JP5344994B2 - Heat sink device - Google Patents

Description

  The present invention relates to a heat sink device, and more particularly to a heat sink device in which, for example, a semiconductor device as a heating element is joined and forcibly cooled.

  A conventional heat sink device is a plate-like first fin that forms a flow path through which a forced air flow passes on the opposite side of the semiconductor device as a heating element, for example, on a substrate on which a semiconductor device is mounted. Is provided. The first fin is formed with a hole penetrating the first fin, and the air flow passes through the hole of the first fin. At the position where the airflow ejected from the hole collides, a second fin is provided on the base so as to face the first fin, thereby forming a flow path for the airflow. Thus, the 1st fin and the 2nd fin are alternately arranged on the base.

  By adopting such a configuration, since the airflow ejected from the hole of the first fin hits the second fin and the airflow ejected from the hole of the second fin hits the first fin, the semiconductor device passes through the base. The heat conducted to the first fin and the second fin can be efficiently removed (see, for example, Patent Document 1).

JP 2002-298771 A

  In the conventional heat sink device, it is necessary to provide through holes in each of the first fin and the second fin that face each other as described above. In general, fins are often made of metal having high thermal conductivity in order to increase heat transfer efficiency. However, providing a hole in a metal fin has a problem that the machining process becomes complicated.

  The present invention has been made to solve such problems, and an object thereof is to provide a heat sink device that can be easily processed and has high cooling performance.

In order to achieve the above object, the present invention is configured as follows.
That is, the heat sink device according to one embodiment of the present invention includes a base plate having a refrigerant flow path to which a heating element is joined and a refrigerant flows, and a plate member inserted into the refrigerant flow path, and the thickness direction of the base plate And a plate member having an opening through which the refrigerant can pass and which is oriented so as to intersect with a main flow direction of the refrigerant in the refrigerant flow path, and the base plate includes the heating element. A plurality of heat dissipating members that protrude in the thickness direction of the base plate and are arranged along the main flow direction of the refrigerant on a member surface facing the joined surface, and the refrigerant flow path includes the base plate and The heat dissipating member and a cover plate disposed on the member surface side so as to face the base plate are formed between adjacent heat dissipating members, and the plate member is erected on the cover plate. Refrigerant in the above cooling passage Characterized in that it is arranged by connecting the diagonal portions located at both ends in the serial main flow direction.

  According to the heat sink device of one aspect of the present invention, the plate member is provided that is inserted into the refrigerant flow path formed in the base plate. The plate material is disposed in the refrigerant flow path and does not act as a heat transfer member. Therefore, it is possible to manufacture with a material different from the base plate and the fin, for example, a resin excellent in workability. Moreover, what is necessary is just to insert the said board | plate material, without processing the existing flow path for refrigerant | coolants. Therefore, the heat sink device can be easily processed as compared with the conventional case, and the cost can be reduced. Further, the plate member is oriented so as to intersect with the main flow direction of the refrigerant, and is disposed in the refrigerant flow path, and has an opening through which the refrigerant can pass. Therefore, the refrigerant ejected from the opening is injected to the fins forming the refrigerant flow path and hits the fins. Therefore, the heat conducted from the base plate to the fins can be efficiently removed from the fins, and the cooling performance can be improved. Thus, according to the heat sink device of one embodiment of the present invention, a heat sink that is easy to process and has high cooling performance can be obtained.

