JP2009081220A - Heat dissipating component, and heat dissipating structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipating component and a heat dissipating structure capable of securing heat dissipation as well as preventing thermal deformation without adding any extra additional structure. <P>SOLUTION: The heat dissipating component is located in the passage of a heating medium to exchange heat with the heating medium. The component includes a plate-like base part 1 and a wall-like fin 3 extending in the base part, and the extending shape of the wall-like fin has a length component in the direction perpendicular to the direction of the passage. The component is disposed so that the exit side is obstructed by the wall-like fin 3, when viewing the exit side along the passage direction of the base part from any location within at least the center range Wc of the width on the entrance side of the base part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat radiating component and a heat radiating structure, and more specifically to a heat radiating component that hardly warps and deforms and a heat radiating structure using the heat radiating component.

  Many semiconductor devices are used in automobiles, high-speed data processing arithmetic devices, communication devices, and the like, and a lot of heat is generated from these semiconductor devices due to power loss. In these apparatuses, as the capacity of the apparatus is increased, the size of the apparatus is reduced, and the processing speed is increased. If sufficient heat radiation is not performed, the temperature of the semiconductor device rises and normal operation cannot be performed. Therefore, measures have been taken to connect a heat sink provided with heat radiation fins to the semiconductor device. The arrangement of the heat sink functions effectively in suppressing the temperature rise of the semiconductor device. However, a large thermal gradient is generated in the heat dissipation path, which causes major problems such as peeling and warping in the heat dissipation path. It has become.

  For this reason, many efforts have been made to the problem of thermal deformation in the heat dissipation path of the semiconductor device. For example, a method has been proposed in which long thin wires are rounded into a lump in a heat dissipation path, and thermal deformation is absorbed by the rounded thin wires while securing a heat path (Patent Document 1). In addition, a measure for preventing thermal deformation by releasing a thermal stress by dividing a member for fixing a semiconductor device into two members that are in slidable linear contact has been proposed (Patent Document 2).

JP-A-9-260555 JP-A-9-33002

  However, all of the above measures require that an extra structure that performs an additional function is added to the heat dissipating body as compared with the conventional structure, requires a space for it, and an increase in size is inevitable. In addition, a manufacturing process for forming an extra structure is required, and the manufacturing process is complicated. It is necessary to avoid an increase in the size of a heat radiating component such as a heat radiating plate and a complicated manufacturing process in a vehicle mounted component or the like that requires strict miniaturization and low price.

  An object of the present invention is to provide a heat radiating component and a heat radiating structure capable of preventing thermal deformation without securing an additional structure while ensuring heat dissipation.

  The heat dissipation component of the present invention is a component that is located in the flow path of the heat medium and exchanges heat with the heat medium. This heat dissipation component includes a plate-like base portion and wall-like fins extending to the base portion, and the extending shape of the wall-like fins has a length component in a direction perpendicular to the flow path direction. And in any position within at least the central range of the width on the inlet side of the base portion, the outlet side is seen along the flow direction of the base portion, and is arranged to be blocked by the wall-shaped fins. .

Here, the extended shape of the wall-shaped fin refers to the shape of the trace of the base of the wall-shaped fin standing at the base (the shape of the portion above the root is not limited). Although it is actually an elongated shape with a width, it refers to the shape of the line as a line in which the width is replaced with a center line passing through the center of the width. The extended shape is often a straight line (line segment), but may be a curved line or a bent line. The length component P _y in the flow channel direction (y direction) is the length when the extended shape of the wall-shaped fin is viewed along the direction (x direction) orthogonal to the flow channel direction (y direction). Yes, that is, the length obtained by projecting the extended shape in the flow channel direction (y direction). The length component in the direction orthogonal to the channel direction (x direction) is the length when the extending shape of the wall fin is viewed along the channel direction (y direction), that is, the channel direction. Is a length P _x projected in a direction (x direction) orthogonal to. The above-mentioned wall-shaped fins often have a predetermined length in which both P _x and P _y are not zero, but only P _x may be zero and P _y may be zero. That is, it may be a wall-like fin having an extended shape of a line segment parallel to the x direction.

  The fin greatly increases the bending rigidity of the heat dissipating component in the direction along the extended shape, but has little influence along the direction orthogonal thereto. Rather, as a result of greatly improving the bending rigidity in the direction along the extended shape, various types of thermal deformation are induced in directions orthogonal thereto, and thermal deformation is likely to occur. A fin of a normal heat dissipation component has only a length component in the flow path direction, but in the present invention, it is assumed that the wall fin has a length component in the flow path direction. Whether or not it has other wall-like fins that share roles). Under such a premise, according to the above configuration, since the wall-shaped fin having a length component in the direction orthogonal to the flow path direction is provided, the heat dissipation component is provided in both the flow path direction and the direction perpendicular thereto. The bending rigidity is increased. As a result, thermal deformation, particularly warpage can be suppressed.

