JP2007273755A - Heat sink as well as power module member, and power module - Google Patents

Heat sink as well as power module member, and power module Download PDF

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JP2007273755A
JP2007273755A JP2006098092A JP2006098092A JP2007273755A JP 2007273755 A JP2007273755 A JP 2007273755A JP 2006098092 A JP2006098092 A JP 2006098092A JP 2006098092 A JP2006098092 A JP 2006098092A JP 2007273755 A JP2007273755 A JP 2007273755A
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heat sink
water channel
cooled
sink body
power module
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JP4626555B2 (en
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Akira Mori
暁 森
Yoshio Kuromitsu
祥郎 黒光
Hiroya Ishizuka
博弥 石塚
Joji Kitahara
丈嗣 北原
Makoto Chokai
誠 鳥海
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

<P>PROBLEM TO BE SOLVED: To obtain high cooling ability, and improve reliability in joining with an object to be cooled. <P>SOLUTION: A heat sink is of a double-layer structure, including a first heat sink body 12 having a supplied water path 11 connected with a cooling liquid supply means formed inside and a second heat sink body 13 provided on the surface of the first heat sink body 12 with smaller flexural rigidity than that of the first body 12. A cooling water path 15 extending in the direction orthogonal to the direction D3 where the first and second heat sink bodies 12 and 13 are stacked and connected with the water path 11 in the direction D3 where both heat sink bodies 12 and 13 are stacked is formed inside the second heat sink body 13. At least part of a region of the surface of the second body 13 located immediately above the cooling water path 15 is to serve as a mounting part with which the object 21 to be cooled is joined. A region except a corresponding region of the rear face of the second body 13 located immediately below the mounting part is joined with the surface of the first heat sink body 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、被冷却体と接合されて、この被冷却体を冷却するヒートシンク並びにパワーモジュール用部材およびパワーモジュールに関するものである。   The present invention relates to a heat sink, a power module member, and a power module that are joined to a cooled object and cool the cooled object.

この種のヒートシンクとして、例えば下記特許文献１に示されるような、その内部に表面に沿った方向に延びる冷却水路が形成され、この表面において冷却水路の直上に被冷却体が搭載される構成が知られている。これにより、被冷却体がヒートシンクの表面に接合された構造体を使用する過程において、冷却水路内に冷却液を流すことにより、この冷却液によって被冷却体の熱を回収するようになっている。
特開２００２−９３９６８号公報 As this type of heat sink, for example, as shown in Patent Document 1 below, a cooling water channel extending in a direction along the surface is formed inside, and a configuration in which a body to be cooled is mounted on the surface directly above the cooling water channel. Are known. Thus, in the process of using the structure in which the object to be cooled is bonded to the surface of the heat sink, the heat of the object to be cooled is recovered by this cooling liquid by flowing the cooling liquid in the cooling water channel. .
JP 2002-93968 A

ところで、近年では、ヒートシンクに高い冷却能を具備させ、ヒートシンクと被冷却体との接合信頼性をさらに向上させることに対する要望がある。   By the way, in recent years, there is a demand for providing a heat sink with a high cooling capability and further improving the bonding reliability between the heat sink and the object to be cooled.

本発明は、このような課題に鑑みてなされたもので、高い冷却能を具備させ、被冷却体との接合信頼性を向上させることができるヒートシンク並びにパワーモジュール用部材およびパワーモジュールを提供することを目的とする。   The present invention has been made in view of such a problem, and provides a heat sink, a power module member, and a power module that have high cooling ability and can improve the reliability of joining to an object to be cooled. With the goal.

