively radiated from 42 to the outside air, and a high cooling effect can be obtained.

なお、この図１に示す放熱体４は、全体が一体的に構成されているが、図２に示すように、放熱体４の放熱基板４１を中心から上下に２分割して構成することもできる。   The entire heat dissipating body 4 shown in FIG. 1 is integrally formed. However, as shown in FIG. 2, the heat dissipating board 41 of the heat dissipating body 4 may be divided into two vertically from the center. it can.

この場合は、分割された放熱体４ａ、４ｂの放熱基板４１ａ、４１ｂの対向面にヒートパイプ３を挿入するための断面が半円の取付溝４３ａ、４３ｂを形成し、一方の冷却体４ｂの取付溝４３ｂにヒートパイプ３を納め、その上から他方の放熱体４ａを重ね合わせて、接合部分をろう付けなどにより結合して、放熱体４ａ、４ｂおよびヒートパイプ３を一体的に結合する。   In this case, mounting grooves 43a and 43b having a semicircular cross section for inserting the heat pipe 3 are formed on the opposing surfaces of the heat dissipation boards 41a and 41b of the divided heat dissipating bodies 4a and 4b, and one of the cooling bodies 4b is formed. The heat pipe 3 is placed in the mounting groove 43b, the other heat dissipating body 4a is overlapped on the heat pipe 3, and the joined portions are joined by brazing or the like, so that the heat dissipating bodies 4a, 4b and the heat pipe 3 are joined together.

このように構成すると、放熱体４を分割して製造することができるので、これ自身の製造が容易となるとともに、ヒートパイプの放熱体への挿入作業が容易となる。   If comprised in this way, since the heat radiator 4 can be divided | segmented and manufactured, while this manufacture becomes easy, the insertion operation to the heat radiator of a heat pipe becomes easy.

図３および図４にこの発明の第２の実施例を示す。図３は組立て前の分解状態を示すもので、（ａ）はその正面断面図、（ｂ）は（ａ）におけるｂ−ｂ線の断面図である。図４は組立ての完成した状態の正面断面図を示すものである。   3 and 4 show a second embodiment of the present invention. 3A and 3B show the disassembled state before assembly, where FIG. 3A is a front sectional view thereof, and FIG. 3B is a sectional view taken along line bb in FIG. FIG. 4 shows a front sectional view of the assembled state.

図３および図４に示すようにこの実施例においては、電子装置等の発熱体２の結合された冷却基板１に受熱端側を結合されたヒートパイプ３の放熱端となる側の端部に補助放熱体４ｃを結合する。４ａおよび４ｂは、補助放熱体４ｃとは、別に構成された放熱体であり、それぞれ平板状の放熱基板４１ａおよび４１ｂに多数の放熱フィン４２ａおよび４２ｂを結合して構成されている。   As shown in FIGS. 3 and 4, in this embodiment, the heat receiving end side is coupled to the cooling substrate 1 to which the heating element 2 such as an electronic device is coupled. The auxiliary radiator 4c is coupled. 4a and 4b are heat radiators configured separately from the auxiliary heat radiator 4c, and are configured by connecting a large number of heat radiation fins 42a and 42b to flat heat radiation boards 41a and 41b, respectively.

補助放熱体４ｃは、放熱体４２ａ，４２ｂとの結合を容易にするため、この実施例においては対向する２面に平坦な接合面４６ｃ、４７ｃが形成された直方体状とし、その中心部にこの接合面と平行に設けられたヒートパイプ取付け用の取付穴４３ｃを備えている。 In order to facilitate the coupling with the radiators 42a and 42b, the auxiliary radiator 4c has a rectangular parallelepiped shape in which flat joint surfaces 46c and 47c are formed on two opposing surfaces in this embodiment. The mounting hole 43c for heat pipe attachment provided in parallel with the joint surface is provided.

この取付穴４３ｃに、図３（ａ）に示すように冷却基板１に受熱端側の端部を結合されたヒートパイプ３の放熱端となる側の端部を挿入し、ろう付けやカシメ加工等によりヒートパイプ３と補助放熱体４ｃとを熱的に良好に結合する。   As shown in FIG. 3 (a), the mounting hole 43c is inserted into the cooling substrate 1 with the heat receiving end connected to the heat receiving end, so that the heat dissipating end is inserted and brazed or caulked. For example, the heat pipe 3 and the auxiliary heat radiating body 4c are thermally coupled together.

このヒートパイプ３に結合された補助放熱体４ｃの対向した上下の平坦な接合面４６ｃ、４７ｃにそれぞれ放熱体４ａおよび４ｂの平板状の放熱基板４１ａおよび４１ｂの平板面を接合して、ろう付けなどにより熱的および機械的に結合する。このようにして補助放熱体４ｃに放熱体４ａ、４ｂを結合し、組立てを完成した冷却装置は、図４に示すとおりとなる。   The flat plate surfaces of the flat heat dissipation boards 41a and 41b of the heat dissipating bodies 4a and 4b are bonded to the opposing upper and lower flat bonding surfaces 46c and 47c of the auxiliary heat dissipating body 4c coupled to the heat pipe 3, respectively. Bonded thermally and mechanically. Thus, the cooling device which combined heat radiator 4a, 4b with auxiliary heat radiator 4c, and completed the assembly becomes as shown in FIG.