  Further, at any position within the central range of the width on the inlet side of the base portion, the outlet side is seen along the flow direction of the base portion and is arranged to be blocked by the wall-like fins, so that the bending rigidity is The linear part (direct flow path part) which falls locally along is not made. The main part of the thermal deformation of the base is a curved surface of the cylindrical part that is curved with the flow direction in the center of the width as an axis. If there is a portion where the line of sight is clear), a waist bending deformation in which the warping strain is concentrated in the direct flow path portion is generated. As described above, it is possible to prevent the curved warp in the above-described form by preventing the direct flow path portion in the flow path direction from being generated in the width center range. In short, it is important to prevent the warpage by increasing the rigidity in the width center range by arranging the wall fins at some position in the flow path direction in the width center range. is there. In addition, the term “at least in the middle range” means a range that is located in the middle of the width and occupies half of the entire width.

  When thermal deformation of a heat-dissipating component occurs, the heat-dissipating path in which the heat-dissipating component is incorporated peels off and does not perform its function and must be discarded and replaced immediately. Such a trouble can be effectively suppressed by the configuration. Furthermore, the above heat dissipating component does not add an extra portion that increases the volume. For this reason, while suppressing thermal deformation, enlargement and complication of the manufacturing process do not occur. That is, by a simple measure of deformation of a conventional fin, it is possible to suppress thermal deformation and provide a heat radiating component having excellent thermal durability.

  Further, the wall-shaped fins are composed of two or more types, and the extending shape of the first wall-shaped fin is close to one end of the base portion in the direction of the flow path, and the second wall-shaped fin The extended shape of the fin can have a shape away from one end thereof. According to this configuration, the first and second wall-shaped fins can provide, for example, a “C” -shaped array of wall-shaped fins, and two or more types of wall-shaped fins can be arranged appropriately to bend. The rigidity can be increased in both the x and y directions, and the heat medium can flow all over the base, and the heat dissipation can be improved over the entire base.

  Said wall-shaped fin has a part which goes to the flow path direction and approaches one end of a base part, and a part which goes away from one end of a base part in one wall-shaped fin. it can. As a result, the heat medium can be guided on a long path on the base, and the distance of contact with the base and the wall-like fins can be extended and lengthened. Therefore, the heat exchange time can be extended in terms of time, so that the efficiency is high. Heat exchange can be realized.

  The wall-shaped fin has alternately a convex top portion toward one end of the base portion and a concave valley portion toward the one end of the base portion along the flow path, and the top portion from the trough portion. Can also be a zigzag fin near one end of the base. Thereby, the contact area with the heat medium per unit flow path (straight line) length can be increased by the shape of a simple wall-shaped fin called a zigzag pattern.

  The two zigzag fins are positioned so as to be juxtaposed across the flow path portion, and the valley portion in one zigzag fin located closer to one end of the base portion of the two zigzag fins However, it can be located farther from one end of the base than the top of the other zigzag fin. As a result, it is possible to prevent the formation of a direct flow path portion in which the bending rigidity is locally reduced along the flow path while increasing the contact area between the wall fin per unit flow path length and the heat medium. In other words, by making the top and valley of adjacent zigzag fins overlap along the flow path so as not to form a straight or straight belt-shaped direct flow path portion, the linear waist folding at any position Since the top portion and the valley portion of the zigzag fin also impart rigidity to the base portion against the thermal deformation of the shape, it is possible to have a stronger deterrent against the thermal deformation.

  Moreover, it can be set as the structure from which the metal which forms said wall-shaped fin differs from the metal which forms a base. As a result, when selecting the material of each part (thermal conductive insulating substrate, heat spreader, wiring material, etc.) that constitutes the heat dissipation path from the heating element to the fin, so that thermal stress and thermal deformation do not occur, material selection It is possible to increase the degree of freedom. Further, the thermal stress generated in the heat radiating component itself can be reduced, and further, the thermal stress exerted on the components of the heat radiating path in the previous stage (position side close to the semiconductor device) of the heat radiating component can be reduced.

  In the heat dissipation structure of the present invention, at least one of a heat conductive insulating layer, a heat spreader, and a wiring material is interposed between the heat generating element and the base of any of the above heat dissipation components. It is connected to the bottom.