このような課題を解決して、前記目的を達成するために、本発明のヒートシンクは、冷却液供給手段に連通される供給水路が内部に形成された第１ヒートシンク本体と、この第１ヒートシンク本体の表面に設けられるとともに、第１ヒートシンク本体よりも曲げ剛性が小さい第２ヒートシンク本体とが備えられた二層構造とされ、第２ヒートシンク本体の内部には、第１、第２ヒートシンク本体が積層された方向と直交する方向に延在し、かつ前記積層された方向で前記供給水路に連通した冷却水路が形成され、第２ヒートシンク本体の表面において冷却水路の直上に位置する部分の少なくとも一部が、被冷却体の接合される搭載部分とされ、この第２ヒートシンク本体の裏面において前記搭載部分の直下に位置する対応部分を除いた部分が、前記第１ヒートシンク本体の表面に接合されていることを特徴とする。
この発明では、被冷却体が、第１ヒートシンク本体よりも曲げ剛性が小さい第２ヒートシンク本体の表面に接合されるので、被冷却体が発熱した際、第２ヒートシンク本体の、被冷却体およびヒートシンクそれぞれの熱膨張係数の差に起因した曲げ変形を、拘束少なく発生させることが可能になり、これら被冷却体と第２ヒートシンク本体との間の接合部に発生する応力を抑えることができる。
しかも、このヒートシンクでは、第２ヒートシンク本体の裏面において前記搭載部分の直下に位置する対応部分を除いた部分が、第１ヒートシンク本体の表面に接合されているので、第２ヒートシンク本体のうち、その表面の前記搭載部分および裏面の前記対応部分が位置する部分のみを前記のように拘束少なく曲げ変形させて、この他の部分では、第１ヒートシンク本体との接合によりこの曲げ変形を拘束することが可能になる。
以上より、曲げ剛性の小さい第２ヒートシンク本体を過度に変形させることなく、被冷却体とヒートシンクとの接合信頼性を向上させることができる。
さらに、第２ヒートシンク本体の冷却水路が、前記積層された方向で供給水路に連通しているので、供給水路から冷却水路に冷却液が流入したときに、まず、この冷却液を、冷却水路を画成する壁面のうち、第２ヒートシンク本体の表面側に位置する上面壁に衝突させ、この冷却液の流れを乱流にし、その後、この乱流の冷却液を冷却水路内を流通させて前記搭載部分の直下に到達させることが可能になる。したがって、ヒートシンクの被冷却体に対する冷却能を向上させることができる。 In order to solve such problems and achieve the above object, a heat sink according to the present invention includes a first heat sink body in which a supply water channel communicating with a coolant supply means is formed, and the first heat sink body. And a second heat sink body having a bending rigidity smaller than that of the first heat sink body, and the first and second heat sink bodies are laminated inside the second heat sink body. At least part of a portion that extends in a direction orthogonal to the formed direction and that communicates with the supply water channel in the stacked direction and is positioned immediately above the cooling water channel on the surface of the second heat sink body Is the mounting portion to which the object to be cooled is joined, and the portion excluding the corresponding portion located directly below the mounting portion on the back surface of the second heat sink body is Characterized in that it is bonded to the surface of the first heat sink body.
In the present invention, since the object to be cooled is joined to the surface of the second heat sink body having a bending rigidity smaller than that of the first heat sink body, when the object to be cooled generates heat, the object to be cooled and the heat sink of the second heat sink body. It becomes possible to generate bending deformation caused by the difference between the respective thermal expansion coefficients with little restraint, and it is possible to suppress the stress generated at the joint between the cooled body and the second heat sink body.
In addition, in this heat sink, the portion of the back surface of the second heat sink body excluding the corresponding portion located immediately below the mounting portion is joined to the surface of the first heat sink body. Only the portion where the corresponding mounting portion on the front surface and the corresponding portion on the back surface are located is bent and deformed with little restraint as described above, and the bending deformation is restrained by joining to the first heat sink body in the other portions. It becomes possible.
As described above, it is possible to improve the bonding reliability between the body to be cooled and the heat sink without excessively deforming the second heat sink body having low bending rigidity.
Furthermore, since the cooling water channel of the second heat sink body communicates with the supply water channel in the stacked direction, when the cooling liquid flows into the cooling water channel from the supply water channel, the cooling liquid is first passed through the cooling water channel. Of the wall surfaces to be defined, the upper surface wall located on the surface side of the second heat sink body is collided to make the flow of the cooling liquid turbulent, and then the turbulent cooling liquid is circulated in the cooling water channel to It becomes possible to reach directly below the mounting part. Therefore, it is possible to improve the cooling ability of the heat sink to the object to be cooled.

ここで、第２ヒートシンク本体の裏面のうち、この裏面に沿った方向において前記対応部分を挟んで互いに対向する部分がそれぞれ、前記第１ヒートシンク本体の表面に接合されてもよい。
この場合、第２ヒートシンク本体のうち、その表面の前記搭載部分および裏面の前記対応部分が位置する部分に対する曲げ変形の拘束を低減させつつ、この他の部分の曲げ変形を確実に拘束することが可能になる。 Here, of the back surface of the second heat sink body, portions facing each other across the corresponding portion in a direction along the back surface may be bonded to the surface of the first heat sink body.
In this case, it is possible to reliably restrain the bending deformation of the other part while reducing the bending deformation of the second heat sink main body on the part where the mounting part on the front surface and the corresponding part on the back surface are located. It becomes possible.