It is a perspective view which shows the structure of the heat sink apparatus in Embodiment 1 of this invention. It is sectional drawing which shows a part of A-A 'part shown to FIG. 1A. It is sectional drawing in the B-B 'part shown to FIG. 1A. It is a perspective view which shows the structure of the heat sink apparatus in Embodiment 2 of this invention. It is a perspective view which shows the board | plate material part of the heat sink apparatus in Embodiment 3 of this invention. It is a perspective view which shows the modification of the opening in the board | plate material shown to FIG. 3A. It is a perspective view which shows another modification of the opening in the board | plate material shown to FIG. 3A. It is a perspective view which shows another modification of the opening in the board | plate material shown to FIG. 3A. In the heat sink apparatus in Embodiment 4 of this invention, it is sectional drawing of the part corresponded to FIG. 1C. It is a perspective view which shows the board | plate material part of the heat sink apparatus in Embodiment 5 of this invention. It is a perspective view which shows the modification of the board | plate material part shown to FIG. 5A. It is a perspective view which shows the board | plate material part of the heat sink apparatus in Embodiment 6 of this invention. It is a perspective view which shows the modification of the board | plate material part shown to FIG. 6A. It is a perspective view which shows the structure of the heat sink apparatus in Embodiment 7 of this invention. It is sectional drawing which shows a part of A-A 'part shown to FIG. 7A. It is a perspective view which shows the structure of the modification of the heat sink apparatus shown to FIG. 7A. FIG. 7C is a cross-sectional view showing a part of the A-A ′ portion shown in FIG. 7C.

  A heat sink device according to an embodiment of the present invention will be described below with reference to the drawings. In each figure, the same or similar components are denoted by the same reference numerals.

Embodiment 1 FIG.
FIG. 1 (generic name of FIG. 1A to FIG. 1C) shows a heat sink device 101 according to Embodiment 1 of the present invention. The heat sink device 101 includes a base plate 4 having a refrigerant flow path 10 and a plate member 20 as basic components, and functions as a heat dissipation device for the semiconductor device 1 in this embodiment. However, the heat sink device 101 is not limited to the heat dissipation of the semiconductor device 1 and can be used for cooling the heating element.

  The base plate 4 is made of a plate material, and a semiconductor device 1 corresponding to an example of a heating element is bonded to the bonding surface 4a. In the present embodiment, since the heating element is the semiconductor device 1, the semiconductor device 1 is fixed to the bonding surface 4 a of the base plate 4 with a heat conductive adhesive. As described above, the heating element is bonded to the base plate 4 by a material or a technique that allows the base plate 4 and the heating element to be thermally conducted, such as brazing or soldering, according to the type. What is necessary is just to join to the surface 4a.

  Further, fins 2 corresponding to an example of a heat radiating member project from a member surface 4 b facing the joining surface 4 a of the base plate 4 along the Z direction corresponding to the thickness direction of the base plate 4. In the present embodiment, as shown in the figure, since the semiconductor devices 1 are arranged in a row along the Y direction, the base plate 4 extends in the Y direction. The shape of the base plate is not limited to the illustrated example.

In the present embodiment, the fin 2 is a plate-like member, extends along the Y direction corresponding to the extending direction of the base plate 4, and extends along the X direction orthogonal to the Y direction and the Z direction. A plurality are arranged in parallel at regular intervals. In the first embodiment, three or more fins 2 are provided as illustrated in the X direction. However, at least two fins 2 may be formed so that at least one of the following refrigerant flow paths 10 is formed. .
Such fins 2 and the base plate 4 are integrally formed of a material having good thermal conductivity, such as a metal material.

Furthermore, the cover plate 3 is disposed to face the base plate 4 on the member surface 4b side. Such a lid plate 3 is a plate material that forms the refrigerant flow path 10 between the adjacent fins 2 together with the base plate 4 and the fins 2.
The refrigerant channel 10 is supplied with a refrigerant such as a gas such as air or a liquid such as water, and flows along the extending direction of the refrigerant channel 10. Thus, in this embodiment, the main flow direction 31 of the refrigerant coincides with the Y direction corresponding to the extending direction of the base plate 4, but it is not necessary to coincide with the extending direction of the base plate 4.

Further, in the present embodiment, side walls 11 are erected in the Z direction from the member surface 4 b on both side portions in the X direction of the member surface 4 b of the base plate 4, and the lid plate 3 is provided at each end of these side walls 11. Are combined to form a recess for accommodating the fin 2. Thus, in this embodiment, the whole said recessed part also including between the adjacent fins 2 forms the flow path 10 for refrigerant | coolants.
In this embodiment, the cover plate 3 is formed of the same material as that of the base plate 4 and the fin 2. However, the material of the cover plate 3 is not limited to this. It is also possible to make it from a material different from that of the fins 2.