  With the above-described configuration, it is possible to provide a heat dissipation structure that has excellent heat durability by ensuring heat dissipation and suppressing thermal deformation. In the heat dissipation structure, since no additional mechanism is provided, the flow of downsizing is not obstructed and the manufacturing process is not complicated. For example, it is possible to improve the range of parts that can be manufactured by die casting.

  According to the heat radiating component and the heat radiating structure of the present invention, it is possible to suppress heat deformation and improve thermal durability without adding an additional structure, while ensuring heat dissipation.

(Embodiment 1)
FIG. 1 is a perspective view showing a heat dissipation component according to Embodiment 1 of the present invention. In this heat radiating component 10, zigzag wall-like fins 3 extend on a plate-like base 1. The plurality of zigzag fins 3 are arranged so that adjacent ones are parallel to each other with the flow path portion interposed therebetween. The point in the present embodiment is blocked by the zigzag fin 3 at any position within the width central range Wc on the inlet side of the base portion 1 at the outlet side along the flow path direction (y direction). There is in point. In other words, in the width center range Wc, a direct flow channel portion sandwiched between wall-shaped fins (a portion that can be easily seen in the flow channel sandwiched between wall-shaped fins) that passes directly along the flow channel direction is not formed. Thus, there is a feature in that a plurality of zigzag fins 3 are arranged.

  One zigzag fin 3 alternately has a convex top part T toward one end E1 of the base part 1 and a concave valley part B toward the one end E1 along the flow path. In one zigzag fin 3, the top T is closer to one end E1 of the base than the valley B. As described above, in order to prevent a line-of-sight portion from being generated in the flow path sandwiched between the wall fins, in the two adjacent zigzag fins 3 positioned across the flow path portion, one of the base portions The valley portion B in one zigzag fin 3 located closer to the end E1 of the base is located farther from one end E1 of the base than the top T of the other zigzag fin. In short, when viewed along the flow path direction (y direction), a plurality of zigzag fins 3 are arranged close to each other so that no direct flow path portion is generated. In the following description, “the valley B of one zigzag fin 3 located closer to one end E1 of the base is farther from one end E1 of the base than the top T of the other zigzag fin 3. The “arrangement that is positioned” may be described as “an arrangement in which two adjacent zigzag fins overlap”.

  FIG. 2 is a plan view showing an extended shape 3f of the wall-like fin 3 in the base 1 of the heat dissipation component 10 of FIG. In the heat radiating component 10 shown in FIG. 2, not only the zigzag fin 3 in the width center range Wc but also the zigzag fin 3 located on the end side overlaps with the adjacent zigzag fin. However, it does not have to overlap with the adjacent zigzag fin at the width position outside the width center range Wc. The width of the both ends We of the width center range is (1/2) Wc from the definition of the width center range described above. The warp deformation due to thermal stress tends to bend around the direct flow channel portion as an axis so as to aim at the direct flow channel portion when there is a direct flow channel portion in the width center range Wc. In addition, when the direct flow path portion in the width center range Wc is bent as an axis, the displacement due to the bending at the end increases, and damage such as peeling of the laminated structure that is not allowed is likely to occur.

As shown in FIG. 2, the extended shape 3f of the zigzag fin is, of course, not parallel to the x direction or the y direction, but the projection P _{y in the} y direction and the projection P in the x direction. Both _x are not zero, and have a length component in the flow direction of the heat medium (y direction) and in a direction perpendicular thereto. For this reason, the base 1 of the heat dissipation component 10 can increase both the bending rigidity in the x direction and the y direction. In addition, since the plurality of zigzag fins positioned in the central range are arranged so that adjacent ones overlap each other, a direct flow path portion that passes directly in the y direction does not occur.

  FIG. 3 is a view for more strictly explaining the overlapping of adjacent zigzag fins 3. The x coordinate of the extended shape 3f of the zigzag fin closer to one end E1 of the base portion 1 is on average larger than the extended shape of the other zigzag fin (see the xy coordinate axes in FIG. 3). Therefore, the arrangement in which the adjacent zigzag fins 3 overlap each other means that the x coordinate of the valley portion B of the zigzag fin occupying a large x coordinate position is greater than the x coordinate of the top T of the zigzag fin occupying the adjacent small x coordinate. A small arrangement. In FIG. 3, the difference between the x-coordinates is Δ, but when Δ is increased, the degree of overlap of the two zigzag fins increases, and the rigidity of the base 1 increases in both the x and y directions, Thermal deformation is less likely to occur. However, on the other hand, an increase in Δ increases resistance to the flow of the heat medium, increasing the flow resistance and increasing the load of the pump, etc., thus preventing thermal deformation and increasing the flow resistance. It is better to set Δ in consideration of interests. Δ may be zero. This is because even if Δ is zero, the above-described direct flow path portion is not formed, and a warp axis passing through the base portion in the above-described thermal deformation in the y direction is not formed.