また、前記冷却水路は、前記積層された方向と直交する方向においてこの水路の延在する方向に直交する方向で複数に仕切られてもよい。
この場合、ヒートシンクの被冷却体に対する冷却能をさらに向上させることができる。 The cooling water channel may be partitioned into a plurality of directions in a direction orthogonal to the direction in which the water channel extends in a direction orthogonal to the stacked direction.
In this case, the cooling ability of the heat sink with respect to the object to be cooled can be further improved.

また、本発明のパワーモジュール用部材は、被冷却体は、表面側に半導体チップが搭載されるパワーモジュール用基板とされ、このパワーモジュール用基板の裏面側が本発明のヒートシンクの前記搭載部分に接合されていることを特徴とする。   In the power module member of the present invention, the object to be cooled is a power module substrate on which a semiconductor chip is mounted on the front surface side, and the back side of the power module substrate is bonded to the mounting portion of the heat sink of the present invention. It is characterized by being.

また、本発明のパワーモジュールは、被冷却体は、パワーモジュール用基板の表面側に半導体チップが搭載された構成とされ、このパワーモジュール用基板の裏面側が本発明のヒートシンクの前記搭載部分に接合されていることを特徴とする。   In the power module of the present invention, the object to be cooled is configured such that a semiconductor chip is mounted on the front surface side of the power module substrate, and the back surface side of the power module substrate is bonded to the mounting portion of the heat sink of the present invention. It is characterized by being.

この発明によれば、高い冷却能を具備させ、被冷却体との接合信頼性を向上させることができる。   According to this invention, it is possible to provide a high cooling capacity and to improve the reliability of joining with the object to be cooled.

以下、本発明に係るヒートシンクの一実施形態について説明する。
このヒートシンク１０は、その表面の後述する搭載部分に接合された被冷却体２１の熱を、内部を流通する冷却液が回収するようになっている。図示の例では、被冷却体２１は、セラミックス板２２を有する絶縁回路基板２３の表面側に半導体チップ２４がはんだ付けされた構成とされている。絶縁回路基板２３は、セラミックス板２２の表面にろう付けされた回路板２２ａと、セラミックス板２２の裏面にろう付けされた金属板２２ｂとにより構成され、回路板２２ａの表面に半導体チップ２４がはんだ付けされ、金属板２２ｂの表面がヒートシンク１０の表面にろう付けまたははんだ付けされて、パワーモジュールが構成されている。 Hereinafter, an embodiment of a heat sink according to the present invention will be described.
The heat sink 10 is configured so that the coolant that circulates inside collects the heat of the object to be cooled 21 joined to the mounting portion to be described later on the surface thereof. In the example shown in the drawing, the body 21 to be cooled has a configuration in which a semiconductor chip 24 is soldered to the surface side of an insulating circuit board 23 having a ceramic plate 22. The insulating circuit board 23 includes a circuit board 22a brazed to the surface of the ceramic board 22 and a metal plate 22b brazed to the back surface of the ceramic board 22, and the semiconductor chip 24 is soldered to the surface of the circuit board 22a. Then, the surface of the metal plate 22b is brazed or soldered to the surface of the heat sink 10 to constitute a power module.

なお、本実施形態では、被冷却体２１は、ヒートシンク１０の表面に一方向Ｄ１に間隔をあけて複数連設されている。また、セラミックス板２２は、例えばＡｌＮ若しくはＳｉＮ等により形成され、回路板２２ａおよび金属板２２ｂは、例えば純度９９％以上のアルミニウム合金若しくは純アルミニウムにより形成されている。さらに、セラミックス板２２の厚さは約０．６３５ｍｍとされ、回路板２２ａおよび金属板２２ｂの各厚さは約０．４ｍｍとされている。   In the present embodiment, a plurality of the objects to be cooled 21 are continuously provided on the surface of the heat sink 10 with an interval in one direction D1. The ceramic plate 22 is made of, for example, AlN or SiN, and the circuit board 22a and the metal plate 22b are made of, for example, an aluminum alloy having a purity of 99% or more or pure aluminum. Further, the thickness of the ceramic plate 22 is about 0.635 mm, and the thickness of each of the circuit board 22a and the metal plate 22b is about 0.4 mm.