  Further, in the present embodiment, the refrigerant flow path 10 is formed with the above-described configuration, but the formation method is not questioned. In short, it is only necessary that the refrigerant flow path 10 exists in the base plate 4 to which the heating element is joined.

Next, the plate material 20 will be described.
The plate member 20 is a plate-like member that is inserted into the refrigerant flow path 10. In the first embodiment, the plate material 20 is a strip-shaped band material, and one plate material 20 is inserted into one refrigerant flow path 10. In the refrigerant flow path 10, the plate member 20 is arranged along the Z direction corresponding to the thickness direction of the base plate 4, that is, along the same direction as the standing direction of the fins 2 as shown in FIG. 1C. In each refrigerant flow path 10, the plate member 20 is oriented so as to intersect the main flow direction 31 of the refrigerant. That is, in the first embodiment, as shown in FIG. 1B, the plate member 20 is disposed so as to connect the diagonal portions 2 a and 2 b located at both end portions 10 a and 10 b in the main flow direction 31 of the refrigerant flow path 10. In addition, as will be described later in Embodiment 7, the arrangement of the plate member 20 is not limited to the form in which the diagonal portions 2a and 2b are connected.

  The plate member 20 thus arranged further has an opening through which the refrigerant flowing through the refrigerant flow path 10 can pass. In this Embodiment 1, the said opening has taken the form of the hole 21 (21a-21d) which penetrates the board | plate material 20 and is about 10 mm in diameter. In this embodiment, as shown in FIG. 1A, the plate member 20 has four holes 21a to 21d. However, the plate member 20 may have at least one hole 21, and may have five or more holes. Further, the shape and size of the hole 21 and the arrangement position are not limited to the illustrated form, and can be set as appropriate.

  In the case of the present embodiment, the plate member 20 having the above-described configuration is configured such that, for example, both end portions of the plate member 20 are fixed to the diagonal portions 2a and 2b of the two fins 2 constituting the respective refrigerant flow paths 10. And installed in each refrigerant flow path 10. In order to reduce the cost, it is also possible to stop the fixing of the plate material 20 to the fin 2 and simply insert the plate material 20 into the refrigerant flow path 10.

  Further, as described above, the plate member 20 is a member inserted into the refrigerant flow path 10 and does not act as a heat transfer member. Therefore, the plate member 20 does not need to be made of a metal material in consideration of thermal conductivity, but rather is preferably made of a resin material or the like that is more workable than metal. Therefore, there is an advantage that the processing of the heat sink device is easier than the conventional one and an advantage that the cost is reduced.

  In the present embodiment, after the plate member 20 is installed in the refrigerant flow path 10 as described above, the refrigerant supply and discharge ports are provided at both ends of the base plate 4 in the Y direction corresponding to the extending direction of the base plate 4. End plates 6 having 5 are joined together. The supply / discharge port 5 is connected to a cooling device such as a pump 90 for forcibly supplying the refrigerant.

The operation of the heat sink device 101 according to the first embodiment configured as described above, that is, the cooling operation of the heating element will be described below.
Heat generated from the semiconductor device 1 that is a heating element is conducted to the base plate 4 and the fins 2.

  On the other hand, for example, air as a refrigerant is supplied to each refrigerant flow path 10 through the supply / discharge port 5 of the end plate 6. The entered air flows through each refrigerant flow path 10 along the main flow direction 31 of the refrigerant. At this time, the air hits the plate material 20 in the refrigerant flow path 10 and passes through the holes 21 a to 21 d of the plate material 20. During this passage, air is ejected from the holes 21a to 21d as jets 32a, 32b, 32c, and 32d having a high flow velocity, and collides with the surface of the opposing fin 2.

Therefore, compared with the conventional structure which does not provide the board | plate material 20, in the surface of the fin 2, a heat transfer rate increases. Therefore, the heat dissipation capability in the fin 2 is improved as compared with the conventional configuration in which the plate member 20 is not provided, and the cooling characteristics in the heat sink device 101 can be improved as compared with the conventional heat sink device.
Thus, according to the heat sink device 101 of the present embodiment, it is possible to provide a heat sink that is easy to process and has high cooling performance.