この第２の実施例においては、ヒートパイプ３は、放熱体４ａ、４ｂに結合される補助放熱体４ｃに全外周を接して結合されるので、ヒートパイプ３から補助放熱体４ｃへの熱伝達効率が高くなり、そして補助放熱体４ｃと放熱体４ａ、４ｂとも平坦な広い面積の接合面で接合して結合されるので、補助放熱体４ｃから放熱体４ａ、４ｂへの熱伝達も良好に行われる。このため、発熱体２で発生した熱は、冷却基板１からヒートパイプ３により放熱体４ａ、４ｂへ効率よく伝達されて、放熱フィン４２ａ、４２ｂから放熱される。   In this second embodiment, the heat pipe 3 is coupled to the auxiliary radiator 4c coupled to the radiators 4a and 4b so as to contact the entire outer periphery, so that heat transfer from the heat pipe 3 to the auxiliary radiator 4c is achieved. The efficiency is increased, and the auxiliary radiator 4c and the radiators 4a, 4b are joined and joined with a flat joint area having a large area, so that heat transfer from the auxiliary radiator 4c to the radiators 4a, 4b is also good. Done. For this reason, the heat generated in the heating element 2 is efficiently transmitted from the cooling substrate 1 to the radiators 4a and 4b through the heat pipe 3, and is radiated from the radiation fins 42a and 42b.

この第２の実施例においても、ヒートパイプ３をブロック状の補助放熱体に結合し、この補助放熱体を放熱基板に放熱フィンを取り付けて構成した放熱体に結合することによりヒートパイプと放熱フィンとを結合するので、放熱フィンを直接ヒートパイプに結合するようにした従来装置と比較すると、ヒートパイプと放熱フィンの結合作業がはるかに容易となる。 Also in the second embodiment, the heat pipe 3 is coupled to a block-shaped auxiliary radiator, and the auxiliary radiator is coupled to a radiator formed by attaching a radiation fin to a radiation board, whereby the heat pipe and the radiation fin are combined. Therefore, compared with the conventional apparatus in which the radiating fins are directly coupled to the heat pipe, the coupling operation of the heat pipe and the radiating fin becomes much easier.

図５は、この発明の第３の実施例を示すものである。この図５において、１、２および３は、それぞれ、前記した実施例と同様に構成された、冷却基板、電子装置等の発熱体およびヒートパイプである。４は、放熱基板４１とこれに取付けられた多数の放熱フィン４２とからなる第１の放熱体であり、受熱端となる側の端部を冷却基板１に結合されたヒートパイプ３の放熱端となる側の端部に結合される。この第１の放熱体４だけでは冷却容量が不足するために、この実施例においては、さらにもう１個、この第１の放熱体４と同じく放熱基板４１ｄと多数の放熱フィン４２ｄとから構成された第２の放熱体４ｄを設けている。そして、この第２の放熱体４ｄの放熱基板４１ｄと第１の放熱体４の放熱基板４１とを前記のヒートパイプ３とは別のヒートパイプ３ｄにより熱的に結合する。   FIG. 5 shows a third embodiment of the present invention. In FIG. 5, reference numerals 1, 2 and 3 denote a cooling substrate, a heating element such as an electronic device, and a heat pipe, respectively, which are configured in the same manner as in the above-described embodiment. Reference numeral 4 denotes a first heat radiating body comprising a heat radiating substrate 41 and a large number of heat radiating fins 42 attached thereto, and a heat radiating end of the heat pipe 3 having an end portion on the side to be a heat receiving end coupled to the cooling substrate 1. Is coupled to the end of the side. Since the cooling capacity is insufficient with only the first heat radiating body 4, in this embodiment, it is further composed of a heat radiating substrate 41 d and a large number of heat radiating fins 42 d as with the first heat radiating body 4. A second heat radiator 4d is provided. The heat radiating board 41d of the second heat radiating body 4d and the heat radiating board 41 of the first heat radiating body 4 are thermally coupled by a heat pipe 3d different from the heat pipe 3.

これにより、発熱体２の熱が、２個の放熱体４および４ｄから放熱されるようになり、冷却容量が放熱体１個の場合の２倍にすることができるので、より容量の大きな発熱体２の冷却を行うことができる。   As a result, the heat of the heating element 2 is dissipated from the two radiators 4 and 4d, and the cooling capacity can be doubled as compared with the case of one radiator, so that heat generation with a larger capacity can be achieved. The body 2 can be cooled.