ヒートシンク１０は、図示されない冷却液供給手段に連通される供給水路１１が内部に形成された第１ヒートシンク本体１２と、この第１ヒートシンク本体１２の表面に設けられるとともに、第１ヒートシンク本体１２よりも曲げ剛性が小さい第２ヒートシンク本体１３とを備える二層構造とされている。
なお、第１ヒートシンク本体１２の断面二次モーメントは、第２ヒートシンク本体１３よりも大きく、例えば、第１ヒートシンク本体１２では、２０００ｍｍ４〜４５００００ｍｍ４とされ、第２ヒートシンク本体１３では、６０ｍｍ４〜２０００ｍｍ４とされている。 The heat sink 10 is provided on the surface of the first heat sink body 12 in which a supply water channel 11 communicated with a coolant supply means (not shown) is formed, and on the surface of the first heat sink body 12. It has a two-layer structure including the second heat sink body 13 having a small bending rigidity.
Incidentally, the second moment of the first heat sink body 12 is greater than the second heat sink body 13, for example, the first heat sink body 12, is a 2000mm 4 ~450000mm 4, the second heat sink body 13, 60 mm 4 ~ there is a 2000mm 4.

供給水路１１は、第１ヒートシンク本体１２の内部に、被冷却体２１が連設されている前記一方向Ｄ１に沿って延在している。さらに、本実施形態では、第１ヒートシンク本体１２の内部に、第１、第２ヒートシンク本体１２、１３が積層された方向Ｄ３と直交する方向において前記一方向Ｄ１に直交する直交方向Ｄ２に供給水路１１と間隔をあけて、この供給水路１１と略平行に延在する排出水路１４が形成されている。
そして、これらの供給水路１１および排出水路１４は、ヒートシンク１０の平面視において、被冷却体２１の搭載された位置を避けた位置に配置されて、被冷却体２１を前記直交方向Ｄ２で挟み込むように配置されている。 The supply water channel 11 extends along the one direction D <b> 1 in which the body 21 to be cooled is continuously provided inside the first heat sink body 12. Further, in the present embodiment, the supply water channel in the orthogonal direction D2 orthogonal to the one direction D1 in the direction orthogonal to the direction D3 in which the first and second heat sink main bodies 12 and 13 are laminated inside the first heat sink body 12. A discharge water passage 14 extending substantially in parallel with the supply water passage 11 is formed at a distance from 11.
The supply water channel 11 and the discharge water channel 14 are arranged at a position avoiding the position where the body 21 to be cooled is mounted in a plan view of the heat sink 10 so as to sandwich the body 21 to be cooled in the orthogonal direction D2. Is arranged.

第２ヒートシンク本体１３は、前記直交方向Ｄ２に横長の平面視矩形状とされ、この直交方向Ｄ２の両端部がそれぞれ、供給水路１１および排出水路１４の直上に配置されるように、前記複数の被冷却体２１それぞれの下面側に各別に設けられている。この第２ヒートシンク本体１３の内部には、前記直交方向Ｄ２に延在し、かつ前記積層された方向Ｄ３で供給水路１１および排出水路１４にそれぞれ連通した冷却水路１５が形成されている。   The second heat sink body 13 has a rectangular shape in plan view that is horizontally long in the orthogonal direction D2, and the both ends of the orthogonal direction D2 are disposed directly above the supply water channel 11 and the discharge water channel 14, respectively. Provided separately on the lower surface side of each cooled object 21. Inside the second heat sink body 13, there are formed cooling water channels 15 extending in the orthogonal direction D2 and communicating with the supply water channel 11 and the discharge water channel 14 in the stacked direction D3.

本実施形態では、第１ヒートシンク本体１２の表面において、供給水路１１の直上に位置する部分には、供給水路１１に開口する第１孔１２ａが、複数の被冷却体２１が連設されている前記一方向Ｄ１における間隔と略等間隔に複数形成されるとともに、排出水路１４の直上に位置する部分には、排出水路１４に開口する第２孔１２ｂが、第１孔１２ａが形成されている間隔と略等間隔で複数形成されている。さらに、第２ヒートシンク本体１３の裏面において、前記直交方向Ｄ２の両端部にはそれぞれ、冷却水路１５に開口する第３孔１３ａおよび第４孔１３ｂが各別に形成されている。   In the present embodiment, on the surface of the first heat sink main body 12, the first hole 12 a that opens to the supply water channel 11 is connected to the portion located immediately above the supply water channel 11, and a plurality of objects to be cooled 21 are connected. A plurality of holes are formed at approximately equal intervals with the interval in the one direction D1, and a second hole 12b that opens to the discharge water channel 14 is formed in a portion located immediately above the discharge water channel 14 and a first hole 12a is formed. A plurality are formed at substantially equal intervals. Further, on the back surface of the second heat sink main body 13, a third hole 13 a and a fourth hole 13 b that open to the cooling water channel 15 are respectively formed at both ends in the orthogonal direction D <b> 2.