  In this embodiment, the fin 2 as an example of the heat radiating member is formed of a plate material. However, the fin 2 is not limited to the plate material, and the heat radiating member is, for example, a rod-shaped member arranged in a matrix in the Y direction and the X direction. It may be a form.

Embodiment 2. FIG.
FIG. 2 shows a heat sink device 102 according to Embodiment 2 of the present invention.
In the first embodiment described above, the lid plate 3 is joined to the side wall 11 erected on the base plate 4 in advance, and the plate material 20 is inserted into the refrigerant flow path 10.
On the other hand, in the second embodiment, the plate material 20 is erected in advance on the lid plate 3 and the plate material 20 is inserted into the refrigerant flow path 10 to join the lid plate 3 to the side wall 11. take. When the cover plate 3 is joined to the side wall 11 and the plate material 20 is inserted into the refrigerant flow path 10, the plate material 20 is positioned at both end portions 10a and 10b in the main flow direction 31 of the refrigerant flow path 10 as described above. It connects and connects the diagonal parts 2a and 2b.
The other configuration of the heat sink device 102 according to the second embodiment is the same as that of the heat sink device 101 according to the first embodiment, and a description thereof is omitted here.

  The heat sink device 102 according to the second embodiment configured as described above can achieve the same effects as the heat sink device 101 described above. Furthermore, according to the heat sink device 102 of the second embodiment, since the plate material 20 is fixed to the lid plate 3, there is no need to process and join the plate material 20 and the lid plate 3 separately. And the cover plate 3 can be integrally processed. Therefore, a heat sink device can be provided at low cost. In the first embodiment, as compared with the case where the plate member 20 is not fixed to the fin 2 and the plate member 20 is simply inserted into the refrigerant flow path 10, the arrangement position of the plate member 20 is the refrigerant. It will not change with the flow of

Embodiment 3 FIG.
In the first and second embodiments described above, the opening of the plate member 20 is the circular hole 21. On the other hand, in this Embodiment 3, the case where the said opening is a hole of shapes other than circular as shown to FIG. 3A to FIG. 3D is shown. Other configurations are the same in the above-described embodiments. 3A to 3D show a form in which the plate member 20 is fixed to the cover plate 3 as in the second embodiment. Of course, the plate member 20 of the third embodiment is applied to the configuration of the first embodiment. Is also possible.

  3A shows the case where the hole is an elliptical hole 21-1, FIG. 3B shows the case where the hole is a square hole 21-2, and FIG. 3C shows the case where the opening is a rectangular notch 21-3. FIG. 3D shows a case where the opening is a triangular notch 21-4. Here, the notches 21-3 and 21-4 correspond to openings formed over the entire height of the plate member 20 along the Z direction corresponding to the thickness direction of the base plate 4.

  Moreover, although not shown in figure, in the extending direction of the board | plate material 20, it is not necessary to make the shape of each opening the same, You may change. Further, the shape of the opening may be changed for each plate member 20.

Even in the heat sink device having the plate member 20 of the third embodiment, the effects exhibited by the heat sink devices of the above-described embodiments can be achieved. Further, according to the third embodiment, since the opening in the plate material 20 may have any shape, an effect of improving the yield in processing the plate material 20 is obtained.
As described above, according to the third embodiment, the speed of the refrigerant ejected from the opening can be easily adjusted, so that the heat transfer coefficient can be improved equally over the entire surface of the fin 2. Can also be obtained.

Embodiment 4 FIG.
In Embodiments 1 to 3 described above, the plate member 20 has a height that contacts the member surface 4b of the base plate 4 as shown in FIG. 1C. On the other hand, in the heat sink device 104 of the fourth embodiment, as shown in FIG. 4, all the plate materials 20-4 have a height having a gap D between the member surface 4 b of the base plate 4. Moreover, the hole which board | plate material 20-4 has takes arbitrary forms from the inside shown in above-mentioned Embodiment 1-3. Other configurations are the same in the above-described embodiments.

