JPWO2023276938A1 - - Google Patents

Info

Publication number
JPWO2023276938A1
JPWO2023276938A1 JP2023531927A JP2023531927A JPWO2023276938A1 JP WO2023276938 A1 JPWO2023276938 A1 JP WO2023276938A1 JP 2023531927 A JP2023531927 A JP 2023531927A JP 2023531927 A JP2023531927 A JP 2023531927A JP WO2023276938 A1 JPWO2023276938 A1 JP WO2023276938A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531927A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276938A1 publication Critical patent/JPWO2023276938A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023531927A 2021-06-30 2022-06-27 Pending JPWO2023276938A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021108734 2021-06-30
PCT/JP2022/025543 WO2023276938A1 (en) 2021-06-30 2022-06-27 Heatsink for cooling thermal devices

Publications (1)

Publication Number Publication Date
JPWO2023276938A1 true JPWO2023276938A1 (en) 2023-01-05

Family

ID=84691416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531927A Pending JPWO2023276938A1 (en) 2021-06-30 2022-06-27

Country Status (3)

Country Link
JP (1) JPWO2023276938A1 (en)
TW (1) TW202303074A (en)
WO (1) WO2023276938A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244327A (en) * 1993-02-17 1994-09-02 Kobe Steel Ltd High tong ratio heat sink and manufacture thereof
EP3684150B1 (en) * 2017-09-12 2022-07-27 Sumitomo Precision Products Co., Ltd. Heat sink
JP7113914B2 (en) * 2018-12-26 2022-08-05 三菱電機株式会社 Heatsinks, heatsink assemblies, electronics, and methods of making heatsinks

Also Published As

Publication number Publication date
TW202303074A (en) 2023-01-16
WO2023276938A1 (en) 2023-01-05

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231012

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20231012