これにより、供給水路１１と冷却水路１５とが、第１孔１２ａおよび第３孔１３ａを介して前記積層された方向Ｄ３で連通し、また、排出水路１４と冷却水路１５とが、第２孔１２ｂおよび第４孔１３ｂを介して前記積層された方向Ｄ３で連通している。
そして、第２ヒートシンク本体１３の表面において冷却水路１５の直上に位置する部分のうち、前記直交方向Ｄ２の中央部が被冷却体２１が接合される搭載部分とされている。 Thereby, the supply water channel 11 and the cooling water channel 15 communicate with each other in the stacked direction D3 through the first hole 12a and the third hole 13a, and the discharge water channel 14 and the cooling water channel 15 are connected to the second hole. 12b and the fourth hole 13b communicate with each other in the stacked direction D3.
Of the portion of the surface of the second heat sink body 13 that is located immediately above the cooling water channel 15, the central portion in the orthogonal direction D <b> 2 is a mounting portion to which the cooled object 21 is joined.

ここで、本実施形態では、第２ヒートシンク本体１３の裏面において前記搭載部分の直下に位置する対応部分を、この裏面に沿った方向で挟む互いに対向する部分が、第１ヒートシンク本体１２の表面に接合されている。
図示の例では、前記直交方向Ｄ２に横長の平面視矩形状とされた第２ヒートシンク本体１３の裏面のうち、この直交方向Ｄ２の両端部にそれぞれ形成された第３孔１３ａおよび第４孔１３ｂの各開口周辺部が、第１ヒートシンク本体１２の表面にろう付けされ、第２ヒートシンク本体１３の裏面において、前記対応部分を含む第３孔１３ａおよび第４孔１３ｂの各開口周辺部同士の間の部分は、第１ヒートシンク本体１２の表面と非接合とされている。 Here, in the present embodiment, on the back surface of the second heat sink body 13, the opposing portions sandwiching the corresponding portions located directly below the mounting portion in the direction along the back surface are on the surface of the first heat sink body 12. It is joined.
In the example shown in the drawing, the third hole 13a and the fourth hole 13b respectively formed at both end portions in the orthogonal direction D2 out of the back surface of the second heat sink body 13 that is rectangular in the orthogonal direction D2. The peripheral portions of each of the openings are brazed to the surface of the first heat sink main body 12, and on the back surface of the second heat sink main body 13, between the peripheral portions of the third holes 13a and the fourth holes 13b including the corresponding portions. This part is not joined to the surface of the first heat sink body 12.

なお、このような第１、第２ヒートシンク１２、１３のろう付けは、内径が第１孔〜第４孔１２ａ、１２ｂ、１３ａ、１３ｂの径よりも大きくされたリング状のろう材箔を、第１ヒートシンク本体１２の表面と第２ヒートシンク本体１３の裏面との間において、各第１孔〜第４孔１２ａ、１２ｂ、１３ａ、１３ｂと同軸上に配置して挟み込んだ状態で加熱溶融させることによって実現することができる。   The brazing of the first and second heat sinks 12 and 13 is performed by using a ring-shaped brazing material foil having an inner diameter larger than the diameters of the first to fourth holes 12a, 12b, 13a, and 13b. Between the front surface of the first heat sink main body 12 and the back surface of the second heat sink main body 13, it is arranged to be coaxial with each of the first to fourth holes 12 a, 12 b, 13 a, 13 b and heated and melted in a sandwiched state. Can be realized.

さらに、本実施形態では、冷却水路１５は、前記一方向Ｄ１、すなわち前記積層された方向Ｄ３に直交する方向においてこの水路１５の延在する方向に直交する方向で複数に仕切られている。図示の例では、冷却水路１５は、複数に仕切られた各水路が前記直交方向Ｄ２の全域にわたって同等の流路断面積とされた、いわゆる多穴管とされている。   Furthermore, in this embodiment, the cooling water channel 15 is partitioned into a plurality of directions in the direction orthogonal to the direction in which the water channel 15 extends in the one direction D1, that is, the direction orthogonal to the stacked direction D3. In the illustrated example, the cooling water passage 15 is a so-called multi-hole pipe in which each of the water passages divided into a plurality of parts has an equivalent flow passage cross-sectional area over the entire region in the orthogonal direction D2.