  FIG. 3 illustrates the case where the extended shape of the zigzag fin is indicated by a line. Actually, the zigzag fin has a thickness and takes the form shown in FIG. 4. In the heat dissipation component 10 shown in the present embodiment, the zigzag shape is arranged in the x direction depending on which position is the top portion T and where the valley portion B is within the thickness range of the wall fins constituting the zigzag fin. Since the number of fins 3 is a plurality exceeding two or three, the displacement of the small z-direction positions of the individual zigzag fins is accumulated, and the overall configuration changes greatly. For this reason, it is necessary to set strictly the position of the top part T and the trough part B of the zigzag fin 3 which has thickness. In the case of the above configuration where the thickness is a problem, the top T of the zigzag fin is the top position within the thickness range (the shortest position to one end E1 or the maximum position of the x coordinate), and the trough B is The bottom position within the thickness range (maximum position to one end E1 or minimum position of the x coordinate).

  By using the heat dissipating component 10 having the base 1 on which the zigzag fins 3 are arranged as described above, it is possible to eliminate a phenomenon in which a warp in which bending distortion is concentrated in a direct flow path portion directly passing in the y direction is generated. When the direct flow path portion is formed in the y direction within the width center range Wc, the strain is concentrated on the direct flow path portion in the y direction due to the thermal stress, resulting in a curved axis, or in some cases, the waist folded portion. This is a major cause of peeling of the laminated structure. As described above, in the configuration in which the direct flow path portion is not formed in the y direction at any position within the width center range Wc, the thermal strain is suppressed and the occurrence of warpage is prevented. In addition, it is not necessary to add an extra structure that performs an additional function to the heat radiating body, and the size is not increased. Therefore, a manufacturing process for forming an extra structure is not required, and the manufacturing process is not complicated. Therefore, it is suitable for parts mounted on automobiles and the like that require strict miniaturization and low price.

  In the semiconductor device mounting structure, when thermal deformation occurs in the heat dissipation component 10 positioned at the final stage of the heat dissipation path, for example, the heat spreader at the previous stage, that is, the position near the semiconductor device of the heat dissipation component 10 is peeled off. This means that the heat dissipation path cannot perform its function and cannot be used. Therefore, the thermal deformation of the heat dissipation component affects the life of the heat dissipation path, and is a very important factor in improving the heat durability of the heat dissipation path. By using the wall-shaped fin 3 shown in FIGS. 1 and 2, it is possible to effectively suppress bending warp and hip-fold deformation with the y direction as an axis at any position in the width central range that is a major cause of peeling, The heat durability of the heat dissipation path can be increased.

Next, a method for manufacturing the heat dissipation component 10 shown in FIG. 1 will be described. The base 1 and the zigzag fin 3 may be formed of the same metal (including an alloy; hereinafter the same), or may be formed of different metals.
(1) When forming with the same metal: When making a metal into aluminum, it can manufacture by integral molding by die-casting etc. When forming with copper, it is good to connect the zigzag fin 3 made of copper with a brazing material, with the base 1 as a copper plate. In that case, aluminum alloy brazing (JIS Z 3263-2002), silver brazing (JIS Z 3261-1998) or the like can be used.
(2) When the base 1 and the zigzag fin 3 are made of different metals: In this case, if the base 1 is made of copper and the zigzag fin 3 is made of aluminum, both the features of copper and the light weight of aluminum can be utilized. it can. The copper plate used as the base 1 is formed with a shallow depression in a range where the zigzag fins 3 stand by the preform. A connecting material having a melting point lower than that of aluminum, such as aluminum solder (JIS Z 3281-1996), low melting point silver alloy solder, and Al—P—Ni, is introduced into the recess. Zigzag fins are fitted into the recesses, heated in the heat treatment furnace to the melting point or higher of the connecting material, melted, and then cooled and fixed. Instead of heat treatment in a heat treatment furnace, energization heating, laser heating, or the like may be performed. The aluminum zigzag fin is preferably plated with nickel. Furthermore, it is preferable to use a mask-like carbon layer when introducing a low melting point connection material.