  According to the fourth embodiment, the effects exhibited by the heat sink device of each of the above-described embodiments can be achieved. Furthermore, according to the heat sink device of the fourth embodiment, the following effects can be obtained. That is, in Embodiments 1 to 3 described above, when the refrigerant passes through the refrigerant flow path 10, the refrigerant can pass only through the hole 21 and the holes 21-1 to 21-4. Therefore, in the configurations of the first to third embodiments, there is a concern about an increase in pressure loss that occurs when the refrigerant passes through the hole.

  On the other hand, according to the configuration of the fourth embodiment, the refrigerant can also pass through the gap D. Therefore, the speed of the refrigerant ejected from the holes 21 and the holes 21-1 to 21-4 can be suppressed, and the pressure loss of the heat sink device 104 as a whole can be suppressed to a low level. Therefore, it is possible to reduce the size of the cooling device connected to the heat sink device by reducing the load.

Embodiment 5 FIG.
The configuration of the fifth embodiment is a combination of the configuration shown in the first to third embodiments and the configuration shown in the fourth embodiment. That is, as shown in FIGS. 5A and 5B, the plate material 20-5 in the fifth embodiment is the same as the hole 21 shown in the first to third embodiments (the embodiment shown in FIGS. 3A and 3B in the third embodiment). And a high portion 20H having no gap D, and a low portion 20L having no gap 21 or the like and having the gap D. Other configurations are the same in the above-described embodiments.

  5A and 5B illustrate a configuration in which the plate member 20-5 is fixed to the lid plate 3 as in the configuration of the second embodiment, but it may be configured as in the first embodiment. 5A shows the case of the elliptical hole 21-1 shown in FIG. 3A, and FIG. 5B shows the case of the rectangular hole 21-2 shown in FIG. 3B. Of course, this is not a limitation.

Also in the fifth embodiment having such a configuration, it is possible to achieve the effects exhibited by the heat sink devices of the above-described embodiments. Furthermore, according to the heat sink device of the fifth embodiment, the following effects can be obtained.
That is, when the refrigerant flows through the refrigerant flow path 10, not only the elliptical hole 21-1 and the square hole 21-2 in the plate member 20-5 but also the refrigerant having an increased flow velocity is ejected from the gap D. Therefore, the number of apparent openings in the plate material 20-5 increases. Therefore, the effect that the heat transfer coefficient in the surface of the fin 2 facing these openings is improved is obtained. In addition, as in the case of the above-described fourth embodiment, the pressure loss of the entire heat sink device can be kept low, and the cooling performance of the heat sink device can be further improved.

Embodiment 6 FIG.
In the fifth embodiment, the configuration shown in FIGS. 3A and 3B is taken as an example with respect to the third embodiment. However, in the sixth embodiment, the configuration shown in FIGS. 3C and 3D is taken as an example. . That is, as shown in FIGS. 6A and 6B, the plate member 20-6 according to the sixth embodiment includes a high portion 20H that does not have the gap D and a low portion 20L that has the gap D. Further, the plate member 20-6 has a notch 21-3 or a notch 21-4. Other configurations are the same in the above-described embodiments.

  Even with the configuration in the sixth embodiment, the same effect as in the fifth embodiment can be obtained.

Embodiment 7 FIG.
In Embodiments 1 to 6 described above, as shown in FIG. 1B, one plate member 20, for example, is a diagonal portion 2 a located at both end portions 10 a and 10 b in the main flow direction 31 in one refrigerant flow path 10. 2b are arranged along a straight line connecting 2b.

  In contrast, in the seventh embodiment, the heat sink device 107-1 shown in FIGS. 7A and 7B includes the plate material 20-7A, and the heat sink device 107-2 shown in FIGS. 7C and 7D includes the plate material 20-7B. Is provided.

  Although the plate material 20-7A is erected along the Z direction corresponding to the thickness direction of the base plate 4, the plate material 20-7A is oriented so as to intersect with the main flow direction 31 in one refrigerant flow path 10 and has the opening. It has a plurality of plate materials 20-7a to 20-7d. The plurality of plate members 20-7a to 20-7d in the plate member 20-7A are all oriented in the same direction as shown in FIG. 7B.