なお、第２ヒートシンク本体１３は、例えば、純度が９９％以上のアルミニウム合金若しくは純アルミニウムにより形成され、前記一方向Ｄ１の大きさが約５０ｍｍ、前記直交方向Ｄ２の大きさが約１００ｍｍ、前記各水路の仕切り間隔が１．５ｍｍ〜２．５ｍｍ、総厚が５ｍｍ以下、前記表面側の天板および前記裏面側の底板の各肉厚が０．３ｍｍ〜０．５ｍｍ、前記各水路を仕切る仕切り壁１３ｃの厚さが１ｍｍ以下とされている。
また、第１ヒートシンク本体１２は、例えば、純度が９９％以上のアルミニウム合金若しくは純アルミニウムにより形成されている。 The second heat sink body 13 is made of, for example, an aluminum alloy having a purity of 99% or more or pure aluminum, the size in the one direction D1 is about 50 mm, the size in the orthogonal direction D2 is about 100 mm, A partition for partitioning the water channels, with a separation interval of water channels of 1.5 mm to 2.5 mm, a total thickness of 5 mm or less, and a thickness of the top plate on the front surface side and a bottom plate on the back surface side of 0.3 mm to 0.5 mm. The thickness of the wall 13c is 1 mm or less.
The first heat sink body 12 is made of, for example, an aluminum alloy having a purity of 99% or more or pure aluminum.

以上説明したように、本実施形態に係るヒートシンク１０によれば、被冷却体２１が、第１ヒートシンク本体１２よりも曲げ剛性が小さい第２ヒートシンク本体１３の表面に接合されるので、被冷却体２１が発熱した際、第２ヒートシンク本体１３の、被冷却体２１およびヒートシンク１０それぞれの熱膨張係数の差に起因した曲げ変形を拘束少なく生じさせることが可能になり、これら被冷却体２１と第２ヒートシンク本体１３との間の接合部に発生する応力を抑えることができる。   As described above, according to the heat sink 10 according to the present embodiment, the object to be cooled 21 is joined to the surface of the second heat sink body 13 having a bending rigidity smaller than that of the first heat sink body 12. When the heat is generated, the second heat sink main body 13 can be restrained from bending deformation due to the difference in thermal expansion coefficient between the cooled object 21 and the heat sink 10. The stress which generate | occur | produces in the junction part between 2 heat sink main bodies 13 can be suppressed.

しかも、このヒートシンク１０では、第２ヒートシンク本体１３の裏面において前記搭載部分の直下に位置する対応部分を除いた部分が、第１ヒートシンク本体１２の表面に接合されているので、第２ヒートシンク本体１３のうち、その表面の前記搭載部分および裏面の前記対応部分が位置する部分のみを前記のように拘束少なく曲げ変形させ、この他の部分では、第１ヒートシンク本体１２との接合によりこの曲げ変形を拘束することが可能になる。
以上より、曲げ剛性の小さい第２ヒートシンク本体１３を過度に変形させることなく、被冷却体２１とヒートシンク１０との接合信頼性を向上させることができる。 In addition, in this heat sink 10, the portion of the back surface of the second heat sink body 13 excluding the corresponding portion located immediately below the mounting portion is joined to the surface of the first heat sink body 12. Among them, only the portion where the mounting portion on the front surface and the corresponding portion on the back surface are located is bent and deformed with little restraint as described above, and in this other portion, this bending deformation is caused by joining with the first heat sink body 12. It becomes possible to restrain.
From the above, it is possible to improve the bonding reliability between the body 21 to be cooled and the heat sink 10 without excessively deforming the second heat sink body 13 having a small bending rigidity.

さらに、第２ヒートシンク本体１３の冷却水路１５が、両ヒートシンク本体１２、１３が積層された方向Ｄ３で供給水路１１と連通しているので、供給水路１１から冷却水路１５に冷却液が流入したときに、まず、この冷却液を、冷却水路１５を画成する壁面のうち、第２ヒートシンク本体１３の表面側に位置する上面壁に衝突させ、この冷却液の流れを乱流にし、その後、この乱流の冷却液を冷却水路１５内を流通させて前記搭載部分の直下に到達させることが可能になる。したがって、ヒートシンク１０の被冷却体２１に対する冷却能を向上させることができる。   Furthermore, since the cooling water channel 15 of the second heat sink body 13 communicates with the supply water channel 11 in the direction D3 in which both heat sink main bodies 12 and 13 are laminated, when the coolant flows into the cooling water channel 15 from the supply water channel 11 First, the coolant is made to collide with the upper wall located on the surface side of the second heat sink body 13 among the wall surfaces defining the cooling water channel 15 to make the flow of the coolant turbulent, and then It becomes possible to cause the turbulent coolant to flow through the cooling water channel 15 and reach directly below the mounting portion. Therefore, the cooling capability with respect to the to-be-cooled body 21 of the heat sink 10 can be improved.