  As described above, in the heat dissipation component 10 of FIG. 1, the base 1 and the zigzag fin 3 may be formed of the same material or different materials. If they are made of different materials, the material of each part (heat conductive insulating layer made of composite material layer, heat spreader, wiring material, etc.) that constitutes the heat dissipation path from the heating element to the fin will be subject to thermal stress and thermal deformation. When selecting to be small, it is possible to increase the degree of freedom of material selection. Further, the thermal stress generated in the heat radiating component itself can be reduced, and further, the thermal stress exerted on the components of the heat radiating path in the previous stage (position side close to the semiconductor device) of the heat radiating component can be reduced.

(Embodiment 2)
FIG. 5 is a perspective view showing a heat dissipation component according to Embodiment 2 of the present invention. In the heat radiating component 10, straight wall-like fins 3 and 13 without bending extend on the plate-like base 1. The point in the present embodiment is that the extending direction of the linear wall fins 3 and 13 is aligned both in the flow direction of the heat medium (y direction) and in the direction orthogonal to the flow direction (x direction). Even if the outlet side is viewed along the flow path direction (y direction) at any position within at least the width central range Wc on the inlet side of the base 1, it is blocked by any of the wall-like fins 3. It is in. In other words, in the width center range Wc, a plurality of walls are formed so that a direct flow channel portion (a portion that can be seen in the flow channel or a portion where a wall-like fin is missing) is not formed. The feature is that the fins 3 are arranged. In the arrangement in which the wall-like fins 3 and 13 are not aligned in the x-direction and the y-direction, not all the wall-like fins may be present, but there may be wall-like fins in the x-direction. 5 shows two types of wall-shaped fins 3 and 13 including a large-sized wall-shaped fin 3 and a small-sized wall-shaped fin 13, the same type of wall-shaped fins may be used.

  FIG. 6 is a plan view of the heat dissipation component 10 shown in FIG. 5, and the extending shapes 3 f and 13 f of the wall-shaped fins 3 and 13 are indicated by lines. The extending shape 3f of the wall fin 3 is indicated by a thin line, and the extending shape 13f of the wall fin 13 is indicated by a thick line. In FIG. 6, the extending shapes 3f and 13f of the wall-shaped fins 3 and 13 are not parallel to both the x direction and the y direction, and no direct flow path portion is generated at least in the width center range Wc. However, the situation is different for the following assumptions.

  Assuming that only one type of wall-shaped fin 3 and no other type of wall-shaped fin 13 are present, as shown in FIG. 6, three finite-width direct flow path portions v, Or the virtual direct flow path part 73 shown with the broken line corresponding to the display of said v is formed. When such an imaginary direct through portion v is present in the width center range Wc, when a thermal stress is generated, it becomes a curved warp axis or a waist break axis, and the risk of peeling of the laminated structure described above increases.

  The virtual direct flow path portion 73 or v that is formed only by the wall-shaped fins 3 is seen through the portion v in the y direction when the actual two types of wall-shaped fins 3 and 13 are arranged. Cannot be blocked by the wall-like fins 13. Therefore, in any one of the width center ranges Wc, a phenomenon in which a warp deformation in which a portion along the y direction is a warp axis is reliably prevented. In the above description, for convenience of description, the description has been made such that the wall fin 3 is mainly used as the auxiliary to the wall fin 13. However, in the heat dissipation component 10, the wall fin 3 and the wall fin 13 are important. In which one is the main and the other is not auxiliary.

  The heat radiating component 10 shown in FIG. 5 is also incorporated in the apparatus and receives heat from the heating element, and even if thermal stress occurs, thermal deformation can be suppressed. In a semiconductor device mounting structure or the like, when thermal deformation occurs in the heat dissipation component 10 located at the final stage of the heat dissipation path, for example, peeling from the heat spreader at the previous stage (position side near the semiconductor device of the heat dissipation component 10). This means that the heat dissipation path cannot perform its function and cannot be used. However, the use of the wall-like fins 3 and 13 shown in FIG. 5 or FIG. 6 effectively suppresses thermal deformation and enhances the heat durability of the heat dissipation path.