なお、ここでは、２個の放熱体を結合するヒートパイプを発熱体の取り付けられた冷却基板１に結合したヒートパイプ３とは別のヒートパイプとしているが、前記のヒートパイプ３を放熱体４を貫通して延長し、その先端部に追加する放熱体４ｄを結合するようにしてもよいのである。これによっても、放熱体の容積が増大し、冷却容量を増加することができる。   Here, the heat pipe that couples the two heat radiators is a heat pipe different from the heat pipe 3 that is coupled to the cooling substrate 1 to which the heat generator is attached. The heat radiating body 4d may be coupled to the tip of the heat radiating body 4d. This also increases the volume of the radiator and increases the cooling capacity.

この発明によれば、電子装置などの発熱体の結合された冷却基板から熱を伝達するヒートパイプを予め放熱基板に放熱フィンを取り付けて構成した放熱体に熱的に結合することにより、ヒートパイプと放熱フィンとの結合が容易となるだけでなく、放熱基板に放熱フィンを取り付けて構成した放熱体として市販されている量産型の櫛歯形冷却体（ヒートシンク）を使用することが可能となるため、冷却装置のコストを低減できる効果もえられる。   According to the present invention, a heat pipe that transfers heat from a cooling substrate to which a heating element such as an electronic device is coupled is thermally coupled to a heat radiator that is configured by attaching a radiation fin to the heat radiation board in advance, thereby In addition to facilitating the coupling between the heat sink and the heat radiation fin, it is possible to use a mass-produced comb-shaped cooling body (heat sink) that is commercially available as a heat radiator formed by attaching the heat radiation fin to the heat radiation board. Moreover, the effect which can reduce the cost of a cooling device is also acquired.

この発明の実施例１による冷却装置の構成を示すもので、（ａ）は、その正面断面図、（ｂ）は、その平面図、（ｃ）は、（ａ）におけるｃ−ｃ線の断面図である。BRIEF DESCRIPTION OF THE DRAWINGS The structure of the cooling device by Example 1 of this invention is shown, (a) is the front sectional drawing, (b) is the top view, (c) is the cross section of the cc line in (a). FIG. この発明の実施例１の変形例を示す分解断面図である。It is a disassembled sectional view which shows the modification of Example 1 of this invention. この発明の実施例２による冷却装置の構成を示すもので、（ａ）は、その分解正面断面図、（ｂ）は、（ａ）におけるｂ−ｂ線の断面図である。The structure of the cooling device by Example 2 of this invention is shown, (a) is the decomposition | disassembly front sectional drawing, (b) is sectional drawing of the bb line in (a). この発明の実施例２による冷却装置の組立て状態の正面断面図である。It is front sectional drawing of the assembly state of the cooling device by Example 2 of this invention. この発明の実施例３による冷却装置の構成を示すもので、（ａ）は、その平面図、（ｂ）はその側面図である。The structure of the cooling device by Example 3 of this invention is shown, (a) is the top view, (b) is the side view. 従来の第１の冷却装置の構成を示すもので、（ａ）は、その平面図、（ｂ）は、その正面図である。The structure of the 1st conventional cooling device is shown, (a) is the top view, (b) is the front view. 従来の第２の冷却装置の構成を示すもので、（ａ）は、その正面図、（ｂ）モは、放熱フィンの平面図である。The structure of the 2nd conventional cooling device is shown, (a) is the front view, (b) is a top view of a radiation fin. 従来の第３の冷却装置の構成を示すもので、（ａ）は、その斜視図、（ｂ）は、その正面断面図である。The structure of the conventional 3rd cooling device is shown, (a) is the perspective view, (b) is the front sectional drawing.

１：冷却基板
２：発熱体（電子装置）
３：ヒートパイプ
４：放熱体
４１：放熱基板
４２：放熱フィン
1: Cooling substrate 2: Heating element (electronic device)
3: Heat pipe 4: Heat radiating body 41: Heat radiating substrate 42: Heat radiating fin

Claims (1)

発熱体の取り付けられた冷却基板と、放熱基板に複数の放熱フィンを結合して形成した放熱体とを設け、前記放熱体のこの冷却基板と放熱体とをヒートパイプにより熱的に結合したものにおいて、中心部に取付け穴を有する補助放熱体を設け、前記取付け穴に前記ヒートパイプの放熱端となる側の端部を挿入して前記ヒートパイプを補助放熱体に結合し、この補助放熱体の対向する両面に前記放熱体の放熱基板を結合することを特徴とする冷却装置。 A cooling board to which a heating element is attached, a radiator formed by coupling a plurality of radiation fins to the radiator board, and the cooling board of the radiator and the radiator are thermally coupled by a heat pipe. An auxiliary radiator having a mounting hole at the center, and inserting the end of the heat pipe on the side that becomes the heat radiating end into the mounting hole to couple the heat pipe to the auxiliary radiator, the auxiliary radiator A cooling device , wherein a heat dissipation substrate of the heat dissipating body is coupled to both opposing surfaces of the heat sink .
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