  The plate member 20-7B of the heat sink device 107-2 is composed of the plurality of plate members 20-7a to 20-7d. As shown in FIG. 7D, the plate members 20-7a to 20-7d are adjacent to each other. The plates are oriented in different directions.

Other configurations of the heat sink devices 107-1 and 107-2 are the same as those of the above-described embodiments.
The plate members 20-7A and 20-7B are composed of four plate members 20-7a to 20-7d, but the number of the plate members 20-7 is not limited to four as long as it is plural.
In FIGS. 7A to 7D, the openings in the plate members 20-7A and 20-7B are in the form of circular holes, but of course, the present invention is not limited to this, and the embodiments 3 to 6 described above are used. It can take the form shown. Therefore, some of the plate materials 20-7a to 20-7d may not have an opening.
Further, in FIGS. 7A to 7D, the plate materials 20-7A and 20-7B are shown standing and fixed on the cover plate 3, but of course, the present invention is not limited to this, and the first embodiment described above is used. The form shown can also be taken.

  The heat sink devices 107-1 and 107-2 configured as described above can achieve the effects described in the first to sixth embodiments. Further, in the heat sink devices 107-1 and 107-2, when each of the plate members 20-7a to 20-7d has a configuration having holes 21a to 21d, the jetting speed 32a to 32b of the refrigerant passing through the holes 21a to 21d. Can be kept relatively constant. Therefore, the heat transfer coefficient can be improved at an equal rate over the entire surface of the fin 2, and the ejection speeds 32a to 32d are constant, so that the pressure loss in the heat sink devices 107-1 and 107-2 as a whole. It is also effective in reducing this.

  In addition, although already described in the description of each embodiment, it is also possible to adopt a configuration in which the configurations in the first to seventh embodiments are appropriately combined. In this case, the effect which the combined embodiment has can be acquired.

DESCRIPTION OF SYMBOLS 1 Semiconductor device, 2 Fin, 2a, 2b Diagonal part, 3 Cover plate,
4 base plate, 4a joint surface, 4b member surface, 10 refrigerant flow path,
20 plate material, 20H high part, 20L low part, 21 holes,
21-3, 21-4 Notch, 31 Main flow direction,
101, 102, 104, 107 Heat sink device.

Claims (7)

A base plate having a flow path for refrigerant through which a heating element is joined and through which refrigerant flows;
A plate member inserted into the refrigerant flow path, is erected along the thickness direction of the base plate, is oriented so as to cross the main flow direction of the refrigerant in the refrigerant flow path, and allows the refrigerant to pass therethrough. A plate material having an opening,
Equipped with a,
The base plate has a plurality of heat-dissipating members that protrude in the thickness direction of the base plate and are arranged along the main flow direction of the refrigerant on a member surface that faces the bonding surface to which the heating elements are bonded.
The refrigerant flow path is formed between the adjacent heat radiating members by the base plate and the heat radiating member, and a lid plate disposed on the member surface side to face the base plate,
The plate material is erected on the lid plate, and is arranged by connecting diagonal portions located at both ends in the main flow direction of the refrigerant in one cooling passage.
A heat sink device characterized by that. Upper Symbol aperture is a hole through the sheet material, a heat sink apparatus according to claim 1. Upper Symbol opening is a cutout formed over the entire height of the sheet along the thickness direction, the heat sink device according to claim 1 or 2. It said plate member has a height that forms a gap between the upper SL base plate, the opening is a hole penetrating the plate, according to claim 1 Symbol placement of the heat sink device. It said plate member has a high portion having the hole without forming the gap, and a low portion formed the gap without having the holes, according to claim 4 Symbol mounting of the heat sink device. Said plate member, and a high portion having a height which does not form a low portion and the gap having a height to form a gap between the upper SL base plate, said opening is along the thickness direction above a notch is formed over the entire height of the plate, according to claim 1 Symbol placement of the heat sink device. Said plate member is arranged plurality relative to the main flow of the refrigerant in one of the coolant flow path, the opening is a hole through the respective plate members, according to claim 1 Symbol placement of the heat sink device.

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