The heat radiating component 10 shown in FIG. 5 can also be manufactured by the same method as the manufacturing method described in the first embodiment. That is, the base 1 and the wall-shaped fin 3 may be formed of the same metal (including an alloy; hereinafter the same), or may be formed of different metals.
(1) When forming with the same metal: When making a metal into aluminum, it can manufacture by integral molding by die-casting etc. In the case of forming with copper, it is preferable to connect the wall-like fins 3 made of copper with the base 1 as a copper plate and a brazing material. In that case, aluminum alloy brazing (JIS Z 3263-2002), silver brazing (JIS Z 3261-1998) or the like can be used.
(2) When the base 1 and the wall-shaped fin 3 are formed of different metals: In this case, if the base 1 is formed of copper and the wall-shaped fin 3 is formed of aluminum, both the features of copper and the light weight of aluminum can be utilized. it can. The copper plate used as the base 1 is formed with a shallow depression in a range where the wall-like fins 3 stand by the preform. A connecting material having a melting point lower than that of aluminum, such as aluminum solder (JIS Z 3281-1996), low melting point silver alloy solder, and Al—P—Ni, is introduced into the recess. Wall-like fins are fitted into the recesses, heated to the melting point of the connecting material or higher in a heat treatment furnace, and then cooled and fixed. Instead of heat treatment in a heat treatment furnace, energization heating, laser heating, or the like may be performed. The aluminum wall-shaped fins are preferably plated with nickel. Furthermore, it is preferable to use a mask-like carbon layer when introducing a low melting point connection material.

  As described above, in the heat dissipation component 10 of FIG. 5, the base 1 and the wall-like fins 3 may be formed of the same material or different materials. If they are made of different materials, the material of each part (heat conductive insulating layer made of composite material layer, heat spreader, wiring material, etc.) that constitutes the heat dissipation path from the heating element to the fin will be subject to thermal stress and thermal deformation. When selecting to be small, it is possible to increase the degree of freedom of material selection. Further, the thermal stress generated in the heat radiating component itself can be reduced, and further, the thermal stress exerted on the components of the heat radiating path in the previous stage (position side close to the semiconductor device) of the heat radiating component can be reduced.

(Embodiment 3)
FIG. 7 is a plan view showing a heat dissipating component (extending shape of wall fins) in Embodiment 3 of the present invention. The wall-shaped fin extending shapes 3f and 7f are indicated by thin lines, and the wall-shaped fin extending shapes 13f are indicated by thick lines. In the present embodiment, wall-shaped fins that are convexly curved toward the upstream are disposed in the center of the width of the flow path of the heat medium, so that the direct flow path portion is not formed at least in the width center range Wc. There is a special feature in the points. In FIG. 7, the extending shape 7f of the wall-shaped fin curved in the convex shape is displayed. FIG. 8 shows a wall-shaped fin 7 as an example corresponding to the extending shape 7 f and other curved (non-linear) type wall-shaped fins 5, 15. In the description of FIG. 7, the extension of the wall fin is simply referred to as a wall fin.

  Since the wall-like fins 7 are arranged at the width center portion on the inlet side, the heat medium is distributed in the left and right end directions at the width center portion, and a situation in which the heat medium is biased to one side can be avoided. In FIG. 7, when it is assumed that there is no wall-shaped fin 13, a direct flow path portion v or a virtual direct flow path portion 73 indicated by a broken line is generated. However, since the wall-shaped fins 13 are actually disposed, The portion v is blocked by the wall fin 13. For this reason, the warp deformation centering on the y direction part in the width center range Wc is reliably prevented. As mentioned in the second embodiment, for convenience of explanation, the wall fins 3 and 7 are handled mainly with the wall fins 13 as an auxiliary. The wall-like fins 13 are equivalent in importance, and one is main and the other is not auxiliary.

  In FIG. 7, the wall-like fins 13 are arranged at three locations along the flow path direction, but need not be three locations, and may be five locations or one or two locations. The wall-like fins effectively act to prevent the warp deformation as long as the direct passage portion is blocked even at one location. Unnecessarily the arrangement of the wall-like fins 13 increases the resistance of the heat medium flow and increases the load of the heat medium driving device such as a pump or a fan. For this reason, the arrangement of the wall-like fins 13 is preferably stopped to the minimum necessary.

  8 and 9 show modifications of the wall fin. FIG. 8 shows curved wall-shaped fins 5, 7 and 15, and FIG. 9 shows a V-shaped wall-shaped fin 9 suitable for being arranged at the center of the width. In the wall-shaped fin 7 in FIG. 8 and the wall-shaped fin 9 in FIG. 9, portions 7 a and 9 a that approach one end side along the flow path direction and portions 7 b and 9 b that move away from one end side are There are two wall fins.