特に本実施形態では、第２ヒートシンク本体１３の裏面において、この裏面に沿った方向で前記対応部分を挟んだ互いに対向する部分、すなわち、第２ヒートシンク本体１３の裏面のうち、前記直交方向Ｄ２の両端部にそれぞれ形成された第３孔１３ａおよび第４孔１３ｂの各開口周辺部に限定して、第１ヒートシンク本体１２の表面にろう付けされているので、第２ヒートシンク本体１３のうち、その表面の前記搭載部分および裏面の前記対応部分が位置する部分に対する曲げ変形の拘束を低減させつつ、この他の部分の曲げ変形を確実に拘束することが可能になる。   In particular, in the present embodiment, the back surface of the second heat sink body 13 is opposed to each other with the corresponding portion sandwiched in the direction along the back surface, that is, the back surface of the second heat sink body 13 in the orthogonal direction D2. Since it is brazed to the surface of the first heat sink main body 12 only in the periphery of each opening of the third hole 13a and the fourth hole 13b formed at both ends, of the second heat sink main body 13, It is possible to reliably restrain the bending deformation of the other portions while reducing the restraint of the bending deformation on the portion where the mounting portion on the front surface and the corresponding portion on the back surface are located.

また、冷却水路１５は前記一方向Ｄ１で複数に仕切られているので、ヒートシンク１０による被冷却体２１の冷却能をさらに向上させることができる。   In addition, since the cooling water channel 15 is partitioned into a plurality in the one direction D1, the cooling ability of the body 21 to be cooled by the heat sink 10 can be further improved.

なお、本発明の技術的範囲は前記実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。
前記実施形態では、冷却水路１５として、いわゆる多穴管を示したが、これに代えて、例えば、前記のような仕切り壁１３ｃを有さず仕切られていない広幅の流路とされた冷却水路１５を採用してもよい。 The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
In the above-described embodiment, a so-called multi-hole pipe is shown as the cooling water channel 15, but instead of this, for example, the cooling water channel which is not divided and does not have the partition wall 13 c as described above. 15 may be adopted.

また、複数のコルゲートフィンを冷却水路１５の幅方向に連設して、この水路１５の流路をその幅方向で仕切るようにしてもよい。
さらに、第２ヒートシンク本体１３の裏面のうち、前記対応部分を除いた部分の全域を第１ヒートシンク本体１２の表面にろう付けするようにしてもよい。
さらにまた、前記実施形態では、第１ヒートシンク本体１２の表面側に複数の被冷却体２１が設けられた構成を示したが、これに代えて、例えば１つの被冷却体２１が設けられた構成においても適用可能である。 Further, a plurality of corrugated fins may be provided continuously in the width direction of the cooling water channel 15 and the flow path of the water channel 15 may be partitioned in the width direction.
Furthermore, you may make it braze the whole surface of the part except the said corresponding part among the back surfaces of the 2nd heat sink main body 13 to the surface of the 1st heat sink main body 12. FIG.
Furthermore, in the above-described embodiment, the configuration in which the plurality of objects to be cooled 21 are provided on the surface side of the first heat sink main body 12 is shown. Instead, for example, the configuration in which one object to be cooled 21 is provided. It is also applicable to.

高い冷却能を具備させ、被冷却体との接合信頼性を向上させる。   High cooling ability is provided, and the reliability of joining with the object to be cooled is improved.

この発明の一実施形態に係るヒートシンクを有するパワーモジュールを示す全体図である。1 is an overall view showing a power module having a heat sink according to an embodiment of the present invention. 図１に示すＡ−Ａ線矢視断面図である。It is an AA arrow directional cross-sectional view shown in FIG.

符号の説明Explanation of symbols

１０ ヒートシンク
１１ 供給水路
１２ 第１ヒートシンク本体
１３ 第２ヒートシンク本体
１５ 冷却水路
２１ 被冷却体
２３ パワーモジュール用基板
２４ 半導体チップ
Ｄ３ 積層された方向
DESCRIPTION OF SYMBOLS 10 Heat sink 11 Supply water channel 12 1st heat sink main body 13 2nd heat sink main body 15 Cooling water channel 21 Cooled body 23 Power module substrate 24 Semiconductor chip D3 Stacked direction

Claims (5)

冷却液供給手段に連通される供給水路が内部に形成された第１ヒートシンク本体と、この第１ヒートシンク本体の表面に設けられるとともに、第１ヒートシンク本体よりも曲げ剛性が小さい第２ヒートシンク本体とが備えられた二層構造とされ、
第２ヒートシンク本体の内部には、第１、第２ヒートシンク本体が積層された方向と直交する方向に延在し、かつ前記積層された方向で前記供給水路に連通した冷却水路が形成され、
第２ヒートシンク本体の表面において冷却水路の直上に位置する部分の少なくとも一部が、被冷却体の接合される搭載部分とされ、
この第２ヒートシンク本体の裏面において前記搭載部分の直下に位置する対応部分を除いた部分が、前記第１ヒートシンク本体の表面に接合されていることを特徴とするヒートシンク。 A first heat sink body in which a supply water channel communicating with the coolant supply means is formed, and a second heat sink body provided on the surface of the first heat sink body and having a lower bending rigidity than the first heat sink body. With a two-layer structure,
Inside the second heat sink body, there is formed a cooling water channel extending in a direction perpendicular to the direction in which the first and second heat sink bodies are laminated and communicating with the supply water channel in the laminated direction,
At least a part of the portion located on the surface of the second heat sink main body directly above the cooling water channel is a mounting portion to which the object to be cooled is joined,
A heat sink, wherein a portion of the back surface of the second heat sink body excluding a corresponding portion located immediately below the mounting portion is bonded to the surface of the first heat sink body. 請求項１記載のヒートシンクにおいて、
第２ヒートシンク本体の裏面のうち、この裏面に沿った方向において前記対応部分を挟んで互いに対向する部分がそれぞれ、前記第１ヒートシンク本体の表面に接合されていることを特徴とするヒートシンク。 The heat sink according to claim 1.
Of the back surface of the second heat sink body, a portion facing each other across the corresponding portion in the direction along the back surface is joined to the surface of the first heat sink body. 請求項１または２に記載のヒートシンクにおいて、
前記冷却水路は、前記積層された方向と直交する方向においてこの水路の延在する方向に直交する方向で複数に仕切られていることを特徴とするヒートシンク。 The heat sink according to claim 1 or 2,
The heat sink, wherein the cooling water channel is partitioned into a plurality of directions in a direction orthogonal to the direction in which the water channels extend in a direction orthogonal to the stacked direction. 前記被冷却体は、表面側に半導体チップが搭載されるパワーモジュール用基板とされ、
このパワーモジュール用基板の裏面側が請求項１から３のいずれかに記載のヒートシンクの前記搭載部分に接合されていることを特徴とするパワーモジュール用部材。 The object to be cooled is a power module substrate on which a semiconductor chip is mounted on the surface side,
A power module member, wherein the back side of the power module substrate is joined to the mounting portion of the heat sink according to any one of claims 1 to 3. 前記被冷却体は、パワーモジュール用基板の表面側に半導体チップが搭載された構成とされ、このパワーモジュール用基板の裏面側が請求項１から３のいずれかに記載のヒートシンクの前記搭載部分に接合されていることを特徴とするパワーモジュール。

The said to-be-cooled body is set as the structure by which the semiconductor chip was mounted in the surface side of the board | substrate for power modules, and the back surface side of this board | substrate for power modules is joined to the said mounting part of the heat sink in any one of Claim 1 to 3 Power module characterized by being.

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009103400A (en) * 2007-10-25 2009-05-14 Toshiba Carrier Corp Heat source unit
JP2016018904A (en) * 2014-07-09 2016-02-01 日産自動車株式会社 Semiconductor device
JP7335101B2 (en) 2019-06-25 2023-08-29 株式会社豊田中央研究所 Cooling module for electronic equipment and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335651A (en) * 1995-06-09 1996-12-17 Mitsubishi Materials Corp Substrate for power module
JP2004006717A (en) * 2002-04-10 2004-01-08 Mitsubishi Electric Corp Power semiconductor device
JP2005322879A (en) * 2004-04-06 2005-11-17 Showa Denko Kk Substrate for semiconductor device, semiconductor module and electric vehicle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335651A (en) * 1995-06-09 1996-12-17 Mitsubishi Materials Corp Substrate for power module
JP2004006717A (en) * 2002-04-10 2004-01-08 Mitsubishi Electric Corp Power semiconductor device
JP2005322879A (en) * 2004-04-06 2005-11-17 Showa Denko Kk Substrate for semiconductor device, semiconductor module and electric vehicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009103400A (en) * 2007-10-25 2009-05-14 Toshiba Carrier Corp Heat source unit
JP2016018904A (en) * 2014-07-09 2016-02-01 日産自動車株式会社 Semiconductor device
JP7335101B2 (en) 2019-06-25 2023-08-29 株式会社豊田中央研究所 Cooling module for electronic equipment and manufacturing method thereof

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