10 and 11 show the wall-shaped fin extension shapes 7f, 9f, and 5f, and the projection length P _{x in the} flow direction (y direction) and the direction perpendicular to the flow direction (x direction). is a diagram illustrating a _{P y.} The projected length of any wall fin is not zero in any direction. The wall-like fins in the present embodiment may have any shape as long as both the projection lengths in the x direction and the y direction are not zero, and may be curved or polygonal. By using the wall-like fins as described above, the bending rigidity in the x direction and the y direction can be increased while ensuring heat dissipation, and thermal deformation can be suppressed. And, when the arrangement is such that a direct flow path portion is not formed at least in the width center range Wc, warping deformation and hip bending deformation centering on the y direction of the width center range are particularly likely to occur. Can be prevented. If thermal deformation of a heat-dissipating component occurs, the heat-dissipating path incorporating the heat-dissipating component will no longer function and must be immediately discarded and replaced. The above heat dissipating component is very effective because it can suppress heat deformation with a simple configuration. Furthermore, the above heat dissipation component does not need to have an additional portion added to the conventional heat dissipation component. For this reason, it is suitable for automobile parts and the like that are required to be low in price and downsized.

(Embodiment 4)
FIG. 12 is a diagram showing a heat dissipation structure 50 according to Embodiment 4 of the present invention. The heat dissipation structure 50 incorporates the heat dissipation component 10 shown in any of the first to third embodiments. In FIG. 12, an aluminum plate or a copper plate 25 is disposed on the bottom surface of a semiconductor device 30 that is a heating element via a solder layer 27. A heat conductive insulating plate 31 such as AlN is disposed under the aluminum plate or copper plate, and an aluminum plate or copper plate 25 is further disposed thereunder. Further, a heat spreader 33 is connected to the lower layer by the solder layer 29, and the heat radiating component 10 is disposed under the heat spreader 33. In the heat dissipating component 10, the base 1 is brought into contact with the heat spreader 33 via grease (not shown), and wall fins (not shown) are located in a heat medium flow path formed by the casing 35 and the base 1. The heat spreader 33, the heat dissipation component 10, and the housing 35 are fastened by screws 23.

  Since the semiconductor device 30 is a power semiconductor of a power switching element used in a hybrid car, it generates a very large amount of heat, and it is essential to construct an efficient heat dissipation path. The heat dissipation structure 50 efficiently dissipates a large amount of heat generated in the semiconductor device to the heat medium by the heat dissipation component 10, and the heat dissipation component can effectively suppress its own thermal deformation. In the heat dissipating structure (heat dissipating path) of FIG. 12, one of the components that are most likely to undergo thermal deformation is the heat dissipating component 10, and it is very significant to be able to suppress the heat deformation of the heat dissipating component.

  In addition, the heat radiating component 10 does not need to be provided with an additional mechanism compared to the conventional heat radiating component, so that it does not increase in volume and does not complicate the manufacturing process in manufacturing. . Accordingly, it is considered that the power module mounted in an automobile, particularly a hybrid car having a large calorific value, is required to be miniaturized, and thus is useful.

(Embodiment 5)
FIG. 13 is a diagram showing a heat dissipation structure 50 according to the fifth embodiment of the present invention. The difference from the heat dissipation structure 50 of the fourth embodiment is only the configuration of the heat dissipation path from the semiconductor device 30 to the heat dissipation component 10, and the configuration of the heat dissipation component 10 is the same as that of the fourth embodiment. The present embodiment is characterized in that the wiring function constituted by (aluminum plate or copper plate 25 + thermally conductive insulating substrate 31 + aluminum plate or copper plate 25) in the fourth embodiment is replaced with a wiring member 37. In FIG. 13, the semiconductor device 30 is connected to the wiring member 37 by the solder layer 27, and the wiring member 37 is connected to the heat dissipation component 10 by the insulating connection layer 38. The wiring member 37 is usually formed of a copper plate or (copper plate + plating).

  In the heat dissipation structure 50 shown in FIG. 13, the manufacturing process can be simplified. Furthermore, the length of the heat radiation path from the semiconductor device 30 to the heat radiation component 10 can be shortened to promote heat conduction. Further, as described above, when the heat dissipation component 10 is formed of a different material, the mismatch between the thermal expansion coefficients of the semiconductor device and the fin can be relaxed, and the thermal stress can be reduced. As for the operational effects when mounting the semiconductor device, the same operational effects as in the fourth embodiment can be obtained. In the point which can be used suitably for the power module of a hybrid car, what was demonstrated in the said Embodiment 4 corresponds as it is.

In the above-described embodiment, not length component P _x, P _y are both zero extension forms also flow path direction of which the wall-like fins including zigzag fins (y-direction) and perpendicular direction (x direction) thereto The example was illustrated. However, although not shown, for example, a wall-like fin having an extended shape (extended shape consisting of a line segment parallel to the x direction) where P _y is zero and P _x is a finite length, that is, a wall-like fin orthogonal to the flow path. There may be (flow channel orthogonal wall-shaped fins). This is because it is assumed that wall fins having a length component in the flow path direction are always provided among the other wall fins in order not to greatly hinder the flow of the heat medium.

(About other variations)
1. For the zigzag shape of the zigzag fin, regularity is not essential for the height (low) of the unevenness along the flow path direction and the period of the unevenness. Even if it is irregular, it has corrugations, and if it satisfies the above-mentioned limiting requirements, it corresponds to the zigzag fin referred to in the present invention.
2. The plurality of zigzag fins arranged in parallel in the width direction may not be the same zigzag shape. Further, the length in the flow path direction may not be the same for the plurality of zigzag fins arranged in parallel.
3. Although the width center range is defined as ½ of the entire width, for the purpose of the present invention, when the axis of thermal deformation warp is concentrated near the narrow center, the width center range is It can be interpreted as a range narrower than ½ of the entire width. In that case, it can be interpreted as "at any position within the central predetermined width at least less than half the full width".

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The discharge component and the heat dissipation structure of the present invention can ensure heat dissipation, suppress thermal deformation, improve thermal durability, do not hinder downsizing, and complicate the manufacturing process. Absent.

It is a perspective view of the thermal radiation component in Embodiment 1 of this invention. It is a top view of the thermal radiation component of FIG. It is the elements on larger scale of the top view of the thermal radiation component of FIG. It is a perspective view which shows the top part and trough part which considered the thickness of the zigzag-shaped fin. It is a perspective view of the thermal radiation component in Embodiment 2 of this invention. It is a top view of the heat radiating component of FIG. It is a top view of the heat radiating component in Embodiment 3 of this invention. It is a perspective view which shows the curve (nonlinear) wall-shaped fin which is a modification of the thermal radiation component of FIG. It is a perspective view which shows the modification of another wall fin. It is a figure which shows the projection to the x direction and y direction of a wall-shaped fin. It is a figure which shows the projection to the x direction and y direction of another wall-shaped fin. It is sectional drawing which shows the thermal radiation structure in Embodiment 4 of this invention. It is sectional drawing which shows the thermal radiation structure in Embodiment 5 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Base part, 3, 5, 7, 9, 13, 15 Wall-shaped fin, 3f, 5f, 7f, 9f, 13f Wall-shaped fin extended shape, 7a, 9a, 7b, 9b The inclined part of wall-shaped fin, 10 Heat dissipating parts, 23 screws, 25 aluminum plate or copper plate, 27, 29 solder, 30 semiconductor device, 31 heat conductive insulating layer (AlN substrate), 33 heat spreader, 35 housing, 37 wiring material, 38 insulating connecting layer, 50 Heat dissipation structure, 73 Virtual direct flow path portion, B Zigzag fin valley, T Zigzag fin top, E1 base one end, v Direct flow path portion (width), Wc width center range, We The end of the width.

Claims (7)

A heat dissipating component that is located in the flow path of the heat medium and exchanges heat with the heat medium,
A plate-like base;
A wall-like fin extending to the base,
The extending shape of the wall fin has a length component in a direction orthogonal to the flow path direction,
In any position within at least the center range of the width of the inlet side of the base portion, the outlet side is seen along the flow direction of the base portion, and is arranged to be blocked by the wall fins. Heat dissipation parts.   The wall-shaped fins are composed of two or more kinds, and the extending shape of the first wall-shaped fin is close to one end of the base portion in the direction of the flow path, and the second wall. 2. The heat dissipating component according to claim 1, wherein the extended shape of the fin has a shape that is away from the one end.   The wall-shaped fin includes, in one wall-shaped fin, a portion that approaches one end of the base portion and a portion that moves away from one end of the base portion in the flow path direction. The heat dissipating component according to claim 1, comprising:   The wall-like fins alternately have a convex top portion toward one end of the base portion and a concave valley portion toward the one end of the base portion along the flow path, and the top portion is the valley portion. The heat dissipating component according to claim 3, wherein the fin is a zigzag fin closer to one end of the base than the portion.   The two zigzag fins are positioned so as to be juxtaposed across the flow path portion, and the valley portion of one zigzag fin located closer to one end of the base portion of the two zigzag fins The heat dissipating component according to claim 4, wherein the heat dissipating component is located farther from one end of the base than the top of the other zigzag fin.   The heat-radiating component according to claim 1, wherein a metal forming the wall-like fin is different from a metal forming the base portion. At least one of a heat conductive insulating layer, a heat spreader, and a wiring material is interposed between the heat generating element and the base of the heat dissipation component according to any one of claims 1 to 6 is connected to the bottom of the interposed object. A heat dissipating structure characterized by being made.

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